JP3206613B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly, to measuring an electrical characteristic by mounting a surface-mounted semiconductor device on an IC socket and bringing its lead into contact with a probe of the IC socket. The positioning means.

[0002]

2. Description of the Related Art A surface-mount type semiconductor device (3) (for example, a Quard Flat Pac) having a plurality of L-shaped curved leads (2) projected from a side wall surface of a resin exterior part (1) in an aligned state.
As shown in FIG. 3, a worker uses an insertion tool (not shown) such as a suction pen or tweezers to insert an IC socket (4) before mounting.
After the cover (6) is closed, the positioning force is fixed by the pressing force, the lead (2) is brought into contact with the probe (5), and then the current is supplied between the two. Is used to measure the electrical characteristics.

[0003]

In recent years, as the miniaturization of the surface mount type semiconductor device (3) has progressed, an IC socket (4) used for measuring its electrical characteristics has been developed.
Is also downsized. Therefore, when an operator attempts to position and fix the semiconductor device (3) on the narrow receiving surface (4A) of the miniaturized IC socket (4) using the suction pen or the tweezers, the tip of the lead (2) and Since the space between the IC socket (4) and the side wall portion (4B) of the chamber is narrow, the operability of the insertion tool is poor, and there are problems such as troublesome work and poor positioning accuracy. When the holding lid (6) is closed and a pressing force is applied to the semiconductor device (3) with the positioning error, the leading end of the lead (2) is hooked on the chamber side wall (4B), and the lead (2) is caught on the lead (2). Defects such as twisting and bending occur.

[0004]

As a means for solving the above-mentioned problems, the present invention is directed to a semiconductor device in which a probe in contact with a lead of a semiconductor device is arranged on a bottom wall surface of a receiving table. A pocket-shaped clearance space for accommodating the leads of the semiconductor device is formed between the side wall surface rising in the upright state and the side wall portion of the resin exterior portion of the semiconductor device supplied on the receiving table, and An IC socket characterized in that an L-shaped positioning member extending along mutually perpendicular side wall surfaces of a resin exterior part of the semiconductor device is arranged above the escape space inside the side wall surface. It is.

Further, according to the present invention, an automatic positioning means for a semiconductor device is provided on the side wall surface rising upright from the bottom end inside the pedestal of the IC socket or on the bottom wall surface of the pedestal outside the system. A negative pressure suction hole is provided in communication with the negative pressure suction source.

[0006]

After the semiconductor device has been supplied onto the bottom wall of the pedestal constituting the IC socket, the leads are positioned in the pocket-shaped clearance space, and the side walls of the resin exterior portion orthogonal to each other are positioned above the clearance space. It is brought into close contact with the L-shaped positioning member provided on the IC socket side. As a result, the semiconductor device is positioned and fixed at the proper position, and its lead is connected to the IC.
Contact the probe that is aligned on the bottom wall of the socket.
At this time, by using the intake air from the negative pressure suction hole provided on the side wall surface or the bottom wall surface of the IC socket,
The semiconductor device automatically moves from an arbitrary supply position to a stationary position defined by the L-shaped positioning member,
Obtain a regular measurement position with the lead facing directly above the probe.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A and FIG.
An embodiment of the present invention will be described with reference to FIG. still,
In the following description, the same constituent members as those in FIG.

In the present invention, as a basic structure, as shown in FIGS. 1A and 1B, an upright state is provided from an inner bottom end (11A) of a receiving stand (11) constituting an IC socket (10). The side wall surface (12) rises and the side wall surface (12)
And a space for accommodating the lead (2) of the semiconductor device (3) between the resin mounting portion (3A) and the side wall portion of the surface-mount type semiconductor device (3) supplied onto the receiving stand (11). A pocket-shaped escape space (13) is formed. In addition, two side wall surfaces (14) (15) of the resin exterior part (3A) that are orthogonal to each other, above the escape space (13) inside the bottom end part (11A) of the upper surface of the receiving stand (11). An L-shaped positioning member (16) extending along is arranged.

Further, the semiconductor device (3) supplied on the cradle (11) is connected to a lead (5) corresponding to the lead (2).
As shown in FIG. 2 (A), the IC socket (10) stands upright from the inner bottom end (11A) of the cradle (11) because the IC socket (10) is automatically sucked and fixed at a predetermined position facing the same. A negative pressure suction hole (17) communicating with a negative pressure suction source (not shown) provided outside the system is provided on a side wall surface (12) that rises at the bottom. In FIG. 2A, the negative pressure suction hole (17) is provided so as to open on the side wall surface (12) of the receiving base (11). As shown in B), it can be provided on the bottom wall surface (11B) of the cradle (11).

Hereinafter, a method of using the IC socket (10) according to the present invention will be described. The surface mount type semiconductor device (3) (for example, Quard Flat Packag), which is the component to be measured, is provided on the bottom wall (11B) of the cradle (11) by using an appropriate supply means.
After supplying e), a negative pressure suction force is applied to the semiconductor device (3) by utilizing the intake air from the negative pressure suction hole (17).
As a result, the semiconductor device (3) moves L from an arbitrary supply position.
It automatically moves to the rest position defined by the V-shaped positioning member (16), and the inner wall surface (1A) of the resin exterior part (3A).
4) Stop with (15) in close contact with the wall surface of the L-shaped positioning member (16). By this automatic movement, the semiconductor device (3) can cause the lead (2) to face directly above the corresponding tracing stylus (5), and the measurement of the electrical characteristics is started in this state. The negative pressure suction hole (17) may be provided on the bottom wall surface (11B) of the receiving table (11) or may be used in combination with the side wall surface (12). In this case, FIG.
As shown in (1), the use of the holding lid (6) can be omitted.

[0011]

According to the present invention, the use of the L-shaped positioning member (16) and the negative pressure suction hole (17) allows the IC socket (10) to be miniaturized with the downsizing of the surface-mount type semiconductor device (3). Nevertheless, the semiconductor device (3) automatically moves to a normal measurement position where the lead (2) and the tracing stylus (5) face each other, and then stops in the positioning state. As a result, the time for attaching and detaching the semiconductor device (3) to and from the IC socket (10) is greatly reduced. Further, after the semiconductor device (3) is supplied onto the pedestal (11), it is not pressed by the holding lid (6) while the positioning is poor, which is a problem in the conventional IC socket (4). There is almost no quality defect such as twisting or bending of the lead (2), and the product yield is improved.

[Brief description of the drawings]

FIG. 1A is a longitudinal sectional view showing an embodiment of an IC socket according to the present invention, and FIG. 1B is a top view showing an embodiment of the IC socket according to the present invention.

FIG. 2A is a longitudinal sectional view showing another embodiment of the IC socket according to the present invention, and FIG. 2B is a longitudinal sectional view showing still another embodiment of the IC socket according to the present invention.

FIG. 3 is a longitudinal sectional view of a conventional IC socket.

[Explanation of symbols]

 REFERENCE SIGNS LIST 2 lead 3 surface-mount type semiconductor device 3A resin exterior part 5 probe 11 receiver 11A inner bottom end of receiver 11B bottom wall of receiver 12 side wall of receiver 13 pocket-shaped clearance space 16 L-shaped positioning Member 17 Negative pressure suction hole

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/32 H01R 33/76

Claims (3)

(57) [Claims] 1. An IC socket arranged in line with a bottom wall of a receiving table in contact with a lead of a semiconductor device, wherein the side wall surface rises upright from an inner bottom end of the receiving table.
A pocket-shaped clearance space for accommodating the leads of the semiconductor device is formed between the semiconductor device and the side wall portion of the resin exterior portion of the semiconductor device supplied onto the receiving table, and the clearance space is formed inside the side wall surface. An L-shaped positioning member extending along side walls orthogonal to each other of the resin exterior of the semiconductor device. 2. The positioning and suction means of the semiconductor device, comprising a negative pressure suction hole in communication with a negative pressure suction source provided outside the system, on a side wall surface rising upright from an inner bottom end of the receiving table. The IC socket according to claim 1, further comprising: 3. The semiconductor device according to claim 1, wherein a bottom surface of said receiving table is provided with a positioning suction means for said semiconductor device comprising a negative pressure suction hole in communication with a negative pressure suction source provided outside the system. 2. The IC socket according to 1.