JP3171986B2 - Novel fluorine derivative of imidazole, method for producing the same, and surface treating agent using the same - Google Patents

Novel fluorine derivative of imidazole, method for producing the same, and surface treating agent using the same

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Publication number
JP3171986B2
JP3171986B2 JP8343593A JP8343593A JP3171986B2 JP 3171986 B2 JP3171986 B2 JP 3171986B2 JP 8343593 A JP8343593 A JP 8343593A JP 8343593 A JP8343593 A JP 8343593A JP 3171986 B2 JP3171986 B2 JP 3171986B2
Authority
JP
Japan
Prior art keywords
imidazole
fluorine derivative
formula
fluorine
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8343593A
Other languages
Japanese (ja)
Other versions
JPH06157471A (en
Inventor
正志 熊谷
克之 土田
一雄 吉田
幸男 荻野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Japan Energy Corp
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Filing date
Publication date
Application filed by Japan Energy Corp filed Critical Japan Energy Corp
Priority to JP8343593A priority Critical patent/JP3171986B2/en
Publication of JPH06157471A publication Critical patent/JPH06157471A/en
Application granted granted Critical
Publication of JP3171986B2 publication Critical patent/JP3171986B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
  • Lubricants (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Epoxy Compounds (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、金属や高分子材料等の
表面の潤滑、防錆、撥水及び撥油等を行うための表面処
理剤、特にはプリント回路用銅張積層板等に用いられる
銅箔や熱交換器の伝熱チューブ等、さらには磁気ディス
ク等の表面処理剤として好適な新規なイミダゾールフッ
素誘導体及びその製造方法、並びにその用途に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treating agent for lubricating, rust-proofing, water-repelling, oil-repelling, etc. the surface of a metal or polymer material, and particularly to a copper-clad laminate for a printed circuit. The present invention relates to a novel imidazole fluorine derivative suitable as a surface treatment agent for a copper foil used, a heat transfer tube of a heat exchanger, and a magnetic disk or the like, a method for producing the same, and uses thereof.

【0002】[0002]

【従来の技術】プリント回路用の銅張積層板は銅箔に紙
−フェノール樹脂含浸基材やガラス−エポキシ樹脂含浸
基材等と加熱、加圧して積層して形成され、これをエッ
チングして回路網を形成し、これに半導体装置等の素子
を搭載することにより電子機器用のボードが作られる。
これらの過程では、基材との接着、加熱、酸やアルカリ
液への浸漬、レジストインクの塗布、ハンダ付け等が行
われるため、銅箔には接着性、耐熱性、耐湿性、耐薬品
性等の性能が要求される。さらに、保管時に銅箔の酸化
変色のないことも要求される。
2. Description of the Related Art A copper-clad laminate for a printed circuit is formed by laminating a copper foil with a paper-phenol resin-impregnated base material or a glass-epoxy resin-impregnated base material by heating and pressing, and etching this. By forming a circuit network and mounting elements such as a semiconductor device on the circuit network, a board for electronic equipment is manufactured.
In these processes, adhesion to the substrate, heating, immersion in an acid or alkaline solution, application of resist ink, soldering, etc. are performed, so the adhesiveness, heat resistance, moisture resistance, and chemical resistance of the copper foil Performance is required. Further, it is required that the copper foil does not undergo oxidative discoloration during storage.

【0003】これらの要求を満たすために、銅箔に黄銅
層形成処理(特公昭51−35711号公報、同54−
6701号公報)、クロメート処理、亜鉛または酸化亜
鉛とクロム酸化物とからなる亜鉛−クロム基混合物被覆
処理等(特公昭58−7077号公報)が行われ、また
これらにシランカップリング剤を塗布して銅箔と樹脂基
板との接着性を向上させる方法も提案されている(特公
平2−19994号公報、特開昭63−183178号
公報、特開平2−26097号公報)。
In order to satisfy these requirements, a brass layer forming treatment is applied to a copper foil (JP-B-51-35711, JP-A-54-35711).
6701), chromate treatment, coating treatment of zinc or a mixture of zinc and chromium groups composed of zinc oxide and chromium oxide (Japanese Patent Publication No. 58-7077), and a silane coupling agent is applied thereto. A method for improving the adhesiveness between a copper foil and a resin substrate has also been proposed (Japanese Patent Publication No. 2-19994, Japanese Patent Application Laid-Open No. 63-183178, Japanese Patent Application Laid-Open No. 2-26097).

【0004】[0004]

【発明が解決しようとする課題】しかし、最近プリント
回路が緻密化しているので、使用されるプリント回路用
銅箔に要求される特性はますます厳しくなっている。ま
た、冷蔵庫等の冷凍システムのコンデンサ、キャピラリ
及びエバポレータ等において、冷媒や潤滑油の劣化或い
はシステム内の有機材料成分の溶出等によりスラッジ状
物質が発生し、これが特にキャピラリにおいて閉塞の原
因となっている。また、エバポレータでは、冷媒の蒸発
に際して潤滑油膜がエバポレータ内表面上に残存付着す
るため伝熱効率が悪く、冷却効率を下げているという問
題があった。
However, as printed circuits have become more and more compact recently, the characteristics required of the copper foil for printed circuits used have become increasingly severe. Further, in condensers, capillaries, evaporators, and the like of refrigeration systems such as refrigerators, sludge-like substances are generated due to deterioration of refrigerants and lubricating oils or elution of organic material components in the systems, and this causes clogging particularly in capillaries. I have. Further, the evaporator has a problem that the lubricating oil film remains on the inner surface of the evaporator when the refrigerant evaporates, so that the heat transfer efficiency is poor and the cooling efficiency is reduced.

【0005】さらに、磁気デスクにおいては、低摩擦
性、撥水性、撥油性が要求され、従来、フッ素系ポリマ
ーが用いられているが、高密度記録化のため、更なる性
能の向上が要求されている。
Further, magnetic desks are required to have low friction, water repellency and oil repellency. Conventionally, fluorine-based polymers have been used. However, further improvement in performance is required for high-density recording. ing.

【0006】本発明はかかる現状に鑑み、銅をはじめ各
種の金属や高分子材料等の表面に対し優れた接着性及び
耐ハクリ性をもって皮膜を形成し、該表面に顕著な撥水
性、撥油性、潤滑性及び防錆性を付与することができる
優れた表面処理剤として有用な新規化合物を提供するこ
と及びそれを用いた表面処理剤を提供することを目的と
するものである。
In view of this situation, the present invention forms a film with excellent adhesion and peel resistance on the surface of various metals such as copper and polymer materials, and has remarkable water repellency and oil repellency on the surface. It is an object of the present invention to provide a novel compound useful as an excellent surface treatment agent capable of imparting lubricity and rust prevention, and to provide a surface treatment agent using the same.

【0007】[0007]

【課題を解決するための手段】本発明者は、鋭意検討し
た結果、フッ素を含む特定一群のイミダゾール誘導体に
よって上記の課題を解決し得ることを見出し、本発明に
至った。
Means for Solving the Problems As a result of intensive studies, the present inventors have found that the above-mentioned problems can be solved by a specific group of imidazole derivatives containing fluorine, and have reached the present invention.

【0008】すなわち、本発明は、 下記一般式(1)で表わされる新規イミダゾールフッ
素誘導体。
[0008] That is, the present invention provides a novel imidazole fluorine derivative represented by the following general formula (1).

【0009】[0009]

【化5】 Embedded image

【0010】(式中、R1は水素、ビニル基又はポリエ
チレン基を示し、R2は下記一般式(2)で表わされる
基を、R3は水素又は下記一般式(3)で表わされる基
をそれぞれ示し、下記一般式(2)中のR4は、フッ素
又はトリフルオロメチル基を示し、nは1〜15の整数
である。)
Wherein R 1 represents hydrogen, a vinyl group or a polyethylene group, R 2 represents a group represented by the following general formula (2), and R 3 represents hydrogen or a group represented by the following general formula (3) R 4 in the following general formula (2) represents a fluorine or trifluoromethyl group, and n is an integer of 1 to 15.)

【0011】[0011]

【化6】 Embedded image

【0012】イミダゾール又は4−ビニルイミダゾー
ルと下記一般式(4)で表わされる1,2−エポキンプ
ロパン化合物とを反応させることを特徴とする前記に
記載のイミダゾールフッ素誘導体の製造方法。
[0012] The method for producing an imidazole fluorine derivative as described above, wherein imidazole or 4-vinylimidazole is reacted with a 1,2-epokinepropane compound represented by the following general formula (4).

【0013】[0013]

【化7】 Embedded image

【0014】(式中、R2は下記一般式(2)で表わさ
れる基を示し、該一般式(2)中のR4はフッ素又はト
リフルオロメチル基を示し、nは1〜15の整数であ
る。}
(Wherein, R 2 represents a group represented by the following general formula (2); R 4 in the general formula (2) represents a fluorine or trifluoromethyl group; and n is an integer of 1 to 15) It is.

【0015】[0015]

【化8】 Embedded image

【0016】上記に記載の一般式(1)で表わされ
たイミダゾールフッ素誘導体の少なくとも一種を有効成
分とすることを特徴とする金属表面処理剤。本発明の前
記一般式(1)で表わされる新規なイミダゾールフッ素
誘導体として、とくに好ましいものを以下に挙げる。
A metal surface treating agent comprising as an active ingredient at least one of the above-mentioned imidazole fluorine derivatives represented by the general formula (1). As the novel imidazole fluorine derivative represented by the general formula (1) of the present invention, particularly preferred are the following.

【0017】[0017]

【化9】 Embedded image

【0018】[0018]

【化10】 Embedded image

【0019】[0019]

【化11】 Embedded image

【0020】本発明の一般式(1)で表わされるイミダ
ゾールフッ素誘導体は、イミダゾール又は4−ビニルイ
ミダゾールと下記一般式(4)で表わされる1,2−エ
ポキシプロパン化合物とを100〜150℃で反応させ
ることにより容易に製造することができる。
The fluorine derivative of imidazole represented by the general formula (1) of the present invention is obtained by reacting imidazole or 4-vinylimidazole with a 1,2-epoxypropane compound represented by the following general formula (4) at 100 to 150 ° C. By doing so, it can be easily manufactured.

【0021】[0021]

【化12】 Embedded image

【0022】(式中のR1、R2、R3は前記と同じ)上
記一般式(4)で表わされる1,2−エポキシプロパン
化合物としては、3−パーフルオロオクチル−1,2−
エポキシプロパン、3−パーフルオロデシル−1,2−
エポキシプロパン、3−(パーフルオロ−9−メチルデ
シル)−1,2−エポキシプロパン等が好ましい。
(Wherein R 1 , R 2 and R 3 are the same as described above) As the 1,2-epoxypropane compound represented by the general formula (4), 3-perfluorooctyl-1,2-
Epoxypropane, 3-perfluorodecyl-1,2-
Epoxypropane, 3- (perfluoro-9-methyldecyl) -1,2-epoxypropane and the like are preferred.

【0023】上記イミダゾール又は4−ビニルイミダゾ
ールと1,2−エポキシプロパン化合物との反応は、1
00〜150℃の温度に加熱したイミダゾール又はビニ
ルイミダゾールに0.5〜2モルの1,2−エポキシプ
ロパン化合物を滴下させながら行うと良く、反応時間は
10分〜6時間程度である。この反応は特に溶媒を必要
としないが、ジメチルホルムアミド、ジメチルアセトア
ミド等を反応溶媒として用いてもよい。又この反応は水
分を嫌うので水分が混入しないように乾燥した窒素、ア
ルゴン等の水分を含まない不活性気体の雰囲気下で行う
ことが好ましい。
The reaction between the above imidazole or 4-vinylimidazole and a 1,2-epoxypropane compound is performed by
The reaction may be carried out while dropping 0.5 to 2 mol of the 1,2-epoxypropane compound into imidazole or vinylimidazole heated to a temperature of 00 to 150 ° C., and the reaction time is about 10 minutes to 6 hours. This reaction does not require a solvent, but dimethylformamide, dimethylacetamide or the like may be used as a reaction solvent. In addition, since this reaction dislikes water, it is preferable to carry out the reaction in an atmosphere of a dry inert gas such as nitrogen or argon so that water is not mixed.

【0024】又、4−ビニルイミダゾールを使用する場
合、上記の反応とともに、ビニル基の付加重合反応が起
るので、これを抑制することを望む場合にはハイドロキ
ノン等の周知の重合禁止剤を使用する。又、反対にビニ
ル基を付加重合させてポリエチレンにイミダゾールフッ
素誘導体がペンダントした化合物を望む場合には重合禁
止剤を用いず、無溶媒で反応を行なうことが好ましい。
When 4-vinylimidazole is used, an addition polymerization reaction of a vinyl group occurs together with the above-mentioned reaction. If it is desired to suppress this, a well-known polymerization inhibitor such as hydroquinone is used. I do. On the contrary, when a compound in which an imidazole fluorine derivative is pendant to polyethylene by addition polymerization of a vinyl group is desired, the reaction is preferably carried out without using a polymerization inhibitor and without using a solvent.

【0025】本発明のイミダゾールフッ素誘導体は、金
属表面処理剤として好適である。金属表面上に形成され
た本発明のイミダゾールフッ素誘導体の皮膜は以下に説
明するようにテフロン級の顕著な撥水性、及び撥油性を
示し、該金属表面の防錆性を著しく向上することができ
る。
The fluorine derivative of the present invention is suitable as a metal surface treating agent. The film of the imidazole fluorine derivative of the present invention formed on the metal surface exhibits remarkable water repellency of Teflon grade and oil repellency as described below, and can significantly improve the rust prevention of the metal surface. .

【0026】この他、本発明のイミダゾールフッ素誘導
体は、金属表面に限らず、高分子材料や無機材料等の各
種の基材に塗布されてその基材に同様に撥水性、撥油
性、潤滑性を付与することができる。又、エポキシ樹脂
などの合成樹脂に添加することにより、その樹脂に対し
ても同様に撥水性、撥油性、潤滑性を付与することがで
きる。
In addition, the imidazole fluorine derivative of the present invention is applied not only to a metal surface but also to various base materials such as a polymer material and an inorganic material, and the water repellency, oil repellency and lubricity are similarly applied to the base material. Can be provided. Further, by adding to a synthetic resin such as an epoxy resin, the resin can be similarly provided with water repellency, oil repellency, and lubricity.

【0027】本発明のイミダゾールフッ素誘導体を金属
表面処理剤として用いる場合についてさらに述べると、
その対象金属には特に制限はない。たとえば銅、アルミ
ニウム、鉄及びこれらの合金等の表面処理剤として有用
である。しかし、銅及び銅合金の表面処理剤として用い
ることが好適であり、特にはプリント回路用銅張積層板
等に用いられる銅箔の表面処理剤として用いる場合に本
発明の効果を十分に発揮することができる。この銅箔に
は銅箔の表面を粗面化処理したもの、銅箔に黄銅層形成
処理したもの、クロメート処理したもの、亜鉛−クロム
基混合物被覆処理したもの等も包含される。
The case where the imidazole fluorine derivative of the present invention is used as a metal surface treating agent is further described as follows.
The target metal is not particularly limited. For example, it is useful as a surface treatment agent for copper, aluminum, iron, and alloys thereof. However, it is preferable to use it as a surface treatment agent for copper and copper alloys, and particularly when using it as a surface treatment agent for copper foil used in copper-clad laminates for printed circuits, etc., the effect of the present invention is sufficiently exhibited. be able to. Examples of the copper foil include those obtained by roughening the surface of a copper foil, those obtained by forming a brass layer on a copper foil, those subjected to a chromate treatment, and those subjected to a zinc-chromium group mixture coating treatment.

【0028】また、冷蔵庫等の冷凍システムのコンデン
サ、キャピラリ及びエバポレータ等の内壁面の表面処理
剤として用いることができ、この表面処理剤の強力な撥
水及び撥油性能により、特に、キャピラリ内壁において
はスラッジ状物質の付着及びこの付着による閉塞を防止
することができる。さらに、エバポレータ内壁において
は、潤滑油と混合した冷媒が蒸発する際、表面処理剤の
強力な撥油性能のため潤滑油が液滴になり、油膜を生じ
ないため、伝熱効率が向上し、冷凍システムの冷却効率
を高めることができる。
Further, it can be used as a surface treatment agent for the inner wall surfaces of condensers, capillaries and evaporators of refrigeration systems such as refrigerators. Can prevent adhesion of sludge-like substances and blockage due to the adhesion. Furthermore, on the inner wall of the evaporator, when the refrigerant mixed with the lubricating oil evaporates, the lubricating oil becomes droplets due to the strong oil-repellent performance of the surface treatment agent, and does not form an oil film. The cooling efficiency of the system can be increased.

【0029】さらに、本発明の表面処理剤は、強力な撥
水、撥油性能に加えて低摩擦性を付与する潤滑性を有す
るため、磁気デスクの表面塗布剤として好適である。上
記イミダゾールフッ素誘導体は、少なくともその一種を
メタノール、エタノール等のアルコール類等の溶剤で
0.001〜20重量%になるように希釈し、この液に
金属を浸漬させる方法で塗布することが簡便で好まし
い。尚、このイミダゾールフッ素誘導体は単独で用いて
もよいが、複数のイミダゾールシラン化合物を混合して
用いてもよく、また他の防錆剤、或いは、カップリング
剤等と混合して用いてもよい。
Further, the surface treating agent of the present invention is suitable as a surface coating agent for a magnetic desk because it has a lubricating property that imparts low friction in addition to strong water and oil repellency. It is convenient to dilute at least one of the above-mentioned imidazole fluorine derivatives with a solvent such as an alcohol such as methanol or ethanol so as to have a concentration of 0.001 to 20% by weight, and to apply a metal by immersion in the liquid. preferable. In addition, this imidazole fluorine derivative may be used alone, but may be used by mixing a plurality of imidazole silane compounds, or may be used by mixing with another rust preventive or a coupling agent. .

【0030】[0030]

【実施例】実施例1イミダゾールフッ素誘導体の合成1 {イミダゾールと3−パーフルオロオクチル−1,2−
エポキシプロパンとの反応より下記式(1−1)で表わ
される化合物の合成}
EXAMPLES Example 1 Synthesis of Imidazole Fluorine Derivative 1 Imidazole and 3-perfluorooctyl-1,2-
Synthesis of Compound Represented by the Following Formula (1-1) from Reaction with Epoxypropane

【0031】[0031]

【化13】 Embedded image

【0032】イミダゾール1.36g(0.02mo
l)を130℃で融解し、アルゴン気流下で撹拌しなが
ら、3−パーフルオロオクチル−1,2−エポキシプロ
パン9.52g(0.02mol)を30分間かけて滴
下した。滴下終了後、さらに130℃の温度で15分間
反応させた。
1.36 g of imidazole (0.02 mol
1) was melted at 130 ° C., and 9.52 g (0.02 mol) of 3-perfluorooctyl-1,2-epoxypropane was added dropwise over 30 minutes while stirring under an argon stream. After the completion of the dropwise addition, the reaction was further performed at a temperature of 130 ° C. for 15 minutes.

【0033】反応生成物は黒色を呈していたが、未反応
モノマーを除去するためエタノールで洗浄することによ
り3.45g(収率31.7%)の白色粉末として得ら
れた。この化合物の融点はDSC測定の結果、210℃
であった。1H−NMR、FT−IR及び19F−NMR
の結果を図1,2,3に示す。又元素の分析の結果を表
1に示す。
The reaction product was black, but was washed with ethanol to remove unreacted monomers, and was obtained as 3.45 g (yield 31.7%) of white powder. The melting point of this compound was 210 ° C. as a result of DSC measurement.
Met. 1 H-NMR, FT-IR and 19 F-NMR
The results are shown in FIGS. Table 1 shows the results of elemental analysis.

【0034】[0034]

【表1】 [Table 1]

【0035】実施例2イミダゾールフッ素誘導体の合成2 {4−ビニルイミダゾールと3−パーフルオロオクチル
−1,2−エポキシプロパンとの反応より下記式(1−
2)で表わされる化合物の合成}
Example 2 Synthesis of Fluorine Derivative of Imidazole 2 From the reaction of 4-vinylimidazole with 3-perfluorooctyl-1,2-epoxypropane, the following formula (1-
Synthesis of compound represented by 2))

【0036】[0036]

【化14】 Embedded image

【0037】4−ビニルイミダゾール1.88g(0.
02mol)と重合禁止剤としてのヒドロキノン0.0
188gをアルゴン気流下で130℃にて撹拌させ、そ
こに3−パーフルオロオクチル−1,2−エポキシプロ
パン9.52g(0.02mol)を30分間かけて滴
下した。滴下終了後さらに130℃で1時間反応させ
た。
1.88 g of 4-vinylimidazole (0.
02 mol) and hydroquinone 0.0 as a polymerization inhibitor
188 g was stirred at 130 ° C. under an argon stream, and 9.52 g (0.02 mol) of 3-perfluorooctyl-1,2-epoxypropane was added dropwise thereto over 30 minutes. After completion of the dropwise addition, the reaction was further performed at 130 ° C. for 1 hour.

【0038】得られた化合物は移動相としてベンゼン9
5%、メタノール5%、充填剤としてシリカゲルを用い
たカラムクロマト法により精製、単離された。単離され
た化合物は1.12g(収率9.8%)の白色の粉末状
化合物であり、DSC測定の結果、融点は149℃であ
った。元素分析の結果を表2に、1H−NMR、FT−
IRの結果を図4,5に示す。
The obtained compound was prepared as benzene 9 as a mobile phase.
Purified and isolated by column chromatography using 5%, 5% methanol, and silica gel as a filler. The isolated compound was a white powdery compound of 1.12 g (9.8% yield), and the melting point was 149 ° C as a result of DSC measurement. The results of the elemental analysis are shown in Table 2, 1 H-NMR, FT-
The results of IR are shown in FIGS.

【0039】[0039]

【表2】 [Table 2]

【0040】実施例3イミダゾールフッ素誘導体の合成3 {4−ビニルイミダゾールと3−パーフルオロオクチル
−1,2−エポキシプロパンとの反応より下記式(1−
3)で表わされる化合物の合成}
Example 3 Synthesis of Fluorine Derivative of Imidazole 3 From the reaction of {4-vinylimidazole with 3-perfluorooctyl-1,2-epoxypropane, the following formula (1-
Synthesis of compound represented by 3))

【0041】[0041]

【化15】 Embedded image

【0042】4−ビニルイミダゾール1.88g(0.
02mol)を130℃でアルゴン気流下で撹拌させ、
そこに3−パーフルオロオクチル−1,2−エポキシプ
ロパン9.52g(0.02mol)を30分間かけて
滴下した。滴下終了後、さらに130℃で1時間反応さ
せた。
1.88 g of 4-vinylimidazole (0.
02 mol) at 130 ° C. under a stream of argon.
Thereto, 9.52 g (0.02 mol) of 3-perfluorooctyl-1,2-epoxypropane was dropped over 30 minutes. After completion of the dropwise addition, the reaction was further performed at 130 ° C. for 1 hour.

【0043】得られた化合物は黒色を呈しており未反応
のモノマーを除去する目的でエタノールでよく洗浄し、
褐色の粉末状化合物を得た。元素分析の結果を表3に、
1H−NMR、FT−IRの結果を図6,7に示す。
The obtained compound has a black color and is thoroughly washed with ethanol in order to remove unreacted monomers.
A brown powdery compound was obtained. Table 3 shows the results of the elemental analysis.
The results of 1 H-NMR and FT-IR are shown in FIGS.

【0044】[0044]

【表3】 [Table 3]

【0045】また、得られたポリマーの固有粘度をヘキ
サフルオロプロパノールを溶媒にして求めたところ1.
3であった。
The intrinsic viscosity of the obtained polymer was determined using hexafluoropropanol as a solvent.
It was 3.

【0046】実施例4イミダゾールフッ素誘導体の合成4 {4−ビニルイミダゾールと3−パーフルオロ−9メチ
ルデシル−1,2−エポキシプロパンとの反応より下記
式(1−4)で表わされる化合物の合成}
Example 4 Synthesis of fluorine derivative of imidazole 4 {Synthesis of compound represented by the following formula (1-4) from reaction of 4-vinylimidazole with 3-perfluoro-9-methyldecyl-1,2-epoxypropane}

【0047】[0047]

【化16】 Embedded image

【0048】4−ビニルイミダゾール1.88g(0.
02mol)と重合禁止剤としてのヒドロキノン0.0
188gをジメチルホルムアミド50mlに溶解した。
この溶液にアルゴン気流下130℃で、3−パーフルオ
ロ−9メチルデシル−1,2−エポキシプロパン12.
53g(0.02mol)をジメチルホルムアミド10
0mlに溶解させた溶液を30分間かけて滴下した。滴
下終了後、さらに5時間反応を続けた。反応終了後、析
出物を濾過により除去し、濾液を濃縮し、得られた固体
をさらにメタノールに可溶な成分と不溶な成分とに分離
した。メタノール可溶成分は移動相としてベンゼン95
%、メタノール5%、充填剤としてシリカゲルを用いた
カラムクロマト法により精製、単離された。単離された
化合物は0.17g(収率1.2%)の白色の粉末状化
合物であり、DSC測定の結果、融点は150℃であっ
た。元素分析の結果を表4に、又、1H−NMR、FT
−IR、19F−NMRの結果を図8,9,10に示す。
1.88 g of 4-vinylimidazole (0.
02 mol) and hydroquinone 0.0 as a polymerization inhibitor
188 g were dissolved in 50 ml of dimethylformamide.
11. This solution was treated with 3-perfluoro-9-methyldecyl-1,2-epoxypropane at 130 ° C. under a stream of argon.
53 g (0.02 mol) of dimethylformamide 10
A solution dissolved in 0 ml was added dropwise over 30 minutes. After completion of the dropwise addition, the reaction was continued for another 5 hours. After completion of the reaction, the precipitate was removed by filtration, the filtrate was concentrated, and the obtained solid was further separated into a component soluble in methanol and a component insoluble in methanol. The methanol-soluble component is benzene 95 as the mobile phase.
%, Methanol 5%, and column chromatography using silica gel as a filler. The isolated compound was 0.17 g (yield 1.2%) of a white powdery compound. As a result of DSC measurement, the melting point was 150 ° C. Table 4 shows the results of the elemental analysis, and 1 H-NMR and FT
The results of -IR and 19 F-NMR are shown in FIGS.

【0049】[0049]

【表4】 [Table 4]

【0050】実施例5イミダゾールフッ素誘導体の合成5 {イミダゾールと3−パーフルオロ−9メチルデシル−
1,2−エポキシプロパンとの反応より下記式(1−
5)及び(1−6)で表わされる化合物の合成}
EXAMPLE 5 Synthesis of Fluorine Derivative of Imidazole 5 Imidazole and 3-perfluoro-9-methyldecyl-
From the reaction with 1,2-epoxypropane, the following formula (1-
Synthesis of compounds represented by 5) and (1-6)}

【0051】[0051]

【化17】 Embedded image

【0052】イミダゾール1.36g(0.02mo
l)をジメチルアセトアミド25mlに溶解した。この
溶液にアルゴン気流下120℃で、3−パーフルオロ−
9メチルデシル−1,2−エポキシプロパン12.53
g(0.02mol)をジメチルアセトアミド35ml
に溶解させた溶液を30分間かけて滴下した。滴下終了
後、さらに6時間反応を続けた。反応終了後、析出物を
濾過により除去し、ガラスフィルター上でジメチルアセ
トアミドにより洗浄した。得られた粉末状化合物をさら
にメタノールに可溶な成分と不溶な成分に分離した。メ
タノールに不溶な成分は減圧乾燥された。メタノールに
可溶な成分は活性炭で処理されメタノールを留去するこ
とにより精製された。単離された化合物はいずれも白色
の粉末状化合物で、前者は2.06g(収率14.8
%)、後者は0.67g(収率4.8%)であり、DS
C測定の結果、融点は125℃(メタノール可溶成
分)、196℃(メタノール不溶成分)であった。元素
分析の結果を表5に、又、1H−NMR、FT−IR、
19F−NMRの結果を図11,12,13,14,1
5,16に示す。
1.36 g of imidazole (0.02 mol)
l) was dissolved in 25 ml of dimethylacetamide. This solution was added with 3-perfluoro-
9-methyldecyl-1,2-epoxypropane 12.53
g (0.02 mol) in 35 ml of dimethylacetamide
Was added dropwise over 30 minutes. After the completion of the dropwise addition, the reaction was continued for another 6 hours. After the completion of the reaction, the precipitate was removed by filtration and washed with dimethylacetamide on a glass filter. The obtained powdery compound was further separated into a component soluble in methanol and a component insoluble in methanol. The component insoluble in methanol was dried under reduced pressure. The components soluble in methanol were treated with activated carbon and purified by distilling off methanol. All of the isolated compounds were white powdery compounds, the former of which was 2.06 g (yield 14.8).
%), And the latter is 0.67 g (4.8% yield), DS
As a result of the C measurement, the melting point was 125 ° C. (methanol soluble component) and 196 ° C. (methanol insoluble component). The results of elemental analysis are shown in Table 5, and 1 H-NMR, FT-IR,
FIGS. 11, 12, 13, 14, 1 show the results of 19 F-NMR.
5 and 16.

【0053】[0053]

【表5】 [Table 5]

【0054】実施例6イミダゾールフッ素誘導体の合成6 {イミダゾールと3−パーフルオロデシル−1,2−エ
ポキシプロパンとの反応より下記式(1−7)及び(1
−8)で表わされる化合物の合成}
Example 6 Synthesis of Fluorine Derivatives of Imidazole 6 From the reaction of imidazole with 3-perfluorodecyl-1,2-epoxypropane, the following formulas (1-7) and (1
Synthesis of compound represented by -8)

【0055】[0055]

【化18】 Embedded image

【0056】イミダゾール1.36g(0.02mo
l)をジメチルアセトアミド25mlに溶解した。この
溶液にアルゴン気流下、120℃で、3−パーフルオロ
−デシル−1,2−エポキシプロパン11.52gをジ
メチルアセトアミド35mlに溶解させた溶液を30分
間かけて滴下した。滴下終了後、さらに6時間反応を続
けた。
1.36 g of imidazole (0.02 mol)
l) was dissolved in 25 ml of dimethylacetamide. A solution prepared by dissolving 11.52 g of 3-perfluoro-decyl-1,2-epoxypropane in 35 ml of dimethylacetamide was added dropwise to this solution over 30 minutes at 120 ° C. under an argon stream. After the completion of the dropwise addition, the reaction was continued for another 6 hours.

【0057】反応終了後、析出物を濾過により除去し、
ガラスフィルター上でジメチルアセトアミドにより洗浄
した。得られた粉末状化合物をさらにメタノールに可溶
な成分と不溶な成分に分離した。メタノールに不溶な成
分は減圧乾燥された。メタノールに可溶な成分は活性炭
で処理されメタノールを留去することにより精製され
た。単離された化合物はいずれも白色の粉末状化合物
で、前者は0.45g(収率3.5%)、後者は0.8
6g(収率6.7%)であり、DSC測定の結果、融点
は139℃(メタノール可溶成分)、117℃(メタノ
ール不溶成分)であった。元素分析の結果を表6に、
又、1H−NMR、FT−IR、19F−NMRの結果を
図17,18,19,20,21,22に示す。
After completion of the reaction, the precipitate was removed by filtration.
Washed with dimethylacetamide on a glass filter. The obtained powdery compound was further separated into a component soluble in methanol and a component insoluble in methanol. The component insoluble in methanol was dried under reduced pressure. The components soluble in methanol were treated with activated carbon and purified by distilling off methanol. Each of the isolated compounds was a white powdery compound. The former was 0.45 g (yield 3.5%), and the latter was 0.8
As a result of DSC measurement, the melting point was 139 ° C (methanol-soluble component) and 117 ° C (methanol-insoluble component). Table 6 shows the results of elemental analysis.
The results of 1 H-NMR, FT-IR, and 19 F-NMR are shown in FIGS. 17, 18, 19 , 20 , 21 , and 22 .

【0058】[0058]

【表6】 [Table 6]

【0059】実施例7イミダゾールフッ素誘導体の合成7 {イミダゾールと3−パーフルオロオクチル−1,2−
エポキシプロパンとの反応より下記式(1−9)で表わ
される化合物の合成}
Example 7 Synthesis of a Fluorine Derivative of Imidazole 7 Imidazole and 3-perfluorooctyl-1,2-
Synthesis of Compound Represented by the Following Formula (1-9) from Reaction with Epoxypropane

【0060】[0060]

【化19】 Embedded image

【0061】イミダゾール1.36g(0.02mo
l)をジメチルホルムアミド25mlに溶解した。この
溶液にアルゴン気流下、120℃で3−パーフルオロオ
クチル−1,2−エポキシプロパン9.52g(0.0
2mol)をジメチルホルムアミド25mlに溶解させ
た溶液を30分間かけて滴下した。滴下終了後、さらに
6時間反応を続けた。反応終了後、析出物を濾過により
除去し、ガラスフィルター上でジメチルアセトアミドに
より洗浄した。得られた粉末状化合物をさらにメタノー
ルに可溶な成分と不溶な成分に分離した。メタノールに
可溶な成分はクロロホルム/メタノール混合溶媒より再
結晶を2回繰り返し、活性炭で処理され溶媒を留去する
ことにより精製された。単離された化合物は0.89g
(収率8.2%)で白色の粉末状化合物であり、DSC
測定の結果、融点は124℃であった。元素分析の結果
を表7に示す。又、1H−NMR、FT−IR、19F−
NMRの結果を図23,24,25に示す。
1.36 g of imidazole (0.02 mol
l) was dissolved in 25 ml of dimethylformamide. 9.52 g (0.02 g) of 3-perfluorooctyl-1,2-epoxypropane was added to this solution at 120 ° C. under a stream of argon.
2 mol) in 25 ml of dimethylformamide was added dropwise over 30 minutes. After the completion of the dropwise addition, the reaction was continued for another 6 hours. After the completion of the reaction, the precipitate was removed by filtration and washed with dimethylacetamide on a glass filter. The obtained powdery compound was further separated into a component soluble in methanol and a component insoluble in methanol. The component soluble in methanol was recrystallized twice from a mixed solvent of chloroform / methanol, treated with activated carbon, and purified by distilling off the solvent. 0.89 g of the isolated compound
(Yield 8.2%) as a white powdery compound, DSC
As a result of the measurement, the melting point was 124 ° C. Table 7 shows the results of the elemental analysis. In addition, 1 H-NMR, FT-IR, 19 F-
The results of NMR are shown in FIGS.

【0062】[0062]

【表7】 [Table 7]

【0063】実施例8 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−1)で表わされるイミダゾールフッ素誘
導体の0.2%ヘキサフルオロ−2−プロパノール溶液
を用いて500RPMにてスピンコートした。その後、
100℃で30分間乾燥してその表面濡れ性を協和界面
科学製CA−D型の接触角測定装置により評価した。評
価結果を表8に示す。
Example 8 An electrolytic copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically washed with acetone for 5 minutes, then washed with water, and immersed and pickled with a 3% aqueous sulfuric acid solution for 1 minute. Then, it wash | cleaned in order of water and acetone, and dried with the dryer. The glossy surface of this electrolytic copper foil was spin-coated at 500 RPM using a 0.2% hexafluoro-2-propanol solution of the imidazole fluorine derivative represented by the formula (1-1). afterwards,
After drying at 100 ° C. for 30 minutes, the surface wettability was evaluated using a CA-D type contact angle measuring device manufactured by Kyowa Interface Science. Table 8 shows the evaluation results.

【0064】[0064]

【表8】 [Table 8]

【0065】*文献値 N.L.Jarvis and W.A.Zisma
n;Encyclopedia of Chemica
l Technology Vol.9,707L.
S.Penn and E.R.Bowler;Sur
face andInterface Analysi
s,vol.3,No.4 161(1981) 実施例9 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−2)で表わされるイミダゾールフッ素誘
導体の0.2%メタノール溶液を用いて500RPMに
てスピンコートした。その後、100℃で30分間乾燥
してその表面濡れ性を協和界面科学製CA−D型の接触
角測定装置により評価した。評価結果を表9に示す。
* Literature values L. Jarvis and W.S. A. Zisma
n; Encyclopedia of Chemica
l Technology Vol. 9,707L.
S. Penn and E. R. Bowler; Sur
face andInterface Analysis
s, vol. 3, No. 4 161 (1981) Example 9 An electrolytic copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically washed with acetone for 5 minutes, then washed with water, and 3% sulfuric acid aqueous solution. For 1 minute. Then, it wash | cleaned in order of water and acetone, and dried with the dryer. The glossy surface of the electrolytic copper foil was spin-coated at 500 RPM using a 0.2% methanol solution of the imidazole fluorine derivative represented by the above formula (1-2). Thereafter, the resultant was dried at 100 ° C. for 30 minutes, and its surface wettability was evaluated using a CA-D contact angle measuring device manufactured by Kyowa Interface Science. Table 9 shows the evaluation results.

【0066】[0066]

【表9】 [Table 9]

【0067】*前記文献値 実施例10 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−3)で表わされるイミダゾールフッ素誘
導体の0.2%ヘキサフルオロ−2−プロパノール溶液
を用いて500RPMにてスピンコートした。その後、
100℃で30分間乾燥してその表面濡れ性を協和界面
科学製CA−D型の接触角測定装置により評価した。評
価結果を表10に示す。
* The above literature values Example 10 Electrodeposited copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically washed with acetone for 5 minutes, then washed with water, and immersed and pickled with a 3% sulfuric acid aqueous solution for 1 minute. did. Then, it wash | cleaned in order of water and acetone, and dried with the dryer. The glossy surface of the electrolytic copper foil was spin-coated at 500 RPM using a 0.2% hexafluoro-2-propanol solution of the imidazole fluorine derivative represented by the above formula (1-3). afterwards,
After drying at 100 ° C. for 30 minutes, the surface wettability was evaluated using a CA-D type contact angle measuring device manufactured by Kyowa Interface Science. Table 10 shows the evaluation results.

【0068】[0068]

【表10】 [Table 10]

【0069】*前記文献値 実施例11,12 アルミ板(実施例11)およびステンレス板(実施例1
2)をアセトンで5分間超音波洗浄し、次いで水洗し
た。これらの基板に前記式(1−1)で表わされるイミ
ダゾールフッ素誘導体の0.2%ヘキサフルオロ−2−
プロパノール溶液を用いて500RPMにてスピンコー
トした。その後、100℃で30分間乾燥してその表面
濡れ性を協和界面科学製CA−D型の接触角測定装置に
より評価した。評価結果を表11に示す。
* The above literature values Examples 11 and 12 Aluminum plate (Example 11) and stainless steel plate (Example 1)
2) was ultrasonically washed with acetone for 5 minutes, and then washed with water. On these substrates, 0.2% hexafluoro-2-% of the imidazole fluorine derivative represented by the above formula (1-1) was added.
Spin coating was performed at 500 RPM using a propanol solution. Thereafter, the resultant was dried at 100 ° C. for 30 minutes, and its surface wettability was evaluated using a CA-D contact angle measuring device manufactured by Kyowa Interface Science. Table 11 shows the evaluation results.

【0070】[0070]

【表11】 [Table 11]

【0071】*前記文献値 比較例1,2 実施例で用いた電解銅箔(脱脂、酸洗後のもの比較例
1)およびテフロン板(比較例2)を用いて実施例と同
様な方法で表面の濡れ性を評価した。結果を表12に示
す。
* The above-mentioned literature values Comparative Examples 1 and 2 The same method as in the Examples was used by using the electrolytic copper foil (Comparative Example 1 after degreasing and pickling) and the Teflon plate (Comparative Example 2) used in the Examples. The surface wettability was evaluated. Table 12 shows the results.

【0072】[0072]

【表12】 [Table 12]

【0073】*前記文献値 前記実施例8〜12と上記比較例とを対比すれば、本発
明のイミダゾールフッ素誘導体は、顕著な撥水性、撥油
性を示すことがわかる。これらの性能は、代表的な撥水
材であるフッ素材料(テフロン)よりも優れている。
* The above literature values Comparing the above Examples 8 to 12 with the above Comparative Examples shows that the imidazole fluorine derivative of the present invention exhibits remarkable water repellency and oil repellency. These performances are superior to a typical water-repellent material, a fluorine material (Teflon).

【0074】実施例13 各種基板をイミダゾールフッ素誘導体{前記式(1−
2)}で実施例9と同様に表面処理し、それらの吸着性
を該誘導体の良溶媒であるメタノールで1分間洗浄する
ことにより調べた。吸着量はFT−IRの高感度反射法
を用いて吸光度を測定することにより求めた。結果を表
13に示す。
Example 13 Various substrates were treated with an imidazole fluorine derivative {the formula (1-
2) The surface treatment was carried out in the same manner as in Example 9 and the adsorptivity thereof was examined by washing with methanol, which is a good solvent for the derivative, for 1 minute. The adsorption amount was determined by measuring the absorbance using a high sensitivity reflection method of FT-IR. Table 13 shows the results.

【0075】[0075]

【表13】 [Table 13]

【0076】注1 ED Copper;電解銅箔、1B;Cu70% Z
n30%、2B;Cu65% Zn35%、1C;Cu
100%(圧延銅箔)、2N;Cu64% Zn18%
Ni18%、5P;Cu95% Sn5%、 1T
C;Cu97% Ti3% 注2 洗浄前の吸着量を100%として計算 上記の結果は、本発明のイミダゾールフッ素誘導体は、
銅及び銅合金に対して特異的な接着性を有することを示
している。
Note 1 ED Copper; electrolytic copper foil, 1B; Cu 70% Z
n 30%, 2B; Cu 65%, Zn 35%, 1C; Cu
100% (rolled copper foil), 2N; Cu 64%, Zn 18%
Ni 18%, 5P; Cu 95%, Sn 5%, 1T
C; Cu 97% Ti 3% Note 2 Calculated assuming the amount of adsorption before washing as 100% The above results show that the imidazole fluorine derivative of the present invention
It shows that it has specific adhesiveness to copper and copper alloy.

【0077】実施例14 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−1)で表わされるイミダゾールフッ素誘
導体の0.2%ヘキサフルオロ−2−プロパノール溶液
を用いて500RPMにてスピンコートし、その後、1
00℃で30分間乾燥した。イミダゾールフッ素誘導体
の銅に対する防錆作用を評価する目的で表面処理された
銅箔を沸騰水に5分間浸漬し、浸漬後の表面の変色を観
察した。前記式(1−2)、(1−3)で表わされるイ
ミダゾールフッ素誘導体を用いた場合および未処理銅箔
の結果も合わせて、評価結果を表14に示す。
Example 14 An electrolytic copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically washed with acetone for 5 minutes, then washed with water, and immersed and pickled with a 3% aqueous sulfuric acid solution for 1 minute. Then, it wash | cleaned in order of water and acetone, and dried with the dryer. The glossy surface of the electrolytic copper foil was spin-coated at 500 RPM using a 0.2% hexafluoro-2-propanol solution of the imidazole fluorine derivative represented by the above formula (1-1),
Dry at 00 ° C. for 30 minutes. A copper foil surface-treated for the purpose of evaluating the rust-proofing effect of the imidazole fluorine derivative on copper was immersed in boiling water for 5 minutes, and the discoloration of the surface after immersion was observed. The evaluation results are shown in Table 14 together with the results when the imidazole fluorine derivatives represented by the above formulas (1-2) and (1-3) were used and the results for the untreated copper foil.

【0078】[0078]

【表14】 [Table 14]

【0079】実施例15 実施例14で示したのと同様の方法で、表15に示した
前記式イミダゾールフッ素誘導体を用いて表面処理した
銅箔に対する耐湿性を評価した。評価は、表面処理した
銅箔を相対湿度95%、温度80℃の恒温槽中で24時
間暴露した。暴露後の銅箔表面の変色を観察した。
Example 15 In the same manner as in Example 14, the moisture resistance of a copper foil surface-treated with the above-mentioned imidazole fluorine derivative shown in Table 15 was evaluated. The evaluation was performed by exposing the surface-treated copper foil in a constant temperature bath at a relative humidity of 95% and a temperature of 80 ° C. for 24 hours. Discoloration of the copper foil surface after exposure was observed.

【0080】また、耐熱性についても、同様に評価し
た。耐熱性の評価は、260℃の半田浴の上に表面処理
した銅箔を、処理面が上になるように置き、10秒後に
取り出し、銅箔表面の変色を観察した。
The heat resistance was evaluated in the same manner. The heat resistance was evaluated by placing a copper foil surface-treated on a 260 ° C. solder bath with the treated surface facing up, taking it out after 10 seconds, and observing discoloration of the copper foil surface.

【0081】さらに、半田濡れ性についても、同様に評
価した。半田濡れ性の評価は、表面処理した銅箔をオー
トフラックスJS−64〔山栄化学(株)製〕で処理
し、255℃の半田浴(JIS H64A)に1秒間浸
漬した後の半田濡れの状態を観察した。これらの結果
を、未処理銅箔の結果と併せて表15に示した。
Further, the solder wettability was similarly evaluated. Evaluation of the solder wettability was performed by treating the surface-treated copper foil with Autoflux JS-64 (manufactured by Yamaei Chemical Co., Ltd.) and immersing it in a 255 ° C. solder bath (JIS H64A) for 1 second. The condition was observed. These results are shown in Table 15 together with the results of the untreated copper foil.

【0082】[0082]

【表15】 [Table 15]

【0083】実施例16 銅平板(11×4.5cm、厚さ0.35mm、表面粗
さRmax0.1μm)を、トリクロロエタンで5日間ソ
ックスレー抽出により脱脂し、エッチング溶液(過酸化
水素50ml、硫酸10ml、イオン交換水1リット
ル)に60秒間浸漬した後、5%硫酸水溶液に1分間浸
漬し、次いでイオン交換水に1分間2回浸漬して水洗
し、ドライヤーで乾燥した。この銅板に表16に示すよ
うな条件で8種のイミダゾールフッ素誘導体(前記式番
号で示した)を、膜厚が0.02μになるようにスピン
コートし、その後、100℃で30分間乾燥した。イミ
ダゾールフッ素誘導体の潤滑性及び皮膜の剪断耐久性を
評価するため、バウデン・レーベン式往復動摩擦試験機
で転がり軸受用鋼球(直径3.96mm、軸受鋼2種)
を用いて、表17の条件で試験した。試験中の皮膜の平
均摩擦係数及び皮膜が破断した時の摩擦回数を表16に
示した。なお、イミダゾールフッ素誘導体をスピンコー
トしていない銅板の摩擦係数は0.35であり、本発明
のイミダゾールフッ素誘導体で表面処理した銅板表面の
摩擦係数は大幅に減っており、非常に良好な潤滑性を有
していることが分かる。さらに、この表面皮膜が、厳し
い条件での摩擦であっても、破断されず、耐久性に優れ
ていることが分かる。
Example 16 A copper flat plate (11 × 4.5 cm, thickness 0.35 mm, surface roughness R max 0.1 μm) was degreased by soxhlet extraction with trichloroethane for 5 days, and an etching solution (50 ml of hydrogen peroxide, (Immersion in sulfuric acid 10 ml, ion exchanged water 1 liter) for 60 seconds, immersion in 5% sulfuric acid aqueous solution for 1 minute, then immersion in ion exchanged water twice for 1 minute, washing with water, and drying with a dryer. Eight kinds of imidazole fluorine derivatives (indicated by the formula numbers) were spin-coated on the copper plate under the conditions shown in Table 16 so that the film thickness became 0.02 μm, and then dried at 100 ° C. for 30 minutes. . Rolling bearing steel balls (diameter 3.96 mm, two types of bearing steel) using a Bowden-Leben type reciprocating friction tester to evaluate the lubricating properties of the imidazole fluorine derivative and the shear durability of the film.
, And tested under the conditions shown in Table 17. Table 16 shows the average coefficient of friction of the coating during the test and the number of times of friction when the coating was broken. The coefficient of friction of the copper plate not spin-coated with the imidazole fluorine derivative was 0.35, and the coefficient of friction of the surface of the copper plate surface-treated with the imidazole fluorine derivative of the present invention was significantly reduced, showing a very good lubricity. It can be seen that this has Furthermore, it can be seen that this surface film is not broken even under friction under severe conditions and has excellent durability.

【0084】[0084]

【表16】 [Table 16]

【0085】MeOH:メタノール、HFP:ヘキサフ
ルオロ−2−プロパノール
MeOH: methanol, HFP: hexafluoro-2-propanol

【0086】[0086]

【表17】 [Table 17]

【0087】実施例17 実施例14と同様の方法で前記式(1−2)のイミダゾ
ールフッ素誘導体を用いて銅箔の表面を処理した。冷蔵
庫等の冷凍システムで使用できるか否かを見る目的で、
冷媒に対する耐久性を評価した。評価は、表面処理した
銅箔をガラスアンプルに入れ、これに冷媒R−134a
を注入し、真空ポンプで脱気した後、封管して、50
℃、100℃の恒温槽に67時間入れ、銅箔表面の水の
接触角の変化を測定することで行った。この結果、試験
前の処理銅箔の接触角は114度で、50℃の試験後は
111度、100℃の試験後は114度で、殆ど変化は
見られず、冷媒に対する耐久性を有し、冷蔵庫等の冷凍
システムで使用できることが分かった。
Example 17 In the same manner as in Example 14, the surface of the copper foil was treated using the imidazole fluorine derivative of the above formula (1-2). To see if it can be used in refrigeration systems such as refrigerators,
The durability to the refrigerant was evaluated. The evaluation was performed by placing the surface-treated copper foil in a glass ampule and adding the refrigerant R-134a
And after degassing with a vacuum pump, seal the
C. and 100.degree. C. were placed in a thermostat for 67 hours, and the change in the contact angle of water on the copper foil surface was measured. As a result, the contact angle of the treated copper foil before the test was 114 degrees, 111 degrees after the test at 50 ° C., and 114 degrees after the test at 100 ° C., almost no change was observed, and it had durability to the refrigerant. It can be used in refrigeration systems such as refrigerators.

【0088】[0088]

【発明の効果】以上説明したように、本発明の新規イミ
ダゾールフッ素誘導体は、表面に顕著な撥水、撥油性、
防錆性及び潤滑性を付与することができる。
As described above, the novel imidazole fluorine derivative of the present invention has remarkable water and oil repellency on its surface.
Rust prevention and lubricity can be imparted.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のイミダゾールフッ素誘導体{式(1−
1)}の1H−NMRスペクトル
FIG. 1 shows a fluorine derivative of an imidazole of the present invention {formula (1-
1) 1 H-NMR spectrum of}

【図2】本発明のイミダゾールフッ素誘導体{式(1−
1)}のIRスペクトル
FIG. 2 shows a fluorine derivative of an imidazole of the present invention {formula (1-
1) IR spectrum of}

【図3】本発明のイミダゾールフッ素誘導体{式(1−
1)}の19F−NMRスペクトル
FIG. 3 is a diagram illustrating an imidazole fluorine derivative of the present invention {formula (1-
1) 19 F-NMR spectrum of}

【図4】本発明のイミダゾールフッ素誘導体{式(1−
2)}の1H−NMRスペクトル
FIG. 4 shows a fluorine derivative of an imidazole of the present invention {formula (1-
2) 1 H-NMR spectrum of}

【図5】本発明のイミダゾールフッ素誘導体{式(1−
2)}のIRスペクトル
FIG. 5 is an imidazole fluorine derivative of the present invention {formula (1-
2) IR spectrum of}

【図6】本発明のイミダゾールフッ素誘導体{式(1−
3)}の1H−NMRスペクトル
FIG. 6 shows the imidazole fluorine derivative of the present invention {formula (1-
3) 1 H-NMR spectrum of}

【図7】本発明のイミダゾールフッ素誘導体{式(1−
3)}のIRスペクトル
FIG. 7 shows a fluorine derivative of an imidazole of the present invention {formula (1-
3) IR spectrum of}

【図8】本発明のイミダゾールフッ素誘導体{式(1−
4)}の1H−NMRスペクトル
FIG. 8 is a diagram illustrating an imidazole fluorine derivative of the present invention {formula (1-
4) 1 H-NMR spectrum of}

【図9】本発明のイミダゾールフッ素誘導体{式(1−
4)}のIRスペクトル
FIG. 9 shows a fluorine derivative of an imidazole of the present invention {formula (1-
4) IR spectrum of}

【図10】本発明のイミダゾールフッ素誘導体{式(1
−4)}の19F−NMRスペクトル
FIG. 10 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-4) 19 F-NMR spectrum of}

【図11】本発明のイミダゾールフッ素誘導体{式(1
−5)}の1H−NMRスペクトル
FIG. 11 shows the imidazole fluorine derivative of the present invention {formula (1)
-5) 1 H-NMR spectrum of}

【図12】本発明のイミダゾールフッ素誘導体{式(1
−5)}のIRスペクトル
FIG. 12 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-5) IR spectrum of}

【図13】本発明のイミダゾールフッ素誘導体{式(1
−5)}の19F−NMRスペクトル
FIG. 13 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-5) 19 F-NMR spectrum of}

【図14】本発明のイミダゾールフッ素誘導体{式(1
−6)}の1H−NMRスペクトル
FIG. 14 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-6) 1 H-NMR spectrum of}

【図15】本発明のイミダゾールフッ素誘導体{式(1
−6)}のIRスペクトル
FIG. 15 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-6) IR spectrum of}

【図16】本発明のイミダゾールフッ素誘導体{式(1
−6)}の19F−NMRスペクトル
FIG. 16 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-6) 19 F-NMR spectrum of}

【図17】本発明のイミダゾールフッ素誘導体{式(1
−7)}の1H−NMRスペクトル
FIG. 17 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-7) 1 H-NMR spectrum of}

【図18】本発明のイミダゾールフッ素誘導体{式(1
−7)}のIRスペクトル
FIG. 18 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-7) IR spectrum of}

【図19】本発明のイミダゾールフッ素誘導体{式(1
−7)}の16F−NMRスペクトル
FIG. 19 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-7) 16 F-NMR spectrum of}

【図20】本発明のイミダゾールフッ素誘導体{式(1
−8)}の1H−NMRスペクトル
FIG. 20 shows a fluorine derivative of an imidazole of the present invention {formula (1)
-8) 1 H-NMR spectrum of}

【図21】本発明のイミダゾールフッ素誘導体{式(1
−8)}のIRスペクトル
FIG. 21 shows the imidazole fluorine derivative of the present invention {formula (1)
-8) IR spectrum of}

【図22】本発明のイミダゾールフッ素誘導体{式(1
−8)}の16F−NMRスペクトル
FIG. 22 shows the imidazole fluorine derivative of the present invention {formula (1)
-8) 16 F-NMR spectrum of}

【図23】本発明のイミダゾールフッ素誘導体{式(1
−9)}の1H−NMRスペクトル
FIG. 23 shows the imidazole fluorine derivative of the present invention {formula (1)
-9) 1 H-NMR spectrum of}

【図24】本発明のイミダゾールフッ素誘導体{式(1
−9)}のIRスペクトル
FIG. 24 shows the imidazole fluorine derivative of the present invention {formula (1)
-9) IR spectrum of}

【図25】本発明のイミダゾールフッ素誘導体{式(1
−9)}の16F−NMRスペクトル
FIG. 25 shows the imidazole fluorine derivative of the present invention {formula (1)
-9) 16 F-NMR spectrum of}

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI C09K 13/06 C09K 13/06 C23G 5/036 C23G 5/036 // C07D 303/08 C07D 303/08 C08J 7/04 C08J 7/04 A C10M 133/46 C10M 133/46 C10N 30:12 40:00 40:18 50:02 (72)発明者 荻野 幸男 埼玉県戸田市新曽南三丁目17番35号 日 本鉱業株式会社内 (56)参考文献 特開 昭63−199724(JP,A) 米国特許4404247(US,A) (58)調査した分野(Int.Cl.7,DB名) C07D 233/60 C08F 8/30 CA(STN) REGISTRY(STN)────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 7 Identification code FI C09K 13/06 C09K 13/06 C23G 5/036 C23G 5/036 // C07D 303/08 C07D 303/08 C08J 7/04 C08J 7 / 04 A C10M 133/46 C10M 133/46 C10N 30:12 40:00 40:18 50:02 (72) Inventor Yukio Ogino Nihon Mining Co., Ltd. 56) References JP-A-63-199724 (JP, A) US Pat. No. 4,404,247 (US, A) (58) Fields investigated (Int. Cl. 7 , DB name) C07D 233/60 C08F 8/30 CA (STN ) REGISTRY (STN)

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 下記一般式(1)で表わされる新規イミ
ダゾールフッ素誘導体。 【化1】 (式中、R1は水素、ビニル基又はポリエチレン基を示
し、R2は下記一般式(2)で表わされる基を、R3は水
素又は下記一般式(3)で表わされる基をそれぞれ示
し、下記一般式(2)中のR4は、フッ素又はトリフル
オロメチル基を示し、nは1〜15の整数である。) 【化2】
1. A novel imidazole fluorine derivative represented by the following general formula (1). Embedded image (Wherein, R 1 represents hydrogen, a vinyl group or a polyethylene group, R 2 represents a group represented by the following general formula (2), and R 3 represents hydrogen or a group represented by the following general formula (3), respectively. R 4 in the following general formula (2) represents a fluorine or trifluoromethyl group, and n is an integer of 1 to 15.)
【請求項2】 イミダゾール又は4−ビニルイミダゾー
ルと下記一般式(4)で表わされる1,2−エポキンプ
ロパン化合物とを反応させることを特徴とする請求項1
に記載のイミダゾールフッ素誘導体の製造方法。 【化3】 (式中、R2は下記一般式(2)で表わされる基を示
し、該一般式(2)中のR4はフッ素又はトリフルオロ
メチル基を示し、nは1〜15の整数である。) 【化4】
2. The method according to claim 1, wherein imidazole or 4-vinylimidazole is reacted with a 1,2-epokinepropane compound represented by the following general formula (4).
3. The method for producing an imidazole fluorine derivative according to item 1. Embedded image (In the formula, R 2 represents a group represented by the following general formula (2), R 4 in the general formula (2) represents a fluorine or trifluoromethyl group, and n is an integer of 1 to 15. )
【請求項3】 請求項1に記載の一般式(1)で表わさ
れたイミダゾールフッ素誘導体の少なくとも一種を有効
成分とすることを特徴とする表面処理剤。
3. A surface treatment agent comprising, as an active ingredient, at least one of the imidazole fluorine derivatives represented by the general formula (1) according to claim 1.
JP8343593A 1992-09-22 1993-04-09 Novel fluorine derivative of imidazole, method for producing the same, and surface treating agent using the same Expired - Lifetime JP3171986B2 (en)

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DE19605509A1 (en) * 1996-02-15 1997-08-21 Basf Ag Use of quaternized imidazoles as non-ferrous metal corrosion inhibitors and antifreeze concentrates and coolant compositions containing them
JP4183999B2 (en) * 2002-07-29 2008-11-19 日鉱金属株式会社 Surface treatment agent containing imidazole alcohol as an active ingredient
KR101455406B1 (en) 2006-03-31 2014-10-27 이데미쓰 고산 가부시키가이샤 Lubricating oil additive, lubricating oil composition containing the same, various low-friction sliding members, rolling bearing, and sliding bearing
KR101554749B1 (en) 2007-06-11 2015-09-21 이데미쓰 고산 가부시키가이샤 Detergent-dispersant additive composition for lubricant and lubricant composition
JP5379361B2 (en) 2007-08-08 2013-12-25 出光興産株式会社 Antiwear agent, additive composition for lubricant and lubricating oil composition
JP5214293B2 (en) * 2008-03-21 2013-06-19 住友軽金属工業株式会社 Copper tube for cross fin tube type heat exchanger
JP2009228941A (en) * 2008-03-21 2009-10-08 Sumitomo Light Metal Ind Ltd Copper tube for cross fin tube type heat exchanger
JP5623048B2 (en) 2009-03-25 2014-11-12 富士フイルム株式会社 Lubricant composition and use thereof
JP5523377B2 (en) 2011-03-07 2014-06-18 富士フイルム株式会社 Lubricant composition, fluorine compound, and use thereof
WO2016021408A1 (en) * 2014-08-07 2016-02-11 ダイキン工業株式会社 Antifouling composition, treatment device, treatment method, and treated article
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