JP3175177B2 - Semiconductor cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device, and more particularly to a semiconductor cooling device for cooling a heat sink, through which a cooling medium flows, in contact with an LSI chip or the like.

[0002]

2. Description of the Related Art A conventional apparatus is disclosed in, for example, Japanese Utility Model Application Laid-Open No. 59-18 / 1984.
As described in Japanese Patent No. 441, a metal plate through which a cooling pipe passes is placed on a board via a contact member to which a metallic spring-like member, a fin-like member, or a pin-like member is attached. Pressing against the LSI chip mounted on the tower, L
The heat generated by the SI chip is transmitted to the metal plate side having the cooling pipe through the contact member to be cooled.

As described in Japanese Utility Model Laid-Open Publication No. Sho 61-53990, a flexible film (rubber) containing a refrigerant is provided between a substrate on which semiconductor components are mounted and a heat sink through which a cooling fluid flows. And the like, and by pressing the pack against the substrate, the heat of the semiconductor component that generates heat is transmitted to the cooling fluid side via the pack and cooled.

[0004]

As described above, the conventional semiconductor cooling device improves the contact between the LSI chip and the heat sink by utilizing the flexibility of the contact member or the cooling containment pack. Heat is transmitted to the heat sink side, and the heat sink and the LSI chip can be attached and detached.
Japanese Unexamined Utility Model Publication No. 59-18441 does not consider electrical insulation.

That is, an LSI chip mounted on a board is often electrically connected to a board constituting the board in a dense manner by a large number of thin signal lines, and a high insulating property is required. However, when the metal contact member is in direct contact with the LSI chip, during operation, fine powder of the metal contact member is generated, adheres to the signal line, weakens insulation, and causes trouble. was there.

[0006] Further, in Japanese Unexamined Utility Model Publication No. Sho 61-53990, heat transfer performance and reliability are not considered.

That is, since a pack is constituted by a flexible film in which rubber is often used, and only the refrigerant liquid is sealed in this container-shaped pack, it can be compared with the case where the refrigerant liquid is not sealed. Although heat transfer performance is good, convection occurs throughout the inside of the container-shaped pack, so that when the amount of heat generated in the LSI chip increases, it is necessary to further improve the heat transfer performance. Further, if the rubber-like flexible film is used for a long period of time, there is a problem that a hole is formed due to corrosion by a refrigerant or the like, and a problem that a refrigerant liquid easily flows on an LSI chip and a substrate occurs.

An object of the present invention is to improve the heat transfer performance of a contact member provided between a semiconductor element to be cooled and a cooling member typified by a heat sink to ensure electrical insulation. It is to provide a cooling device.

[0009]

[0010]

[0011]

[0012]

[0013]

The above object is achieved, for example, by providing a contact member provided between a semiconductor element to be cooled mounted on a substrate and a cooling member for radiating heat of the semiconductor element to cool the semiconductor element. a semiconductor cooling apparatus for cooling a semiconductor element provided with the contact member is a hollow member the interior, the hollow interior of the contact member comprises a thermally conductive fluid, the contact member is made of a metallic material The core member is formed of a pack provided with an insulating film on the outer surface or the inner and outer surfaces of the core member, and the contact member is achieved by providing a flat surface on the side in contact with the cooling member. You.

[0014]

[0015]

[0016]

[0017]

[0018]

[0019]

[0020]

[0021]

[0022]

[0023]

[0024]

The contact member of the present invention is provided between a heat sink having a flow path for flowing a fluid having a relatively low temperature and an LSI chip mounted on a plurality of boards, and the heat generated in the LSI chip is removed. It is transmitted to the heat sink through the contact member .

First, the path of the heat flow will be described. LS
The inside I chip is a built a number of semiconductor devices generate heat during operation. This heat is conducted by heat conduction to the contact member side in an LSI chip made of silicon or the like. The contact portion between the surface of the contact member and the LSI chip is not strictly a perfect contact, but a gas or a liquid is present in a minute gap, and the heat resistance when conducting heat therethrough is large. Subsequently, the multilayer structure of the contact member is thermally conducted, and then transmitted through the liquid portion sealed inside the contact member. When the liquid does not move, it is transferred by heat, and when convection occurs, it is transferred by convective heat transfer. The heat transfer efficiency is higher in the case of convection heat transfer. Further, the heat is transmitted to the cooling member side, and is transferred to the cooling member side via heat transfer at a contact portion between the heat transfer member and the contact member.

[0026] In the semiconductor cooling device of the present invention, a container-like pack for forming the contact member to the first and a multi-layer structure, a thin metallic material for the core material is provided, the outer surface or inner and outer <br its core The surface is provided with an insulating coating . Alternatively, since the laminated insulating resin foil surface or both inner and outer surfaces of the outer pack material as the metal foil, as possible out possible to provide insulating properties to signal Line like.

Second, since a liquid having excellent thermal conductivity is sealed in a container-shaped pack and a metal member group that contacts the upper and lower surfaces of the pack is provided, the upper and lower surfaces of the contact member are connected by a metal member. Then, the heat transfer from the lower surface of the pack to the upper surface of the pack is conducted by heat conduction not only in the sealed liquid portion but also in the metal member portion. Since the thermal conductivity of metal generally has a high value, providing a metal member increases the heat transfer efficiency.

Further, since a pulsation generating mechanism for forcibly flowing the fluid in the pack is provided in a part of the contact member, convection heat transfer is promoted to improve heat transfer efficiency.

In a pack structure having a relatively thin and wide structure, a partition wall is provided in the middle, so that convection with high heat transfer efficiency can be locally generated. Heat transfer efficiency can be increased.

Third, since a partition wall is provided in that area in the contact member in accordance with the difference in the amount of heat generation of the LSI chip, a portion having a large amount of heat generation corresponds to a local convection heat transfer corresponding to the portion. Therefore, the amount of heat to be transferred can be adjusted.

Further, by providing the partition, the temperature difference does not occur over a wide range and is locally limited, so that the temperature of the LSI chip can be set to substantially the same temperature.

Fourth, when a plurality of LSI chips having different heights are mounted on the board, the inside of the contact member is divided by providing partitions in a plurality of regions according to the height of the LSI chip.
Part of the structure has a communicating structure, so that even if the height of the LSI chip is different, a contact member corresponding to the height can be provided. -The pressing force against the LSI chip on the chip can be prevented from becoming excessive.

Further, since the pressure adjusting portion is provided in a part of the contact member, the pressing force of the contact member against the LSI chip on the board can be adjusted, so that the pressing force can be optimized.

Also, since the metal member group provided in the contact member has a spring property, its spring force can be adjusted.
The pressing force against the LSI chip can be optimized. In addition, since it has flexibility, it can absorb a high irregularity of a plurality of LSI chips. Also, since the metal member is a spring-like mechanism,
The metal member functions to press the upper surface of the pack toward the heat sink and the lower surface of the pack toward the LSI chip. Therefore, between the upper surface of the pack and the heat sink, and the lower surface of the pack and the LSI
The contact thermal resistance between the chips is reduced, and the heat transfer efficiency is increased here.

[0035]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention is shown in FIGS. FIG. 1 shows an overall configuration diagram of a semiconductor cooling device of the present invention. An LSI chip 7 is arranged on a board 6, and a platter 53 is mounted so as to sandwich both sides of the board 6. At the top of the LSI chip 7, the liquid 5
A heat sink 8 is arranged via the contact member 1 in which the heat sink 8 is enclosed. In the heat sink 8, for example, a flow path 55 provided with fins 54 therein is provided, and cooling water 9 flows to cool the heat sink. Has become. A bolt hole 56 is provided on the end surface side of the heat sink 8, and the contact member 1 is pressed against the LSI chip 7 by screwing the heat sink 8 to the platter 53 using a bolt 57.

Here, in consideration of the fact that the LSI chip 7 often has a different height, the contact member 1 has a large difference in height by changing the thickness of the contact member 1, while the LSI chip 7 has a large height. The relatively small height differences can be absorbed in the following manner. The surface of the contact member 1 on the side of the heat sink 8 is formed flat, and the heat sink 8 is pressed against and fixed to this surface.

That is, the respective packs 2a and 2b communicate with each other through the refrigerant passage 48, and the pressure adjusting portion 36 is provided in the pack 2 or a part of the refrigerant passage 48. Since the fluid is sealed in the pack 2 and the refrigerant passage 48, the pressure adjusting unit 3
6, the pressure is adjusted to an appropriate value, and the pack 2 is deformed and pressed with a uniform pressure, so that the contact with the LSI chip 7 and the heat sink 8 can be made uniform with a weak force. Note that the pressure adjusting unit 36 can be omitted as necessary.

On the other hand, the heat sink 8 comprises two cooling water pipes 58, 59 having flexible portions 58a, 59a.
The cooling water supply device 60 is connected to the cooling water supply device 60 via the cooling water supply device 60 to supply and discharge the cooling water 9 to and from the heat sink 8. That is, the cooling supply device 60 typically includes a water pump 61, a water tank 62, and a chiller 63, and water heated by the heat sink 8 is supplied to the cooling water pipe 5.
8, is sent to the cooling supply device 60, is cooled by the chiller 63, and is cooled by the cooling water pipe 5 by the water pump 61.
9 again flows to the heat sink 8 side, cools the heat sink 8 and generates heat when the semiconductor device operates.
The chip 7 is cooled.

Here, the heat sink 8 and the cooling supply device 6
Since the heat sink 8 is connected to the board 6 through the flexible portion 58 by the cooling water pipe 59, the bolt 57 can be removed to easily remove the heat sink 8 from the board 6 on which the LSI chip 7 is mounted. .

Next, embodiments of the contact member 1 will be described with reference to FIGS.

FIG. 2 shows a pack 2 of the contact member 1 of this embodiment.
FIG. 3 is a cross-sectional perspective view of the pack 2 shown in FIG.

The inside of the pack 2 contains thermally conductive grease, thermally conductive silicone oil or florinate (this
Is a trade name manufactured by 3M Corporation in the United States. In the following description
A sealing liquid 5 such as a liquid is sealed. The material of the pack 2 is, for example, a material in which an insulating resin is thinly laminated on both sides of an aluminum foil in a film shape. Examples of the resin to be laminated in the form of a film include polyethylene, polypropylene and the like, and a material having excellent corrosion resistance is selected depending on the type of liquid sealed in the pack. The ends of the pack upper surface 3 and the pack lower surface 4 are each closed, so that the sealed liquid 5 can be retained. With this configuration, since the sealed liquid 5 having good heat conductivity such as heat conductive grease, heat conductive silicon oil, or Fluorinert liquid is used, the heat transfer performance based on the heat conduction in the pack 2 is improved. I do. Also, since the insulating resin is thinly laminated on both sides of the aluminum foil in the form of a film, the pack 2 is excellent in insulation. Also, since aluminum foil is used, the strength is strong and the corrosion resistance is improved.

Next, application examples for further improving the heat transfer performance of the contact member 1 are shown in FIGS. 4 to 11, respectively.

FIG. 4 is a sectional perspective view of the contact member 1.
In this application example, a case where a metal coil 10 made of a thin metal wire and wound in a cylindrical shape is inserted into the pack 2 along the pack upper surface 3 is shown. Here, the metal coil 10 partially has a contact 11 on the pack upper surface 3 so that heat transfer is good.
The other part is configured to be in contact with the pack lower surface 4 at a contact point 12, respectively. That is, since heat is transferred from the pack lower surface 4 side to the pack upper surface 3 side, the metal coil 10 is configured to be in contact with the pack upper surface 3 and the lower surface 4 by bonding or the like, so that the contact 1
This is because heat conduction of 1 and 12 parts is promoted. On the other hand, since the metal coil 10 is rich in elasticity, when the contact member 1 is pressed between the LSI chip 7 and the heat sink 8, the metal coil 10 moves the pack upper surface 3 to the heat sink 8 side and the pack lower surface 4 is generated against the LSI chip 7. Thus, the thermal resistance between the pack upper surface 3 and the heat sink 8 and the thermal resistance between the pack lower surface 4 and the LSI chip 7 are reduced, and the heat transfer performance can be improved. The metal coil 10 may be inserted into the pack 2 together with the filling liquid 5. FIG. 5 is a cross-sectional perspective view of a contact member 1 showing another application example. In this application example, a metal coil 13 made of a thin metal wire and wound in a cylindrical shape is substantially placed on the pack upper surface 3 in the pack 2. Inserted vertically. Metal coil 1
One end of 3 is in contact with the pack upper surface 3 and the other end is in contact with the pack lower surface 4 at the contacts 14 and 15, respectively. The heat generated in the LSI chip 7 is transmitted by conduction through the filling liquid 5 in the contact member 1 and the metal coil 13. Therefore, when the contacts 14 and 15 are configured to be in contact with each other by bonding or the like, the heat transfer efficiency is improved. In this case, since the metal coil 13 is inserted so as to be substantially perpendicular to the upper surface 3 of the pack, the contact area of the contacts 14 and 15 is larger than that of the application example shown in FIG. Can be reduced. The metal coil 13 may be inserted into the pack 2 together with the filling liquid 5.

FIG. 6 is a cross-sectional perspective view of a contact member 1 showing still another application example. In this application example, a sealed liquid is formed as a metal scrubber 16 in a state where a large number of fine metal wires are bent in a pack 2. 5 is inserted. Also in this case, the contact 1 where the metal scrubber 16 contacts the pack upper surface 3 and the pack lower surface 4
By joining the portions of No. 7, good heat transfer can be maintained. In the case of this structure, the metal scrubbers 16 can be inserted into the pack 2 relatively randomly, which facilitates manufacture.

FIG. 7 is a sectional perspective view of a contact member 1 showing still another application example. In this application example, a fin 18 made of a thin metal wire and continuously bent into a mountain shape is used as a pack upper surface 3 and a pack lower surface. 4 is inserted into the pack 2 so as to be in contact therewith. Here, the contacts 19 and 20 at the portions contacting the pack upper surface 3 and the pack lower surface 4 may be thin metal wires,
It may be a metal plate. Also in this case, the contacts 19, 2
0 is good when it is joined to the pack upper surface 3 and the pack lower surface 4, respectively. Since the fins 18 made of thin metal wires are regularly arranged and have high elasticity, the pack upper surface 3 and the pack lower surface 4 are pressed against the heat sink 8 and the LSI chip 7, so that the heat transfer efficiency can be improved.

FIG. 8 is a sectional perspective view of a contact member 1 showing still another application example. In this application example, a finned plate 21 provided with a large number of U-shaped bent metal plates 22 regularly. Are inserted in the pack 2 together with the filling liquid 5. Also in this case, the pack upper surface 3 and the fin 22 are in contact with each other, and the pack lower surface 4 is in contact with the base plate 25 at the contact points 23 and 24. When these contacts 23 and 24 are joined, the heat transfer efficiency is improved.

FIG. 9 shows a contact member 1 showing still another application example.
In this application example, a large number of fine metal wires 2 are shown.
6 are bundled with, for example, a rubber-like resin 27 and inserted into the pack 2 together with the filling liquid 5. Both ends of the thin metal wire 26 are in contact with the pack upper surface 3 and the pack lower surface 4 at contact points 28 and 29. When this portion is joined, the heat transfer efficiency is improved.

FIG. 10 is a longitudinal sectional view of a contact member 1 showing still another application example.
A plurality of pins 30 are joined to the side, and a metal washer 31 is provided in the pack 2 on the pack lower surface 4 side, and when the pack 2 is formed, the tip of the pin 30 is inserted into the metal washer 31. And In this case, the pins 30 and the metal washers 31 come into thermal contact with each other while maintaining flexibility.

FIG. 11 is a longitudinal sectional view of a contact member 1 showing still another application example.
Are provided with a number of pins 30, and a perforated plate 33 having a number of holes 32 is mounted on the lower surface 4 of the pack. The multiple pins 30 and the multiple holes 32 correspond to each other, and can be inserted. When the pack 2 is formed, the pin 30 is inserted into the pack 2 together with the filling liquid 5 with the pins 30 being inserted into the holes 32. In this manner, the pin 30 and the hole 32 can be in thermal contact with each other while maintaining flexibility.

Another embodiment of the present invention will be described with reference to FIGS. FIG. 12 is a perspective view showing a state in which the contact member 1 is sandwiched between the substrate 6 and the heat sink 8, and FIG.
Side view of the assembled state the lateral direction shown in 12, 14
Is a perspective view of a contact member 1 for guiding heat generated in an LSI chip to a heat sink, and FIG. 15 is a longitudinal sectional view showing a structure of a heat conductive film 39 used for the contact member 1.

As shown in FIGS. 12 and 13, the semiconductor cooling device of the present embodiment comprises a substrate 6 on which an LSI chip 7 is mounted.
The contact member 1 made of the heat transfer pack 2 is disposed between the heat sink 8 and the heat sink 8, and the ends are fixed with clamps 38 in order to stabilize the heat transfer performance. Substrate 6
, A plurality of large and small LSI chips 7 are arranged. The height of each LSI chip 7 from the substrate 6 is substantially equal, and the contact surface of the heat transfer pack 2 is flat. In addition, the contact member 1 is provided with a pressure adjusting unit 36 separately from the heat transfer unit 34 that contacts the LSI chip 7 and the heat sink 8. Then, the pressure adjustment unit 36 is
The heat transfer portion 34 of the heat transfer pack 2 is brought into close contact with the LSI chip 7 and the heat sink 8 mounted on the substrate 6 by increasing the internal pressure of the contact member 1. In such a mounting state, the pressing force on the LSI chip 7 can be easily changed by the spring constant of the pressure holding spring 37 mounted on the pressure adjusting unit 36. Another function of the pressure adjusting unit 36 is that a gas reservoir is simultaneously sealed when a heat transfer medium such as a grease or liquid inside the contact member 1 is sealed. The heat transfer medium in the installed pack 2 can efficiently transfer heat.

Here, as an example, the substrate 6 is 220
The case where a size of mm × 130 mm × 2 mm is used will be described. Thirty LSI chips 7 each having a heating value of 3 W / chip are mounted on the substrate 6, and power supply to the LSI chips 7 mounted on the substrate 6 is not shown in FIG. This is done by a connector installed on the opposite end face of the part 36. At the center of the back side of the mounting surface of the LSI chip 7, the heat transfer pack 2 is
In order to prevent the substrate 6 from being deformed by the force applied to the substrate 6 via the LSI chip 7 when the internal pressure is increased in order to bring the substrate into close contact, a reinforcing member 46 having a cross section of 3 mm × 10 mm is arranged. Note that the reinforcing member 46 may not be provided when the deformation of the substrate 6 is small due to the shape, that is, the size and the thickness of the substrate 6. Further, the contact member 1 includes a pressure adjusting unit 3
The size except for 6 is almost the same as the substrate.
The pressure adjusting unit 36 has a size of 40 mm × 25 mm,
The portion on the 40 mm side is formed integrally with the main body side of the heat transfer pack 2.

On the other hand, as shown in FIG. 14, the contact member 1 has a heat transfer medium such as grease or liquid having a high thermal conductivity sealed therein, and the bag-shaped portion has a core as shown in FIG. It is made of a heat conductive film 39 provided with resin layers 41 and 42 on both sides of a material 40. The heat transfer medium sealed inside the pack 2 is a heat conductive grease based on silicon grease, and the amount of sealing is adjusted so that the average thickness of the contact member 1 after sealing is about 3 mm.

The heat sink 8 uses a heat pipe whose inside is subdivided, and finally discharges heat by flowing water through a member attached to the end face of the heat pipe. In addition, the same effect can be obtained by using the heat sink 8 as a jacket having a flowing water portion inside instead of the heat pipe. Also, substantially the same effect can be obtained by using a liquid refrigerant such as Fluorinert as the heat transfer medium sealed in the contact member 1.

In the above mounting state, the LSI chip 7
At a junction temperature of 80 ° C. or less.

Another embodiment of the present invention will be described with reference to FIG. Although FIG. 16 shows only the contact member 1, in the present embodiment, the protrusion 47 is provided on the cooling portion of the LSI chip 7 of the pack 2.
And vibrates the portion to forcibly circulate the liquid heat transfer medium sealed in the contact member 1.

The heat transfer efficiency is significantly improved by forcibly moving, diffusing, and mixing the heat transfer medium as compared with the case where the heat transfer medium is kept stationary. In this embodiment, this feature is applied to the contact member 1. In addition, the protrusion 47 provided on the pack 2 was hit by the vibration generator 43 to cause the forced circulation of the heat transfer medium as described above, thereby greatly improving the heat transfer ability. Vibration generator 43 used in this embodiment, FIG. 16
如 shown rather consists of the hitting portion 44 and the motor 45. The striking portion 44 is configured such that a plurality of rotatable spherical components are attached to the outer peripheral portion of the disk, and the spherical components are located outside the outer peripheral portion of the disk. The disk of the striking portion 44 is rotated by the motor 45, and the spherical component provided on the outer periphery of the disk intermittently strikes the projection 47, thereby pulsating the heat transfer medium in the contact member 1. In addition, the position of the protrusion 47 may be provided on each side of the pack 2, and the same effect is obtained.

Another embodiment of the present invention will be described with reference to FIGS. FIG. 17 is a perspective view showing a state in which an LSI chip is mounted on a substrate, and FIGS. 18 and 21 are heat transfer portions 34 according to the arrangement of each type of LSI chip mounted on the substrate.
19 and 20 are longitudinal sectional views of the contact member 1 shown in FIG. 18, and FIG. 22 is a longitudinal sectional view of the contact member 1 shown in FIG.

There are various mounting forms of the LSI chip 7 mounted on the substrate 6. In this embodiment, a pin grid type LSI 20 and a DIL type L having different shapes as shown in FIG.
A case where a substrate 6 in which SI is mixed is used will be described.
In this case, the height of the various LSI chips 7 mounted on the substrate 6 is different, and the height of the contact surface to the pack 2 may be different. However, as shown in FIG. The contact stability can be maintained by changing the thickness of the contact member 1. That is, as shown in FIG. 19, the contact member 1 used in this embodiment
Each pin grid type LS
The heat transfer portions 34 of the contact member 1 are divided corresponding to I49 and the plurality of DIL type LSIs 50, and the thickness of each heat transfer portion 34 is set to L.
It is changed according to the height of the SI chip 7. In the pack 2 of this embodiment, the heat transfer sections 3 divided as described above are used.
The four spaces are connected to each other by a refrigerant passage 48. If there is not much difference between the heights of the various LSI chips 7, the cross-sectional shape of the contact member 1 has the same thickness as shown in FIG.

As described above, by dividing the heat transfer section 34 and changing the thickness of each heat transfer section 34 according to the height of the LSI chip 7, the contact can be kept stable, and the heat transfer performance can be improved. In addition, since local convection can be generated in each of the heat transfer units 34, the convection can be generated without the division of the heat transfer unit 34 as compared with the case where convection occurs in the entire pack 2.
There is an advantage that cooling according to the amount of heat generated by the various LSI chips 7 can be efficiently performed.

The same type of LSI chip 7 on the same substrate 6
Is mounted, the heat transfer pack 2 is configured to have a heat transfer portion 34 corresponding to each LSI chip 7 as shown in FIG. 21 and to have substantially the same thickness as shown in FIG. You may. Also in the case of such a configuration, local convection can be generated in each heat transfer section 34, and each L
Since the adhesion between the SI chip 7 and the contact member 1 is improved, there is an effect that heat can be smoothly transferred. Another embodiment of the present invention is shown in FIGS. FIG. 23 is a longitudinal sectional view showing an application example when the contact member 1 is arranged between the substrate 6 and the heat sink 8 arranged in the vertical direction.

The contact member 1 used in this embodiment is a pack 2
A liquid heat transfer medium is sealed therein, and a partition wall 52 for preventing the flow 51 of the heat transfer medium is provided inside the heat transfer pack 2. Each partition 52 is provided such that a region formed by each partition 52 corresponds to each LSI chip 7. In such a configuration, heat generated in the LSI chip 7 is transmitted to the heat transfer medium 5 through the coating forming the contact member 1. Heated heat transfer medium 5
Rises above the contact member 1 by convection, but is prevented by the partition wall 52, turns to the heat sink 8 side, is cooled near the heat sink 8, descends downward, and returns to the LSI chip 7.
The flow 51 turns to the side. Therefore, the temperature difference in the vertical direction of the heat transfer medium in the heat transfer pack 2 arranged in the vertical direction is eliminated, the heat transfer medium of the same temperature is supplied to each LSI chip 7, and the temperature variation between the LSI chips 7 is reduced. Has an effect.

In the embodiment shown in FIG. 24, a pack 2 similar to the contact member 1 shown in FIG. 23 can be arranged in the horizontal direction, and an application example thereof is shown. In this case also it is possible to cause localized convection by septal wall 52, it is possible to form the flow 51 of the heat transfer medium corresponding to each of the LSI chip 7, the heat transfer at the same temperature for each LSI chip 7 The medium is supplied, the temperature variation between the LSI chips 7 is reduced, and the cooling stability of the LSI chips 7 is increased.

FIG. 25 shows another embodiment of the present invention. In the present embodiment, a plurality of LSI chips 7 are arranged on a substrate 6, and independent contact members 1 corresponding to the respective LSI chips 7 are arranged. Each of the contact members 1 has a configuration similar to that of the heat transfer pack 2 described above, and the heat sink 8 has a structure in which, for example, cooling water 9 flows therein to cool the heat sink 8. With such a configuration, cooling corresponding to each LSI chip 7 can be performed, and there is an effect that stability of cooling of the LSI chip 7 is increased.

[0066]

According to the present invention described above, the heat transfer performance of the contact member between the semiconductor element to be cooled and the cooling member represented by the heat sink is improved , and the insulating property to the electric circuit is improved .
Semiconductor cooling device that ensures the above.

According to the present invention, a container forming a contact member
Good heat conductivity such as heat conductive grease inside the pack
Fill the liquid and pack the metal member that comes into contact with the pack inner surface.
Heat conduction inside the pack is sealed
As well as the liquid that has been transferred
Therefore, the heat transfer efficiency based on the heat conduction in the contact member is improved.
effective.

[0068]

[0069]

[0070]

[0071]

According to the present invention, a container forming a contact member
Metal wire with spring effect inside
The contact member and the semiconductor element side
Has the effect of pressing against the contact member side, and is semiconductive with the contact member.
Enhance the heat transfer effect at the contact area between the body element and the cooling member
be able to.

According to the present invention, a plurality of semiconductors are provided on a substrate.
When the element is mounted, the hollow part of the contact member
Into a structure where the heat conductive fluid in each area communicates.
The pressure of the heat conductive fluid in each area is equalized
Of the contact member against the semiconductor element
This has the effect of preventing the size from becoming too small.

[0074]

[0075]

[0076]

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overall configuration of a semiconductor cooling device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a contact member showing one embodiment of the present invention.

FIG. 3 is a sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 4 is a sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 5 is a sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 6 is a sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 7 is a sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 8 is a vertical sectional view of a contact member showing one embodiment of the present invention.

FIG. 9 is a longitudinal sectional view of a contact member showing one embodiment of the present invention.

FIG. 10 is a longitudinal sectional view of a contact member showing one embodiment of the present invention.

FIG. 11 is a longitudinal sectional view of a contact member showing one embodiment of the present invention.

FIG. 12 is a perspective view showing another embodiment of the present invention.

FIG. 13 is a side view showing an assembled state according to another embodiment of the present invention.

FIG. 14 is a perspective view of a contact member according to another embodiment of the present invention.

FIG. 15 is a longitudinal sectional view of a heat conductive film showing another embodiment of the present invention.

FIG. 16 is a perspective view of a contact member showing still another embodiment of the present invention.

FIG. 17 is a perspective view showing still another embodiment of the present invention.

FIG. 18 is a cross-sectional view of a contact member according to still another embodiment of the present invention.

FIG. 19 is a longitudinal sectional view of a contact member showing still another embodiment of the present invention.

FIG. 20 is a longitudinal sectional view of a contact member showing still another embodiment of the present invention.

FIG. 21 is a cross-sectional view of a contact member according to still another embodiment of the present invention.

FIG. 22 is a longitudinal sectional view of a contact member showing still another embodiment of the present invention.

FIG. 23 is a longitudinal sectional view showing a mounting state of still another embodiment of the present invention.

FIG. 24 is a longitudinal sectional view showing a mounting state of still another embodiment of the present invention.

FIG. 25 is a longitudinal sectional view showing still another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Contact member, 2 ... Pack, 5 ... Filled liquid, 7 ... LSI chip, 8 ... Heat sink, 10 ... Horizontal metal coil, 13
... vertical metal coil, 16 ... metal scrubber, 18 ... mountain-shaped fin, 19 ... finned plate, 36 ... pressure adjusting unit, 43 ... vibration generator, 48 ... refrigerant passage, 34 ... heat transfer unit, 35 ... seal unit , 36: Pressure adjusting part, 37: Holding spring, 38: Clamp, 39: Thermal conductive film, 40: Core material, 41, 42
... resin layer, 43 ... vibration generator, 44 ... hitting part, 45 ...
Motor, 46: reinforcement member, 47: protrusion, 48: refrigerant passage, 49: pin grid type LSI, 50: DIL type LS
I, 51: flow of heat transfer medium, 52: partition wall, 53: platter, 54: fin, 55: flow path, 57: bolt, 58
... flexible part, 59 ... cooling water pipe, 60 ... cooling water purification device, 61 ... water pump, 62 ... water tank, 63 ... chiller.

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshio Hatada 502 Kandate-cho, Tsuchiura-shi, Ibaraki Pref. Machinery Research Laboratory, Hitachi, Ltd. In-house (72) Inventor Motohiro Sato 502 Kandate-cho, Tsuchiura-shi, Ibaraki Pref. Machinery Research Laboratory, Hitachi, Ltd. Person Takao Oba 1 Horiyamashita, Hadano-shi, Kanagawa Prefecture Inside Hitachi, Ltd.Kanagawa Plant (72) Inventor Akira Yamagiwa 1-Horiyamashita, Hadano-shi, Kanagawa Prefecture Hitachi Ltd., Kanagawa Plant (56) 36794 (JP, A) JP-A-57-211258 (JP, A) JP-A-61-74356 (JP, A) (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/34-23/46

Claims (3)

(57) [Claims] 1. A semiconductor device comprising: a semiconductor element mounted on a substrate to be cooled; and a contact member provided between the semiconductor element and a cooling member for radiating heat of the semiconductor element to cool the semiconductor element. In the semiconductor cooling device, the contact member is a hollow member, the hollow inside of the contact member is provided with a heat conductive fluid, and the contact member includes a core material made of a metal material and the core material. A semiconductor cooling device, comprising: a pack having an insulating film provided on an outer surface or inner and outer surfaces of the cooling member, wherein the contact member has a flat surface on a side in contact with the cooling member. 2. The semiconductor device according to claim 1, wherein said plurality of semiconductor elements are provided on a side of said contact member which contacts said semiconductor element so as to contact each of said plurality of semiconductor elements corresponding to a distance from said cooling member side. The semiconductor cooling device according to claim 1, further comprising a curved surface. 3. The semiconductor cooling device according to claim 2, wherein the inside of said contact member is subdivided into a plurality of regions, and said heat conductive fluid is communicated between said subdivided regions.