JP3172942B2 - Bonding equipment - Google Patents
Bonding equipmentInfo
- Publication number
- JP3172942B2 JP3172942B2 JP16324297A JP16324297A JP3172942B2 JP 3172942 B2 JP3172942 B2 JP 3172942B2 JP 16324297 A JP16324297 A JP 16324297A JP 16324297 A JP16324297 A JP 16324297A JP 3172942 B2 JP3172942 B2 JP 3172942B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- heating
- heat generating
- generating member
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Die Bonding (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ボンディング対象
の半導体チップ等を加熱及び加圧して回路基板等に接合
するボンディングヘッドを備えたボンディング装置の改
良に関するものであり、詳しくはボンディングヘッドを
冷却する技術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a bonding apparatus provided with a bonding head for bonding a semiconductor chip or the like to be bonded to a circuit board by heating and pressing, and more particularly, to cooling the bonding head. It is about technology.
【０００２】[0002]
【従来の技術】半田バンプを加熱溶融させることにより
半導体チップ等を回路基板等にボンディングするボンデ
ィング装置の一つとして、大電流をボンディングヘッド
に流し、ボンディングヘッドを加熱してボンディングす
る方法が採用されている。2. Description of the Related Art As one of bonding apparatuses for bonding a semiconductor chip or the like to a circuit board or the like by heating and melting solder bumps, a method of applying a large current to a bonding head and heating the bonding head to perform bonding is adopted. ing.
【０００３】このようなボンディング装置では溶融した
半田が冷却固化しないうちにボンディングヘッドからチ
ップを離すとチップの重みにより半田がつぶれてしまい
接合不良が発生するので、半田が冷却するまでボンディ
ングヘッドは次の動作に移れないものであった。そこ
で、ボンディング時間の短縮のためボンディングヘッド
の発熱部材に対する冷却手段を備えるのが常であった。In such a bonding apparatus, if the chip is separated from the bonding head before the molten solder is cooled and solidified, the solder will be crushed by the weight of the chip and a bonding failure will occur. It could not move to the operation of. Therefore, in order to shorten the bonding time, a cooling means for the heat generating member of the bonding head is usually provided.
【０００４】従来から存在するボンディングヘッド冷却
手段として、外部に別設したノズルから発熱部材の外部
に冷却用気体である冷却空気や冷却窒素ガスを吹き付け
る手段（特開昭５７−１２６１４３号公開特許公報記
載）や、発熱部材の内部に冷却用気体の通路を設ける手
段（実公平２−３８４５１号及び実公平３−５６０５４
号実用新案公報記載）が存在した。更に実施技術として
は、両者を併用する場合もあった。[0004] As a conventional bonding head cooling means, means for blowing cooling air or cooling nitrogen gas as a cooling gas from the nozzle separately provided to the outside of the heat generating member (Japanese Patent Laid-Open No. 57-126143). Means) and means for providing a cooling gas passage inside the heat generating member (Japanese Utility Model Publication No. 2-38451 and Japanese Utility Model Publication No. 3-56054).
No. Utility Model Publication). Furthermore, as an implementation technique, there were cases where both were used in combination.
【０００５】しかし、従来の方法では、冷却時間が長く
かかり、冷却時間を短縮させるためには冷却用気体を増
加させる必要があった。更に発熱部材の上部を支持する
支持部材は、発熱部材の発熱のために熱変形の危険性を
有しており、これらの防止を図ることも冷却手段の重要
な課題の一つであった。However, in the conventional method, the cooling time is long, and it is necessary to increase the cooling gas in order to shorten the cooling time. Further, the supporting member that supports the upper part of the heat generating member has a risk of thermal deformation due to the heat generated by the heat generating member, and prevention of these is also an important issue of the cooling means.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、発熱部材の
上部を支持する支持部材に断熱性に優れた素材を利用す
ることで支持部材の熱変形を防止し、外部冷却の伝わり
難い発熱部材と支持部材の当接面に冷却溝を設けること
により、発熱部材の良好なる冷却を可能とするボンディ
ング装置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention uses a material having excellent heat insulating properties for a support member for supporting an upper portion of a heat generating member, thereby preventing thermal deformation of the support member and preventing the external cooling from being easily transmitted. It is an object of the present invention to provide a bonding apparatus capable of excellently cooling a heat generating member by providing a cooling groove on a contact surface between the heat generating member and the supporting member.
【０００７】[0007]
【課題を解決するための手段】本発明は、上記ような課
題を解決するため、ボンディング対象チップを加熱及び
加圧して基板等に接合するボンディングヘッドを備えた
ボンディング装置において、ボンディングヘッドの作用
側先端部にボンディングツール、ボンディングツールを
加熱する発熱部材、発熱部材を支持する支持部材とを設
け、該支持部材を発熱部材よりも断熱性の優れた材質と
するとともに、発熱部材と支持部材の当接面に外部に通
じる冷却溝を、両部材の少なくとも一方に形成し、該冷
却溝に冷却用気体を供給することを特徴とするボンディ
ング装置を提供する。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a bonding apparatus having a bonding head for bonding a chip to be bonded to a substrate or the like by heating and pressurizing the chip. A bonding tool, a heat-generating member for heating the bonding tool, and a support member for supporting the heat-generating member are provided at the distal end portion. The support member is made of a material having better heat insulating properties than the heat-generating member. A bonding apparatus is provided, wherein a cooling groove communicating with the outside is formed in at least one of both members, and a cooling gas is supplied to the cooling groove.
【０００８】更に、部品点数を減らす目的で、発熱部材
と支持部材とが導電性あるボルトとナットとにより連結
し、該ボルトの一部が発熱部材と電気的に接触し、更に
ボルトに電源用端子が接続されたものとした。Further, for the purpose of reducing the number of parts, the heat generating member and the support member are connected by conductive bolts and nuts, and a part of the bolt electrically contacts the heat generating member. Terminals were connected.
【０００９】[0009]
【発明の実施の形態】以下図示の実施例とともに発明の
実施の形態について説明する。図１が、本発明に係るボ
ンディング装置の概要を示す正面図であり、ボンディン
グ装置は、チップを基板に加熱及び加圧して接合させる
ためのボンディングヘッド１を、ヘッド保持部材２で保
持しており、ボンディングヘッド１は基板ステージ３に
対し、Ｚ軸駆動機構、Θ軸駆動機構により上下方向の移
動及び水平方向の角度調整可能に取り付けられている。
尚、基板ステージ３はＸＹ軸方向に移動可能とされてい
る。Embodiments of the present invention will be described below with reference to the illustrated embodiments. FIG. 1 is a front view showing an outline of a bonding apparatus according to the present invention. The bonding apparatus holds a bonding head 1 for bonding a chip to a substrate by heating and pressing with a head holding member 2. The bonding head 1 is attached to the substrate stage 3 by a Z-axis drive mechanism and a Θ-axis drive mechanism so as to be able to move in the vertical direction and adjust the angle in the horizontal direction.
Note that the substrate stage 3 is movable in the XY axis directions.
【００１０】ボンディングヘッド１の詳細は、図２の内
部を示す正面説明図に示されているが、本発明は、ボン
ディングヘッド１の作用側（ボンディング面側）先端部
４に特徴を有する。図２中点線の丸で囲まれたボンディ
ングヘッド先端部４は、先端よりチップを吸着接合する
ボンディングツール５、ボンディングツール５を加熱す
る発熱部材６、発熱部材６を支持する支持部材７により
形成されている。尚、図３は、該先端部４のみを部分断
面図にて示している。Although the details of the bonding head 1 are shown in the front explanatory view showing the inside of FIG. 2, the present invention is characterized by the tip portion 4 on the working side (bonding surface side) of the bonding head 1. A bonding head tip 4 surrounded by a dotted circle in FIG. 2 is formed by a bonding tool 5 for sucking and joining a chip from the tip, a heating member 6 for heating the bonding tool 5, and a supporting member 7 for supporting the heating member 6. ing. FIG. 3 shows only the distal end portion 4 in a partial sectional view.
【００１１】ボンディングツール５は、チップに対応し
て交換可能なもので、従来より利用されているものでよ
く、ボンディングヘッド１先端（本発明では発熱部材
６）に真空吸着される形式のものが利用される。ボンデ
ィングツール５は、図９及び図１０で示されるようにチ
ップ吸着穴１４か設けられている。The bonding tool 5 can be exchanged corresponding to a chip, and may be a conventionally used one. A type which is vacuum-adsorbed to the tip of the bonding head 1 (the heat generating member 6 in the present invention) may be used. Used. The bonding tool 5 is provided with a chip suction hole 14 as shown in FIGS.
【００１２】発熱部材６は、電気抵抗の大きい炭化珪素
のセラミックスを利用する。この素材は従来の発熱部材
に利用されていたモリブデン等に比べると電気抵抗が非
常に大きいので、小さい電圧で大きな熱量が得られ、発
熱部材６への配線を細いものとすることが可能となる。
尚、発熱部材６の下面にはボンディングツール５を吸着
保持するツール吸着溝１５がリング状に形成されてい
る。Heating member 6 utilizes silicon carbide ceramics having a large electric resistance. Since this material has a much higher electric resistance than molybdenum or the like used for a conventional heating member, a large amount of heat can be obtained with a small voltage, and the wiring to the heating member 6 can be made thin. .
A tool suction groove 15 for suction holding the bonding tool 5 is formed in a ring shape on the lower surface of the heat generating member 6.
【００１３】支持部材７は、発熱部材６よりも断熱性の
優れた材質とする。この素材は熱を全く吸収しないもの
が最善であるが、現在かような素材は存在しない。そこ
で支持部材７は窒化珪素のセラミックスを利用してい
る。支持部材７と発熱部材６とをセラミックスという同
質の素材を利用することにより、もっとも変形の影響が
でやすい両部材６，７の当接面の変形を少なくすること
ができる。The support member 7 is made of a material having better heat insulating properties than the heat generating member 6. It is best that this material does not absorb any heat, but such material does not currently exist. Therefore, the supporting member 7 uses silicon nitride ceramics. By using the same material of ceramics for the supporting member 7 and the heat generating member 6, deformation of the contact surfaces of the members 6, 7 which are most susceptible to deformation can be reduced.
【００１４】発熱部材６と支持部材７とは、図３に示さ
れるように導電性あるボルト２０とナット２１、２２と
により連結されている。尚、発熱部材６とボンディング
ツール５とは、後に説明するツール吸着溝１５により発
熱部材６が、ボンディングツール５を吸着保持してい
る。The heat generating member 6 and the supporting member 7 are connected by conductive bolts 20 and nuts 21 and 22 as shown in FIG. Note that the heat generating member 6 and the bonding tool 5 are suction-held by the heat generating member 6 by a tool suction groove 15 described later.
【００１５】熱部材６及び支持部材７にはボルト２０の
取付貫通穴２５が、ボルト頭２４を発熱部材６の底面内
部に埋設可能なように穿設されている。ボルト２０は発
熱部材６側より差し込まれ、支持部材７上面でナット２
１にて両部材６，７を連結固定する。更に、ナット２１
の上部のボルト２０先端付近に電源用端子２３を装着
し、これをナット２２にて更に固定する。The heat member 6 and the support member 7 are provided with through holes 25 for mounting the bolts 20 so that the bolt heads 24 can be embedded in the bottom surface of the heat generating member 6. The bolt 20 is inserted from the heat generating member 6 side, and the nut 2 is
At 1, the members 6 and 7 are connected and fixed. Further, the nut 21
A power supply terminal 23 is mounted near the tip of the bolt 20 on the upper side of the bolt, and this is further fixed with a nut 22.
【００１６】このようにしてボルト２０の一部が発熱部
材６と電気的に接触し、図示されていない別設の電源部
よりボルト２０に装着された電源用端子２３に流された
電流が発熱部材６に達することができるのである。In this way, a part of the bolt 20 comes into electrical contact with the heat-generating member 6, and a current flowing from a power supply terminal 23 attached to the bolt 20 from a separate power supply unit (not shown) generates heat. The member 6 can be reached.
【００１７】本発明では、発熱部材６と支持部材７の当
接面に外部に通じる冷却溝８を、両部材の少なくとも一
方に形成する。図４及び図５に示される第１実施例では
冷却溝８は、支持部材７側に形成されている。In the present invention, a cooling groove 8 communicating with the outside is formed in at least one of the contact surfaces of the heat generating member 6 and the supporting member 7. In the first embodiment shown in FIGS. 4 and 5, the cooling groove 8 is formed on the support member 7 side.
【００１８】冷却溝８は、支持部材７の下端で、発熱部
材６との当接面９に、深さ０．１乃至０．３ミリメート
ル、幅３乃至６ミリメートルで、図４に示されるように
支持部材７の一端より対応する他端に抜けるよう２本形
成されている。このときの冷却溝８の両端部が支持部材
７と発熱部材６を当接させたとき（図５に示される）、
内部冷却用気体の吹き出し口１０となる。The cooling groove 8 has a depth of 0.1 to 0.3 mm and a width of 3 to 6 mm at the lower end of the support member 7 at the contact surface 9 with the heat generating member 6 as shown in FIG. Are formed so as to pass from one end of the support member 7 to the corresponding other end. At this time, when both ends of the cooling groove 8 contact the support member 7 and the heat generating member 6 (shown in FIG. 5),
It becomes the outlet 10 for the internal cooling gas.
【００１９】内部冷却用気体の流れについて説明する
と、ボンディングヘッド１に設けられた冷却用気体接続
口１７（図２左側上方）が、別設の冷却用気体供給装置
（図示されていない）と接続され、冷却用気体を受け入
れる。冷却用気体は、ボンディングヘッド１内の通気路
１８（図２では一部省略されている）を通り、支持部材
７の通気路１９に通じる。The flow of the internal cooling gas will be described. The cooling gas connection port 17 (upper left side in FIG. 2) provided in the bonding head 1 is connected to a separate cooling gas supply device (not shown). And accept cooling gas. The cooling gas passes through an air passage 18 (partially omitted in FIG. 2) in the bonding head 1 and communicates with an air passage 19 of the support member 7.
【００２０】図９に示されるように支持部材７内の通気
路１９は、冷却溝８に連結しており、冷却用気体は、冷
却用気体導入口１１より冷却溝８内に送り込まれ、冷却
溝８の端部である吹き出し口１０より排出される。この
冷却溝８を冷却用気体が通過するとき、発熱部材６の上
端面を冷却するのである。As shown in FIG. 9, an air passage 19 in the support member 7 is connected to the cooling groove 8, and a cooling gas is sent into the cooling groove 8 from the cooling gas introduction port 11, and is cooled. It is discharged from the outlet 10 which is the end of the groove 8. When the cooling gas passes through the cooling groove 8, the upper end surface of the heat generating member 6 is cooled.
【００２１】図８に示されるように支持部材７内部に形
成されている通路は冷却用気体の通気路１９のみではな
く、チップ吸着のためのチップ吸引通路２６とボンディ
ングツール５の吸着保持のためのツール吸引通路２８が
形成されている。As shown in FIG. 8, the passages formed inside the support member 7 are not only the cooling gas ventilation passage 19, but also a chip suction passage 26 for chip suction and a suction holding of the bonding tool 5. Is formed.
【００２２】これらの通路２６，２８はボンディングヘ
ッド１の側面に設けられたチップ吸引接続口３０、図示
されていないボンディングツール吸引接続口と接続され
て、ともに図示されていない真空吸引装置により真空吸
引されている。These passages 26 and 28 are connected to a chip suction connection port 30 provided on the side surface of the bonding head 1 and a bonding tool suction connection port (not shown), and both of them are evacuated by a vacuum suction device (not shown). Have been.
【００２３】支持部材７のチップ吸引通路２６は、発熱
部材６のチップ吸引通路２７とつながっており、更に、
ボンディングツール５のチップ吸着穴１４にもつなが
り、チップ吸着穴１４にてチップを吸着保持する。The chip suction passage 26 of the support member 7 is connected to the chip suction passage 27 of the heat generating member 6.
It is also connected to the chip suction hole 14 of the bonding tool 5, and holds the chip by the chip suction hole 14.
【００２４】他方、ツール吸引通路２８は、支持部材７
下面のツール吸引連絡口１６から発熱部材６のツール吸
引通路２９より、発熱部材６の下端面に形成されたツー
ル吸着溝１５と接続され、ツール吸着溝１５により、図
１０に示されるようにボンディングツール５を吸着保持
する。On the other hand, the tool suction passage 28 is
The tool suction groove 16 formed on the lower end surface of the heat generating member 6 is connected from the tool suction communication port 16 on the lower surface to the tool suction groove 29 formed on the lower end surface of the heat generating member 6, and is bonded by the tool suction groove 15 as shown in FIG. The tool 5 is held by suction.
【００２５】第１実施例において冷却溝８は、支持部材
７の下端面（発熱部材６との当接面９）に形成されたも
のであるが、第２実施例のように発熱部材６側に形成し
てもよい。図６及び図７がこの第２実施例を示してい
る。In the first embodiment, the cooling groove 8 is formed on the lower end surface of the support member 7 (the contact surface 9 with the heat generating member 6). May be formed. 6 and 7 show this second embodiment.
【００２６】[0026]
【発明の効果】本発明は、ボンディングヘッドの作用側
先端部にボンディングツール、ボンディングツールを加
熱する発熱部材、発熱部材を支持する支持部材とを設
け、発熱部材と支持部材の当接面に外部に通じる冷却溝
を、両部材の少なくとも一方に形成し、該冷却溝に冷却
用気体を供給するものであるので、もっとも冷却効果を
得難い発熱部材と支持部材の当接面付近を有効に冷却す
ることができる。According to the present invention, a bonding tool, a heating member for heating the bonding tool, and a supporting member for supporting the heating member are provided at the tip of the bonding head on the working side, and an external surface is provided on the contact surface between the heating member and the supporting member. Is formed in at least one of the two members, and a cooling gas is supplied to the cooling groove. Therefore, the vicinity of the contact surface between the heat-generating member and the support member, which is the most difficult to obtain the cooling effect, is effectively cooled. be able to.
【００２７】本発明は、ボンディングヘッドの作用側先
端部をボンディングツール、ボンディングツールを加熱
する発熱部材、発熱部材を支持する支持部材とで構成
し、該支持部材を発熱部材よりも断熱性の優れた材質と
するものであるので、ボンディングヘッドの変形を防止
することもできる。According to the present invention, the tip of the bonding head on the working side is constituted by a bonding tool, a heating member for heating the bonding tool, and a supporting member for supporting the heating member, and the supporting member has better heat insulating properties than the heating member. Since the bonding head is made of such a material, deformation of the bonding head can be prevented.
【００２８】発熱部材と支持部材とを導電性あるボルト
とナットとにより連結し、ボルトの一部を発熱部材と接
触させ、更にボルトに電源用端子が接続されることによ
り、発熱部材の取り付けと、発熱のための電源配線を兼
用することを可能にしたものである。The heat-generating member and the support member are connected by conductive bolts and nuts, a part of the bolt is brought into contact with the heat-generating member, and a power supply terminal is connected to the bolt, so that the mounting of the heat-generating member is possible. In addition, the power supply wiring for heat generation can be shared.
【図１】本発明に係るボンディング装置の概要を示す正
面図FIG. 1 is a front view showing an outline of a bonding apparatus according to the present invention.
【図２】ボンディングヘッドの内部正面説明図FIG. 2 is an explanatory front view of the inside of a bonding head.
【図３】ボンディングヘッド先端部の部分断面図FIG. 3 is a partial cross-sectional view of a tip of a bonding head.
【図４】発熱部材と支持部材の１実施例を示す分解斜視
図FIG. 4 is an exploded perspective view showing one embodiment of a heating member and a supporting member.
【図５】同連結状態を示す斜視図FIG. 5 is a perspective view showing the connected state.
【図６】発熱部材と支持部材の他実施例を示す分解斜視
図FIG. 6 is an exploded perspective view showing another embodiment of the heating member and the supporting member.
【図７】同連結状態を示す斜視図FIG. 7 is a perspective view showing the connected state.
【図８】ボンディングヘッド先端部の通気路を示す水平
面断面図FIG. 8 is a horizontal sectional view showing an air passage at the tip of the bonding head.
【図９】同Ａ−Ａ線断面図FIG. 9 is a sectional view taken along line AA of FIG.
【図１０】同Ｂ−Ｂ線断面図FIG. 10 is a sectional view taken along the line BB of FIG.
１．．．．．．．．．．ボンディングヘッド ２．．．．．．．．．．ヘッド保持部材 ３．．．．．．．．．．基板ステージ ４．．．．．．．．．．先端部 ５．．．．．．．．．．ボンディングツール ６．．．．．．．．．．発熱部材 ７．．．．．．．．．．支持部材 ８．．．．．．．．．．冷却溝 ９．．．．．．．．．．当接面 １０．．．．．．．．吹き出し口 １１．．．．．．．．冷却用気体導入口 １２、１３．．チップ吸引連絡口 １４．．．．．．．．チップ吸着穴 １５．．．．．．．．ツール吸着溝 １６．．．．．．．．ツール吸引連絡口 １７．．．．．．．．冷却用気体接続口 １８、１９．．通気路 ２０．．．．．．．．ボルト ２１、２２．．ナット ２３．．．．．．．．電源用端子 ２４．．．．．．．．ボルト頭 ２５．．．．．．．．取付貫通穴 ２６，２７．．．チップ吸引通路 ２８、２９．．．ツール吸引通路 1. . . . . . . . . . 1. Bonding head . . . . . . . . . Head holding member 3. . . . . . . . . . Substrate stage 4. . . . . . . . . . Tip 5. . . . . . . . . . 5. Bonding tool . . . . . . . . . Heating member 7. . . . . . . . . . Support member 8. . . . . . . . . . Cooling groove 9. . . . . . . . . . Contact surface 10. . . . . . . . Outlet 11. . . . . . . . Cooling gas inlets 12, 13. . Tip suction connection port 14. . . . . . . . 14. Chip suction hole . . . . . . . Tool suction groove 16. . . . . . . . Tool suction port 17. . . . . . . . Cooling gas connection port 18, 19. . Ventilation path 20. . . . . . . . Bolts 21, 22. . Nut 23. . . . . . . . Power supply terminal 24. . . . . . . . Bolt head 25. . . . . . . . Mounting through holes 26, 27. . . Chip suction passage 28, 29. . . Tool suction passage
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/52 H01L 21/60 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 21/52 H01L 21/60
Claims (2)
て基板等に接合するボンディングヘッドを備えたボンデ
ィング装置において、ボンディングヘッドの作用側先端
部にボンディングツール、ボンディングツールを加熱す
る発熱部材、発熱部材を支持する支持部材とを設け、該
支持部材を発熱部材よりも断熱性の優れた材質とすると
ともに、発熱部材と支持部材の当接面に外部に通じる冷
却溝を、両部材の少なくとも一方に形成し、該冷却溝に
冷却用気体を供給することを特徴とするボンディング装
置。In a bonding apparatus provided with a bonding head for bonding a chip to be bonded to a substrate or the like by heating and pressurizing, a bonding tool, a heating member for heating the bonding tool, and a heating member for heating the bonding tool are provided at the front end of the bonding head. A supporting member for supporting the supporting member, the supporting member being made of a material having better heat insulating properties than the heat generating member, and a cooling groove communicating with the outside of the contact surface between the heat generating member and the support member formed on at least one of the two members. And a cooling gas is supplied to the cooling groove.
とナットとにより連結され、該ボルトの一部が発熱部材
と電気的に接触し、更にボルトに電源用端子が接続され
たことを特徴とする請求項１記載のボンディング装置。2. A heat generating member and a support member are connected by conductive bolts and nuts, a part of the bolt is in electrical contact with the heat generating member, and a power supply terminal is connected to the bolt. The bonding apparatus according to claim 1, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16324297A JP3172942B2 (en) | 1997-06-05 | 1997-06-05 | Bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16324297A JP3172942B2 (en) | 1997-06-05 | 1997-06-05 | Bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10340915A JPH10340915A (en) | 1998-12-22 |
| JP3172942B2 true JP3172942B2 (en) | 2001-06-04 |
Family
ID=15770060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16324297A Expired - Fee Related JP3172942B2 (en) | 1997-06-05 | 1997-06-05 | Bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3172942B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4683782B2 (en) * | 2001-07-31 | 2011-05-18 | 京セラ株式会社 | Contact heating device |
| JP4726837B2 (en) * | 2007-03-20 | 2011-07-20 | 京セラ株式会社 | Heater device |
| JP4808283B1 (en) * | 2010-06-30 | 2011-11-02 | 株式会社新川 | Electronic component mounting apparatus and electronic component mounting method |
| KR102158822B1 (en) * | 2014-06-10 | 2020-09-22 | 세메스 주식회사 | Bonding head and die bonding apparatus having the same |
| KR102141189B1 (en) * | 2014-06-30 | 2020-08-04 | 세메스 주식회사 | Bonding head and die bonding apparatus having the same |
-
1997
- 1997-06-05 JP JP16324297A patent/JP3172942B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10340915A (en) | 1998-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7208833B2 (en) | Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate | |
| JP3165807B2 (en) | Electronic semiconductor device, multi-chip module and row thereof | |
| US5825625A (en) | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink | |
| US6569764B1 (en) | Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material | |
| JP3971568B2 (en) | Semiconductor package and semiconductor package manufacturing method | |
| JP3172942B2 (en) | Bonding equipment | |
| JP3347279B2 (en) | Semiconductor device and method of manufacturing the same | |
| JPH06309532A (en) | Ic card | |
| JPH11163045A (en) | Semiconductor device and its manufacture | |
| JP2003133662A (en) | Ceramic circuit board | |
| JP3539826B2 (en) | Thermocompression tools | |
| JP3449185B2 (en) | Electronic component bonding equipment | |
| JP2000286292A (en) | Electric power part brazed to support and its fitting method | |
| JP3275396B2 (en) | IC chip bonding method and bonding head | |
| WO2020254143A1 (en) | Half-bridge power assembly | |
| JP2002100714A (en) | Semiconductor device | |
| JPH05315467A (en) | Hybrid integrated circuit device | |
| JP4120173B2 (en) | Chip structure | |
| JPH0279451A (en) | Semiconductor device, its cooling and manufacturing methods | |
| JPH1167958A (en) | High-radiation type package structure for flip chip | |
| JP2800605B2 (en) | Semiconductor device | |
| JPH08255868A (en) | Semiconductor device and manufacture thereof | |
| KR20000020421A (en) | High heat dissipating chip scale package(csp) and manufacturing method thereof | |
| JP4112682B2 (en) | Electronic component mounting device | |
| JPH10189801A (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080330 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090330 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090330 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100330 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110330 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110330 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120330 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120330 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130330 Year of fee payment: 12 |
|
| LAPS | Cancellation because of no payment of annual fees |