JPH05114661A - Ic carrier - Google Patents

Abstract

PURPOSE:To swiftly and easily mount an IC package without deformation of its leads by providing a plurality of narrow grooves in parallel in the major face of a lead support seat and isolating each lead support point thereby. CONSTITUTION:An IC package is mounted and held on an IC carrier in the following procedure: (1) The IC package body 11, almost square, is placed in the IC housing in the IC carrier so that the sides of the IC package are parallel to those of the IC carrier, (2) a group 13 of leads projected sideways from each side of the IC package body 11 is respectively placed on a corresponding lead support face 15 of a lead support seat 14 where the leads are so located that each of them is placed on each support point isolated by narrow grooves 16, and (3) each corner of the IC package body is engaged, pressed and held by a lock pawl 17 from above. This enables easily and swiftly mounting an IC package on an IC carrier, causing no leads 13 to deform.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC carrier that holds an IC during transportation and handling.

[0002]

2. Description of the Related Art Generally, when an IC device such as an IC package is carried by itself, the main body and leads may be damaged. Therefore, a jig called an IC carrier is used as a medium for carrying or carrying. I like this
The C carrier has a function of protecting the IC body and leads during transportation and handling of an IC package and the like. As shown in FIG.
It has a basic configuration in which it has a C accommodation portion 2, and a lead support seat 3 is provided around the accommodation portion 2, and engagement restraint means such as lock claws are provided at four corner positions around the accommodation portion. .. As shown in FIG. 5, a plurality of slots 4 are provided in parallel on the lead support seat 3 at regular intervals (pitch). When the IC package 5 is mounted, the IC housing portion 2 is provided with an IC. The package body 6 is housed, the corners thereof are held by the engaging and holding means, and the groups of leads 7 projecting laterally from the IC package body 6 are individually housed in the respective slots 4. Is being done.

Further, as shown in FIG. 6, there is provided a lead support seat 3 having a flat supporting surface 8 without slots, and the flat supporting surface 8 is collectively provided for each group of leads 7 on each side. IC carriers configured for mounting have also been developed.

[0004]

However, each of these IC carriers has the following problems.

That is, the IC carrier having the lead support seat 3 with the slot 4 as shown in FIG.
When the pitch is relatively large and has sufficient rigidity, it is useful in preventing the deformation of the leads 7 and has been conventionally used. However, in lead-projection type IC packages that have been widely used in recent years, the pitch of the leads 7 has become extremely small, and along with this, the leads 7 themselves are also fine and easily deformed.
Even in the IC carrier that inevitably supports this, it is necessary to make the pitch of the slots 4 minute and to form the partition wall 9 between the slots 4 extremely thin. Therefore, not only is more and more advanced molding technology required for mass production of IC carriers, but it also takes time and effort to individually house each lead 7 in the corresponding slot 4 when mounting the IC package 5. there were. Further, at this time, it is necessary to align the lead 7 and the slot 4 by visual measurement, but if the visual measurement is erroneous, the lead 7 is pushed in a state of riding on the slot partition wall 9, and thus the lead 7 is deformed. It was

Further, in the IC carrier having the lead support seat 3 as shown in FIG. 6, the lead 7 is not deformed due to the contact of the lead 7 with the slot partition wall 9, but the lead 7 subjected to the solder treatment is When the lead supporting seat 3 comes into contact with the supporting surface 8, the solder is transferred and attached to the supporting surface 8, and the leads 7 are short-circuited (short-circuited) by this solder.
However, there is a problem in that it becomes defective during the electrical inspection.

The present invention has been made in order to solve these problems, and the mounting work can be carried out extremely quickly and easily without causing deformation of the leads of ICs such as IC packages, and the transition soldering is used. It is an object of the present invention to provide an IC carrier that does not cause a short circuit between leads.

[0008]

An IC carrier according to the present invention has a lead support seat for supporting a lead group laterally protruding from the IC body, around a housing portion for housing a body of the IC. Further, in the IC carrier including means for retaining the IC, a plurality of narrow grooves are provided in parallel on the main surface of the lead support seat, and each supporting portion of the lead is separated by the narrow grooves. And

[0009]

In the IC carrier of the present invention, the main surface of the lead support seat for supporting the IC lead group serves as the lead support surface as it is, and a plurality of fine grooves are formed in parallel in the surface, and these fine grooves are used. The support portion of each lead is separated. Therefore, when mounting the IC, after accommodating the IC main body in the accommodating portion, the leads protruding laterally from the main body are
Since it is only necessary to separately mount one lead on each support portion of the lead support seat, the mounting work can be performed easily and quickly. Further, at this time, the lead is not deformed.

Furthermore, when a solder-treated lead is supported, the solder that has moved from the lead to the support surface does not migrate to another lead and adheres to another lead, causing an electrical failure due to a short between the leads. To be prevented.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of an embodiment of an IC carrier according to the present invention, and FIG. 2 is an enlarged cross-sectional view of a main part thereof. Further, FIG. 3 shows the IC carrier of the embodiment
It is a top view which shows the state which mounted the C package.

In the drawings, reference numeral 10 indicates a thin, rectangular base, and an IC housing 12 for housing a main body 11 of an IC package is recessed in the center thereof. Also the base 10
A lead support seat 14 that supports a group of leads 13 projecting laterally from two sides or four sides of the IC package body 11 is provided on the main surface of the so as to surround the IC housing portion 12. A plurality of thin grooves 16 are provided in parallel on the support surface 15, which is the main surface of the lead support seat 14, at regular intervals. Further, four lock claws 17 are provided on the main surface of the base 10 around the IC housing portion 12, respectively.

In order to mount and hold the IC package on the IC carrier of the embodiment constructed as described above, the substantially rectangular IC package body 11 is arranged so that the sides are parallel to each other.
A group of leads 13 housed in the IC housing 12 of the C carrier and projecting laterally from each side of the IC package body 11 are placed on the corresponding supporting surface 15 of the lead support seat 14 for each group row, and One piece is placed on each of the separated support portions. Further, the lock claws 17 are engaged with the four corners of the IC package body 11 from above to press and lock them. Thus, the work of mounting the IC package on the IC carrier can be performed extremely easily and quickly without deforming the leads 13. Further, even when the leads 13 are soldered, the leads 13 are not short-circuited by the solder transferred to and attached to the lead support surface 15, and the occurrence of defects in electrical inspection is prevented.

[0015]

As described above, according to the IC carrier of the present invention, the group of leads protruding laterally from the main body of the IC are collectively placed on the supporting surface of the lead support seat for each group and supported. To be done. Therefore, the conventional slotted IC
As in the case of the carrier, when the IC is mounted, misalignment between the lead and the slot is erroneously measured, and the lead is not deformed due to the contact with the slot partition. I can
It is possible to effectively deal with the trend of fine pitch and miniaturization of C leads.

Further, since the respective support portions of the lead support seat are separated from each other by the fine groove, even when the leads subjected to the solder treatment are supported, the leads are short-circuited by the solder which is transferred and attached to the lead support surface. And the occurrence of defects in electrical inspection is prevented.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of an IC carrier according to the present invention.

FIG. 2 is an enlarged sectional view showing a lead support seat in the IC carrier of the embodiment.

FIG. 3 is a plan view showing a state in which an IC package is mounted on the IC carrier of the embodiment.

FIG. 4 is a sectional view showing a basic form of a conventional IC carrier.

FIG. 5 is an enlarged sectional view showing an example of a lead support seat in a conventional IC carrier.

FIG. 6 is an enlarged sectional view showing another example of a lead support seat in a conventional IC carrier.

[Explanation of symbols]

 1, 10 ... Base plate 2, 12 ... IC accommodating portion 3, 14 ... Lead support seat 4 ... Slot 5 ... IC package 6, 11 ... IC package body 7, 13 ... Lead 8, 15 ... Support surface 9 ……… Slot partition wall 16 ………… Slit groove 17 ………… Lock claw

Claims (1)

[Claims] 1. A periphery of a housing portion for housing a main body of an IC,
In an IC carrier having a lead support seat for supporting a lead group laterally protruding from the IC body and having means for retaining the IC, a plurality of fine grooves are formed on a main surface of the lead support seat. An IC carrier, wherein the IC carriers are provided in parallel and each support portion of the lead is separated by the narrow groove.