JP3192170U - 電子装置の収容ケース - Google Patents
電子装置の収容ケース Download PDFInfo
- Publication number
- JP3192170U JP3192170U JP2014002608U JP2014002608U JP3192170U JP 3192170 U JP3192170 U JP 3192170U JP 2014002608 U JP2014002608 U JP 2014002608U JP 2014002608 U JP2014002608 U JP 2014002608U JP 3192170 U JP3192170 U JP 3192170U
- Authority
- JP
- Japan
- Prior art keywords
- fence
- electronic device
- terminal portion
- end surface
- housing case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009434 installation Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000010586 diagram Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F2027/297—Terminals; Tapping arrangements for signal inductances with pin-like terminal to be inserted in hole of printed path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finishing Walls (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coils Or Transformers For Communication (AREA)
- Seats For Vehicles (AREA)
Abstract
Description
2 ケース部
21 底板
210 設置面
22 フェンス
221 フェンス端面
222 外周面
23 収容空間
3 接続端子
31 第1の端子部
314 斜面
315 縦平面
316 先端面
318 円弧面
319 リード保持空間
32 内蔵部
33 第2の端子部
34 フック部
4 リード線
Claims (8)
- 所定の設置面を有する底板と、前記底板の周縁から前記設置面が向かっている側へ突起して先端に前記設置面と略平行するフェンス端面を有するように形成されたフェンスとを有し、前記底板と前記フェンスとにより囲まれる収容空間内に電子装置を収容することができるケース部と、
前記フェンスに取り付けられ、前記フェンス端面と略直交するように前記フェンスの前記フェンス端面から更に突起する第1の端子部と、前記第1の端子部と略直交するように前記第1の端子部の先端から前記第1の端子部の一側へ湾曲するフック部とを有し、前記第1の端子部と前記フック部とによってリード保持空間を画成する少なくとも1つの接続端子と、を備えている
電子装置の収容ケース。 - 前記第1の端子部の前記リード保持空間(319)に臨む前記一側の反対側に前記フェンス端面と略直交する縦平面(315)が形成され、前記フック部の前記フェンス端面から離れた先端に前記縦平面と略直交する先端面が形成されている
請求項1に記載の電子装置の収容ケース。 - 前記第1の端子部(31)は、前記一側に前記リード保持空間に臨むと共に前記フェンス端面と所定の鈍角をなす斜面(314)を有し、前記フック部は、前記斜面の前記フェンス端面から離れた一端から更に延伸し、前記縦平面と直交する縦断面において円弧線をなす円弧面(318)を有するように形成されている
請求項2に記載の電子装置の収容ケース。 - 前記第1の端子部(31)の前記斜面の前記フェンス端面に接する一端から、前記縦平面までの最短距離が略0.46mmであり、
前記円弧面から、前記縦平面までの最短距離が略0.26mmである
請求項3に記載の電子装置の収容ケース。 - 前記円弧線の曲率半径は略0.16mmである
請求項3または請求項4に記載の電子装置の収容ケース。 - 前記接続端子の前記第1の端子部の前記フェンス端面から突起する長さが0.2mm〜3mmの範囲内にある
請求項1〜請求項5のいずれか1項に記載の電子装置の収容ケース。 - 前記接続端子は、前記第1の端子部と繋がっていると共に、前記フェンス内に埋め込まれている内蔵部と、前記内蔵部と繋がっていると共に、前記フェンスの前記収容空間の反対側にある外周面から外側へ突起する第2の端子部とを更に有する
請求項2〜請求項6のいずれか1項に記載の電子装置の収容ケース。 - 前記第2の端子部は、前記フェンスの前記収容空間の反対側にある外周面から外側へ突起してから前記フェンス端面が向かう側へ湾曲し、更に前記外側へ湾曲するように形成されている
請求項7に記載の電子装置の収容ケース。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102219588U TWM471092U (zh) | 2013-10-21 | 2013-10-21 | 電子元件座 |
TW102219588 | 2013-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3192170U true JP3192170U (ja) | 2014-07-31 |
Family
ID=50348507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014002608U Expired - Lifetime JP3192170U (ja) | 2013-10-21 | 2014-05-20 | 電子装置の収容ケース |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150107887A1 (ja) |
JP (1) | JP3192170U (ja) |
KR (1) | KR20150045880A (ja) |
CN (2) | CN203722029U (ja) |
TW (1) | TWM471092U (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM471092U (zh) * | 2013-10-21 | 2014-01-21 | Bothhand Entpr Inc | 電子元件座 |
DE202023100454U1 (de) | 2023-01-31 | 2023-02-16 | Premo, S.A. | Induktionsvorrichtung, die bereit ist, um auf einer Leiterplatte angebracht zu werden |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1885477A (en) * | 1930-06-09 | 1932-11-01 | Potter Company | Terminal |
US3910666A (en) * | 1973-07-27 | 1975-10-07 | Robertshaw Controls Co | Electrical terminal and method of forming an electrical connection therewith |
DE8905229U1 (ja) * | 1989-04-25 | 1989-06-29 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
DE3936110C2 (de) * | 1989-10-30 | 2000-03-23 | Rene Weiner | Lötstift mit Anwickelscheren für Hochtemperaturlackdrähte |
US5656985A (en) * | 1995-08-10 | 1997-08-12 | Halo Electronics, Inc. | Electronic surface mount package |
JP2007213963A (ja) * | 2006-02-09 | 2007-08-23 | Fuji Electric Fa Components & Systems Co Ltd | 電気器具の端子装置 |
CN101371320A (zh) * | 2006-03-13 | 2009-02-18 | 胜美达集团株式会社 | 金属端子、线圈零件及导电线的夹持固定方法 |
CN201134566Y (zh) * | 2007-12-04 | 2008-10-15 | 帛汉股份有限公司 | 端子座 |
CN201247835Y (zh) * | 2008-06-12 | 2009-05-27 | 帛汉股份有限公司 | 端子座装置 |
CN202678028U (zh) * | 2012-06-28 | 2013-01-16 | 开平帛汉电子有限公司 | 电子装置及其线圈 |
TWM471092U (zh) * | 2013-10-21 | 2014-01-21 | Bothhand Entpr Inc | 電子元件座 |
-
2013
- 2013-10-21 TW TW102219588U patent/TWM471092U/zh not_active IP Right Cessation
-
2014
- 2014-02-21 CN CN201420074941.5U patent/CN203722029U/zh not_active Expired - Lifetime
- 2014-02-21 CN CN201410059050.7A patent/CN104577598A/zh active Pending
- 2014-05-16 US US14/280,267 patent/US20150107887A1/en not_active Abandoned
- 2014-05-20 JP JP2014002608U patent/JP3192170U/ja not_active Expired - Lifetime
- 2014-06-11 KR KR20140070744A patent/KR20150045880A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20150045880A (ko) | 2015-04-29 |
US20150107887A1 (en) | 2015-04-23 |
CN104577598A (zh) | 2015-04-29 |
TWM471092U (zh) | 2014-01-21 |
CN203722029U (zh) | 2014-07-16 |
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