JP3217628B2 - Liquid crystal display - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display.

[0002]

2. Description of the Related Art A conventional liquid crystal display device 1 is shown in FIGS. 5 to 7, and FIG. 5 is a plan view thereof, and FIGS. 6 and 7 are an enlarged plan view and an enlarged sectional view of a region A shown in FIG. It is.

In the liquid crystal display device 1, a liquid crystal is sealed between an upper glass substrate 2 and a lower glass substrate 3, and display electrodes 4 are arranged on the inner surfaces of the liquid crystal display devices so as to be orthogonal to each other. Then, a wiring board 5 such as a printed board is juxtaposed on the lower glass substrate 3 such that respective end faces thereof face each other, and the lower glass substrate 3 and the wiring board 5 are placed on a metal plate 6 made of stainless steel or the like. It is fixed with an adhesive resin 7. The driving ICs 8 are arranged on the wiring substrate 5 and the lower glass substrate 3, and the display electrodes 4 are arranged on the lower glass substrate 3.
In addition, a bonding pad 11 is also formed on the wiring board 5 in connection with the output side wiring 10 provided in the non-display area 9. The terminals of the driving IC 8 are connected to the respective terminals of the bonding pads 10 and 11 of the output-side wiring by wire bonding 12. Reference numeral 13 denotes a coordinate recognition marker for mounting an IC or bonding a wire to an IC terminal.

[0004]

However, in the liquid crystal display device 1 having the above structure, if the lower glass substrate 3 and the wiring substrate 5 are juxtaposed so that their end faces face each other, a gap 14 of 0.4 mm or less is generated. In this state, when the thermosetting protective resin 15 covers the drive IC 8 and the gap 14 as shown in FIG. 8, the protective resin 15 does not enter the gap 14 and bubbles are generated. Thereafter, when the protective resin 15 is heated to cure, the bubbles expand and the protective resin 15 ruptures, whereby a part of the protective resin 15 swells. As a result, when the liquid crystal panel is assembled, the swelling portion is raised. There is a problem of hitting other members such as a backlight (for example, a light guide plate or a light diffusion plate, a fluorescent tube or a reflection plate). In addition, there is a problem that the driving IC 8 and the metal film on the lower glass substrate 3 are exposed to the outside air and corrode.

Accordingly, an object of the present invention is to further prevent corrosion of a driving IC and wiring so as not to interfere with other members such as a backlight when assembling a liquid crystal panel.

[0006]

According to the liquid crystal display device of the present invention, a wiring board is connected to one of a pair of glass substrates having a display area bonded through a liquid crystal by connecting a wiring board to a substrate connecting portion. Are arranged side by side so that the end faces thereof face each other, and a metal plate extending from the wiring substrate is provided on the back surface of the one glass substrate, and is driven on the non-display area of the one glass substrate or on the wiring substrate. In a configuration in which a drive IC and a driving IC and the substrate connecting portion are covered with a resin, a through hole or a notch is formed in a portion of the metal plate corresponding to the substrate connecting portion.

[0007]

According to the liquid crystal display device of the present invention, the substrate connecting portion can be formed by arranging one glass substrate and the wiring substrate side by side so that their end faces face each other. According to this configuration, when resin is coated on the driving IC and the substrate connecting portion, the outside air communicates with the inside of the substrate connecting portion via the through hole or the notch. Therefore, the substrate connecting portion does not become a closed state, so that even when the resin is thermally cured, bubbles are not generated, and the resin does not rise, and as a result, it interferes with other members such as a backlight at the time of assembling the liquid crystal panel. And no extra stress. Further drive IC
And the metal film on one of the glass substrates does not corrode.

[0008]

1 to 3 show a liquid crystal display device 16 according to the present invention. FIG. 1 is a plan view, FIG. 2 is an enlarged plan view of a region B shown in FIG. 1, and FIG. It is sectional drawing of the cutting surface line XX in a middle. Note that the same members as those of the conventional liquid crystal display device 1 are denoted by the same reference numerals.

In the liquid crystal display device 16, a liquid crystal (not shown) is provided between the upper glass substrate 2 which is a common side glass substrate and the lower glass substrate 3 which is a segment side glass substrate by a sealant (not shown). ) Is sealed, and display electrodes 4 are arranged on the inner surfaces of the upper and lower glass substrates 2 and 3 so as to be orthogonal to each other to form a display region 4. By arranging the wiring boards 5 such as a printed board on the lower glass substrate 3 so that the end faces thereof are opposed to each other, the above-described board connecting portion is formed, and the wiring board 5 is formed on a metal plate 17 made of stainless steel (SUS) or the like. The glass substrate 3 and the wiring substrate 5 are adhered and fixed with a tape (for example, Nitto Denko Corporation No. 3161-F [black one-sided tape] and No. 5915 [double-sided tape]), and the black adhesive resin layer 7 is fixed. Intervene.

With the above structure, a gap 14 of 0.4 mm or less is formed between the lower glass substrate 3 serving as the board connecting portion and the wiring board 5, and a metal plate corresponding to the gap 14 is formed. 17 holes (or cutouts)
18 are formed. For example, there is a through-hole 18 in which several tens of holes are arranged along the gap 14.

Then, the driving ICs 8 are arranged on the wiring substrate 5 and the lower glass substrate 3, and the display electrodes 4 are connected to the output side wirings 10 provided in the non-display area 9 of the lower glass substrate 3, Further, the input side wiring 11 was also formed on the wiring board 5.
The terminals of the driving IC 8 are connected to the respective terminals of the output-side wiring 10 and the input-side wiring 11 by an Au wire by a wire bonding 12.

The wiring board 5 has, for example, 1 inside the board.
A bus line group having a multilayer wiring structure in which one or two or more wiring layers can be formed and / or a structure in which wiring layers are formed on both main surfaces and having a power supply and a signal line necessary for driving the driving IC 8 Is wired. Power supply as needed,
Each system such as logic may be wired for each layer, or a circuit for processing various power supplies and signals supplied from the outside may be mounted.

Thus, according to the liquid crystal display device 16 having the above configuration, as shown in FIG. 4, when the thermosetting protective resin 15 is coated on the driving IC 8 and the gap 14, the through hole 18 is formed in the metal plate 17. Since it is formed, the protective resin 15
When a part of the resin enters the gap 14 and then is heated to cure the protective resin 15, a gas remaining in the resin is generated. As a result, even if the resin itself expands, the expansion pressure is applied to the through hole 18. Since the resin escapes, the resin does not swell even partially, and as a result, does not interfere with other members such as a backlight when assembling the liquid crystal panel.
8 and the metal film on the lower glass substrate 3 are not exposed to the outside air and do not corrode.

It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements may be made without departing from the scope of the present invention.

[0015]

As described above, according to the liquid crystal display device of the present invention, by connecting one glass substrate and the wiring substrate side by side so that their end faces face each other, a substrate connecting portion can be formed. However, since a through hole or a notch is formed in the metal plate, even if the resin is coated on the driving IC and the substrate connecting portion, the inside of the substrate connecting portion and the outside air communicate through the through hole or the notch. Therefore, the substrate connection portion does not become a closed state, so that even when the resin is thermally cured, bubbles are not generated, the resin does not rise, and it does not interfere with other members such as a backlight at the time of assembling the liquid crystal panel, resulting in extra stress. And the driving IC and the metal film on one of the glass substrates are not corroded. As a result, a high quality and highly reliable liquid crystal display device can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a liquid crystal display device according to an embodiment.

FIG. 2 is an enlarged view of a main part of the liquid crystal display device of the embodiment.

FIG. 3 is a cross-sectional view of a main part of the liquid crystal display device of the embodiment.

FIG. 4 is a sectional view of a main part of the liquid crystal display device according to the embodiment.

FIG. 5 is a plan view of a conventional liquid crystal display device.

FIG. 6 is an enlarged view of a main part of a conventional liquid crystal display device.

FIG. 7 is a sectional view of a main part of a conventional liquid crystal display device.

FIG. 8 is a cross-sectional view of a main part of a conventional liquid crystal display device after a protective resin is applied.

FIG. 9 is a cross-sectional view of a main part of a conventional liquid crystal display device after heat curing of a protective resin.

[Description of sign]

 2 upper glass substrate 3 lower glass substrate 4 display area 5 wiring board 7 black adhesive resin layer 8 drive IC 9 non-display area 10 output side wiring 11 input side wiring 12 wire bonding 14 gap 15 protective resin 16 liquid crystal display device 17 metal plate 18 Through hole

Claims (1)

(57) [Claims] 1. A wiring substrate is arranged in parallel with one of a pair of glass substrates having a display region bonded through a liquid crystal so that end faces forming a substrate connecting portion face each other. Disposing a metal plate extending from the wiring substrate on the back surface of the one glass substrate, disposing a driving IC on a non-display area of the one glass substrate or on the wiring substrate, and A liquid crystal display device having a substrate connection portion covered with a resin, wherein a through hole or a notch is formed in a portion of a metal plate corresponding to the substrate connection portion.