JP4112682B2 - Electronic component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a circuit board by forming connection terminals of the electronic component by bumps and thermally bonding the bumps to electrode portions formed on the circuit board. is there.
[0002]
[Prior art]
As a mounting technique for improving the mounting density of electronic components on a circuit board, a mounting method is known in which bumps formed on an electronic component such as an IC are thermally bonded to electrode portions of the circuit board. An electronic component mounting apparatus for mounting such a bump-formed electronic component on a circuit board by thermal bonding includes a heating unit in a bonding head for mounting the electronic component at a predetermined position on the circuit board. . This electronic component mounting apparatus is configured as shown in FIG. 1, and the bonding head A is mounted on a moving mechanism 21 in the X-axis direction in the drawing, and the electronic component 1 is removed from a parts tray 2 that supplies the electronic component 1. It is held and moved onto the circuit board 4. The parts tray 2 and the circuit board 4 are held on a slide base 6 mounted on a mechanism 23 for moving in the Y-axis direction, and the horizontal movement of the bonding head A and the slide base 6 in the XY-axis directions respectively. After positioning the mounting position, the bump formed on the electronic component 1 is brought into contact with the electrode portion formed on the circuit board by the lowering of the bonding head A, and the electronic component 1 is attached by the heating means provided in the bonding head A. It heats and heat-bonds between a bump and an electrode part.
[0003]
The bonding head A is configured as shown in FIG. 6 in the prior art. The bonding head A4 according to the prior art includes a bonding tool 23, a ceramic heater 24, a water jacket 27, and a main body 28 from the front end side. The main body 28 is provided with a component suction air passage 25 and a tool suction air passage 26, and the tip of the component suction air passage 25 opens to the center of the bonding tool 23, and the electronic component is obtained by vacuum suction. 1 is adsorbed. The tip of the tool suction air passage 26 opens at the lower surface of the ceramic heater 24 to hold the bonding tool 23 by vacuum suction. The bonding head A <b> 4 sucks the electronic component 1 with the bonding tool 23 by the vacuum exhaust from the component suction air passage 25 on the parts tray 2, moves onto the circuit board 4, and heats the bonding tool 23 with the ceramic heater 24. Thus, the electronic component 1 is heated to thermally bond the bump 30 to the electrode portion 31. The water jacket 27 provided between the ceramic heater 24 and the main body 28 is provided with cooling water so that the heating of the ceramic heater 24 does not reach the main body 28 and cause a decrease in mechanical accuracy due to thermal expansion. Circulates so that the heat of the ceramic heater 24 does not reach the main body 28.
[0004]
[Problems to be solved by the invention]
In the above-described conventional configuration, the bonding temperature at which the bump 30 is thermally bonded to the electrode portion 31 is 250 ° C. or less when solder, an anisotropic conductive film, or the like is used as the bump 30, so the maximum heating temperature of the ceramic heater 24 is also high. It is set to about 250 ° C. However, when a material having a high bonding temperature is used as the bump 30, it is necessary to increase the heating temperature of the ceramic heater 24. At this time, the bumper 30 is connected to a heating power source to supply heating power to the ceramic heater 24. The temperature of the power supply connection part 29 rises and exceeds the heat resistance temperature of the power supply connection part 29. For example, when the heating temperature of the ceramic heater 24 is set to 500 ° C., the temperature of the power supply connection portion 29 rises to 420 ° C. close to the surface temperature of the ceramic heater 24 as shown in FIG. The power supply connection portion 29 is an electrical connection portion, and at such a high temperature, the deterioration due to the thermal effect is severe, and there is a risk of not only reducing the life but also disconnection. Therefore, the bonding head A4 according to the conventional configuration has a high function because the ceramic heater 24 cannot be heated to a temperature higher than the heat resistance temperature of the power supply connection portion 29, and the material for forming the bump 30 to be thermally bonded is limited. There is a problem that an electronic component mounting apparatus that improves the mounting density and mounting accuracy by the bump structure cannot be configured.
[0005]
An object of the present invention is to provide an electronic component mounting apparatus configured to be able to cope with a case where a high bonding temperature is required for thermal bonding of bumps to electrode portions.
[0006]
[Means for Solving the Problems]
The present invention for achieving the above object, the bonding head attaching operation by the lifting movement of the electronic component on the circuit board includes a main body portion of the bonding head to the lifting movement, from the distal end side of its adsorption of the electronic component a bonding tool for holding abut on this bonding tool, and a ceramic heater for heating the bonding tool contacts the ceramic heater, and a cooling unit for the heat of the ceramic heater is thermally cut off so as not transmitted to the main body portion The cooling part is disposed between the ceramic heater and the main body part so as to be in contact with the main body part and provided at the front end side of the main body part, and is sucked and held by the bonding tool. A bump of the electronic component is brought into contact with an electrode portion formed on the circuit board so that the electronic component is adjacent to the ceramic heater. In an electronic component mounting apparatus for supplying heating power from a power supply connection portion of a ceramic heater provided as described above and thermally bonding the bumps of the electronic component to an electrode portion by heating the ceramic heater, and mounting the electronic component on a circuit board, A part of the casing of the cooling part provided between the ceramic heater and the main body part is protruded downward so as to cool the power supply connection part to a heat resistant temperature or less, and the power supply connection part is contacted with the power supply connection part. The power supply connection part cooling means in contact is provided.
[0007]
According to this configuration, the power connection portion of the ceramic heater, provided to protrude a portion of the cooling portion of the housing provided between the ceramic heater and the main body downward, is brought into contact with power connections Because it is cooled by the power connection cooling means, even when the heating temperature of the ceramic heater is set high and thermal bonding between the bump and the electrode is performed, deterioration and disconnection due to temperature rise of the power connection are prevented. The
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings for understanding of the present invention. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
[0012]
In FIG. 1, an electronic component mounting apparatus according to the present embodiment mounts an electronic component on a circuit board by thermally bonding bumps formed on the electronic component to electrode portions of the circuit board. In order to mount the electronic component on which the bumps that require this are formed, it is configured to be capable of thermal bonding at a high temperature. A bonding head A for mounting electronic components is mounted on an X-axis moving mechanism 21 that moves the bonding head A in the X-axis direction in the figure, and includes an elevating mechanism 22. The electronic component 1 is supplied to the parts tray 2 fixed on the slide base 6 that moves in the Y-axis direction shown in the figure by the Y-axis moving mechanism 23, and the circuit board 4 is positioned on the bonding stage 7 fixed on the slide base 6. Fixed. The operation of taking out the electronic component 1 from the parts tray 2 by the movement of the bonding head A in the X-axis direction, the movement of the slide base 6 in the Y-axis direction, and the up-and-down movement of the bonding head A, the positioning operation of the circuit board 4, and the electronic components The electronic component mounting is executed by performing a series of movements of mounting 1 to a predetermined position on the circuit board 4.
[0013]
The first to third embodiments of the bonding head A in which the bump formed on the electronic component 1 is thermally bonded to the electrode portion of the circuit board 4 will be described below.
[0014]
In FIG. 2, the bonding head A <b> 1 according to the first embodiment includes a water jacket 5, a ceramic heater 8, and a bonding tool 9 on a main body 3 that moves in the X-axis direction and moves up and down by the X-axis moving mechanism 21 and the lifting mechanism 22. Is provided. The main body 3 is formed with a component suction air passage 16 and a tool suction air passage 17 which are connected to vacuum exhaust means (not shown), respectively, and the tool suction air passage 17 opens on the lower surface of the ceramic heater 8. Thus, the bonding tool 9 is configured to be adsorbed to the ceramic heater 8 by vacuum adsorption. With this adsorption structure, the bonding tool 9 can be replaced with one that matches the size and shape of the electronic component 1. The component suction air passage 16 opens at the center of the bonding tool 9 and sucks the electronic component 1 onto the bonding tool 9 by vacuum suction.
[0015]
The bonding head A1 that has attracted the electronic component 1 to the bonding tool 9 is lowered onto the circuit board 4 by the elevating mechanism 22, and the electronic component is applied to the electrode portion 11 formed on the circuit board 4 as shown in FIG. The bump 10 formed in 1 is brought into contact.
[0016]
The bonding tool 9 is heated by the ceramic heater 8, and the electronic component 1 is heated from the upper surface thereof, whereby heat is conducted from the bump 10 to the circuit board 4 through the electrode portion 11, and the heating between the bump 10 and the electrode portion 11 is caused by this heating. Thermally bonded. When the heating of the ceramic heater 8 is conducted to the main body 3 side, an error occurs in positioning accuracy and the like due to thermal expansion. Therefore, the water jacket 5 is disposed between the ceramic heater 8 and the main body 3. The heat conduction to the main body 3 is blocked by the circulation of the cooling water.
[0017]
In the thermal bonding between the bump 10 and the electrode part 11, when using solder, an anisotropic conductive film or the like, the bonding temperature is 250 ° C. or lower, so the maximum heating temperature of the ceramic heater 8 is also set to about 250 ° C. Is done. However, when Au (gold) is used as the bonding material, the temperature of the thermal bonding may need to be heated to about 500 ° C. When such high temperature heating is performed, the ceramic heater 8 The temperature of the power supply connecting part 12 for supplying heating power to the battery also rises, causing damage or disconnection due to heat. Therefore, in this configuration, a cooling unit that suppresses the temperature rise of the power supply connection portion 12 is provided. As shown in FIG. 2, this cooling means is a cooling protrusion (power supply connecting part cooling means) 5a provided on the water jacket 5 by projecting a part of the casing downward, which is connected to the power supply. Since the power supply connection portion 12 is cooled by the casing of the water jacket 5 that is cooled by circulation of the cooling water by being brought into contact with the connection portion 12, the surface temperature of the ceramic heater 8 is changed as shown in FIG. Even in the state of being heated to 500 ° C., the power supply connecting portion 12 is maintained at 240 ° C. or lower. Since the power supply connection portion 12 is cooled to a temperature lower than the heat-resistant temperature by the configuration of the cooling means, the problem that the power supply connection portion 12 deteriorates due to the temperature rise and is disconnected even when performing thermal bonding at a high temperature is solved. .
[0018]
The structure which suppresses the temperature rise of the power supply connection part 12 can also be comprised like the 2nd, 3rd embodiment shown below.
[0019]
FIG. 3 shows the configuration of the bonding head A2 according to the second embodiment, and a heat conduction portion (power supply connection portion cooling means) 8a that abuts the water jacket 5 is provided on the power supply connection portion 12 of the ceramic heater 8. Configured. With this configuration, the temperature of the power supply connecting portion 12 is cooled by being conducted from the heat conducting portion 8a to the water jacket 5, so that the temperature rise as shown in FIG. 5 is suppressed.
[0020]
Moreover, in order to suppress the temperature rise of the power supply connection part 12, it can also comprise like 3rd Embodiment shown in FIG. In this configuration, as shown in the figure, the temperature rise of the power supply connection portion 12 can be suppressed by blowing air from the air cooling nozzle (power supply connection portion cooling means) 13 to the power supply connection portion 12.
[0021]
【The invention's effect】
According to the present invention as explained above, the power source connecting portion of the ceramic heater as a heating source for thermal bonding, the downward part of the housing of the cooling portion provided between the main body portion and the ceramic heater Since the cooling means is provided so as to protrude and contact with each other , even when the thermal bonding temperature is high, the temperature rise of the power connection portion is suppressed, and damage or disconnection due to the high temperature of the power connection portion is eliminated. be able to.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a configuration of an electronic component mounting apparatus according to an embodiment.
FIG. 2 is a cross-sectional structure diagram showing the configuration of the bonding head according to the first embodiment.
FIG. 3 is a cross-sectional structure diagram illustrating a configuration of a bonding head according to a second embodiment.
FIG. 4 is a cross-sectional structure diagram showing a configuration of a bonding head according to a third embodiment.
FIG. 5 is a temperature graph showing the effect of suppressing the temperature of the power connection part.
FIG. 6 is a cross-sectional structure diagram showing a configuration of a bonding head according to a conventional technique.
FIG. 7 is a temperature graph showing a temperature rise in a power connection part.
[Explanation of symbols]
A, A1, A2, A3 Bonding head 1 Electronic component 3 Body part 4 Circuit board 5 Water jacket (cooling part)
5a Cooling protrusion (power supply connection part cooling means)
8 Ceramic heater (heater)
8a Heat conduction part (power supply connection part cooling means)
9 Bonding tool 10 Bump 11 Electrode part 12 Power supply connection part 13 Air-cooling nozzle (power supply connection part cooling means)

Claims (1)

Bonding head for mounting operation by the lifting movement of the electronic component on the circuit board includes a main body portion of the bonding head to the lifting movement, from the distal end side of that, the bonding tool for attracting and holding the electronic component, those in the bonding tool contact, and a ceramic heater for heating a bonding tool, the ceramic heater in contact, and having a cooling portion for heat rejection to the heat of the ceramic heater is not transmitted to the main body portion, the ceramic heater of the cooling unit The electronic component is formed on the circuit board so as to be disposed between the main body and the front end of the main body so as to be disposed between the main body and the bonding tool. The bumps of the electronic component are brought into contact with the electrode parts, and the ceramic heater provided adjacent to the ceramic heater In the electronic component mounting apparatus for mounting electronic components on a circuit board by heat bonding the electronic component of the bump to the electrode portion by heating of the ceramic heater by supplying heating power from a source connection portion,
A part of the casing of the cooling part provided between the ceramic heater and the main body part is protruded downward so as to cool the power supply connection part to a heat resistant temperature or less, and the power supply connection part is contacted with the power supply connection part. An electronic component mounting apparatus, comprising: a power supply connection portion cooling means that is in contact with the electronic component mounting section.

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