JP3220706U - 電子機器放熱構造 - Google Patents

電子機器放熱構造 Download PDF

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Publication number
JP3220706U
JP3220706U JP2019000109U JP2019000109U JP3220706U JP 3220706 U JP3220706 U JP 3220706U JP 2019000109 U JP2019000109 U JP 2019000109U JP 2019000109 U JP2019000109 U JP 2019000109U JP 3220706 U JP3220706 U JP 3220706U
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electronic device
dissipation structure
heat dissipation
heat
circuit board
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JP2019000109U
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Japanese (ja)
Inventor
養明 施
養明 施
宏源 許
宏源 許
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慧隆科技股▲ふん▼有限公司
株式会社ジー・エム・エス
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JP2019000109U 2018-01-17 2019-01-16 電子機器放熱構造 Active JP3220706U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW107101696 2018-01-17
TW107101696A TWI697271B (zh) 2018-01-17 2018-01-17 電子裝置散熱結構

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JP3220706U true JP3220706U (ja) 2019-03-28

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TW (1) TWI697271B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021017676A1 (zh) * 2019-07-27 2021-02-04 深圳市麟富科技有限公司 一种防辐射保护套及其加工工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205883820U (zh) * 2016-06-30 2017-01-11 慧隆科技股份有限公司 辐射散热式电子装置
CN206614861U (zh) * 2017-02-20 2017-11-07 慧隆科技股份有限公司 石墨材料散热片
TWM541701U (zh) * 2017-02-24 2017-05-11 Amazing Cool Tech Corp 電子裝置的定向散熱結構
CN206506817U (zh) * 2017-02-27 2017-09-19 慧隆科技股份有限公司 电子装置的定向散热结构
TWM560761U (zh) * 2018-01-17 2018-05-21 慧隆科技股份有限公司 電子裝置散熱結構

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021017676A1 (zh) * 2019-07-27 2021-02-04 深圳市麟富科技有限公司 一种防辐射保护套及其加工工艺

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Publication number Publication date
TW201933974A (zh) 2019-08-16
TWI697271B (zh) 2020-06-21

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