JP3220706U - 電子機器放熱構造 - Google Patents
電子機器放熱構造 Download PDFInfo
- Publication number
- JP3220706U JP3220706U JP2019000109U JP2019000109U JP3220706U JP 3220706 U JP3220706 U JP 3220706U JP 2019000109 U JP2019000109 U JP 2019000109U JP 2019000109 U JP2019000109 U JP 2019000109U JP 3220706 U JP3220706 U JP 3220706U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- dissipation structure
- heat dissipation
- heat
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 230000005855 radiation Effects 0.000 claims abstract description 81
- 239000002184 metal Substances 0.000 claims abstract description 48
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 229910021389 graphene Inorganic materials 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000011807 nanoball Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 description 8
- 239000007770 graphite material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000011805 ball Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107101696 | 2018-01-17 | ||
TW107101696A TWI697271B (zh) | 2018-01-17 | 2018-01-17 | 電子裝置散熱結構 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3220706U true JP3220706U (ja) | 2019-03-28 |
Family
ID=65895155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019000109U Active JP3220706U (ja) | 2018-01-17 | 2019-01-16 | 電子機器放熱構造 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3220706U (zh) |
TW (1) | TWI697271B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021017676A1 (zh) * | 2019-07-27 | 2021-02-04 | 深圳市麟富科技有限公司 | 一种防辐射保护套及其加工工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205883820U (zh) * | 2016-06-30 | 2017-01-11 | 慧隆科技股份有限公司 | 辐射散热式电子装置 |
CN206614861U (zh) * | 2017-02-20 | 2017-11-07 | 慧隆科技股份有限公司 | 石墨材料散热片 |
TWM541701U (zh) * | 2017-02-24 | 2017-05-11 | Amazing Cool Tech Corp | 電子裝置的定向散熱結構 |
CN206506817U (zh) * | 2017-02-27 | 2017-09-19 | 慧隆科技股份有限公司 | 电子装置的定向散热结构 |
TWM560761U (zh) * | 2018-01-17 | 2018-05-21 | 慧隆科技股份有限公司 | 電子裝置散熱結構 |
-
2018
- 2018-01-17 TW TW107101696A patent/TWI697271B/zh active
-
2019
- 2019-01-16 JP JP2019000109U patent/JP3220706U/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021017676A1 (zh) * | 2019-07-27 | 2021-02-04 | 深圳市麟富科技有限公司 | 一种防辐射保护套及其加工工艺 |
Also Published As
Publication number | Publication date |
---|---|
TW201933974A (zh) | 2019-08-16 |
TWI697271B (zh) | 2020-06-21 |
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