JPH08179350A - Liquid crystal display device - Google Patents

Abstract

PURPOSE: To provide a liquid crystal display device having high quality and high reliability. CONSTITUTION: In this liquid crystal display device 16, a wiring board 5 is juxtaposed with the lower glass base plate 3 of a pair of glass base plates 2 and 3 stuck through a liquid crystal and having a display area 4 so that the end faces forming a base plate connection part may be opposed to each other, a metallic plate 17 extended from the wiring board 5 is disposed on the back surface of the lower glass base plate 3, and an IC 8 for driving is arranged in the non-display area 9 of the lower glass base plate 3 or the wiring board 5, and the IC 8 and the base plate connection part are coated with a protective resin 15. A through-hole 18 is formed at the part of the metallic plate 7 corresponding to the base plate connection part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device.

[0002]

2. Description of the Related Art A conventional liquid crystal display device 1 is shown in FIGS. 5 to 7, FIG. 5 is a plan view thereof, and FIGS. 6 and 7 are an enlarged plan view and an enlarged sectional view of an area A shown in FIG. 5, respectively. Is.

In the liquid crystal display device 1, liquid crystal is sealed between the upper glass substrate 2 and the lower glass substrate 3, and the display electrodes are arranged on the inner surfaces of the liquid crystal so that the display electrodes are orthogonal to each other. Then, on the lower glass substrate 3, wiring boards 5 such as printed boards are arranged side by side so that their end surfaces face each other, and the lower glass substrate 3 and the wiring board 5 are placed on a metal plate 6 made of stainless steel or the like. It is fixed by the adhesive resin 7. The driving ICs 8 are arranged on the wiring substrate 5 and the lower glass substrate 3, and the display electrodes 4 are arranged on the lower glass substrate 3.
Is connected to the output side wiring 10 provided in the non-display area 9, and a bonding pad 11 is also formed on the wiring board 5. The terminals of the driving IC 8 are connected to the terminals of the bonding pad 10 and the bonding pad 11 of the output side wiring by the wire bonding 12. Reference numeral 13 is a coordinate recognition marker for mounting an IC or for wire bonding to an IC terminal.

[0004]

However, in the liquid crystal display device 1 having the above structure, when the lower glass substrate 3 and the wiring substrate 5 are juxtaposed so that their end faces face each other, a gap 14 of 0.4 mm or less occurs. When the thermosetting protective resin 15 covers the driving IC 8 and the gap 14 in this state as shown in FIG. 8, the protective resin 15 does not enter the gap 14 and bubbles are formed. When the protective resin 15 is subsequently heated to cure it, the bubbles expand and the protective resin 15 bursts, which causes a portion of the protective resin 15 to rise, and as a result, the raised portion rises when the liquid crystal panel is assembled. There is a problem of hitting other members such as a backlight (for example, a light guide plate or a light diffusing plate, a fluorescent tube or a reflecting plate). In addition, there is a problem that the driving IC 8 and the metal film on the lower glass substrate 3 are exposed to the outside air and corrode.

Therefore, an object of the present invention is to prevent the driving IC and wiring from being corroded so as not to interfere with other members such as a backlight when the liquid crystal panel is assembled.

[0006]

In a liquid crystal display device of the present invention, a wiring board is connected to one glass substrate of a pair of glass substrates having a display area bonded via liquid crystal, and a substrate connecting portion. Are arranged side by side so that the end faces that form each other face each other, a metal plate extending from the wiring substrate is arranged on the back surface of one glass substrate, and the glass plate is driven on the non-display area of one glass substrate or on the wiring substrate. In the configuration in which the driving IC and the driving IC and the board connecting portion are covered with resin, a through hole or a notch is formed in a portion of the metal plate corresponding to the board connecting portion.

[0007]

According to the liquid crystal display device of the invention, the substrate connecting portion can be formed by arranging the one glass substrate and the wiring substrate side by side so that the end faces of both are opposed to each other. Through-holes or notches are formed in this structure. According to this configuration, when the driving IC and the substrate connecting portion are covered with resin, the inside of the substrate connecting portion communicates with the outside air through the through-holes or notches. Therefore, the board connecting part does not become blocked, and even if the resin is cured by heat, bubbles do not occur and the resin does not rise, and as a result, it interferes with other members such as a backlight when assembling the liquid crystal panel. There is no extra stress. Further driving IC
The metal film on the other glass substrate does not corrode.

[0008]

1 is a plan view of the liquid crystal display device 16 of the present invention, FIG. 2 is an enlarged plan view of a region B shown in FIG. 1, and FIG. It is sectional drawing of the cutting plane line XX in the inside. The same members as those of the conventional liquid crystal display device 1 are designated by the same reference numerals.

In the liquid crystal display device 16, liquid crystal (not shown) is provided between the upper glass substrate 2 which is the common side glass substrate and the lower glass substrate 3 which is the segment side glass substrate by a sealant (not shown). And the display electrodes are arranged on the inner surfaces of the upper and lower glass substrates 2 and 3 so as to be orthogonal to each other to form a display region 4. By arranging the wiring boards 5 such as printed boards in parallel on the lower glass substrate 3 so that their end surfaces face each other, the above-mentioned board connecting portion can be formed and the wiring board 5 can be placed on the metal plate 17 made of stainless steel (SUS) or the like. The glass substrate 3 and the wiring substrate 5 are attached and fixed with a tape (for example, No. 3161-F [black one-sided tape] and No. 5915 [double-sided tape] manufactured by Nitto Denko Corporation), and the black adhesive resin layer 7 is fixed. Intervene.

With the above structure, a gap 14 of 0.4 mm or less is formed between the lower glass substrate 3 which is the substrate connecting portion and the wiring substrate 5, and the metal plate corresponding to this gap 14 is formed. Through hole (or notch) in 17 parts
18 is formed. As the through hole 18, there is, for example, one in which several tens of holes are arranged along the gap 14.

Then, the driving ICs 8 are arranged on the wiring board 5 and the lower glass substrate 3, and the display electrodes 4 are connected to the output side wirings 10 provided in the non-display area 9 of the lower glass substrate 3. Further, the input side wiring 11 is also formed on the wiring board 5.
The terminals of the driving IC 8 are connected to the terminals of the output side wiring 10 and the input side wiring 11 by wire bonding 12 with Au wires.

The wiring board 5 has, for example, 1 inside the board.
Bus line group having a multi-layer wiring structure capable of forming one or more kinds of wiring layers and / or a structure in which wiring layers are formed on both main surfaces, and having a power supply and a signal line necessary for driving the driving IC 8 Is wired. If necessary, a power source,
Each system such as logic may be wired for each layer, or various power supplies and signal processing circuits supplied from the outside may be mounted.

Thus, according to the liquid crystal display device 16 having the above structure, as shown in FIG. 4, when the thermosetting protective resin 15 covers the driving IC 8 and the gap 14, the through hole 18 is formed in the metal plate 17. Since it is formed, the protective resin 15
When a part of the resin penetrates into the gap 14 and then is heated to cure the protective resin 15, a gas remaining in the resin is generated, and even if the resin itself expands, the expansion pressure of the gas expands to the through hole 18. Since it escapes, the resin does not rise even partially, and as a result, it does not interfere with other members such as a backlight when the liquid crystal panel is assembled.
8 and the metal film on the lower glass substrate 3 are not exposed to the outside air and do not corrode.

The present invention is not limited to the above embodiments, and various modifications and improvements can be made without departing from the scope of the present invention.

[0015]

As described above, according to the liquid crystal display device of the present invention, a substrate connecting portion can be formed by arranging one of the glass substrate and the wiring substrate side by side so that their end faces face each other. However, since the through hole or the cutout is formed in the metal plate, even if the resin is coated on the driving IC and the board connecting portion, the inside of the board connecting portion and the outside air communicate with each other through the through hole or the notch. , The board connecting part does not become closed, so that even if the resin is cured by heat, bubbles do not occur and the resin does not rise, and it does not interfere with other members such as the backlight when assembling the liquid crystal panel and extra stress is applied. In addition, the driving IC and the metal film on the one glass substrate are not corroded, and as a result, a high quality and highly reliable liquid crystal display device can be provided.

[Brief description of drawings]

FIG. 1 is a plan view of a liquid crystal display device of an example.

FIG. 2 is an enlarged view of a main part of the liquid crystal display device according to the embodiment.

FIG. 3 is a cross-sectional view of a main part of a liquid crystal display device of an example.

FIG. 4 is a cross-sectional view of a main part of a liquid crystal display device of an example.

FIG. 5 is a plan view of a conventional liquid crystal display device.

FIG. 6 is an enlarged view of a main part of a conventional liquid crystal display device.

FIG. 7 is a cross-sectional view of a main part of a conventional liquid crystal display device.

FIG. 8 is a cross-sectional view of a main part of a conventional liquid crystal display device after applying a protective resin.

FIG. 9 is a cross-sectional view of a main part of a conventional liquid crystal display device after a protective resin is heated and cured.

[Description of sign]

 2 Upper glass substrate 3 Lower glass substrate 4 Display area 5 Wiring board 7 Black adhesive resin layer 8 Driving IC 9 Non-display area 10 Output side wiring 11 Input side wiring 12 Wire bonding 14 Gap 15 Protective resin 16 Liquid crystal display device 17 Metal plate 18 through holes

Claims (1)

[Claims] 1. A wiring substrate is arranged side by side with respect to one glass substrate of a pair of glass substrates having a display region bonded together via liquid crystal so that end faces forming a substrate connecting portion face each other. A metal plate extending from the wiring substrate on the back surface of the one glass substrate, and a driving IC on the non-display area of the one glass substrate or on the wiring substrate. A liquid crystal display device in which a substrate connecting portion is covered with resin, wherein a through hole or a notch is formed in a portion of a metal plate corresponding to the substrate connecting portion.