JP2536696B2 - Film carrier type carrier for semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for a film carrier type semiconductor device, and more particularly to a carrier for holding a film carrier type semiconductor device by hooking a fixing hook in a sprocket hole of the film carrier.

2. Description of the Related Art Film carrier type semiconductor device (IC)
The manufacturing process of will be described with reference to FIG. First, an insulating base film 1 made of a flexible resin such as polyimide, in which a sprocket hole 15 for carrying and positioning and a device hole 11 for accommodating a semiconductor chip 14 are provided.
A metal foil of copper or the like is attached onto the surface of the film 0, and the leads 12 and the pads 13 for electric selection having a desired shape are formed by patterning to form a film carrier. Next, the semiconductor chip 1 in which metal projections (bumps) are previously provided on the electrode terminals
4, the leads 12 of the film carrier and the bumps of the semiconductor chip 14 are bonded by thermocompression bonding or eutectic to complete the film carrier type IC 100.

The film carrier type IC 100 manufactured in this way is a pad 1 of a film carrier tape.
It is subjected to electrical screening and bias test through the contactor that contacts 3. In preparation for this type of test, the semiconductor chip 14 may be resin-sealed by potting the resin in order to ensure reliability and protect from mechanical shock.

When the film carrier type IC as described above is mounted on a printed circuit board, the leads are cut to a desired length, and then the semiconductor chip is fixed on the printed circuit board with an adhesive, and then the leads are printed on the printed circuit board. Outer bonding is performed on the bonding pad formed above.

Thus, in the film carrier type IC,
Bonding can be performed all at once regardless of the number of leads, so the bonding speed is fast. Also, since it is a tape-shaped film carrier, it is easy to automate the work, and it is smaller, thinner, and thinner than other semiconductor devices.
It is lightweight.

However, this film carrier type IC10
In the case of 0, the base film 10 forming the film carrier has flexibility, so that the leads formed on the surface of the base film 10 are easily deformed or broken. In order to mechanically protect and reinforce the film carrier type IC 100 to eliminate this defect, a film carrier type IC cut from a film carrier tape into individual pieces is mounted on an IC carrier (hereinafter simply referred to as a carrier). There is an increasing number of cases where products are subjected to manufacturing processes such as resin encapsulation and electrical sorting, or shipped.

As shown in FIGS. 6 (a) and 6 (b), a conventional carrier is a rectangular substrate 1 made of resin, an opening 3 provided in the center of the substrate 1, and an opening 3 A concave portion 4 provided around the portion 3 for holding the film carrier type IC, and a concave portion 4 opposed to the concave portion 4 with the opening 3 interposed therebetween are provided.
A fixing hook 5 inserted into the substrate, a direction display notch 9 provided at one of the corners of the substrate, and a first hole 2A into which a pin is inserted in accordance with the sprocket hole of the film carrier for positioning the IC. A second hole 2B for inserting a pin, if necessary, in accordance with the tooling hole 7 provided in the base film, and a carrier fixing notch 8 provided around the substrate 1 for positioning the carrier.
Etc.

The carrier constructed in this way is shown in FIG.
As shown in (a) and (b), a film carrier type IC
When the IC is mounted, there are one that completely fixes the IC and one that holds the IC in a slightly movable state.

Hook 5 for fixing the film carrier type IC
In the case of a carrier which is completely fixed by the method described above, the contact and the IC pad must be aligned with the carrier fixing notch in the electrical selection step, so that there is a drawback that the alignment accuracy is poor. On the other hand, in the case of holding the carrier while allowing it to move, after roughly aligning the contact and the pad with the carrier fixing notch 8, the final positioning is performed by the sprocket hole 15 or the tooling hole 7 of the film carrier. It can be done by putting a pin on it.
Therefore, in general, many carriers that allow this movement are used. When a film carrier tape having a width of 35 mm is used, the "movement allowance" here is 0.05 to 0.15 mm.

The fixing hook 5 provided on the carrier is
As shown in FIGS. 8 (a) to 8 (c), the film carrier is provided with a size having the above-mentioned allowance so as to be located substantially at the center of the sprocket hole 15 of the film carrier, or the width of the fixing hook 5 is reduced, Further, the center of the fixing hook is shifted to the outside of the center of the sprocket hole 15, that is, the interval between the opposing fixing hooks 5 is widened to prevent the margin from increasing.

[0010]

However, the above-mentioned carrier according to the prior art has a drawback that when the fixing hook 5 is inserted into the sprocket hole 15, the protrusion 5B formed on the upper portion of the carrier deforms the sprocket hole. is there. In particular, if the width of the fixing hook 5 is large, the sprocket hole 15 is largely deformed, so that the sprocket hole 15 is damaged or the leads are deformed. If the width of the fixing hook 5 is reduced as a measure against this, the deformation of the sprocket hole 15 is reduced when the fixing hook is inserted, but the clearance between the fixing hook 5 and the sprocket hole 15 is increased, and the sprocket hole 15 or the touring hole is increased. When the locating pin is inserted into 7, the locating pin may damage these locating holes, resulting in inaccurate positioning. When the fixing hook 5 is shifted to the outside and the margin is reduced, the deformation of the sprocket hole 15 becomes large when the fixing hook 5 is inserted as described above.

As a countermeasure against this, Japanese Patent Laid-Open No. 59-72746.
In Japanese Patent Laid-Open No. 61-90453 and Japanese Patent Laid-Open No. 61-90453, male,
A two-piece type carrier in which a film carrier type IC is sandwiched and used by using two carriers each having a female fixing hook has been proposed. However, in this case, since two carriers having the same shape are produced, there is a drawback that the cost is increased.

An object of the present invention is a film carrier type IC.
It is an object of the present invention to provide a film carrier type IC carrier capable of reducing the damage of the sprocket hole and the deformation of the leads by reducing the deformation of the sprocket hole of the film carrier which tends to occur during mounting.

[0013]

A carrier for a film carrier type semiconductor device of the present invention is a film carrier type carrier provided in an opening portion provided in a central portion of a rectangular substrate and in the substrate around the opening portion. A recess for holding the semiconductor device, a fixing hook provided in the recess so as to face the opening and inserted into a sprocket hole of the film carrier type semiconductor device, and an upper portion of the fixing hook. It has a protrusion provided and a protrusion provided on a side surface of the fixing hook so as to control a distance between the sprocket hole and the fixing hook.

[0014]

The present invention will be described below with reference to the drawings. 1A and 1B are a plan view and a sectional view taken along the line AA of the first embodiment of the present invention, and FIGS. 2A to 2C show the vicinity of the fixing hook of the first embodiment. It is a top view, a side view, and a front view.

Referring to FIGS. 1 (a) and 1 (b), a carrier according to the first embodiment of the present invention is composed of a rectangular substrate 1 made of resin or the like, and an opening 3 is formed at the center thereof. I have it. Around the opening 3, a recess 4 for holding the base film 10 of the film carrier type IC is formed.
Is provided. A plurality of fixing hooks 5 facing each other across the opening 3 and a first hole 2 aligned with a sprocket hole 15 of the film carrier are provided in the recess 4.
Second hole 2 aligned with A and touring hole 7
B and are provided. Further, a carrier fixing cutout 8 and a direction display cutout 9 are provided around the substrate 1.

2A to 2C, the fixing hook 5 has its center aligned with the center of the sprocket hole 15 of the base film 10, and its width W is about 1 of the width of the sprocket hole 15. It is formed to be / 3. Since the fixing hook 5 is located at the center of the sprocket hole 15 where the sprocket hole 15 is easily deformed and has a small width, there is a risk that the sprocket hole 15 may be damaged or the lead 12 may be deformed when holding the IC 100. Less.

Further, on the back side of each of the surfaces of the pair of fixing hooks 5 facing each other, a projection 6A having a tapered upper portion and a semicircular cross section is provided. Therefore, even if the width W of the fixing hook 5 is reduced, it is possible to freely control the margin between the IC 100 and the carrier, that is, the gap d between the sprocket hole 15 and the fixing hook 5. That is, in order to prevent the tooling hole 7 and the sprocket hole 15 from being damaged by the positioning pin when positioning the IC 100, the projection 6A has a gap d of 0.05 to 0.15 m.
It is controlled to be m. Moreover, this protrusion 6A is
The sprocket hole 15 is the protruding portion 5A of the fixing hook 5.
It is provided at a position where it does not come into contact with the end of the sprocket hole 15 even if it is deformed by. After the IC 100 is held by the carrier, the movement of the sprocket hole 15, that is, the IC 100 is restricted, and the distance d
I try not to make it larger than necessary.

1.42 mm square sprocket hole 15
For the IC 100 having the same, the center of the fixing hook 5 is the same as the center of the sprocket hole 15, and the width W of the fixing hook is 0.5 mm, the length L is 1.3 mm, and the projection 6
As a result of setting the thickness w of A to 0.35 mm, the resistance when the IC 100 is inserted into the carrier is small, and the damage of the sprocket hole 15 and the deformation of the lead 12 hardly occur. In addition, the margin between the IC 100 and the carrier is also within a proper range, and erroneous contact during electrical selection or the like does not occur.

Further, the protruding portion 5A on the upper portion of the fixing hook 5
As shown in FIG. 2 (c), since the taper is provided so that a large force is not suddenly applied to the sprocket hole portion during insertion, the fixing hook 5 is more easily inserted into the sprocket hole 15. It will be easier. If the taper angle is in the range of 20 to 40 degrees as a result of evaluation, a large force is not suddenly applied to the sprocket hole portion at the time of insertion, and the time during which the sprocket hole 15 is deformed can be very short. I understand. Therefore, by forming the taper on the protrusion 5A so as to have this angle, it is possible to further reduce the occurrence of breakage of the sprocket hole 15 and deformation of the lead 12.

In the first embodiment described above, as shown in FIG. 2 (a), the case where the corner portion at the tip of the protruding portion 5A has an angular shape has been described, but the corner portion should be rounded. May be. In this case, the force applied to the sprocket hole 15 when the fixing hook 5 is inserted is further reduced.

Referring to FIGS. 3 (a) and 3 (b), in the second embodiment of the present invention, the protrusion 6B formed on the side surface of the fixing hook 5 has a triangular sectional shape. . The other structure is the same as that of the first embodiment. Also in the second embodiment, the protrusion 6B properly controls the gap d with the sprocket hole.

Referring to FIGS. 4A and 4B, in the third embodiment of the present invention, the projection 6C has a trapezoidal cross section. Also in the third embodiment, since the gap d between the tip of the trapezoidal protrusion 6C and the end of the sprocket hole 15 is appropriately controlled, damage to the sprocket hole and deformation of the lead 12 can be eliminated.

[0023]

As described above, according to the present invention, a protrusion is provided on the side surface of the fixing hook of the carrier for a film carrier type semiconductor device, and a taper is provided on the protruding portion above the fixing hook. This has the effect of preventing damage to the sprocket holes of the semiconductor device and deformation of the leads.

[Brief description of drawings]

FIG. 1 is a plan view and a sectional view of a first embodiment of the present invention.

FIG. 2 is a top view, a side view, and a front view of the vicinity of a fixing hook according to the first embodiment.

3A and 3B are a top view and a side view near a fixing hook according to a second embodiment of the present invention.

FIG. 4 is a top view and a side view of the vicinity of a fixing hook according to a third embodiment of the present invention.

FIG. 5 is a top view of a carrier tape for explaining a film carrier type IC.

6A and 6B are a plan view and a cross-sectional view of a conventional example.

7A and 7B are a plan view and a sectional view when a film carrier type IC is mounted on a conventional example.

FIG. 8 is a top view, a side view, and a front view in the vicinity of a fixing hook of a conventional example.

[Explanation of symbols]

 1 Substrate 2A First Hole 2B Second Hole 4 Recess 5 Fixing Hook 5A, 5B Projection 6A to 6C Protrusion 7 Tooling Hole 8 Carrier Fixing Notch 9 Direction Display Notch 10 Base Film 11 Device Hole 12 Lead 13 Pad 14 semiconductor chip 15 sprocket hole

Claims (9)

(57) [Claims] 1. An opening provided in a central portion of a rectangular substrate, a recess provided around the opening for holding a film carrier type semiconductor device, and the opening in the recess. A fixing hook that is provided so as to be opposed to each other and is inserted into a sprocket hole of the film carrier type semiconductor device, a protrusion provided on an upper portion of the fixing hook, the sprocket hole and the fixing hook. A carrier for a film carrier type semiconductor device, comprising: a protrusion provided on a side surface of the fixing hook so as to control the distance between the two. 2. The carrier for a film carrier type semiconductor device according to claim 1, wherein the protrusion provided on the upper portion of the fixing hook is provided with a taper for facilitating insertion into the sprocket hole. 3. The carrier for a film carrier type semiconductor device according to claim 1, wherein the protrusion is provided on the facing surface side of the fixing hook. 4. The carrier for a film carrier type semiconductor device according to claim 1, wherein the protrusion is provided on the back side of the facing surface of the fixing hook. 5. The carrier for a film carrier type semiconductor device according to claim 1, wherein the protrusion is provided on a side surface of at least four fixing hooks at a corner portion of the recess. 6. The carrier for a film carrier type semiconductor device according to claim 5, wherein the projection has a semicircular cross-sectional shape. 7. The carrier for a film carrier type semiconductor device according to claim 5, wherein the protrusion has a triangular cross-sectional shape. 8. The carrier for a film carrier type semiconductor device according to claim 5, wherein the projection has a trapezoidal sectional shape. 9. The carrier for a film carrier type semiconductor device according to claim 5, wherein a taper is provided on an upper portion of the protrusion.