JPH0536869A - Integrated circuit holding jig - Google Patents

Abstract

PURPOSE:To enable an integrated circuit holding jig to hold an integrated circuit correcting the deformation and bend of terminals and to be applied to a test process holding an integrated circuit by a method wherein partitioning walls which separate outer connection terminals from each other are composed of grooves which are formed deep enough to enable the outer connection terminals to be inserted so far as regions excluding their tip regions. CONSTITUTION:Grooves 11c2 wide enough to enable an outer connection terminal 1b to be freely inserted in a crosswise direction are provided to an peripheral wall 11c1 in position separating from each other by a partitioning wall 11c3 so as to correspond to the outer connection terminals 1b of the positioned integrated circuit 1. When the integrated circuit 1 is mounted on a holding jig 11, not only the circuit is automatically positioned by the peripheral wall 11c1 but also the outer connection terminals 1b are protected by the grooves 11c1. When the integrated circuit 1 held by the holding jig 11 is tested, a partitioning wall is not located close to the tip region 1b' of the outer connection terminal 1b which the, probe pin of a tester comes into contact with. Therefore, the outer connection terminals 1b are restrained from being bent or deformed by an external force, so that reliable test data earn be obtained in a test process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a jig for holding an integrated circuit, and particularly for the integrated circuit in which fine terminals are arranged at a small pitch due to high integration, the bending and displacement of the terminals can be corrected. The present invention relates to a holding jig for an integrated circuit in which productivity is improved by configuring the holding jig so that the holding jig can be applied to a test process while being held.

Many kinds of methods for forming external connection terminals have been put to practical use in integrated circuits. Among them, the external connection terminals project from the peripheral surface of the package in four directions and are then offset-bent to one side of the package. QFP (Quad-Flat-Pac
The kage) type and the SOP (Small-Outline-Package) type in which the terminals project from the package peripheral surface in two opposite directions and are offset-bent in the same manner as above are often used.

In such an integrated circuit, the portion of the external connection terminal projecting to the outside of the package is easily deformed by an external force, so that storage, transfer, test work, etc. are performed while being housed in a dedicated holding jig for protecting the terminal. I am trying.

[0004]

2. Description of the Related Art FIG. 2 is a diagram for explaining the structure of a conventional holding jig. In the figure, the case of a holding jig corresponding to a QFP type integrated circuit will be described as an example.

In the integrated circuit 1 held by a required holding jig in the drawing, the rectangular package 1a is offset-bent to one side (lower surface in the figure) of the package 1a after projecting in four directions from each side peripheral surface. A plurality of external connection terminals 1b are formed.

On the upper surface 2a side of a rectangular plate-shaped holding jig 2 made of a resin molded product for holding the integrated circuit 1 in a state of being turned upside down, offset-bent external connection terminals of the integrated circuit 1 are provided. A rectangular recessed hole having a size corresponding to a size region (a region shown by a dashed line in the figure) A excluding the tip region 1b ′ of 1b.
2b is formed, and a step surface 2c having a size substantially equal to that of the package 1a is formed in the center thereof so as to slightly project from the bottom surface of the recess hole 2b as a stage for mounting the integrated circuit 1.

Further, on the peripheral wall of the recessed hole 2b, the package 1a of the integrated circuit 1 which is turned upside down is placed at a position corresponding to the tip region 1b 'of each external connection terminal 1b so that the package 1a can be inserted up to near the step surface 2c. Groove 2d into which the tip region 1b 'can be inserted individually
Is formed with a partition wall 2e.

The through holes 2f formed at the four corners of the holding jig 2 are positioning holes for a tester or the like which will be described later. Therefore, when the integrated circuit 1 which is turned upside down as indicated by an arrow B is inserted into the holding jig 2 by a vacuum suction tool or the like (not shown), the package of the integrated circuit 1 is packaged.
When 1a is located in the vicinity of the step surface 2c, the tip region 1b 'of the external connection terminal 1b located between the partition walls 2e is mounted in contact with the bottom surface of the groove 2d as shown in the partially enlarged view (a). In this case, even if each external connection terminal 1b before being inserted into the holding jig 2 is slightly bent or deformed, it is corrected by the partition wall 2e, so that it is held in a stable state.

Therefore, by storing or transferring the integrated circuit 1 in such a state, it is possible to suppress the bending or deformation of each external connection terminal 1b due to an external force. On the other hand, the holding jig 2
Head 3 for testing the integrated circuit 1 still held in the
Is integrated with a measuring device (not shown) connected to the control unit.

Particularly in this case, the measuring head 3 is retracted when the tip is pressed to each position on the end face 3a corresponding to the groove 2d of the holding jig 2, and is returned when the pressing is released. The probe pin 4 that returns to the initial position is provided so as to be connected to the control unit, and a required characteristic can be tested by an electric signal transmitted and received by the probe pin 4.

The guide pin 5 provided at the position corresponding to the through hole 2f of the holding jig 2 so as to project from the end face 3a is for positioning the holding jig 2. Therefore,
By fitting the holding jig 2 holding the integrated circuit 1 and the measuring head 3 by the positioning means as shown by the arrow C, the tip region 1b of the external connection terminal 1b corresponding to each probe pin 4 respectively. The desired characteristics of the integrated circuit 1 can be tested in contact with the '.

The holding jig 2 having such a structure is efficient because it can be stored, transferred and tested while the external connection terminals are protected.

[0013]

However, the thickness of the partition wall 2e must be reduced as the number of external connection terminals increases as the degree of integration increases as an integrated circuit.

This means that the partition wall 2e is weakened in strength and is likely to be damaged.
2e is located at the tip region 1b 'of the external connection terminal 1b, and at the same time is located near the probe pin 4 of the measuring head 3.

Therefore, when the integrated circuit 1 is mounted, the bending of the connecting terminals of the connecting part and the broken pieces of the partition wall 2e at the time of correcting the deformation, and the holding jig 2 and the measuring head 3 and thus the probe pin 4 relative to each other during the test If the probe pin 4 and the partition wall 2a come into contact with each other due to the positional deviation, the broken wastes of the partition wall 2e are generated in the external connection terminal 1b
When it adheres to the tip region 1b ', it may not be possible to obtain the required test information.

With the conventional holding jig, required test information may not be obtained due to damage and debris on the external connection terminal spacing wall, which increases as the degree of integration of the integrated circuit increases. There was a problem that I could not do it.

[0017]

The above object is to provide an integrated circuit having a plurality of external connection terminals, which project from the peripheral surface of the package to the periphery in the same plane and are then offset-bent to one surface side of the package. A holding jig for an integrated circuit that accommodates and holds together with the external connection terminal such that the offset bending direction of the connection terminal faces upward, and a partition wall separating the external connection terminals is provided when the integrated circuit is mounted. The offset-bent external connection terminals of the integrated circuit can be individually inserted up to the area excluding the tip area thereof at positions corresponding to the external connection terminals of the peripheral wall of the rectangular hole that can position the integrated circuit in the package area. It is solved by a jig for holding an integrated circuit, which is constituted by a groove formed at a depth.

[0018]

If the holding jig is configured so that the partition 2e shown in FIG. 2 does not exist on the surface where the probe pin contacts the external connection terminal, at least the partition waste generated by the probe pin can be eliminated. You can definitely get it.

Further, the external connection terminal is less bent and deformed as it is closer to its root. Therefore, in the present invention, a partition wall separating each external connection terminal is formed in the vicinity of the root of the terminal, that is, on the inner wall surface of the rectangular recessed hole described in FIG. 2, so that the tip region of the terminal and the contact region with the probe pin are formed. The holding jig is constructed by eliminating the partition wall located and forming a taper on the edge side of the partition wall so that the opening side becomes wider and becomes narrower toward the inner side so that the integrated circuit can be inserted by using the edge side of the partition wall as a guide. ing.

This means that not only the positioning of the integrated circuit when the integrated circuit is mounted can be facilitated, but also the generation of partition waste during the test can be suppressed. Therefore, even in the case of a highly integrated integrated circuit, it can be easily mounted,
It is possible to realize a holding jig that can be held and surely obtains required test information.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a constitutional view for explaining an example of a holding jig for an integrated circuit according to the present invention, (1-1) is an overall perspective view, (1-2)
FIG. 3 is a cross-sectional view of (1-1) taken along a-a ′.

Since a holding jig corresponding to a QFP type integrated circuit similar to that shown in FIG. 2 is used as an example in the drawing, the same members as those in FIG. 2 are designated by the same reference numerals. A rectangular plate-shaped holding jig 11 made of a resin molded product for holding the integrated circuit 1 described in FIG. 2 in a state in which the integrated circuit 1 is turned upside down like FIG.
And 11c are formed concentrically.

The inner rectangular hole 11b has a size sufficient to cover the size of the integrated circuit 1 including the external connection terminal 1b and has a depth of about half the thickness of the integrated circuit 1. also rectangular hole 11c, further dug down from the angular-shaped hole 11b by the peripheral wall 11c ₁ when dropped into the package 1a portion of the peripheral wall 11c ₁ is formed with a taper which narrows enough go to the bottom the integrated circuit 1 It is formed in a size that can be almost positioned.

The depth h of the square hole 11c is (1-2)
The height h ₁ from the package surface of the integrated circuit 1 indicated by the broken line to the tip end region of the external connection terminal which is offset and bent is set to be slightly larger than the height h ₁ .

Furthermore in the peripheral wall 11c _1, the grooves 11c having a width the external connection terminal 1b to the respective positions corresponding to the external connection terminal 1b of the positioning integrated circuit 1 can be freely inserted in the width direction _{The area 2} is separated by the partition wall 11c ₃ and described in FIG.
Is formed up to the region corresponding to.

Therefore, when the integrated circuit 1 which has been turned upside down as described with reference to FIG. 2 is mounted on the holding jig 11, the partition 11c ₃ is separated near the root of each external connection terminal 1b as shown in FIG. While being inserted into the groove 11c ₂ described above, the distal region of the terminal 1b
1b 'is exposed on the bottom surface of the rectangular hole 11b which is out of the groove 11c ₂ .

This means that when the integrated circuit 1 is mounted on the holding jig 11, the integrated circuit 1 is automatically positioned by the peripheral wall 11c ₁ described above and at the same time each external connection terminal 1b is grooved.
11c ₂ is meant to be protected, and when the integrated circuit 1 held by the holding jig 11 is tested by the test device described with reference to FIG. This indicates that there is no partition near the tip region 1b '.

[0028] Note that some bending or deformation of the external connection terminal 1b before being mounted on the holding jig 11 is corrected by the partition wall 11c _3, damage to the partition wall 11c ₃ which weakened thinner Even if occurs, the broken chips are in the test area.
Is not located in the tip region 1b '.

Therefore, it is possible to realize a holding jig for an integrated circuit which can suppress the bending and deformation of each external connection terminal 1b due to an external force and can obtain reliable test information in the test process.

[0030]

As described above, according to the present invention, even in an integrated circuit in which fine terminals are arranged at a small pitch due to high integration, the bending and displacement of the terminals are corrected and held, and a test process is performed in the held state. It is possible to provide a jig for holding an integrated circuit that can be applied to the above.

In the description of the present invention, the case where the integrated circuit is of the QFP type is taken as an example, but by providing the grooves formed in the holding jig only on two opposite sides, the same applies to the case of the SOP type integrated circuit. The effect can be obtained.

[Brief description of drawings]

FIG. 1 is a configuration diagram illustrating an example of a jig for holding an integrated circuit according to the present invention.

FIG. 2 is a diagram illustrating a configuration of a conventional holding jig.

[Explanation of symbols]

1 Integrated circuit 1b External connection terminal 1b 'Tip area 11 Holding jig 11a Top surface 11b, 11c Square hole 11c ₁ Surrounding wall 11c ₂ Groove 11c ₃ Partition wall

Claims (2)

[Claims] 1. An integrated circuit having a plurality of external connection terminals, which project from a peripheral surface of a package to the periphery of the same surface and are offset-bent to one surface side of the package, wherein the offset bending direction of the external connection terminals is upward. A holding jig for an integrated circuit that accommodates and holds the external connection terminal together with the external connection terminal so that the partition wall (11c ₃ ) for separating the external connection terminal is located in the package area when the integrated circuit is mounted. The offset-bent external connection terminals (1b) of the integrated circuit (1) are individually arranged at positions corresponding to the external connection terminals of the peripheral wall (11c ₁ ) of the rectangular hole (11c) capable of positioning the integrated circuit. Groove (11c ₂ ) formed to a depth that allows insertion up to the area excluding the tip area (1b ′)
A jig for holding an integrated circuit, which is configured by 2. A square hole for positioning the integrated circuit.
2. The jig for holding an integrated circuit according to claim 1, wherein the peripheral wall (11c ₁ ) of the (11c) is formed with a taper that can be automatically positioned when the integrated circuit is mounted.