JP3189331B2 - Joining method and joining device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[Industrial application] CHIP-ON for liquid crystal display panel
The present invention relates to a method for bonding a glass panel, which is a light transparent body, to an IC chip or the like, such as GLASS mounting.

[0002]

2. Description of the Related Art Liquid crystal driving electrodes are formed on a glass panel of a liquid crystal display panel. These electrodes are restricted by a flexible tape on which a liquid crystal driving IC chip is mounted and the shape and pitch of lead wires. It is thermocompression-bonded with an adhesive that can be connected to the target joint. Alternatively, the IC chip for driving the liquid crystal is thermocompression-bonded directly to the electrode of the glass panel using an adhesive without using a flexible tape. The former is OUTER-LEAD-BON
DING implementation (hereinafter referred to as OLB implementation), the latter being CHI
This is called PON-GLASS mounting (hereinafter referred to as COG mounting). It can be said that COG mounting will be the mainstream method from the viewpoint of total cost such as labor cost due to component cost or the number of processes, and response to miniaturization of connection pitch.

The bonding method of the IC chip and the glass panel in COG mounting with an adhesive is generally the same as the bonding method of the flexible tape and the glass panel in OLB mounting with an adhesive. In other words, thermocompression bonding by pressurization and heating is performed, but by pressurization of the pressurization head for pressurization, pressurization and heating are performed by one mechanism and simultaneously.

[0004]

However, COG bonding is a bonding between rigid bodies due to the fact that the object to be bonded is an IC chip and a glass panel, compared to OLB bonding.
The OLB bonding is a one-dimensional bonding, that is, a line bonding, whereas the COG bonding is a two-dimensional bonding, that is, a surface bonding determined by the arrangement of conductive bumps of an IC chip.
It has the following disadvantages not found in the OLB junction.

[0005] First, there is a disadvantage due to the temperature characteristics of the adhesive. The adhesive has fluidity (viscosity) so as to be evenly filled between the IC chip and the glass panel, and the fluidity increases as the temperature increases. This is to allow the adhesive to flow during the heating process because the joining is performed by heating. Then, in the latter half of the heating process, the adhesive is thermally cured. (In flip chip bonding such as COG bonding, it is common to use a thermosetting adhesive or an adhesive of a blend type with a thermoplastic adhesive.) The problem is heating and pressing. This is the behavior at the end. At the end of heating, since the adhesive has fluidity, the pressure is released, and at the same time, the adhesive flow returns, so-called reverse flow phenomenon, and the bonding between the IC chip bumps and the glass panel occurs. The phenomenon that the agent enters and inhibits the conductivity appears.

Further, the adhesive shows a change in Young's modulus depending on the temperature. There is a difference of about two digits between a low temperature and a high temperature, and the difference is smaller at a higher temperature. In addition, the coefficient of thermal expansion cannot be neglected, and together with the temperature change of the Young's modulus, a force that separates the IC chip from the glass panel is generated at the end of heating and pressurization. Inhibits.

Next, there is a problem of heat conduction and a problem of thermal stress caused by the heat bonding. The object to be heated is an IC chip or a glass panel, but in any case, the above problems caused by the thermal conductivity, heat capacity, Young's modulus, thermal expansion coefficient, and the like must be considered.

In the heat conduction problem, a difference in temperature distribution occurs depending on a distance from a heating source (in the conventional method, a pressure head) and a relative position. The difference in the temperature distribution appears as a difference in the fluidity of the adhesive, a difference in the time of heat curing, and a difference in the curing rate, leading to a difference in uniformity over the entire surface to be joined. This, of course, narrows the margin of the bonding quality and adversely affects the stabilization of the quality.

[0009] In the thermal stress problem, a difference in heat distribution occurs in the bonding cross section during the bonding process, and a thermal stress is generated between the bonding and the uniformity of the heat distribution at the end of the bonding (at the time of normal temperature recovery). The thermal stress acts in a direction that makes the relative distance between the IC chip and the glass panel unstable, and deteriorates the bonding state.

As described above, due to the thermal characteristics of the adhesive and the various thermal characteristics of the object to be joined, the joining based on pressure / heat joining always involves the fatal problem of having a heating step. Have.

[0011]

SUMMARY OF THE INVENTION Accordingly, the present invention solves the above-mentioned problems and provides the following joining method and joining apparatus.

In the joining method for joining the transparent object A and the object B with an adhesive, the joining means for joining the object A and the object B is placed on the object A. A transparent pedestal including a transparent pedestal-shaped step portion, and at least heating means for heating the adhesive, the heating means is a light irradiation means for irradiating light, a side surface of the step portion Is characterized by being subjected to an optical treatment to become a total reflection surface with respect to light, and heating and bonding the adhesive by irradiating the object A to be bonded with light from the pedestal side. . Alternatively, in a bonding apparatus for bonding the transparent target A and the transparent target B with an adhesive, the bonding apparatus includes a transparent base-shaped step portion on which the target A is mounted. A pedestal, and a heating unit for heating the adhesive, at least, the heating unit is a light irradiation unit for irradiating the object A to be joined from the pedestal side, the side surface of the step portion Is characterized in that light is subjected to an optical treatment to be a total reflection surface. According to this, the scattered light that is not straight light among the irradiation light from the optical fiber or the like is reflected by the reflection coat applied to the side surface of the step portion, and is efficiently collected on the adhesive or the like to be irradiated. To play. Alternatively, in a joining method of joining the joining target A and the joining target B with an adhesive,
A step of applying pressure to a joining block sandwiched between the object to be joined A and the object to be joined B; and a step of heating the joining block independently of each other. A is a transparent body, the heating step is a heating step by light, and has an auxiliary heating step for the purpose of auxiliary heating of the heating step, the auxiliary heating of the auxiliary heating step, It is performed by applying a voltage to the conductor pattern for joule heating provided on the contact surface of the joining target A with the adhesive. According to this, the temperature non-uniformity in the heating region is basically improved only by a simple change of the mask pattern. Further, even when the heating energy is insufficient, the effect that the energy required for bonding can be supplemented can be obtained. Alternatively, in a joining apparatus that joins the joining target A and the joining target B with an adhesive, a pressing unit that presses a joining block that sandwiches the adhesive between the joining target A and the joining target B. And a heating means for heating the joining block, independently of each other,
Is a transparent body, the crimping pedestal on which the object to be joined A is placed is a transparent body, and the heating means is a light irradiating means for irradiating the object to be joined A with light from the crimping pedestal side. The shape of the contact surface of the crimping pedestal with the object A to be joined is the same as or larger than the outer shape of the joining surface of the object B to be joined, and A step is provided between the contact surface and the non-contact surface with the joining object A, and the side surface of the step is provided perpendicular to the contact surface of the crimping pedestal with the joining object A and is provided for light. It is characterized in that optical processing for forming a total reflection surface is performed. According to this, scattered light that is not straight light among irradiation light from an optical fiber or the like is reflected by the reflection coat applied to the side surface of the stepped portion, and the irradiation target IC is irradiated.
Light is efficiently collected on chips and adhesives. Further, by independently providing the heating means and the pressurizing means, it is possible to achieve an effect that the trouble caused by the simultaneous opening of the pressurization and the heating at the end is greatly improved. And a pressing unit that presses a bonding block that sandwiches the adhesive between the bonding target A and the bonding target B in a bonding apparatus that bonds the bonding target A and the bonding target B with an adhesive. A heating means for heating the joining block, and an auxiliary heating means for auxiliary heating of the heating means, wherein the auxiliary heating means comprises a pressure bonding head constituting the pressurizing means. Is heated by heating the adhesive. According to this, it is possible to achieve an effect that the temperature non-uniformity in the heating area of the heating means is improved.

[0013]

[0014]

[0015]

[0016]

[0017]

In flip-chip bonding such as COG bonding by pressurization and heat bonding, separation of functions between pressurization and heating is realized. As a result, the disadvantage that the pressurization and the heating are simultaneously released at the end of the joining is greatly improved. In other words, the pressure can be left (residual pressure) even at the end of the heating, and the fatal problem of the joining requiring the heating means can be suppressed by separating and utilizing the pressure. This is because the physical condition of the IC chip and the glass panel immediately before the end of the bonding is maintained by pressurization, and it is possible to wait until the temperature increased by heating becomes normal temperature or a certain low temperature.

Further, since the pressing force and the heating force in the bonding process are variable, it is possible to perform the desired control such as the optimal control of the adhesive flow process and the hardening process, and the control of the contact and crushing of the IC bumps. .

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A bonded object A is a glass panel and a bonded object B.
FIG. 5 shows a cross-sectional view of a so-called COG junction using the above as an IC chip. The conductivity between the IC chip 1 and the glass panel 3 is based on the IC bumps 2 formed on the four sides of the IC chip 1.
The contact is performed by contact with the conductive lead wire 4 formed on the glass panel 3. The contact may be based on a mere physical contact between the IC bump 2 and the conductive lead wire 4 or a reactive contact such as a metal eutectic or an alloy.
In any case, the conductivity must be maintained for all the IC bumps 2 for a long time. For this purpose, it is general that the adhesive 5 is uniformly filled not only around the IC bumps 2 but also throughout the IC chip 1. The purpose of the adhesive 5 is to prevent the chemical reaction such as corrosion of the joint by blocking the joint from the outside such as moisture, and to make the IC chip 1 after the joint.
And maintaining the physical state of the glass panel 3.
Further, the adhesive 5 has a phenomenon of thermal contraction due to heating,
Heat bonding increases the bonding strength between the IC chip 1 and the glass panel 3.

FIG. 6 shows a COG bonding process diagram. The state before joining is shown in FIG. The adhesive 5 is applied to the cut glass panel 3 or the IC chip 1 in accordance with the bonding size of a thin sheet, or is applied to the glass panel 3 or the IC chip 1 in the form of a paste. The area may be equal to or slightly larger than the outer size of the IC chip 1 (solid line in the figure) or may be the inner part of the IC bump 2 (dotted line in the figure). In any case, the alignment between the IC bump 2 and the opposing conducting lead wire 4 is performed. FIG. 6B shows the flow of the adhesive 5 in the first half of the joining process. By applying appropriate pressure and heating, the adhesive 5 is made to flow and be filled evenly throughout the IC chip 1. Furthermore, the lead wire 4 for conduction between the IC bump 2 and the glass panel 3
And the adhesive 5 is not interposed on the contact surface. Next, FIG. 6C shows an adhesive curing process which is the latter half of the joining process. In general, as the adhesive, a thermosetting adhesive which is cured by heating, or a blend type of a thermoplastic adhesive and a thermosetting adhesive is used. Therefore, the adhesive 5 that has flowed firmly in the first half of the joining process is maintained at a temperature at which thermal curing is started to maintain the joined state. Further, when the heating is released after the joining, the above-described heating shrinkage occurs, and the joining force is further strengthened.

[0021] Even in the above-described bonding, a bonding failure occurs. This is shown in the cross-sectional view of the COG junction in FIG. FIG. 7A shows a case of good bonding, and FIG. 7B shows a case of poor bonding. It can be seen that the poor bonding to the good bonding impedes the adhesive 5 under the IC bumps 2 and inhibits conduction.

The cause of such a defect is as described in the above-mentioned problem. FIG. 8 shows the temperature characteristics of the adhesive which is the basis of the bonding. As the bonding temperature, a standard temperature (T ₀ ), a temperature (T ₁ ) sufficient for the adhesive to flow sufficiently without being cured, and a temperature (T ₂ ) for firmly curing the adhesive can be used as guidelines. Characteristics include viscosity indicating fluidity and Young's modulus indicating springiness. The viscosity tends to flow with increasing temperature. The Young's modulus is different between the uncured product and the cured product, but also becomes smaller as the temperature rises.
Thus, it can be seen that by performing bonding in accordance with the properties of the adhesive, ideal bonding quality can be obtained.

Therefore, the joining process will be decomposed. As described above, it is a flow process and a curing process of the adhesive, and a cooling process of the adhesive after the completion of the curing. In particular, the cooling process is performed at a high temperature, such as release from the instability of the state due to heating, i.e., the amount of return at the time of pressure release from Young's modulus, the return of elongation due to thermal expansion, and the release of thermal strain due to temperature distribution. This is a process in which the state change to room temperature is severe. Taking these facts into consideration, the following joining method is adopted.

FIG. 3 is a time chart of the joining method according to the conventional method. Pressurization at a constant pressure and heating at a constant energy are started at the same time, and both the pressurization and heating are simultaneously released after a certain time. According to this, the joining process is basically one process, and the above-mentioned problem is not solved. FIG. 4 is a time chart showing an example of the joining method according to the present invention. The joining process is defined as three processes. The first step is a flow of the adhesive, and the pressure is P1 and the heating is H1. The second process is a curing process of the adhesive, and the pressure is P1 and the heating is H2. The third process is a process of cooling the adhesive, and the pressure is P2 and no heating. First, note the following regarding heating. In the first step, the adhesive is not cured, but is heated to a temperature at which the flow is firmly performed, that is, the flow of the adhesive is prevented from being inhibited by the advance of the curing of the adhesive. From this, the heating power of the second process is set higher than the heating power of the first process,
Cure the adhesive tightly. In the third step, it is necessary to cool the adhesive quickly from the viewpoint of cycle time, and the heating power is completely released. Next, the following viewpoint is applied to pressurization. In the first and second steps, it is sufficient that the pressing force is sufficient for the IC bumps and the conductive lead wires to come into firm contact with each other. The presence of pressurization in the third step is a feature of the joining method of the present invention and can be said to be an important item. The purpose of the third step is to cool the adhesive by releasing the heating, but the following phenomenon can be suppressed by continuing the pressurization in this step. In the early stage of the third step, since the temperature is still high, there is fluidity, the Young's modulus is low, and thermal expansion is present.
A gap is created between the IC bump and the conductive lead,
Adhesive enters. However, the above-mentioned problem is solved by leaving the pressurization (pressurization residual) as shown in FIG. The above time chart focuses on an adhesive having a certain property. If the property of the adhesive is different, it is sufficient to set the pressure, the heating, and the time according to the property.

Next, FIG. 2 shows a block diagram of a joining apparatus for realizing the joining method according to the present invention. In order that the pressurizing means and the heating means exist independently and each controllability is good, CP
This is an example in which a digital control method by U is adopted. The controllability means good reproducibility of pressure / heating force, flexibility of setting pressure / heating force and time, and matching with elements other than joining (workpiece supply / alignment, etc.). As expected. The CPU 20 includes a memory unit 21 for storing a control program, setting data, and the like, a process setting I / F 22 for setting a pressing force, a heating force, a time, and the like with the DSW 24 and the like, an external I / O I / F 23, A pressure control I / F 26 for the means and a heating control I / F 32 for the heating means are connected by a CPU bus. Pressurization control I / F26 is D /
The compressed air is controlled by the A converter 27 and the electropneumatic regulator 28, and the compressed air is supplied to the cylinder 29,
Is connected directly to the cylinder 29 or by a pressure reducing or increasing mechanism such as a lever. In order to improve the controllability of the pressurizing force, the pressurizing force 31 from the electropneumatic regulator 28 or the pressurizing force 31 by the strain gauge of the pressurizing head 6 may be fed back to the pressurizing control I / F 26.
The heating control I / F 32 gives control information to a light heating device 33 for emitting light and serving as a heating source.
(Xenon lamp, halogen lamp, laser, etc.). The emitted light is applied to the object to be heated directly or by the optical fiber 9 or the like. Again, in order to stabilize the light energy 35 of the light emitting source 34, a light heating device 33 is provided by a photoelectric element such as a phototransistor.
Will be fed back.

FIG. 1 shows a diagram of a joining apparatus according to the present invention. IC chip 1 having bonding symmetry with adhesive 5 interposed therebetween
And the glass panel 3 are placed on a transparent crimping support 7. The light guided by the optical fiber 9 from the light emitting source is collected by the condenser lens 8.
Is focused on the IC to be irradiated with light. Pressurization is performed by placing the object to be heated between
The pressurizing head 6, which has a degree of parallelism with the transparent pressure receiving base 7 and a degree of flatness, is placed, and the pressurization is controlled by the pressurization control I / F 26 in FIG. According to this device,
One IC chip is bonded to the glass panel by one bonding, and this is the method in which the bonding quality is most easily obtained. Therefore, if there are a plurality of IC chips to be joined, the optical fiber 9 and the pressing mechanism may be made movable, or the object to be heated may be moved in a plane, and joined after the movement.
According to this method, the light guided by the optical fiber 9 from the light emitting source can be effectively and efficiently used for a portion to be irradiated. In consideration of the tact time, it is advantageous if a large number of IC chips can be bonded by one bonding. Therefore, the parallelism and the flatness of the transparent pedestal, which is a pressing mechanism, and the pressing head 6 are secured. If the entire heating area can be irradiated and light energy for heating can be obtained, a large number of IC chips can be joined by one joining.

Next, FIG. 11 shows a crimp receiving table according to the present invention. It is assumed that the pressure receiving table 7 shown in FIG. 1 is a light transparent body, and the shape is a flat one-sided shape. In contrast, in FIG.
There is a contact surface 10 with the glass panel 3 and a non-contact surface 11,
They are connected by a step surface 12. Further, the contact surface 10 only needs to have a minimum necessary area for applying uniform pressure to the IC chip 1. This makes it easier to ensure the flatness of the pressure receiving pedestal 7 because the pressing surface is the minimum.

FIG. 12 is a cross-sectional view of a pressure receiving pedestal according to the present invention, in which a reflection coat for totally reflecting light is applied to the entire surface of the step surface 12. As a result, scattered light that is not straight light among irradiation light from an optical fiber or the like is reflected by the reflection coat 13 applied to the step surface 12, and the irradiation target IC is irradiated.
This is because the light is efficiently collected on the chip 1, the adhesive 5, and the like.

In the embodiments described above, light is used as the heating means. However, non-uniformity of the temperature in the heating area or insufficient heating energy may occur. As means for solving this problem, auxiliary heating which complements heating other than optical heating is performed. FIG. 9 is a diagram showing an improvement in temperature characteristics by auxiliary heating with respect to temperature non-uniformity. The thermal conduction from the IC chip to the pressure head makes the IC center and IC
The non-uniformity shown in the figure easily occurs between the left and right sides. Therefore, the pressure head itself can be heated, and the temperature difference between the central part of the IC and the right and left parts of the IC can be eliminated. However, in this case, the characteristics by light heating, that is, the heating characteristics with good responsiveness, and the temperature cooling characteristics in the pressurized state by the non-contact heating under the pressurized heating separation,
Conditioning to the extent that it is not hindered is a prerequisite. Further FIG.
0 is a temperature characteristic improvement diagram by auxiliary heating relating to insufficient heating energy. The temperature reached in COG bonding includes a temperature that must be attained to a minimum (such as a curing temperature of an adhesive) (required temperature) and a temperature that can afford enough to bring out an ideal bonding process (sufficient temperature). In FIG. 10, in the variable range of the light energy in the case of only the light heating, the required temperature is satisfied but the temperature is not sufficiently satisfied. Therefore, by performing the auxiliary heating, the required temperature and the sufficient temperature can be satisfied in the variable range of the light energy. However, even in this case, the characteristics due to the above-described light heating must not be impaired.

FIG. 13 is a structural view in the case where the conductor pattern 14 for joule heating is formed on the glass panel 3 to perform auxiliary heating. In the process of forming the conductive lead wire 4 on the glass panel 3, the Joule heating conductor pattern 14 shown in the figure may be formed at the same time. Basically, it is possible only by changing the mask pattern, and the cost is not increased by the film formation. The figure shows a case where the heating of the left and right portions of the IC is performed with emphasis and the uniformity of the temperature is aimed at. FIG. 14 is a bonding diagram according to the present invention showing a probing method for applying a voltage for heating the pattern formed according to FIG. The probe 15 is attached to the pressurizing head 6 and linked with the pressurizing head 6. In a pressurized state, positioning is performed in advance so that the probe 15 contacts the joule heating conductor pattern 14. Then, a voltage is applied to the probe 15 at the time of joining, and a current is caused to flow through the joule heating conductor pattern 14 to generate Joule heat.

The joining structure and the joining apparatus using the joule heating conductor pattern shown in FIGS. 13 and 14 are based on the premise that auxiliary heating of light heating is used. Of course, it is also possible to use.

[0032]

By utilizing the selectivity, high response and non-contact properties of light, the joining process can be performed with high-precision selective energy supply, short-time intensive energy supply, and non-contact Since it can be realized by effectively utilizing the separation of heat and power due to the energy supply, optimal process control for the joining process is possible.

This increases the degree of freedom with respect to the required bonding quality, such as the quality for temporary bonding for aligning the IC chip and the glass panel and the quality for final bonding for final bonding. Thus, it is possible to easily realize a variety of process selections and a high quality bonding state.

[Brief description of the drawings]

FIG. 1 is a diagram of a bonding apparatus according to the present invention.

FIG. 2 is a block diagram of a bonding apparatus according to the present invention.

FIG. 3 is a time chart of a conventional joining method.

FIG. 4 is a time chart of the joining method according to the present invention.

FIG. 5 is a cross-sectional view of a COG junction.

FIG. 6 is a COG bonding process diagram.

FIG. 7 is a cross-sectional view of a COG junction.

FIG. 8 is a temperature characteristic diagram of an adhesive.

FIG. 9 is a temperature characteristic improvement diagram.

FIG. 10 is a temperature characteristic improvement diagram.

FIG. 11 is a view of a crimping pedestal according to the present invention.

FIG. 12 is a cross-sectional view of a crimping pedestal according to the present invention.

FIG. 13 is a joining structure diagram according to the present invention.

FIG. 14 is a joining diagram according to the present invention.

[Explanation of symbols]

 1: IC chip 2: IC bump 3: Glass panel 4: Lead wire for conduction 5: Adhesive 6: Pressurizing head 7: Compression receiver 8: Condensing lens 9: Optical fiber 10: Contact surface 11: Non-contact surface 12 : Stepped surface 13: Reflective coating 14: Joule heating conductor pattern 15: Probe 20: CPU 21: Memory unit 22: Process setting I / F 23: External I / O I / F 24: DSW 25: External I / O 26: Pressurization control I / F 27: D / A converter 28: Electropneumatic regulator 29: Cylinder 30: Pneumatic force 31: Pressure 32: Heating control I / F 33: Light heating device 34: Light source 35: Light energy 36: Joining block

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 311

Claims (5)

(57) [Claims] 1. A joining method for joining a transparent joining object A and a joining object B with an adhesive, wherein the joining means for joining the joining objects A and B includes: And a heating means for heating the adhesive, wherein the heating means is a light irradiating means for irradiating light; and The side surface has been subjected to an optical treatment to be a total reflection surface with respect to light, and the adhesive is heated and joined by irradiating the object A to be joined with light from the pedestal side. And the joining method. 2. A joining apparatus for joining a transparent joining object A and a joining object B with an adhesive, wherein the joining apparatus comprises a transparent platform-shaped step portion on which the joining object A is placed. And a heating means for heating the adhesive, wherein the heating means is a light irradiating means for irradiating light to the object to be joined A from the pedestal side; A bonding apparatus, wherein a side surface of the portion is subjected to an optical process to be a total reflection surface for light. 3. A joining method for joining an object to be joined A and an object to be joined B with an adhesive, wherein the adhesive is applied to a joining block sandwiched between the objects to be joined A and the object to be joined B. A pressurizing step of applying pressure, and a heating step of heating the joining block independently of each other, wherein the article to be joined A is a transparent body, the heating step is a heating step using light, and An auxiliary heating step for the purpose of auxiliary heating in the heating step is provided. The auxiliary heating in the auxiliary heating step is a conductor for joule heating provided on a contact surface of the bonding target A with the adhesive. A bonding method, which is performed by applying a voltage to a pattern. 4. A joining apparatus for joining an object A to be joined and an object B to be joined with an adhesive, and presses a joining block sandwiching the adhesive between the object A and the object B to be joined. A pressurizing unit, and a heating unit for heating the joining block are independently provided. The joining target A is a transparent body, and the crimping pedestal on which the joining target A is placed is a transparent body. The heating means is a light irradiating means for irradiating the object A to be joined with light from the crimping pedestal side, and the shape of the contact surface of the crimping pedestal with the object A to be joined is The outer shape of the joining surface of the joining object B is the same as or larger than the outer shape, and a step portion is provided between a contact surface and the non-contact surface of the crimping cradle with the joining object A; The side of the part is the object A to be joined of the crimping cradle. A bonding surface which is provided perpendicular to a contact surface with the substrate and has been subjected to an optical process to be a total reflection surface for light. 5. A joining apparatus for joining an object to be joined A and an object to be joined B with an adhesive, wherein a pressure is applied to a joining block in which the adhesive is sandwiched between the objects to be joined A and the object to be joined B. Pressure means, and a heating means for heating the joining block are provided independently, and an auxiliary heating means for auxiliary heating of the heating means is provided. The auxiliary heating means constitutes the pressurizing means. A bonding apparatus, wherein the adhesive is heated by heating a pressure bonding head to be bonded.