CN116679494B - Display panel, bonding method of display panel and display device - Google Patents

Display panel, bonding method of display panel and display device Download PDF

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Publication number
CN116679494B
CN116679494B CN202310968800.1A CN202310968800A CN116679494B CN 116679494 B CN116679494 B CN 116679494B CN 202310968800 A CN202310968800 A CN 202310968800A CN 116679494 B CN116679494 B CN 116679494B
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lead layer
display panel
circuit board
substrate
protective
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CN202310968800.1A
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CN116679494A (en
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范胜才
叶利丹
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HKC Co Ltd
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HKC Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application provides a display panel, which comprises a display area and a bonding area, wherein the bonding area is arranged at one side of the display area, the display panel further comprises a lead layer, a flexible circuit board and protective glue, part of the lead layer and part of the flexible circuit board are positioned at the bonding area, the lead layer is electrically connected with the flexible circuit board, a plurality of first bubbles are dispersed in the protective glue, after the protective glue is coated at the bonding area, a second bubble is arranged in the protective glue, the first bubbles are communicated with each other when the protective glue rises to a preset temperature to form an exhaust channel, the exhaust channels are respectively communicated with the second bubble and the outside, at least part of gas in the second bubble is discharged to the outside through the exhaust channels, the contact between the lead layer and air is avoided, and further, the lead layer corrosion caused by the fact that water vapor in the air enters the lead layer is prevented, and therefore the picture display effect of the display panel is improved. The application also provides a bonding method of the display panel and a display device.

Description

Display panel, bonding method of display panel and display device
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel, a bonding method of the display panel, and a display device having the display panel.
Background
With rapid development of display technology, electronic devices with display functions are becoming more common in people's lives, such as televisions, smartphones, tablet computers, smartwatches, and the like.
The display panel generally has a lead layer, and the lead layer of the display panel is often electrically connected with the circuit board through a flexible circuit board, and a connection part between the lead layer and the flexible circuit board is generally coated with a protective adhesive to protect the flexible circuit board. However, in the coating process, bubbles are easily generated in the protective adhesive, so that the connection part of the lead layer and the flexible circuit board is contacted with air, water vapor in the air enters the lead layer, and then the lead layer is corroded, so that the display panel is poor in display.
Therefore, how to solve the problem of corrosion of the lead layer caused by contact between the air and the connection part of the lead layer of the display panel and the flexible circuit board in the prior art is a urgent need for those skilled in the art.
Disclosure of Invention
In view of the foregoing drawbacks of the prior art, an object of the present application is to provide a display panel and a display device having the same, which are intended to solve the problem of corrosion of metal leads caused by contact between the display panel and air at the connection of the display panel and a flexible circuit board in the prior art.
In order to solve the above technical problems, an embodiment of the present application provides a display panel, which includes a display area and at least one bonding area, wherein at least one bonding area is disposed on one side of the display area, the display panel further includes a lead layer and a flexible circuit board disposed on the lead layer, a portion of the lead layer and a portion of the flexible circuit board are disposed on the bonding area, and the lead layer is electrically connected with the flexible circuit board, and the flexible circuit board is used for transmitting an electrical signal to the lead layer. The display panel further comprises a protective adhesive, a plurality of first bubbles are dispersed in the protective adhesive, wherein at least one second bubble is arranged in the protective adhesive after the protective adhesive is coated on the bonding area, the first bubbles are communicated when the protective adhesive rises to a preset temperature to form at least one exhaust channel, at least one exhaust channel is respectively communicated with the second bubbles and the outside, and at least part of gas in the second bubbles is discharged to the outside through the exhaust channel.
In summary, in the display panel provided by the embodiment of the application, when the protective adhesive is raised to a predetermined temperature, the plurality of first bubbles in the protective adhesive are communicated to form at least one exhaust channel, at least one exhaust channel is respectively communicated with the second bubbles and the outside, at least part of gas in the second bubbles is discharged to the outside through the exhaust channel, at least part of gas in the second bubbles is discharged through the exhaust channel, and therefore, the lead layer is prevented from being corroded due to the fact that water vapor in the air enters the lead layer, and poor display of the display panel is avoided.
In an exemplary embodiment, the display panel further includes a first substrate, a portion of the first substrate is located at the bonding region, and the lead layer is located at one side of the first substrate. The display panel further comprises a second substrate, the second substrate is located outside the bonding area, the second substrate is located on one side, opposite to the first substrate, of the lead layer, the side, facing the flexible circuit board, of the second substrate is adjacent to the bonding area, and the protective adhesive is connected with the side, adjacent to the bonding area, of the second substrate.
In an exemplary embodiment, the second substrate includes a chamfer end disposed at a side of the second substrate adjacent to the bonding region, and a portion of the protective paste is filled into the chamfer end. The inclined surface of the chamfer end is inclined towards the direction of the bonding region in the direction of pointing to the lead layer on the second substrate; or in the direction that the lead layer points to the second substrate, the inclined surface of the chamfer end is inclined towards the direction of the bonding region.
In an exemplary embodiment, the chamfer end has a chamfer height of 0.1mm to 0.4mm; the inclined plane of the chamfer end and the included angle of the thickness direction of the second substrate are 30-60 degrees.
In an exemplary embodiment, the display panel further includes a conductive adhesive film located at the bonding region, the conductive adhesive film is disposed on a side of the lead layer opposite to the first substrate, a portion of the flexible circuit board is disposed on a side of the conductive adhesive film opposite to the lead layer, and the conductive adhesive film electrically connects the lead layer with the flexible circuit board.
In an exemplary embodiment, the display panel further includes an insulating layer, the insulating layer and the conductive adhesive film are disposed on the same side of the lead layer, the second substrate is disposed on a side of the insulating layer opposite to the lead layer, a portion of the insulating layer is located in the bonding region, the protective adhesive is coated on the insulating layer located in the bonding region, and a portion of the protective adhesive covers the flexible circuit board.
Based on the same inventive concept, the embodiment of the application also provides a display device, which comprises a circuit board and the display panel, wherein the circuit board is electrically connected with the flexible circuit board of the display panel, and the circuit board is used for providing electric signals to the display panel.
In summary, the display device provided by the embodiment of the application includes a circuit board and a display panel, the display panel is communicated with each other to form at least one exhaust channel when the protective glue is raised to a predetermined temperature by a plurality of first air bubbles in the protective glue, at least one exhaust channel is respectively communicated with the second air bubbles and the outside, at least part of air in the second air bubbles is discharged to the outside through the exhaust channels, at least part of air in the second air bubbles is discharged through the exhaust channels, and therefore, the lead layers are prevented from being corroded due to the fact that water vapor in the air enters the lead layers, and display defects of the display panel are avoided.
Based on the same inventive concept, the embodiment of the application further provides a bonding method of the display panel, where the bonding method of the display panel is used for bonding the display panel, and the bonding method includes:
providing a lead layer assembly, a protective adhesive and a flexible circuit board, wherein the lead layer assembly comprises a lead layer, and the protective adhesive is internally provided with a plurality of first bubbles;
mounting one end of the flexible circuit board to a part of the lead layer;
coating the protective glue so that the protective glue covers part of the flexible circuit board and at least one second air bubble is arranged in the protective glue, wherein the lead layer assembly, the protective glue and the flexible circuit board form a display panel;
and heating the protective adhesive to a preset temperature to enable the protective adhesive to expand so as to enable a plurality of first air bubbles in the protective adhesive to be communicated to form at least one exhaust channel, wherein the exhaust channel is respectively communicated with the second air bubbles and the outside, and at least part of air in the second air bubbles is discharged through the exhaust channel.
In an exemplary embodiment, the bonding method of the display panel further includes:
the temperature of the protective glue is reduced so that the exhaust channel is closed.
In an exemplary embodiment, the mounting one end of the flexible circuit board to a portion of the lead layer includes:
providing a conductive adhesive film;
mounting the conductive adhesive film on part of the lead layer;
and installing the flexible circuit board on one side of the conductive adhesive film, which is opposite to the lead layer, wherein the lead layer is electrically connected with the flexible circuit board through the conductive adhesive film.
In summary, the bonding method of the display panel provided by the embodiment of the application includes: providing a lead layer assembly, a protective adhesive and a flexible circuit board, wherein the lead layer assembly comprises a lead layer, and the protective adhesive is internally provided with a plurality of first bubbles; mounting one end of the flexible circuit board to a part of the lead layer; coating the protective glue so that the protective glue covers part of the flexible circuit board and at least one second air bubble is arranged in the protective glue, wherein the lead layer assembly, the protective glue and the flexible circuit board form a display panel; and heating the protective adhesive to a preset temperature to enable the protective adhesive to expand so as to enable a plurality of first air bubbles in the protective adhesive to be communicated to form at least one exhaust channel, wherein the exhaust channel is respectively communicated with the second air bubbles and the outside, and at least part of air in the second air bubbles is discharged through the exhaust channel. Therefore, when the protective adhesive is raised to a preset temperature, the first air bubbles in the protective adhesive are communicated to form at least one exhaust channel, at least one exhaust channel is respectively communicated with the second air bubbles and the outside, at least part of air in the second air bubbles is discharged to the outside through the exhaust channels, at least part of air in the second air bubbles is discharged through the exhaust channels, and therefore water vapor in air is prevented from entering the lead layer to cause corrosion of the lead layer, and poor display of the display panel is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic top view of a display panel according to a first embodiment of the present application;
FIG. 2 is a schematic layer structure of bonding regions of a display panel according to a first embodiment of the present application;
fig. 3 is a schematic diagram of a structure of a protective adhesive of a display panel in a non-venting state according to a first embodiment of the present application;
fig. 4 is a schematic structural diagram of a display panel according to a first embodiment of the present application when the display panel is in an exhaust state;
fig. 5 is a schematic view of a display panel according to a first embodiment of the present application after being exhausted;
FIG. 6 is a schematic view of a first layer structure of bonding regions of a display panel according to a second embodiment of the present application;
FIG. 7 is a schematic diagram of a second layer structure of a bonding region of a display panel according to a second embodiment of the present application;
fig. 8 is a schematic layer structure of a display device according to a third embodiment of the present application;
FIG. 9 is a flowchart illustrating a bonding method of a display panel according to a fourth embodiment of the present application;
fig. 10 is a flowchart of step S20 of a bonding method of a display panel according to a fourth embodiment of the present application.
Reference numerals illustrate:
10-a lead layer; 20-a flexible circuit board; 30-protecting glue; 31-first bubbles; 32-a second bubble; 33-an exhaust passage; 50-a conductive adhesive film; 60-a first substrate; 70-an insulating layer; 80-a second substrate; 80 a-chamfer ends; 100-a display panel; 100 a-a display panel; 101-a display area; 102-a non-display area; 102 a-bonding region; 300-a circuit board; 400-display device; S10-S50-a bonding method of the display panel; S21-S23-step S20.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the application. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present application are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. It should be noted that the terms "first," "second," and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprises," "comprising," "includes," "including," or "having," when used in this specification, are intended to specify the presence of stated features, operations, elements, etc., but do not limit the presence of one or more other features, operations, elements, etc., but are not limited to other features, operations, elements, etc. Furthermore, the terms "comprises" or "comprising" mean that there is a corresponding feature, number, step, operation, element, component, or combination thereof disclosed in the specification, and that there is no intention to exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof. It will also be understood that the meaning of "at least one" as described herein is one and more, such as one, two or three, etc., and the meaning of "a plurality" is at least two, such as two or three, etc., unless specifically defined otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Referring to fig. 1, fig. 1 is a schematic top view of a display panel according to a first embodiment of the application. In the embodiment of the present application, the display panel 100 includes a display area 101 and a non-display area 102, the non-display area 102 is disposed around the display area 101, the display area 101 is used for performing image display, and the non-display area 102 is used for setting other auxiliary display components or functional units and signal lines. The non-display area 102 includes at least one bonding area 102a, and the bonding area 102a is disposed at one side of the display area 101. The bonding regions 102a may be disposed at intervals, that is, the bonding regions 102a are disposed at intervals on one side of the display region 101.
In an embodiment of the present application, referring to fig. 2, fig. 2 is a schematic layer structure diagram of a bonding region of a display panel according to a first embodiment of the present application. The display panel 100 further includes a lead layer 10 and a flexible circuit board 20 disposed on the lead layer 10, wherein a portion of the lead layer 10 and a portion of the flexible circuit board 20 are disposed in the bonding region 102a, and the lead layer 10 and the flexible circuit board 20 are electrically connected in the bonding region 102a, and the flexible circuit board 20 is configured to transmit an electrical signal to the lead layer 10. Wherein the lead layer 10 includes a plurality of metal leads, the flexible circuit board 20 shown in fig. 2 is only a portion of the flexible circuit board 20.
The display panel generally has a lead layer, and the lead layer of the display panel is often electrically connected with the circuit board through a flexible circuit board, and a connection part between the lead layer and the flexible circuit board is generally coated with a protective adhesive to protect the flexible circuit board.
In an embodiment of the present application, referring to fig. 2 and fig. 3, fig. 3 is a schematic diagram of a structure of a protective adhesive of a display panel in which the protective adhesive is not exhausted according to a first embodiment of the present application. The display panel 100 further includes a protective adhesive 30, a plurality of first air bubbles 31 are dispersed in the protective adhesive 30, after the protective adhesive 30 is coated on the bonding region 102a, that is, the protective adhesive 30 is coated on an electrical connection position between the lead layer 10 and the flexible circuit board 20 in the bonding region 102a, and at least one second air bubble 32 is provided in the protective adhesive 30, wherein a volume of each first air bubble 31 is smaller than a volume of each second air bubble 32. It will be appreciated that the first air bubbles 31 are micro-air bubbles dispersed in the protective glue 30, and the volume thereof is smaller, that is, the volume of each first air bubble 31 is much smaller than the volume of each second air bubble 32, and even the sum of the volumes of at least part of the first air bubbles 31 is smaller than the volume of each second air bubble 32.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a display panel according to a first embodiment of the application when the display panel is in an exhaust state. By raising the temperature of the protective glue 30, the protective glue 30 expands, a plurality of the first air bubbles 31 are communicated to form at least one exhaust channel 33, the exhaust channels 33 are respectively communicated with the second air bubbles 32 and the outside, and at least part of the air in the second air bubbles 32 is discharged to the outside through the exhaust channels 33. The protective paste 30 is used to fix, protect, seal the flexible circuit board 20 and insulate the portion of the flexible circuit board 20 that is in contact with the protective paste 30.
In the embodiment of the present application, a plurality of first air bubbles 31 are blown into the protective glue 30, and after the protective glue 30 is uniformly stirred, the plurality of first air bubbles 31 are uniformly dispersed in the protective glue 30 due to the certain fluidity of the protective glue 30. When the protective glue 30 is applied to a predetermined temperature during glue application, the protective glue 30 expands when heated, so that a plurality of first bubbles 31 dispersed in the protective glue 30 are squeezed and communicated to form at least one exhaust channel 33, thereby removing second bubbles 32 in the protective glue 30.
It can be appreciated that the protective adhesive 30 has a certain fluidity, and air cannot be discharged in time during the coating process, after the protective adhesive is coated on the bonding region 102a, the second air bubbles 32 contacting the flexible circuit board 20 are formed in the protective adhesive 30, and the second air bubbles 32 are easily communicated with the outside, so that water vapor in the air enters the lead layer 10, and the water vapor corrodes the lead layer 10. The protective glue 30 of the present application has a plurality of first bubbles 31, the protective glue 30 is heated to expand, the plurality of first bubbles 31 are extruded to communicate with each other to form corresponding air exhaust channels 33, and the air exhaust channels 33 are respectively communicated with the second bubbles 32 and the outside. Because the protective glue 30 has a certain fluidity, under the action of gravity, the protective glue 30 presses the second air bubbles 32, so that at least part of the air in the second air bubbles 32 is discharged through the air discharge channel 33, the lead layer 10 is prevented from being contacted with air, and further, the lead layer 10 is prevented from being corroded due to the fact that water vapor in the air enters the lead layer 10. Moreover, the injection and discharge of the first air bubbles 31 will not cause too large volume change of the protective glue 30, so that the protective glue 30 is prevented from degumming.
In the embodiment of the present application, after the protective glue 30 returns to the normal temperature, i.e. in the environment of normal temperature, according to the principle of thermal expansion and cold contraction, the volume of the protective glue 30 is reduced, and the exhaust channel 33 can be closed, so as to prevent the entry of external water vapor. In addition, in the environment where the heat and the cold alternate, the volume of the protective glue 30 may shrink and expand, so that the release and the suction of the first air bubbles 31 in the protective glue 30 can adjust the volume of the protective glue 30, so that the degumming phenomenon caused by too large volume change of the protective glue 30 can be further prevented, and the specific contents thereof will be described in detail below with reference to the accompanying drawings.
In an exemplary embodiment, the flexible circuit board 20 may be a Chip On Film (COF). The protective paste 30 may be a taffy (Tuffy) paste or an Ultraviolet (UV) photo-curable paste, which is not particularly limited in the present application.
In an embodiment of the present application, referring to fig. 5, fig. 5 is a schematic diagram of a display panel after exhausting according to a first embodiment of the present application. By reducing the temperature of the protective glue 30, the protective glue 30 contracts according to the principle of thermal expansion and contraction, so that the exhaust channel 33 is closed, and thus, moisture in the air can be prevented from entering the lead layer 10 through the exhaust channel 33. After the exhaust passage 33 is eliminated or blocked, a certain amount of the first bubbles 31 still exist in the protective glue 30.
In an exemplary embodiment, referring to fig. 2, the lead layer 10 is partially overlapped with the flexible circuit board 20, that is, the orthographic projection of the lead layer 10 in the bonding region 102a is overlapped with the orthographic projection of the flexible circuit board 20 in the bonding region 102a, and the overlapped portions of the lead layer 10 and the flexible circuit board 20 are spaced apart. That is, the lead layers 10 are disposed on the flexible circuit board 20 at a predetermined distance, and the orthographic projection of the lead layers 10 on the flexible circuit board 20 is located in the bonding region 102a and partially overlaps the flexible circuit board 20.
In the embodiment of the application, referring to fig. 2, the display panel 100 further includes a conductive adhesive film 50, wherein the conductive adhesive film 50 is located in the bonding region 102a and is connected between the lead layer 10 and the flexible circuit board 20, that is, the conductive adhesive film 50 is disposed on one side of the lead layer 10, and a portion of the flexible circuit board 20 is disposed on a side of the conductive adhesive film 50 opposite to the lead layer 10. The conductive adhesive film 50 is used for electrically connecting the lead layer 10 and the flexible circuit board 20.
In an exemplary embodiment, the conductive adhesive film 50 may be an anisotropic conductive adhesive film (Anisotropic Conductive Film, ACF).
In an exemplary embodiment, referring to fig. 2, the display panel 100 further includes a first substrate 60, the first substrate 60 is located on a side of the lead layer 10 opposite to the conductive adhesive film 50, and a portion of the first substrate 60 is located on the bonding region 102a. Specifically, the lead layer 10 is located at a side of the first substrate 60, the conductive adhesive film 50 is located at a side of the lead layer 10 opposite to the first substrate 60, and a part of the flexible circuit board 20 is located at a side of the conductive adhesive film 50 opposite to the lead layer 10.
In the embodiment of the application, referring to fig. 2, the display panel 100 further includes an insulating layer 70, wherein the insulating layer 70 is disposed on a side of the lead layer 10 opposite to the first substrate 60, i.e. the insulating layer 70 and the conductive adhesive film 50 are disposed on the same side of the lead layer 10. A portion of the insulating layer 70 is disposed on the bonding region 102a, that is, a portion of the lead layer 10 located on the bonding region 102a is covered by the conductive adhesive film 50, and another portion of the lead layer 10 located on the bonding region 102a is covered by the insulating layer 70. Wherein, the thickness of the conductive adhesive film 50 is greater than the thickness of the insulating layer 70. Due to the lamination of the flexible circuit board 20 and the lead layer 10, the conductive adhesive film 50 between the lead layer 10 and the flexible circuit board 20 may overflow, i.e. the conductive adhesive film 50 may also cover a part of the insulating layer 70.
In an exemplary embodiment, the material of the insulating layer 70 may include soluble Polytetrafluoroethylene (PFA).
In the embodiment of the application, the protective adhesive 30 is coated on the bonding region 102a, and the protective adhesive 30 is disposed on a side of the insulating layer 70 opposite to the lead layer 10, that is, the protective adhesive 30 is coated on the insulating layer 70 located on the bonding region 102a, and the protective adhesive 30 covers a portion of the side of the flexible circuit board 20 opposite to the conductive adhesive film 50, that is, the protective adhesive 30 is coated on the bonding region 102a and covers a portion of the insulating layer 70, a portion of the flexible circuit board 20, and adjacent positions of the flexible circuit board 20, the conductive adhesive film 50, and the insulating layer 70.
It is to be understood that the second air bubble 32 of the protective adhesive 30 may be formed on the insulating layer 70, and the portion of the conductive adhesive film 50 overflows into the second air bubble 32, so that the moisture in the air may enter the lead layer 10 through the gap between the portion of the conductive adhesive film 50 overflows and the insulating layer 70 due to the non-uniform direct contact between the portion of the conductive adhesive film 50 overflows and the insulating layer 70. Therefore, in the display panel 100 of the present application, the protective glue 30 is heated to expand, the plurality of first bubbles 31 are extruded and communicated to form the air exhaust channel 33, and the air exhaust channel 33 is communicated with the second bubbles 32 and the outside, so that at least part of the air in the second bubbles 32 is exhausted through the air exhaust channel 33, thereby avoiding the lead layer 10 from contacting with air, and further preventing the lead layer 10 from being corroded due to the fact that the water vapor in the air enters the lead layer 10, and further improving the picture display effect of the display panel 100.
In the embodiment of the application, referring to fig. 2, the display panel 100 further includes a second substrate 80, the second substrate 80 is disposed on a side of the insulating layer 70 opposite to the lead layer 10, and the second substrate 80 is located outside the bonding region 102 a. The side of the second substrate 80 facing the flexible circuit board 20 is adjacent to the bonding region 102a, and the protective adhesive 30 is connected to the side of the second substrate 80 adjacent to the bonding region 102 a. The second substrate 80 is located on a side of the lead layer 10 opposite to the first substrate 60.
It can be appreciated that the connection between the protective adhesive 30 and the side surface of the second substrate 80 adjacent to the bonding region 102a increases the contact area of the protective adhesive 30, which is beneficial to the fixation of the protective adhesive 30 and the fixation of the flexible circuit board 20.
In an exemplary embodiment, the height of the second substrate 80 is higher than the height of the protective glue 30 with the surface of the second substrate 80 facing the insulating layer 70 as a reference surface. It will be appreciated that the display panel 100 also needs to be disposed in a housing, and if the height of the protective glue 30 is higher than that of the second substrate 80, the display panel 100 will not adhere to the inner wall of the housing, and the protective glue 30 will overflow from the second substrate 80 when heated.
In an embodiment of the present application, the display panel 100 may be a liquid crystal display panel (Liquid Crystal Display, LCD), the first substrate 60 may be an array substrate, and the second substrate 80 may be a color film substrate.
In other embodiments of the present application, the display panel 100 may be an Organic Light-Emitting Diode (OLED) display panel or a Micro Light-Emitting Diode (Micro LED) display panel, the first substrate 60 is provided therein with a driving circuit, and the second substrate 80 is provided therein with a plurality of Light-Emitting elements, and the driving circuit is electrically connected with the plurality of Light-Emitting elements to drive the plurality of Light-Emitting elements to emit Light. Wherein, the light emitting element can be an organic light emitting diode or a micron light emitting diode.
In summary, the display panel 100 provided by the embodiment of the application includes the display area 101 and at least one bonding area 102a, wherein the bonding area 102a is disposed at one side of the display area 101. The display panel 100 further includes a lead layer 10 and a flexible circuit board 20, a portion of the lead layer 10 and a portion of the flexible circuit board 20 are located in the bonding region 102a, and the lead layer 10 is electrically connected to the flexible circuit board 20. The display panel 100 further includes a protective adhesive 30, wherein a plurality of first air bubbles 31 are dispersed in the protective adhesive 30, and at least one second air bubble 32 is disposed in the protective adhesive 30 after the protective adhesive 30 is coated on the bonding region 102 a. The temperature of the protective glue 30 is raised, so that the protective glue 30 expands, a plurality of the first air bubbles 31 are communicated to form at least one air exhaust channel 33, the air exhaust channels 33 are respectively communicated with the second air bubbles 32 and the outside, at least part of air in the second air bubbles 32 is exhausted through the air exhaust channels 33, and further, water vapor in the air is prevented from entering the lead layer 10 to cause corrosion of the lead layer 10, and further, poor display of the display panel 100 is avoided.
Referring to fig. 6, fig. 6 is a schematic view of a first layer structure of a bonding region of a display panel according to a second embodiment of the application. The display panel 100a of the second embodiment is different from the display panel 100 of the first embodiment in that: the second substrate 80 of the display panel 100a includes a chamfered end 80a. The display panel 100a of the second embodiment is the same as the display panel 100 of the first embodiment, and the description of the display panel 100 of the first embodiment is omitted herein.
In an embodiment of the present application, the chamfer end 80a is disposed on a side surface of the second substrate 80 adjacent to the bonding region 102a, and the inclined surface of the chamfer end 80a is connected with the surface of the second substrate 80 opposite to the first substrate 60, a part of the protective glue 30 is filled into the chamfer end 80a, and a part of the protective glue 30 filled into the chamfer end 80a is located outside the bonding region 102 a. In the direction of the second substrate 80 pointing to the lead layer 10, the bevel of the chamfer end 80a is inclined toward the direction of the bonding region 102 a. That is, the upper portion of the side of the second substrate 80 adjacent to the bonding region 102a is inclined, and the inclined surface of the chamfer end 80a is connected to the surface of the second substrate 80 facing away from the first substrate 60.
In another embodiment of the present application, referring to fig. 7, fig. 7 is a schematic view of a second layer structure of a bonding region of a display panel according to a second embodiment of the present application. The chamfer end 80a is disposed on a side surface of the second substrate 80 adjacent to the bonding region 102a and is connected to a surface of the second substrate 80 facing the insulating layer 70, and in a direction in which the lead layer 10 points to the second substrate 80, a slope of the chamfer end 80a is inclined toward a direction in which the bonding region 102a is located. That is, the lower portion of the side of the second substrate 80 adjacent to the bonding region 102a is a slope, and the slope is connected to the surface of the second substrate 80 facing the insulating layer 70.
It is understood that the chamfer end 80a increases the contact area between the protective paste 30 and the second substrate 80, which is beneficial to the fixation of the protective paste 30 and the fixation of the flexible circuit board 20. In addition, in the prior art, since the protective adhesive is coated on the side surface of the second substrate adjacent to the bonding region, a gap is formed between the protective adhesive and the second substrate, and the gap also easily causes moisture in air to enter the lead layer. Therefore, the chamfer end 80a of the present application can more facilitate the flow of the protective paste 30, so that the protective paste 30 contacts the second substrate 80 more tightly, and a gap is avoided between the protective paste 30 and the second substrate 80.
In an exemplary embodiment, referring to fig. 6, the height H of the inclined surface of the chamfer end 80a may be 0.1mm to 0.4mm, for example, 0.1mm, 0.15mm, 0.2mm, 0.27mm, 0.33mm, 0.4mm, or other values, and the present application is not particularly limited thereto, and the height direction of the inclined surface is the thickness direction of the second substrate 80. In other exemplary embodiments, the height H of the slope of the chamfer end 80a may be 0.25 to 0.75 times the thickness of the first substrate 60, or may be 0.25 to 0.75 times the thickness of the second substrate 80, for example, 0.25 times, 0.35 times, 0.42 times, 0.5 times, 0.6 times, 0.75 times, or other values, which are not particularly limited by the present application. The thickness of the first substrate 60 and the second substrate 80 may be 0.5mm.
In an exemplary embodiment, referring to fig. 7, the angle α between the bevel of the chamfer end 80a and the thickness direction of the second substrate 80 may be 30 degrees to 60 degrees, for example, 30 degrees, 37 degrees, 40 degrees, 45 degrees, 50 degrees, 54 degrees, 60 degrees, or other values, which are not particularly limited in the present application.
In an exemplary embodiment, the second substrate 80 may be subjected to an edging process to form the chamfered end 80a.
In summary, the display panel 100a provided by the embodiment of the application includes the display area 101 and at least one bonding area 102a, wherein the bonding area 102a is disposed at one side of the display area 101. The display panel further comprises a lead layer 10 and a flexible circuit board 20, wherein a part of the lead layer 10 and a part of the flexible circuit board 20 are positioned in the bonding region 102a, and the lead layer 10 is electrically connected with the flexible circuit board 20. The display panel further includes a protective adhesive 30, wherein a plurality of first air bubbles 31 are dispersed in the protective adhesive 30, and at least one second air bubble 32 is disposed in the protective adhesive 30 after the protective adhesive 30 is coated on the bonding region 102 a. The temperature of the protective glue 30 is raised, so that the protective glue 30 expands, a plurality of the first air bubbles 31 are communicated to form at least one air exhaust channel 33, the air exhaust channels 33 are respectively communicated with the second air bubbles 32 and the outside, at least part of air in the second air bubbles 32 is exhausted through the air exhaust channels 33, the lead layer 10 is prevented from being contacted with air, and further, the lead layer 10 is prevented from being corroded due to the fact that water vapor in the air enters the lead layer 10, so that poor display of the display panel 100a is prevented.
Based on the same inventive concept, an embodiment of the present application further provides a display device, referring to fig. 8, and fig. 8 is a schematic layer structure of a display device according to a third embodiment of the present application. The display device 400 includes the display panel and the circuit board 300, wherein the circuit board 300 is electrically connected to the flexible circuit board 20 of the display panel, and the circuit board 300 is used for providing electrical signals to the display panel. The display panel may be the display panel 100 of the first embodiment or the display panel 100a of the second embodiment. Since the embodiments shown in fig. 1 to 7 have been described in more detail, the description thereof is omitted herein.
In order to more clearly and conveniently describe the technical solution in the embodiment of the present application, in the following description, a display device 400 of the embodiment of the present application is described by taking a display panel 100 including the first embodiment as an example, as shown in fig. 8. It is to be understood that the following description of the display device 400 is equally applicable to the display panel 100a of the second embodiment.
In an exemplary embodiment, the circuit board 300 may be a printed circuit board assembly (Printed Circuit Board Assembly, PCBA).
It is understood that the display device 400 may be used in electronic devices including, but not limited to, televisions, tablet computers, notebook computers, desktop computers, mobile phones, in-vehicle displays, smart watches, smart bracelets, smart glasses, and the like. According to the embodiment of the present application, the specific type of the display device 400 is not particularly limited, and a person skilled in the art can correspondingly design according to the specific use requirement of the display device 400, which is not described herein.
In an exemplary embodiment, the display device 400 may further include other necessary components and constituent parts such as a driving board, a power board, a high-voltage board, and a key control board, which may be correspondingly supplemented by those skilled in the art according to the specific type and actual function of the display device 400, and will not be described herein.
In summary, the display device 400 provided by the embodiment of the application includes the display panel 100 and the circuit board 300, wherein the display panel 100 includes the display area 101 and at least one bonding area 102a, and the bonding area 102a is disposed at one side of the display area 101. The display panel 100 further includes a lead layer 10 and a flexible circuit board 20, a portion of the lead layer 10 and a portion of the flexible circuit board 20 are located in the bonding region 102a, and the lead layer 10 is electrically connected to the flexible circuit board 20. The display panel 100 further includes a protective adhesive 30, wherein a plurality of first air bubbles 31 are dispersed in the protective adhesive 30, and at least one second air bubble 32 is disposed in the protective adhesive 30 after the protective adhesive 30 is coated on the bonding region 102 a. By raising the temperature of the protective glue 30, the protective glue 30 expands, a plurality of the first air bubbles 31 are communicated to form at least one air exhaust channel 33, the air exhaust channels 33 are respectively communicated with the second air bubbles 32 and the outside, at least part of air in the second air bubbles 32 is exhausted to the outside through the air exhaust channels 33, the lead layer 10 is prevented from being contacted with the air of the outside, and then moisture in the air is prevented from entering the lead layer 10 to cause corrosion of the lead layer 10, so that poor display of the display device 400 is prevented.
Based on the same inventive concept, the embodiment of the present application further provides a bonding method of a display panel, where the bonding method of the display panel is used for bonding the display panels shown in fig. 1 to 7, and descriptions of the same points of the bonding method of the display panel as those of the display panel are omitted herein for brevity, referring to the descriptions of the embodiments shown in fig. 1 to 7. Referring to fig. 9, fig. 9 is a flowchart illustrating a bonding method of a display panel according to a fourth embodiment of the present application, where the bonding method of the display panel may include the following steps.
S10, providing a lead layer assembly, a protective adhesive 30 and a flexible circuit board 20, wherein the lead layer assembly comprises a lead layer 10, and the protective adhesive 30 is internally provided with a plurality of first air bubbles 31.
Specifically, a lead layer assembly, a protective adhesive 30 and a flexible circuit board 20 are provided, the lead layer assembly has a bonding region 102a, the lead layer assembly includes a lead layer 10, a part of the lead layer 10 is located in the bonding region 102a, and a plurality of first bubbles 31 are located in the protective adhesive 30.
In an exemplary embodiment, the lead layer assembly further includes a conductive adhesive film 50, a first substrate 60, an insulating layer 70, and a second substrate 80, and the conductive adhesive film 50, the first substrate 60, the insulating layer 70, and the second substrate 80 are described with reference to the display panel 100 of the first embodiment and the display panel 100a of the second embodiment.
In an exemplary embodiment, the protective paste 30 may be provided with a plurality of the first bubbles 31 therein by injecting a gas into the protective paste 30, and then uniformly stirring the protective paste 30 such that the plurality of the first bubbles 31 are uniformly dispersed in the protective paste 30.
And S20, mounting one end of the flexible circuit board 20 on part of the lead layer 10.
S30, coating the protective glue 30, so that part of the flexible circuit board 20 is covered by the protective glue 30, and at least one second air bubble 32 is arranged in the protective glue 30, wherein the lead layer assembly, the protective glue 30 and the flexible circuit board 20 form a display panel.
Specifically, the protective adhesive 30 is coated on the bonding region 102a by a dispensing machine, the protective adhesive 30 is connected with the lead layer assembly and covers a part of the flexible circuit board 20, and at least one second air bubble 32 is formed in the protective adhesive 30. Wherein the volume of each of the first bubbles 31 is smaller than the volume of each of the second bubbles 32. It will be appreciated that the first air bubbles 31 are micro-air bubbles dispersed in the protective glue 30, and the volume thereof is smaller, that is, the volume of each first air bubble 31 is much smaller than the volume of each second air bubble 32, and even the sum of the volumes of at least part of the first air bubbles 31 is smaller than the volume of each second air bubble 32.
And S40, heating the protective glue 30 to a preset temperature so as to expand the protective glue 30, so as to enable a plurality of first air bubbles 31 in the protective glue 30 to be communicated to form at least one exhaust channel 33, wherein the exhaust channel 33 is respectively communicated with the second air bubbles 32 and the outside, and at least part of air in the second air bubbles 32 is discharged through the exhaust channel 33.
Specifically, the dispenser heats the protective paste 30 when the protective paste 30 is applied, and the temperature of the protective paste 30 is increased.
And S50, reducing the temperature of the protective glue 30 so that the exhaust channel 33 is closed.
Specifically, by lowering the temperature of the protective paste 30, the protective paste 30 contracts, and the exhaust passage 33 is closed.
In the embodiment of the present application, referring to fig. 10, fig. 10 is a schematic flow chart of step S20 of the bonding method of the display panel disclosed in the fourth embodiment of the present application, where the step of "mounting one end of the flexible circuit board 20 onto a portion of the lead layer 10" may include the following steps.
S21, providing a conductive adhesive film 50.
And S22, mounting the conductive adhesive film 50 on part of the lead layer 10.
And S23, mounting the flexible circuit board 20 on the side, opposite to the lead layer 10, of the conductive adhesive film 50, wherein the lead layer 10 is electrically connected with the flexible circuit board 20 through the conductive adhesive film 50.
Specifically, the flexible circuit board 20 is mounted on a side of the conductive adhesive film 50 facing away from the lead layer 10, and the flexible circuit board 20 is pressed, so that the conductive adhesive film 50 can electrically connect the lead layer 10 with the conductive adhesive film 50.
In summary, the bonding method of the display panel provided by the embodiment of the application includes: providing a lead layer assembly, a protective adhesive 30 and a flexible circuit board 20, wherein the lead layer assembly comprises a lead layer 10, and the protective adhesive 30 is internally provided with a plurality of first air bubbles 31; mounting one end of the flexible wiring board 20 to a part of the lead layer 10; coating the protective glue 30, so that the protective glue 30 covers part of the flexible circuit board 20, and at least one second air bubble 32 is arranged in the protective glue 30, wherein the lead layer assembly, the protective glue 30 and the flexible circuit board 20 form a display panel; the protective glue 30 is heated to a predetermined temperature so that the protective glue expands to communicate a plurality of first air bubbles 31 in the protective glue 30 to form at least one exhaust channel 33, the exhaust channels 33 are respectively communicated with the second air bubbles 32 and the outside, at least part of air in the second air bubbles 32 is discharged to the outside through the exhaust channels 33, the lead layer 10 is prevented from being contacted with the air of the outside, and then the lead layer 10 is prevented from being corroded due to the fact that water vapor in the air enters the lead layer 10, so that poor display of the display device 400 is prevented.
The flow chart described in the present application is merely one embodiment, and many modifications may be made to this illustration or the steps in the present application without departing from the spirit of the application. For example, the steps may be performed in a differing order, or steps may be added, deleted or modified. Those skilled in the art will recognize that the full or partial flow of the embodiments described above can be practiced and equivalent variations of the embodiments of the present application are within the scope of the appended claims.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It is to be understood that the application is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims. Those skilled in the art will recognize that the full or partial flow of the embodiments described above can be practiced and equivalent variations of the embodiments of the present application are within the scope of the appended claims.

Claims (9)

1. A display panel, including display region and at least one bonding area, at least one bonding area set up in one side of display region, its characterized in that, display panel still includes:
the flexible circuit board is used for transmitting electric signals to the lead layer, part of the first substrate is positioned in the bonding area, and the lead layer is positioned on one side of the first substrate; the second substrate is positioned outside the bonding region, the second substrate is positioned at one side of the lead layer opposite to the first substrate, and the side surface of the second substrate facing the flexible circuit board is adjacent to the bonding region;
The protective glue is connected with the side surface of the second substrate adjacent to the bonding area, a plurality of first bubbles are dispersed in the protective glue, at least one second bubble is arranged in the protective glue after the protective glue is coated on the bonding area, the volume of the first bubble is smaller than that of the second bubble, the plurality of first bubbles are communicated when the protective glue rises to a preset temperature to form at least one exhaust channel, the at least one exhaust channel is respectively communicated with the second bubble and the outside, and at least part of gas in the second bubble is discharged to the outside through the exhaust channel.
2. The display panel of claim 1, wherein the second substrate includes a chamfered end disposed on a side of the second substrate adjacent to the bonding region, a portion of the protective paste being filled into the chamfered end;
the bevel of the chamfer end is inclined towards the bonding region in the direction of the second substrate pointing to the lead layer, and the bevel of the chamfer end is connected with the surface of the second substrate facing away from the first substrate; or in the direction that the lead layer points to the second substrate, the inclined surface of the chamfer end is inclined towards the direction where the bonding region is located, and the inclined surface of the chamfer end is connected with the surface of the second substrate facing the first substrate.
3. The display panel of claim 2, wherein the chamfer end has a chamfer height of 0.1mm to 0.4mm; the inclined plane of the chamfer end and the included angle of the thickness direction of the second substrate are 30-60 degrees.
4. A display panel according to any one of claims 1-3, further comprising a conductive adhesive film located at the bonding region, wherein the conductive adhesive film is disposed on a side of the lead layer opposite the first substrate, and a portion of the flexible circuit board is disposed on a side of the conductive adhesive film opposite the lead layer, and wherein the conductive adhesive film electrically connects the lead layer and the flexible circuit board.
5. The display panel of claim 4, further comprising an insulating layer disposed on the same side of the lead layer as the conductive adhesive film, wherein the second substrate is disposed on a side of the insulating layer opposite to the lead layer, a portion of the insulating layer is disposed on the bonding region, the protective adhesive is coated on the insulating layer disposed on the bonding region, and a portion of the flexible circuit board is covered.
6. A display device comprising a circuit board and the display panel of any one of claims 1-5, the circuit board being electrically connected to the flexible circuit board of the display panel, the circuit board being for providing electrical signals to the display panel.
7. A method of bonding a display panel according to any one of claims 1-5, the method comprising:
providing a lead layer assembly, a protective adhesive and a flexible circuit board, wherein the lead layer assembly comprises a lead layer, and the protective adhesive is internally provided with a plurality of first bubbles;
mounting one end of the flexible circuit board to a part of the lead layer;
coating the protective glue so that the protective glue covers part of the flexible circuit board and at least one second air bubble is arranged in the protective glue, wherein the lead layer assembly, the protective glue and the flexible circuit board form a display panel;
and heating the protective adhesive to a preset temperature to enable the protective adhesive to expand so as to enable a plurality of first air bubbles in the protective adhesive to be communicated to form at least one exhaust channel, wherein the exhaust channel is respectively communicated with the second air bubbles and the outside, and at least part of air in the second air bubbles is discharged through the exhaust channel.
8. The method of bonding a display panel of claim 7, further comprising:
the temperature of the protective glue is reduced so that the exhaust channel is closed.
9. The bonding method of a display panel according to claim 7 or 8, wherein the mounting one end of the flexible wiring board to a part of the lead layer includes:
providing a conductive adhesive film;
mounting the conductive adhesive film on part of the lead layer;
and installing the flexible circuit board on one side of the conductive adhesive film, which is opposite to the lead layer, wherein the lead layer is electrically connected with the flexible circuit board through the conductive adhesive film.
CN202310968800.1A 2023-08-03 2023-08-03 Display panel, bonding method of display panel and display device Active CN116679494B (en)

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JPH0880688A (en) * 1994-09-12 1996-03-26 Yoichi Kamata Bonding sheet for temporarily bonding flexographic printing plate
JPH08179350A (en) * 1994-12-26 1996-07-12 Kyocera Corp Liquid crystal display device
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