JP2780210B2 - Jig for holding integrated circuits - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a jig for holding an integrated circuit, and in particular, to correct the bending and displacement of the terminal even in an integrated circuit in which fine terminals are arranged at a small pitch due to high integration. The present invention relates to a holding jig for an integrated circuit, which is configured so that productivity is improved by configuring the holding jig so that the holding jig can be applied to a test process while holding the jig.

Many types of external connection terminals have been put into practical use in integrated circuits. In particular, the external connection terminals are offset from one side of the package after projecting from the peripheral surface of the package in four directions. QFP (Quad-Flat-Pac
A SOP (Small-Outline-Package) type, in which the terminal protrudes in two opposite directions from the package peripheral surface and is bent in the same manner as described above, is often used.

[0003] In such an integrated circuit, the portion of the external connection terminal protruding outside the package is easily deformed by an external force. Therefore, storage, transfer, test work, and the like are performed with the external connection terminal housed in a dedicated holding jig for protecting the terminal. Like that.

[0004]

2. Description of the Related Art FIG. 2 is a view for explaining the structure of a conventional holding jig. In the figure, a holding jig corresponding to a QFP type integrated circuit will be described as an example.

In the figure, the integrated circuit 1 held by a required holding jig is projected to four sides from the peripheral surface of each side of the rectangular package 1a and then is offset-bent to one surface (the lower surface in the figure) of the package 1a. In addition, a plurality of external connection terminals 1b are formed.

[0006] On the upper surface 2a side of a square plate-shaped holding jig 2 made of a resin molded product for holding the integrated circuit 1 in an inverted state, each of the external connection terminals of the integrated circuit 1 that are offset bent. A square recessed hole having a size corresponding to the area A (area indicated by a chain line in the figure) excluding the tip area 1b 'of 1b
2b is formed, and a step surface 2c having a size substantially equal to that of the package 1a is formed at a central portion thereof as a stage on which the integrated circuit 1 is mounted and slightly protrudes from the bottom surface of the recessed hole 2b.

Further, on the peripheral wall of the recessed hole 2b, a position corresponding to the tip region 1b 'of each external connection terminal 1b is placed so that the package 1a of the integrated circuit 1 which is turned upside down can be inserted into the vicinity of the step surface 2c. Groove 2d into which the tip region 1b 'can be inserted individually
Are formed with partition walls 2e.

The through holes 2f formed at the four corners of the holding jig 2 are holes for positioning related to a test device and the like described later. Then, when the integrated circuit 1 in a state of being turned upside down as shown by the arrow B is inserted into the holding jig 2 by, for example, a vacuum suction tool (not shown), the package of the integrated circuit 1 is packaged.
When 1a is located in the vicinity of the step surface 2c, as shown in the partially enlarged view (a), the tip region 1b 'of the external connection terminal 1b located between the partition walls 2e is mounted in contact with the bottom surface of the groove 2d. In this case, even if each of the external connection terminals 1b is slightly bent or deformed before being inserted into the holding jig 2, the external connection terminals 1b are corrected by the partition walls 2e, so that they are held in a stable state.

Therefore, by storing or transferring the integrated circuit 1 in such a state, it is possible to suppress bending or deformation of each external connection terminal 1b due to external force. On the other hand, the holding jig 2
Measuring head 3 for testing integrated circuit 1 held in
Is integrated with a measuring device (not shown) connected to the control unit.

Particularly, in this case, the measuring head 3 retreats when its tip is pressed to each position of the end face 3a corresponding to the groove 2d of the holding jig 2, and returns when the pressing is released. The probe pin 4 which returns to the initial position is connected to the control unit, and required characteristics can be tested with an electric signal transmitted and received by the probe pin 4.

A guide pin 5 provided at a position corresponding to the through hole 2f of the holding jig 2 so as to protrude from the end face 3a is for positioning the holding jig 2. Therefore,
By fitting the holding jig 2 holding the integrated circuit 1 and the measuring head 3 as shown by the arrow C by the above-described positioning means, each probe pin 4 can correspond to the tip region 1b of the corresponding external connection terminal 1b. 'To test the required characteristics of the integrated circuit 1.

In the holding jig 2 having such a configuration, storage, transfer, and test operations can be performed while the external connection terminals are protected, which is efficient.

[0013]

However, as the degree of integration of the integrated circuit increases and the number of external connection terminals increases, the thickness of the partition wall 2e must be reduced.

This means that the partition 2e is weakened in strength and is easily broken, and in particular, in this case, the partition 2e
2e is located near the probe pin 4 of the measuring head 3 at the same time as being located at the tip region 1b 'of the external connection terminal 1b.

Accordingly, when the integrated circuit 1 is mounted, bending of the connection portion connection terminal or breakage debris of the partition wall 2e at the time of correcting the deformation, and relative movement between the holding jig 2 and the measuring head 3 and thus the probe pin 4 at the time of the test. The debris of the partition wall 2e due to the contact between the probe pin 4 and the partition wall 2a due to the displacement is reduced to the external connection terminal 1b.
When it adheres to the tip region 1b ', required test information may not be obtained.

In the holding jig having the conventional structure, required test information may not be obtained due to breakage debris of the external connection terminal interval wall which increases as the degree of integration as an integrated circuit increases, and an improvement in productivity is expected. There was a problem that I could not do that.

[0017]

SUMMARY OF THE INVENTION The object of the present invention is to provide an integrated circuit having a plurality of external connection terminals projecting from the package peripheral surface to the periphery in the same plane and then being bent to one side of the package. A jig for holding and holding an integrated circuit together with the external connection terminal so that an offset bending direction of the connection terminal is directed upward, wherein a partition separating the external connection terminals is mounted when the integrated circuit is mounted. The offset bent external connection terminals of the integrated circuit can be individually inserted into a region excluding its tip region at a position corresponding to each external connection terminal on the peripheral wall of the rectangular hole in which the integrated circuit can be positioned in the package region. The problem is solved by an integrated circuit holding jig constituted by a groove formed at a depth.

[0018]

[Function] If the holding jig is configured so that the partition wall 2e shown in FIG. 2 does not exist on the surface where the probe pin contacts the external connection terminal, at least the partition dust generated by the probe pin can be eliminated. Can be obtained reliably.

The closer the external connection terminal is to its root, the less the bend or deformation. Therefore, in the present invention, a partition wall separating each external connection terminal is formed in the vicinity of the root of the terminal, that is, on the inner wall surface of the square concave hole described with reference to FIG. The holding jig is formed by eliminating the partition wall which is located and forming a taper on the edge side of the partition wall such that the opening side is wider and narrower toward the back so that an integrated circuit can be inserted using the edge side of the partition wall as a guide. ing.

This means that not only can the positioning of the integrated circuit be easily performed when the integrated circuit is mounted, but also the generation of partition debris during the test can be suppressed. Therefore, even in the case of a highly integrated circuit, it can be easily mounted,
It is possible to realize a holding jig that can be held and that can reliably obtain required test information.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a structural diagram for explaining an example of a jig for holding an integrated circuit according to the present invention.
FIG. 2 is a cross-sectional view of (1-1) cut along a to a ′.

In the figure, a holding jig corresponding to a QFP type integrated circuit similar to FIG. 2 is described as an example, and therefore, the same members as those in FIG. 2 are denoted by the same symbols. As shown in FIG. 2, a square plate-shaped holding jig 11 made of a resin molded product for holding the integrated circuit 1 described in FIG.
And 11c are formed concentrically.

The inner rectangular hole 11b is large enough to cover the size of the integrated circuit 1 including the external connection terminals 1b, and has a depth of about half the thickness of the integrated circuit 1. also rectangular hole 11c, further dug down from the angular-shaped hole 11b by the peripheral wall 11c ₁ when dropped into the package 1a portion of the peripheral wall 11c ₁ is formed with a taper which narrows enough go to the bottom the integrated circuit 1 It is formed in such a size that it can be almost positioned.

The depth h of the rectangular hole 11c is (1-2)
It is set to be slightly larger than the height h ₁ from the package surface of the integrated circuit 1 shown in broken lines until the offset bend is tip area of the external connection terminals.

Furthermore in the peripheral wall 11c _1, the grooves 11c having a width the external connection terminal 1b to the respective positions corresponding to the external connection terminal 1b of the positioning integrated circuit 1 can be freely inserted in the width direction area _{a 2} is described in FIG. 2 by partition walls 11c ₃
Are formed up to a region corresponding to

[0026] Thus, when the integrated circuit 1 is reversed as described in FIG. 2 mounted on the holding jig 11, the root neighborhood of the external connection terminal 1b is partition walls 11c _3, as shown by (b) The terminal 1b is inserted into the groove 11c ₂ described above.
1b 'is in a state of being exposed on the bottom surface of the rectangular hole 11b which deviates from the groove 11c _2.

[0027] This means that the external connection terminal 1b simultaneously the integrated circuit 1 is automatically positioned in the peripheral wall 11c ₁ described above when mounting the integrated circuit 1 to the holding jig 11 is a groove
11c ₂ means that when the integrated circuit 1 held by the holding jig 11 is tested by the test apparatus described with reference to FIG. This indicates that there is no partition wall near the tip region 1b '.

[0028] Note that some bending or deformation of the external connection terminal 1b before being mounted on the holding jig 11 is corrected by the partition wall 11c _3, damage to the partition wall 11c ₃ which weakened thinner Even if a crack occurs, the debris remains in the terminal 1b, which is the test area.
Is not located in the front end region 1b 'of the.

Therefore, it is possible to realize a jig for holding an integrated circuit that can suppress bending and deformation of each external connection terminal 1b due to external force and obtain reliable test information in a test process.

[0030]

As described above, according to the present invention, even in an integrated circuit in which fine terminals are arranged at a small pitch due to high integration, the bending and displacement of the terminals are corrected and held, and the test process is performed in a state where the terminals are held. Thus, it is possible to provide an integrated circuit holding jig which can also be applied to the present invention.

In the description of the present invention, the case where the integrated circuit is of the QFP type is taken as an example. However, by providing grooves formed in the holding jig only on two opposite sides, the same applies to the case of an SOP type integrated circuit. The effect can be obtained.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating an example of a jig for holding an integrated circuit according to the present invention.

FIG. 2 is a diagram illustrating a configuration of a conventional holding jig.

[Explanation of symbols]

1 integrated circuit 1b external connection terminal 1b 'tip area 11 holding jig 11a upper surface 11b, 11c square hole 11c ₁ peripheral wall 11c ₂ groove 11c ₃ partition

Claims (2)

(57) [Claims] 1. An integrated circuit having a plurality of external connection terminals, which protrudes from the package peripheral surface to the periphery in the same plane and is bent to one side of the package by offset bending, the external connection terminals having an offset bending direction upward. A jig for accommodating and holding together with the external connection terminals such that the partition wall (11c ₃ ) for isolating between the external connection terminals is provided in the package area when the integrated circuit is mounted. in positions corresponding to the external connection terminals of the peripheral wall (11c ₁₎ of square holes (11c) capable of positioning the integrated circuit, the offset bend is the external connection terminals of the integrated circuit (1) (1b) is the individual Groove (11c ₂ ) formed to a depth that allows insertion to the area excluding the tip area (1b ′)
A holding jig for an integrated circuit, comprising: 2. A square hole for positioning said integrated circuit.
Peripheral wall of (11c) (11c ₁₎ is holding jig of the integrated circuit of claim 1 wherein characterized in that it is formed comprises a taper can be automatically positioned when mounting the integrated circuit.