JPH06157471A - New imidazole fluorine derivative, its production and surface treating agent using the same - Google Patents

New imidazole fluorine derivative, its production and surface treating agent using the same

Info

Publication number
JPH06157471A
JPH06157471A JP8343593A JP8343593A JPH06157471A JP H06157471 A JPH06157471 A JP H06157471A JP 8343593 A JP8343593 A JP 8343593A JP 8343593 A JP8343593 A JP 8343593A JP H06157471 A JPH06157471 A JP H06157471A
Authority
JP
Japan
Prior art keywords
formula
imidazole
fluorine derivative
compound
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8343593A
Other languages
Japanese (ja)
Other versions
JP3171986B2 (en
Inventor
Masashi Kumagai
正志 熊谷
Katsuyuki Tsuchida
克之 土田
Kazuo Yoshida
一雄 吉田
Yukio Ogino
幸男 荻野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KYOSEKI SEIHIN GIJUTSU KENK
KYOSEKI SEIHIN GIJUTSU KENKYUSHO KK
Eneos Corp
Original Assignee
KYOSEKI SEIHIN GIJUTSU KENK
KYOSEKI SEIHIN GIJUTSU KENKYUSHO KK
Japan Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KYOSEKI SEIHIN GIJUTSU KENK, KYOSEKI SEIHIN GIJUTSU KENKYUSHO KK, Japan Energy Corp filed Critical KYOSEKI SEIHIN GIJUTSU KENK
Priority to JP8343593A priority Critical patent/JP3171986B2/en
Publication of JPH06157471A publication Critical patent/JPH06157471A/en
Application granted granted Critical
Publication of JP3171986B2 publication Critical patent/JP3171986B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a new compound, capable of forming a film having excellent adhesion and peeling resistance on the surface of a metal, a polymeric material, etc., and imparting water and oil repellency, lubricity and rust preventing properties to the surface and useful as a surface treating agent. CONSTITUTION:The compound of formula I {R<1> is H, vinyl or polyethylene; R<2> is formula II [R<4> is F or trifluoromethyl; (n) is 1-15]; R<3> is H or formula III}, e.g. a compound of formula IV. This compound of formula I is obtained by reacting imidazole or 4-vinylimidazole with a 1,2-epoxypropane compound of formula V at 100-150 deg.C.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、金属や高分子材料等の
表面の潤滑、防錆、撥水及び撥油等を行うための表面処
理剤、特にはプリント回路用銅張積層板等に用いられる
銅箔や熱交換器の伝熱チューブ等、さらには磁気ディス
ク等の表面処理剤として好適な新規なイミダゾールフッ
素誘導体及びその製造方法、並びにその用途に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment agent for lubrication, rust prevention, water repellency, oil repellency, etc. of a surface of a metal or a polymer material, especially a copper clad laminate for printed circuits. The present invention relates to a novel imidazole fluorine derivative suitable for use as a copper foil used, a heat transfer tube for a heat exchanger, and a surface treatment agent for magnetic disks, a method for producing the same, and uses thereof.

【0002】[0002]

【従来の技術】プリント回路用の銅張積層板は銅箔に紙
−フェノール樹脂含浸基材やガラス−エポキシ樹脂含浸
基材等と加熱、加圧して積層して形成され、これをエッ
チングして回路網を形成し、これに半導体装置等の素子
を搭載することにより電子機器用のボードが作られる。
これらの過程では、基材との接着、加熱、酸やアルカリ
液への浸漬、レジストインクの塗布、ハンダ付け等が行
われるため、銅箔には接着性、耐熱性、耐湿性、耐薬品
性等の性能が要求される。さらに、保管時に銅箔の酸化
変色のないことも要求される。
2. Description of the Related Art Copper clad laminates for printed circuits are formed by laminating a paper-phenol resin-impregnated base material or glass-epoxy resin-impregnated base material on a copper foil by heating and pressing, and etching this. A board for electronic equipment is made by forming a circuit network and mounting an element such as a semiconductor device on the circuit network.
In these processes, adhesion with the substrate, heating, immersion in acid or alkaline solution, application of resist ink, soldering, etc. are performed, so the copper foil has adhesiveness, heat resistance, moisture resistance, chemical resistance. Etc. performance is required. Furthermore, it is also required that the copper foil does not undergo oxidative discoloration during storage.

【0003】これらの要求を満たすために、銅箔に黄銅
層形成処理(特公昭51−35711号公報、同54−
6701号公報)、クロメート処理、亜鉛または酸化亜
鉛とクロム酸化物とからなる亜鉛−クロム基混合物被覆
処理等(特公昭58−7077号公報)が行われ、また
これらにシランカップリング剤を塗布して銅箔と樹脂基
板との接着性を向上させる方法も提案されている(特公
平2−19994号公報、特開昭63−183178号
公報、特開平2−26097号公報)。
In order to meet these demands, a brass layer forming treatment is applied to a copper foil (Japanese Patent Publication No. 51-35711, 54-54).
6701), chromate treatment, zinc-chromium group mixture coating treatment comprising zinc or zinc oxide and chromium oxide (Japanese Patent Publication No. 58-7077), and a silane coupling agent is applied to these. There has also been proposed a method for improving the adhesiveness between a copper foil and a resin substrate (Japanese Patent Publication No. 2-19994, Japanese Patent Laid-Open No. 63-183178, Japanese Patent Laid-Open No. 2-26097).

【0004】[0004]

【発明が解決しようとする課題】しかし、最近プリント
回路が緻密化しているので、使用されるプリント回路用
銅箔に要求される特性はますます厳しくなっている。ま
た、冷蔵庫等の冷凍システムのコンデンサ、キャピラリ
及びエバポレータ等において、冷媒や潤滑油の劣化或い
はシステム内の有機材料成分の溶出等によりスラッジ状
物質が発生し、これが特にキャピラリにおいて閉塞の原
因となっている。また、エバポレータでは、冷媒の蒸発
に際して潤滑油膜がエバポレータ内表面上に残存付着す
るため伝熱効率が悪く、冷却効率を下げているという問
題があった。
However, since the printed circuit has been densified recently, the characteristics required for the copper foil for the printed circuit used have become more and more severe. Further, in condensers, capillaries, evaporators, etc. of refrigeration systems such as refrigerators, sludge-like substances are generated due to deterioration of refrigerant and lubricating oil or elution of organic material components in the system, which causes clogging especially in capillaries. There is. Further, in the evaporator, the lubricating oil film remains adhered on the inner surface of the evaporator during the evaporation of the refrigerant, so that the heat transfer efficiency is poor and the cooling efficiency is lowered.

【0005】さらに、磁気デスクにおいては、低摩擦
性、撥水性、撥油性が要求され、従来、フッ素系ポリマ
ーが用いられているが、高密度記録化のため、更なる性
能の向上が要求されている。
Further, the magnetic desk is required to have low friction, water repellency, and oil repellency, and a fluorine-based polymer has been conventionally used, but further improvement in performance is required for high density recording. ing.

【0006】本発明はかかる現状に鑑み、銅をはじめ各
種の金属や高分子材料等の表面に対し優れた接着性及び
耐ハクリ性をもって皮膜を形成し、該表面に顕著な撥水
性、撥油性、潤滑性及び防錆性を付与することができる
優れた表面処理剤として有用な新規化合物を提供するこ
と及びそれを用いた表面処理剤を提供することを目的と
するものである。
In view of the above situation, the present invention forms a film with excellent adhesiveness and scuff resistance on the surface of various metals such as copper and polymer materials, and has remarkable water repellency and oil repellency on the surface. Another object of the present invention is to provide a novel compound useful as an excellent surface treatment agent capable of imparting lubricity and rust preventive property, and to provide a surface treatment agent using the same.

【0007】[0007]

【課題を解決するための手段】本発明者は、鋭意検討し
た結果、フッ素を含む特定一群のイミダゾール誘導体に
よって上記の課題を解決し得ることを見出し、本発明に
至った。
As a result of intensive studies, the present inventors have found that the above-mentioned problems can be solved by a specific group of imidazole derivatives containing fluorine, and have completed the present invention.

【0008】すなわち、本発明は、 下記一般式(1)で表わされる新規イミダゾールフッ
素誘導体。
That is, the present invention is a novel imidazole fluorine derivative represented by the following general formula (1).

【0009】[0009]

【化5】 [Chemical 5]

【0010】(式中、R1は水素、ビニル基又はポリエ
チレン基を示し、R2は下記一般式(2)で表わされる
基を、R3は水素又は下記一般式(3)で表わされる基
をそれぞれ示し、下記一般式(2)中のR4は、フッ素
又はトリフルオロメチル基を示し、nは1〜15の整数
である。)
(Wherein R 1 represents hydrogen, a vinyl group or a polyethylene group, R 2 represents a group represented by the following general formula (2), and R 3 represents hydrogen or a group represented by the following general formula (3). And R 4 in the following general formula (2) represents a fluorine or trifluoromethyl group, and n is an integer of 1 to 15.)

【0011】[0011]

【化6】 [Chemical 6]

【0012】イミダゾール又は4−ビニルイミダゾー
ルと下記一般式(4)で表わされる1,2−エポキンプ
ロパン化合物とを反応させることを特徴とする前記に
記載のイミダゾールフッ素誘導体の製造方法。
The method for producing an imidazole fluorine derivative as described above, which comprises reacting imidazole or 4-vinylimidazole with a 1,2-epokinpropane compound represented by the following general formula (4).

【0013】[0013]

【化7】 [Chemical 7]

【0014】(式中、R2は下記一般式(2)で表わさ
れる基を示し、該一般式(2)中のR4はフッ素又はト
リフルオロメチル基を示し、nは1〜15の整数であ
る。}
(In the formula, R 2 represents a group represented by the following general formula (2), R 4 in the general formula (2) represents a fluorine or trifluoromethyl group, and n is an integer of 1 to 15. It is.}

【0015】[0015]

【化8】 [Chemical 8]

【0016】上記に記載の一般式(1)で表わされ
たイミダゾールフッ素誘導体の少なくとも一種を有効成
分とすることを特徴とする金属表面処理剤。本発明の前
記一般式(1)で表わされる新規なイミダゾールフッ素
誘導体として、とくに好ましいものを以下に挙げる。
A metal surface treating agent comprising at least one kind of the imidazole fluorine derivative represented by the above general formula (1) as an active ingredient. Particularly preferable examples of the novel imidazole fluorine derivative represented by the general formula (1) of the present invention are shown below.

【0017】[0017]

【化9】 [Chemical 9]

【0018】[0018]

【化10】 [Chemical 10]

【0019】[0019]

【化11】 [Chemical 11]

【0020】本発明の一般式(1)で表わされるイミダ
ゾールフッ素誘導体は、イミダゾール又は4−ビニルイ
ミダゾールと下記一般式(4)で表わされる1,2−エ
ポキシプロパン化合物とを100〜150℃で反応させ
ることにより容易に製造することができる。
The imidazole fluorine derivative represented by the general formula (1) of the present invention is obtained by reacting imidazole or 4-vinylimidazole with a 1,2-epoxypropane compound represented by the following general formula (4) at 100 to 150 ° C. By doing so, it can be easily manufactured.

【0021】[0021]

【化12】 [Chemical 12]

【0022】(式中のR1、R2、R3は前記と同じ)上
記一般式(4)で表わされる1,2−エポキシプロパン
化合物としては、3−パーフルオロオクチル−1,2−
エポキシプロパン、3−パーフルオロデシル−1,2−
エポキシプロパン、3−(パーフルオロ−9−メチルデ
シル)−1,2−エポキシプロパン等が好ましい。
(Wherein R 1 , R 2 and R 3 are the same as above), the 1,2-epoxypropane compound represented by the above general formula (4) is 3-perfluorooctyl-1,2-
Epoxy propane, 3-perfluorodecyl-1,2-
Epoxy propane, 3- (perfluoro-9-methyldecyl) -1,2-epoxy propane and the like are preferable.

【0023】上記イミダゾール又は4−ビニルイミダゾ
ールと1,2−エポキシプロパン化合物との反応は、1
00〜150℃の温度に加熱したイミダゾール又はビニ
ルイミダゾールに0.5〜2モルの1,2−エポキシプ
ロパン化合物を滴下させながら行うと良く、反応時間は
10分〜6時間程度である。この反応は特に溶媒を必要
としないが、ジメチルホルムアミド、ジメチルアセトア
ミド等を反応溶媒として用いてもよい。又この反応は水
分を嫌うので水分が混入しないように乾燥した窒素、ア
ルゴン等の水分を含まない不活性気体の雰囲気下で行う
ことが好ましい。
The reaction between the imidazole or 4-vinylimidazole and the 1,2-epoxypropane compound is 1
It may be carried out while dropping 0.5 to 2 mol of a 1,2-epoxypropane compound into imidazole or vinylimidazole heated to a temperature of 00 to 150 ° C., and the reaction time is about 10 minutes to 6 hours. This reaction does not require a solvent, but dimethylformamide, dimethylacetamide or the like may be used as a reaction solvent. Since this reaction does not like water, it is preferable to carry out the reaction in an atmosphere of dry inert gas such as nitrogen or argon so as not to mix water.

【0024】又、4−ビニルイミダゾールを使用する場
合、上記の反応とともに、ビニル基の付加重合反応が起
るので、これを抑制することを望む場合にはハイドロキ
ノン等の周知の重合禁止剤を使用する。又、反対にビニ
ル基を付加重合させてポリエチレンにイミダゾールフッ
素誘導体がペンダントした化合物を望む場合には重合禁
止剤を用いず、無溶媒で反応を行なうことが好ましい。
When 4-vinylimidazole is used, addition polymerization reaction of vinyl group occurs together with the above reaction. Therefore, when it is desired to suppress this, a known polymerization inhibitor such as hydroquinone is used. To do. On the other hand, when a compound in which a imidazole fluorine derivative is pendant to polyethylene is desired by addition-polymerizing a vinyl group, it is preferable to carry out the reaction without a solvent without using a polymerization inhibitor.

【0025】本発明のイミダゾールフッ素誘導体は、金
属表面処理剤として好適である。金属表面上に形成され
た本発明のイミダゾールフッ素誘導体の皮膜は以下に説
明するようにテフロン級の顕著な撥水性、及び撥油性を
示し、該金属表面の防錆性を著しく向上することができ
る。
The imidazole fluorine derivative of the present invention is suitable as a metal surface treating agent. The film of the imidazole fluorine derivative of the present invention formed on a metal surface exhibits remarkable Teflon-grade water repellency and oil repellency as described below, and can significantly improve the rust preventive property of the metal surface. .

【0026】この他、本発明のイミダゾールフッ素誘導
体は、金属表面に限らず、高分子材料や無機材料等の各
種の基材に塗布されてその基材に同様に撥水性、撥油
性、潤滑性を付与することができる。又、エポキシ樹脂
などの合成樹脂に添加することにより、その樹脂に対し
ても同様に撥水性、撥油性、潤滑性を付与することがで
きる。
In addition to the above, the imidazole fluorine derivative of the present invention is applied not only to the metal surface but also to various base materials such as polymer materials and inorganic materials, and the water repellency, oil repellency and lubricity are similarly applied to the base materials. Can be given. Further, by adding it to a synthetic resin such as an epoxy resin, it is possible to impart water repellency, oil repellency and lubricity to the resin as well.

【0027】本発明のイミダゾールフッ素誘導体を金属
表面処理剤として用いる場合についてさらに述べると、
その対象金属には特に制限はない。たとえば銅、アルミ
ニウム、鉄及びこれらの合金等の表面処理剤として有用
である。しかし、銅及び銅合金の表面処理剤として用い
ることが好適であり、特にはプリント回路用銅張積層板
等に用いられる銅箔の表面処理剤として用いる場合に本
発明の効果を十分に発揮することができる。この銅箔に
は銅箔の表面を粗面化処理したもの、銅箔に黄銅層形成
処理したもの、クロメート処理したもの、亜鉛−クロム
基混合物被覆処理したもの等も包含される。
The case of using the imidazole fluorine derivative of the present invention as a metal surface treating agent will be further described below.
The target metal is not particularly limited. For example, it is useful as a surface treatment agent for copper, aluminum, iron and alloys thereof. However, it is suitable to be used as a surface treatment agent for copper and copper alloys, and particularly when used as a surface treatment agent for a copper foil used for a copper clad laminate for a printed circuit or the like, the effect of the present invention is sufficiently exhibited. be able to. The copper foil includes a copper foil whose surface has been roughened, a copper foil which has been subjected to a brass layer formation treatment, a chromate treatment, a zinc-chromium group mixture coating treatment, and the like.

【0028】また、冷蔵庫等の冷凍システムのコンデン
サ、キャピラリ及びエバポレータ等の内壁面の表面処理
剤として用いることができ、この表面処理剤の強力な撥
水及び撥油性能により、特に、キャピラリ内壁において
はスラッジ状物質の付着及びこの付着による閉塞を防止
することができる。さらに、エバポレータ内壁において
は、潤滑油と混合した冷媒が蒸発する際、表面処理剤の
強力な撥油性能のため潤滑油が液滴になり、油膜を生じ
ないため、伝熱効率が向上し、冷凍システムの冷却効率
を高めることができる。
Further, it can be used as a surface treatment agent for inner wall surfaces of condensers, capillaries and evaporators of refrigeration systems such as refrigerators, and the strong water and oil repellency of this surface treatment agent makes it possible, in particular, on the inner wall of the capillaries. Can prevent the adhesion of sludge-like substances and the blockage due to this adhesion. Furthermore, on the inner wall of the evaporator, when the refrigerant mixed with the lubricating oil evaporates, the lubricating oil becomes droplets due to the strong oil repellency of the surface treatment agent and does not form an oil film, improving heat transfer efficiency and refrigeration. The cooling efficiency of the system can be increased.

【0029】さらに、本発明の表面処理剤は、強力な撥
水、撥油性能に加えて低摩擦性を付与する潤滑性を有す
るため、磁気デスクの表面塗布剤として好適である。上
記イミダゾールフッ素誘導体は、少なくともその一種を
メタノール、エタノール等のアルコール類等の溶剤で
0.001〜20重量%になるように希釈し、この液に
金属を浸漬させる方法で塗布することが簡便で好まし
い。尚、このイミダゾールフッ素誘導体は単独で用いて
もよいが、複数のイミダゾールシラン化合物を混合して
用いてもよく、また他の防錆剤、或いは、カップリング
剤等と混合して用いてもよい。
Further, the surface treatment agent of the present invention has strong water repellency and oil repellency as well as lubricity that imparts low friction, and is therefore suitable as a surface coating agent for magnetic desks. It is easy to apply at least one of the imidazole fluorine derivatives by diluting at least one of them with a solvent such as alcohols such as methanol and ethanol to a concentration of 0.001 to 20% by weight, and dipping a metal in this solution. preferable. The imidazole fluorine derivative may be used alone, or a plurality of imidazole silane compounds may be mixed and used, or may be mixed with another rust preventive agent, a coupling agent or the like. .

【0030】[0030]

【実施例】実施例1イミダゾールフッ素誘導体の合成1 {イミダゾールと3−パーフルオロオクチル−1,2−
エポキシプロパンとの反応より下記式(1−1)で表わ
される化合物の合成}
EXAMPLES Example 1 Synthesis of imidazole fluorine derivative 1 {Imidazole and 3-perfluorooctyl-1,2-
Synthesis of compound represented by the following formula (1-1) by reaction with epoxypropane}

【0031】[0031]

【化13】 [Chemical 13]

【0032】イミダゾール1.36g(0.02mo
l)を130℃で融解し、アルゴン気流下で撹拌しなが
ら、3−パーフルオロオクチル−1,2−エポキシプロ
パン9.52g(0.02mol)を30分間かけて滴
下した。滴下終了後、さらに130℃の温度で15分間
反応させた。
1.36 g of imidazole (0.02 mo
l) was melted at 130 ° C., and 9.52 g (0.02 mol) of 3-perfluorooctyl-1,2-epoxypropane was added dropwise over 30 minutes while stirring under an argon stream. After the dropping was completed, the reaction was further performed at a temperature of 130 ° C. for 15 minutes.

【0033】反応生成物は黒色を呈していたが、未反応
モノマーを除去するためエタノールで洗浄することによ
り3.45g(収率31.7%)の白色粉末として得ら
れた。この化合物の融点はDSC測定の結果、210℃
であった。1H−NMR、FT−IR及び19F−NMR
の結果を図1,2,3に示す。又元素の分析の結果を表
1に示す。
The reaction product had a black color, but it was washed with ethanol to remove unreacted monomers, whereby 3.45 g (yield 31.7%) of a white powder was obtained. The melting point of this compound is 210 ° C. as a result of DSC measurement.
Met. 1 H-NMR, FT-IR and 19 F-NMR
The results are shown in FIGS. The results of elemental analysis are shown in Table 1.

【0034】[0034]

【表1】 [Table 1]

【0035】実施例2イミダゾールフッ素誘導体の合成2 {4−ビニルイミダゾールと3−パーフルオロオクチル
−1,2−エポキシプロパンとの反応より下記式(1−
2)で表わされる化合物の合成}
Example 2 Synthesis of imidazole fluorine derivative 2 From the reaction of {4-vinylimidazole and 3-perfluorooctyl-1,2-epoxypropane, the following formula (1-
Synthesis of compound represented by 2)}

【0036】[0036]

【化14】 [Chemical 14]

【0037】4−ビニルイミダゾール1.88g(0.
02mol)と重合禁止剤としてのヒドロキノン0.0
188gをアルゴン気流下で130℃にて撹拌させ、そ
こに3−パーフルオロオクチル−1,2−エポキシプロ
パン9.52g(0.02mol)を30分間かけて滴
下した。滴下終了後さらに130℃で1時間反応させ
た。
1.88 g of 4-vinylimidazole (0.
02 mol) and hydroquinone as a polymerization inhibitor 0.0
188 g was allowed to stir at 130 ° C. under an argon stream, and 9.52 g (0.02 mol) of 3-perfluorooctyl-1,2-epoxypropane was added dropwise thereto over 30 minutes. After the dropping was completed, the reaction was further performed at 130 ° C. for 1 hour.

【0038】得られた化合物は移動相としてベンゼン9
5%、メタノール5%、充填剤としてシリカゲルを用い
たカラムクロマト法により精製、単離された。単離され
た化合物は1.12g(収率9.8%)の白色の粉末状
化合物であり、DSC測定の結果、融点は149℃であ
った。元素分析の結果を表2に、1H−NMR、FT−
IRの結果を図4,5に示す。
The obtained compound is benzene 9 as a mobile phase.
Purified and isolated by column chromatography using 5%, methanol 5%, and silica gel as a packing material. The isolated compound was 1.12 g (yield 9.8%) of a white powdery compound, and the melting point was 149 ° C. as a result of DSC measurement. The results of elemental analysis are shown in Table 2, 1 H-NMR, FT-
The results of IR are shown in FIGS.

【0039】[0039]

【表2】 [Table 2]

【0040】実施例3イミダゾールフッ素誘導体の合成3 {4−ビニルイミダゾールと3−パーフルオロオクチル
−1,2−エポキシプロパンとの反応より下記式(1−
3)で表わされる化合物の合成}
Example 3 Synthesis of imidazole fluorine derivative 3 From the reaction of {4-vinylimidazole and 3-perfluorooctyl-1,2-epoxypropane, the following formula (1-
Synthesis of compound represented by 3)}

【0041】[0041]

【化15】 [Chemical 15]

【0042】4−ビニルイミダゾール1.88g(0.
02mol)を130℃でアルゴン気流下で撹拌させ、
そこに3−パーフルオロオクチル−1,2−エポキシプ
ロパン9.52g(0.02mol)を30分間かけて
滴下した。滴下終了後、さらに130℃で1時間反応さ
せた。
4-Vinylimidazole 1.88 g (0.
02 mol) at 130 ° C. under an argon stream,
9.52 g (0.02 mol) of 3-perfluorooctyl-1,2-epoxypropane was added dropwise thereto over 30 minutes. After the dropping was completed, the reaction was further performed at 130 ° C. for 1 hour.

【0043】得られた化合物は黒色を呈しており未反応
のモノマーを除去する目的でエタノールでよく洗浄し、
褐色の粉末状化合物を得た。元素分析の結果を表3に、
1H−NMR、FT−IRの結果を図6,7に示す。
The obtained compound has a black color and is thoroughly washed with ethanol for the purpose of removing unreacted monomers.
A brown powdery compound was obtained. The results of elemental analysis are shown in Table 3,
The results of 1 H-NMR and FT-IR are shown in FIGS.

【0044】[0044]

【表3】 [Table 3]

【0045】また、得られたポリマーの固有粘度をヘキ
サフルオロプロパノールを溶媒にして求めたところ1.
3であった。
The intrinsic viscosity of the obtained polymer was determined by using hexafluoropropanol as a solvent.
It was 3.

【0046】実施例4イミダゾールフッ素誘導体の合成4 {4−ビニルイミダゾールと3−パーフルオロ−9メチ
ルデシル−1,2−エポキシプロパンとの反応より下記
式(1−4)で表わされる化合物の合成}
Example 4 Synthesis of imidazole fluorine derivative 4 {Synthesis of compound represented by the following formula (1-4) from reaction of 4-vinylimidazole with 3-perfluoro-9-methyldecyl-1,2-epoxypropane}

【0047】[0047]

【化16】 [Chemical 16]

【0048】4−ビニルイミダゾール1.88g(0.
02mol)と重合禁止剤としてのヒドロキノン0.0
188gをジメチルホルムアミド50mlに溶解した。
この溶液にアルゴン気流下130℃で、3−パーフルオ
ロ−9メチルデシル−1,2−エポキシプロパン12.
53g(0.02mol)をジメチルホルムアミド10
0mlに溶解させた溶液を30分間かけて滴下した。滴
下終了後、さらに5時間反応を続けた。反応終了後、析
出物を濾過により除去し、濾液を濃縮し、得られた固体
をさらにメタノールに可溶な成分と不溶な成分とに分離
した。メタノール可溶成分は移動相としてベンゼン95
%、メタノール5%、充填剤としてシリカゲルを用いた
カラムクロマト法により精製、単離された。単離された
化合物は0.17g(収率1.2%)の白色の粉末状化
合物であり、DSC測定の結果、融点は150℃であっ
た。元素分析の結果を表4に、又、1H−NMR、FT
−IR、19F−NMRの結果を図8,9,10に示す。
4-Vinylimidazole 1.88 g (0.
02 mol) and hydroquinone as a polymerization inhibitor 0.0
188 g was dissolved in 50 ml of dimethylformamide.
This solution was added with 3-perfluoro-9-methyldecyl-1,2-epoxypropane 12.
53 g (0.02 mol) of dimethylformamide 10
The solution dissolved in 0 ml was added dropwise over 30 minutes. After the dropping was completed, the reaction was continued for 5 hours. After completion of the reaction, the precipitate was removed by filtration, the filtrate was concentrated, and the obtained solid was further separated into a methanol-soluble component and an insoluble component. Methanol-soluble component is benzene 95 as mobile phase.
%, Methanol 5%, and purified and isolated by column chromatography using silica gel as a packing material. The isolated compound was 0.17 g (yield 1.2%) of a white powdery compound, and the melting point was 150 ° C. as a result of DSC measurement. The results of elemental analysis are shown in Table 4, 1 H-NMR and FT.
The results of -IR and 19 F-NMR are shown in FIGS.

【0049】[0049]

【表4】 [Table 4]

【0050】実施例5イミダゾールフッ素誘導体の合成5 {イミダゾールと3−パーフルオロ−9メチルデシル−
1,2−エポキシプロパンとの反応より下記式(1−
5)及び(1−6)で表わされる化合物の合成}
Example 5 Synthesis of imidazole fluorine derivative 5 {Imidazole and 3-perfluoro-9-methyldecyl-
From the reaction with 1,2-epoxypropane, the following formula (1-
5) and synthesis of compounds represented by (1-6)}

【0051】[0051]

【化17】 [Chemical 17]

【0052】イミダゾール1.36g(0.02mo
l)をジメチルアセトアミド25mlに溶解した。この
溶液にアルゴン気流下120℃で、3−パーフルオロ−
9メチルデシル−1,2−エポキシプロパン12.53
g(0.02mol)をジメチルアセトアミド35ml
に溶解させた溶液を30分間かけて滴下した。滴下終了
後、さらに6時間反応を続けた。反応終了後、析出物を
濾過により除去し、ガラスフィルター上でジメチルアセ
トアミドにより洗浄した。得られた粉末状化合物をさら
にメタノールに可溶な成分と不溶な成分に分離した。メ
タノールに不溶な成分は減圧乾燥された。メタノールに
可溶な成分は活性炭で処理されメタノールを留去するこ
とにより精製された。単離された化合物はいずれも白色
の粉末状化合物で、前者は2.06g(収率14.8
%)、後者は0.67g(収率4.8%)であり、DS
C測定の結果、融点は125℃(メタノール可溶成
分)、196℃(メタノール不溶成分)であった。元素
分析の結果を表5に、又、1H−NMR、FT−IR、
19F−NMRの結果を図11,12,13,14,1
5,16に示す。
1.36 g of imidazole (0.02 mo
1) was dissolved in 25 ml of dimethylacetamide. 3-perfluoro-
9 Methyldecyl-1,2-epoxypropane 12.53
35 g of dimethylacetamide (g (0.02 mol))
The solution dissolved in was added dropwise over 30 minutes. After the dropping was completed, the reaction was continued for another 6 hours. After the reaction was completed, the precipitate was removed by filtration and washed with dimethylacetamide on a glass filter. The obtained powdery compound was further separated into a methanol-soluble component and an insoluble component. The components insoluble in methanol were dried under reduced pressure. The component soluble in methanol was treated with activated carbon and purified by distilling off methanol. Each of the isolated compounds was a white powdery compound, the former being 2.06 g (yield 14.8).
%), The latter is 0.67 g (yield 4.8%), DS
As a result of C measurement, the melting point was 125 ° C (methanol-soluble component) and 196 ° C (methanol-insoluble component). The results of elemental analysis are shown in Table 5, 1 H-NMR, FT-IR,
The results of 19 F-NMR are shown in FIGS. 11, 12, 13, 14, and 1.
5,16.

【0053】[0053]

【表5】 [Table 5]

【0054】実施例6イミダゾールフッ素誘導体の合成6 {イミダゾールと3−パーフルオロデシル−1,2−エ
ポキシプロパンとの反応より下記式(1−7)及び(1
−8)で表わされる化合物の合成}
Example 6 Synthesis of imidazole fluorine derivative 6 {from the reaction of imidazole with 3-perfluorodecyl-1,2-epoxypropane, the following formulas (1-7) and (1
Synthesis of compound represented by -8)}

【0055】[0055]

【化18】 [Chemical 18]

【0056】イミダゾール1.36g(0.02mo
l)をジメチルアセトアミド25mlに溶解した。この
溶液にアルゴン気流下、120℃で、3−パーフルオロ
−デシル−1,2−エポキシプロパン11.52gをジ
メチルアセトアミド35mlに溶解させた溶液を30分
間かけて滴下した。滴下終了後、さらに6時間反応を続
けた。
1.36 g of imidazole (0.02 mo
1) was dissolved in 25 ml of dimethylacetamide. A solution prepared by dissolving 11.52 g of 3-perfluoro-decyl-1,2-epoxypropane in 35 ml of dimethylacetamide was added dropwise to this solution at 120 ° C. over 30 minutes under an argon stream. After the dropping was completed, the reaction was continued for another 6 hours.

【0057】反応終了後、析出物を濾過により除去し、
ガラスフィルター上でジメチルアセトアミドにより洗浄
した。得られた粉末状化合物をさらにメタノールに可溶
な成分と不溶な成分に分離した。メタノールに不溶な成
分は減圧乾燥された。メタノールに可溶な成分は活性炭
で処理されメタノールを留去することにより精製され
た。単離された化合物はいずれも白色の粉末状化合物
で、前者は0.45g(収率3.5%)、後者は0.8
6g(収率6.7%)であり、DSC測定の結果、融点
は139℃(メタノール可溶成分)、117℃(メタノ
ール不溶成分)であった。元素分析の結果を表6に、
又、1H−NMR、FT−IR、19F−NMRの結果を
図17,18,19,20,21,22に示す。
After the reaction was completed, the precipitate was removed by filtration,
It was washed with dimethylacetamide on a glass filter. The obtained powdery compound was further separated into a methanol-soluble component and an insoluble component. The components insoluble in methanol were dried under reduced pressure. The component soluble in methanol was treated with activated carbon and purified by distilling off methanol. The isolated compounds are white powdery compounds, the former 0.45 g (yield 3.5%), the latter 0.8.
It was 6 g (yield 6.7%), and as a result of DSC measurement, the melting point was 139 ° C. (methanol-soluble component) and 117 ° C. (methanol-insoluble component). The results of elemental analysis are shown in Table 6.
The results of 1 H-NMR, FT-IR and 19 F-NMR are shown in FIGS. 17, 18, 19 , 20 , 21 , and 22 .

【0058】[0058]

【表6】 [Table 6]

【0059】実施例7イミダゾールフッ素誘導体の合成7 {イミダゾールと3−パーフルオロオクチル−1,2−
エポキシプロパンとの反応より下記式(1−9)で表わ
される化合物の合成}
Example 7 Synthesis of imidazole fluorine derivative 7 {Imidazole and 3-perfluorooctyl-1,2-
Synthesis of a compound represented by the following formula (1-9) from a reaction with epoxypropane}

【0060】[0060]

【化19】 [Chemical 19]

【0061】イミダゾール1.36g(0.02mo
l)をジメチルホルムアミド25mlに溶解した。この
溶液にアルゴン気流下、120℃で3−パーフルオロオ
クチル−1,2−エポキシプロパン9.52g(0.0
2mol)をジメチルホルムアミド25mlに溶解させ
た溶液を30分間かけて滴下した。滴下終了後、さらに
6時間反応を続けた。反応終了後、析出物を濾過により
除去し、ガラスフィルター上でジメチルアセトアミドに
より洗浄した。得られた粉末状化合物をさらにメタノー
ルに可溶な成分と不溶な成分に分離した。メタノールに
可溶な成分はクロロホルム/メタノール混合溶媒より再
結晶を2回繰り返し、活性炭で処理され溶媒を留去する
ことにより精製された。単離された化合物は0.89g
(収率8.2%)で白色の粉末状化合物であり、DSC
測定の結果、融点は124℃であった。元素分析の結果
を表7に示す。又、1H−NMR、FT−IR、19F−
NMRの結果を図23,24,25に示す。
1.36 g of imidazole (0.02 mo
l) was dissolved in 25 ml of dimethylformamide. 9.52 g of 3-perfluorooctyl-1,2-epoxypropane (0.0
A solution prepared by dissolving 2 mol) in 25 ml of dimethylformamide was added dropwise over 30 minutes. After the dropping was completed, the reaction was continued for another 6 hours. After the reaction was completed, the precipitate was removed by filtration and washed with dimethylacetamide on a glass filter. The obtained powdery compound was further separated into a methanol-soluble component and an insoluble component. The component soluble in methanol was purified by repeating recrystallization twice from a chloroform / methanol mixed solvent, treating with activated carbon and distilling off the solvent. 0.89 g of isolated compound
(Yield 8.2%), white powdery compound, DSC
As a result of the measurement, the melting point was 124 ° C. The results of elemental analysis are shown in Table 7. In addition, 1 H-NMR, FT-IR, 19 F-
The results of NMR are shown in FIGS.

【0062】[0062]

【表7】 [Table 7]

【0063】実施例8 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−1)で表わされるイミダゾールフッ素誘
導体の0.2%ヘキサフルオロ−2−プロパノール溶液
を用いて500RPMにてスピンコートした。その後、
100℃で30分間乾燥してその表面濡れ性を協和界面
科学製CA−D型の接触角測定装置により評価した。評
価結果を表8に示す。
Example 8 An electrolytic copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically cleaned with acetone for 5 minutes, then washed with water, and immersed in a 3% sulfuric acid aqueous solution for 1 minute for pickling. Then, it was washed with water and acetone in that order and dried with a dryer. A glossy surface of this electrolytic copper foil was spin-coated at 500 RPM using a 0.2% hexafluoro-2-propanol solution of the imidazole fluorine derivative represented by the formula (1-1). afterwards,
After drying at 100 ° C. for 30 minutes, the surface wettability was evaluated by a Kyowa Interface Science CA-D type contact angle measuring device. The evaluation results are shown in Table 8.

【0064】[0064]

【表8】 [Table 8]

【0065】*文献値 N.L.Jarvis and W.A.Zisma
n;Encyclopedia of Chemica
l Technology Vol.9,707L.
S.Penn and E.R.Bowler;Sur
face andInterface Analysi
s,vol.3,No.4 161(1981) 実施例9 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−2)で表わされるイミダゾールフッ素誘
導体の0.2%メタノール溶液を用いて500RPMに
てスピンコートした。その後、100℃で30分間乾燥
してその表面濡れ性を協和界面科学製CA−D型の接触
角測定装置により評価した。評価結果を表9に示す。
* Reference value N. L. Jarvis and W.D. A. Zisma
n; Encyclopedia of Chemica
l Technology Vol. 9,707L.
S. Penn and E. R. Bowler; Sur
face and Interface Analysis
s, vol. 3, No. 4 161 (1981) Example 9 An electrolytic copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically cleaned with acetone for 5 minutes, and then washed with water, and a 3% sulfuric acid aqueous solution was used. It was soaked and pickled for 1 minute. Then, it was washed with water and acetone in that order and dried with a dryer. The glossy surface of this electrolytic copper foil was spin-coated at 500 RPM using a 0.2% methanol solution of the imidazole fluorine derivative represented by the above formula (1-2). Then, it was dried at 100 ° C. for 30 minutes and its surface wettability was evaluated by a Kyowa Interface Science CA-D type contact angle measuring device. The evaluation results are shown in Table 9.

【0066】[0066]

【表9】 [Table 9]

【0067】*前記文献値 実施例10 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−3)で表わされるイミダゾールフッ素誘
導体の0.2%ヘキサフルオロ−2−プロパノール溶液
を用いて500RPMにてスピンコートした。その後、
100℃で30分間乾燥してその表面濡れ性を協和界面
科学製CA−D型の接触角測定装置により評価した。評
価結果を表10に示す。
* The above literature values Example 10 An electrolytic copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically cleaned with acetone for 5 minutes, then washed with water, and immersed in a 3% sulfuric acid aqueous solution for 1 minute for pickling. did. Then, it was washed with water and acetone in that order and dried with a dryer. A glossy surface of this electrolytic copper foil was spin coated at 500 RPM using a 0.2% hexafluoro-2-propanol solution of the imidazole fluorine derivative represented by the above formula (1-3). afterwards,
After drying at 100 ° C. for 30 minutes, the surface wettability was evaluated by a Kyowa Interface Science CA-D type contact angle measuring device. The evaluation results are shown in Table 10.

【0068】[0068]

【表10】 [Table 10]

【0069】*前記文献値 実施例11,12 アルミ板(実施例11)およびステンレス板(実施例1
2)をアセトンで5分間超音波洗浄し、次いで水洗し
た。これらの基板に前記式(1−1)で表わされるイミ
ダゾールフッ素誘導体の0.2%ヘキサフルオロ−2−
プロパノール溶液を用いて500RPMにてスピンコー
トした。その後、100℃で30分間乾燥してその表面
濡れ性を協和界面科学製CA−D型の接触角測定装置に
より評価した。評価結果を表11に示す。
* The above literature values Examples 11 and 12 Aluminum plate (Example 11) and stainless plate (Example 1)
2) was ultrasonically washed with acetone for 5 minutes and then washed with water. On these substrates, 0.2% hexafluoro-2- of the imidazole fluorine derivative represented by the above formula (1-1) was used.
It was spin-coated at 500 RPM using a propanol solution. Then, it was dried at 100 ° C. for 30 minutes and its surface wettability was evaluated by a Kyowa Interface Science CA-D type contact angle measuring device. The evaluation results are shown in Table 11.

【0070】[0070]

【表11】 [Table 11]

【0071】*前記文献値 比較例1,2 実施例で用いた電解銅箔(脱脂、酸洗後のもの比較例
1)およびテフロン板(比較例2)を用いて実施例と同
様な方法で表面の濡れ性を評価した。結果を表12に示
す。
* Reference values above Comparative Examples 1 and 2 In the same manner as in Examples, the electrolytic copper foil (after degreasing and pickling, Comparative Example 1) and the Teflon plate (Comparative Example 2) used in Examples were used. The wettability of the surface was evaluated. The results are shown in Table 12.

【0072】[0072]

【表12】 [Table 12]

【0073】*前記文献値 前記実施例8〜12と上記比較例とを対比すれば、本発
明のイミダゾールフッ素誘導体は、顕著な撥水性、撥油
性を示すことがわかる。これらの性能は、代表的な撥水
材であるフッ素材料(テフロン)よりも優れている。
* The above literature values By comparing Examples 8 to 12 with the above Comparative Example, it can be seen that the imidazole fluorine derivative of the present invention exhibits remarkable water repellency and oil repellency. These performances are superior to the fluorine material (Teflon) which is a typical water repellent material.

【0074】実施例13 各種基板をイミダゾールフッ素誘導体{前記式(1−
2)}で実施例9と同様に表面処理し、それらの吸着性
を該誘導体の良溶媒であるメタノールで1分間洗浄する
ことにより調べた。吸着量はFT−IRの高感度反射法
を用いて吸光度を測定することにより求めた。結果を表
13に示す。
Example 13 Various substrates were prepared by using an imidazole fluorine derivative {the above formula (1-
2)} was surface-treated in the same manner as in Example 9, and their adsorptivity was examined by washing with methanol, which is a good solvent for the derivative, for 1 minute. The adsorption amount was determined by measuring the absorbance using the high sensitivity reflection method of FT-IR. The results are shown in Table 13.

【0075】[0075]

【表13】 [Table 13]

【0076】注1 ED Copper;電解銅箔、1B;Cu70% Z
n30%、2B;Cu65% Zn35%、1C;Cu
100%(圧延銅箔)、2N;Cu64% Zn18%
Ni18%、5P;Cu95% Sn5%、 1T
C;Cu97% Ti3% 注2 洗浄前の吸着量を100%として計算 上記の結果は、本発明のイミダゾールフッ素誘導体は、
銅及び銅合金に対して特異的な接着性を有することを示
している。
Note 1 ED Copper; electrolytic copper foil, 1B; Cu 70% Z
n30%, 2B; Cu65%, Zn35%, 1C; Cu
100% (rolled copper foil), 2N; Cu 64% Zn 18%
Ni 18%, 5P; Cu 95% Sn 5%, 1T
C; Cu 97% Ti 3% Note 2 Calculated assuming the adsorption amount before washing as 100%. The above results show that the imidazole fluorine derivative of the present invention is
It shows that it has specific adhesion to copper and copper alloys.

【0077】実施例14 電解銅箔(4.5×4.5cm、厚さ70μm)をアセ
トンで5分間超音波洗浄し、次いで水洗し、3%硫酸水
溶液で1分間浸漬酸洗した。その後、水、アセトンの順
で洗浄しドライヤーで乾燥した。この電解銅箔の光沢面
に前記式(1−1)で表わされるイミダゾールフッ素誘
導体の0.2%ヘキサフルオロ−2−プロパノール溶液
を用いて500RPMにてスピンコートし、その後、1
00℃で30分間乾燥した。イミダゾールフッ素誘導体
の銅に対する防錆作用を評価する目的で表面処理された
銅箔を沸騰水に5分間浸漬し、浸漬後の表面の変色を観
察した。前記式(1−2)、(1−3)で表わされるイ
ミダゾールフッ素誘導体を用いた場合および未処理銅箔
の結果も合わせて、評価結果を表14に示す。
Example 14 An electrolytic copper foil (4.5 × 4.5 cm, thickness 70 μm) was ultrasonically washed with acetone for 5 minutes, then washed with water, and immersed in a 3% sulfuric acid aqueous solution for 1 minute to be pickled. Then, it was washed with water and acetone in that order and dried with a dryer. The glossy surface of this electrolytic copper foil was spin-coated at 500 RPM using a 0.2% hexafluoro-2-propanol solution of the imidazole fluorine derivative represented by the formula (1-1), and then 1
It was dried at 00 ° C. for 30 minutes. The surface-treated copper foil was immersed in boiling water for 5 minutes for the purpose of evaluating the anticorrosive effect of the imidazole fluorine derivative on copper, and the discoloration of the surface after the immersion was observed. The evaluation results are shown in Table 14 together with the results of using the imidazole fluorine derivative represented by the formulas (1-2) and (1-3) and the results of the untreated copper foil.

【0078】[0078]

【表14】 [Table 14]

【0079】実施例15 実施例14で示したのと同様の方法で、表15に示した
前記式イミダゾールフッ素誘導体を用いて表面処理した
銅箔に対する耐湿性を評価した。評価は、表面処理した
銅箔を相対湿度95%、温度80℃の恒温槽中で24時
間暴露した。暴露後の銅箔表面の変色を観察した。
Example 15 In the same manner as in Example 14, the moisture resistance of the copper foil surface-treated with the above formula imidazole fluorine derivative shown in Table 15 was evaluated. For the evaluation, the surface-treated copper foil was exposed for 24 hours in a thermostat at a relative humidity of 95% and a temperature of 80 ° C. The discoloration of the copper foil surface after the exposure was observed.

【0080】また、耐熱性についても、同様に評価し
た。耐熱性の評価は、260℃の半田浴の上に表面処理
した銅箔を、処理面が上になるように置き、10秒後に
取り出し、銅箔表面の変色を観察した。
The heat resistance was evaluated in the same manner. To evaluate the heat resistance, the surface-treated copper foil was placed on a solder bath at 260 ° C. with the treated surface facing upward, and after 10 seconds, the copper foil was taken out and the discoloration of the copper foil surface was observed.

【0081】さらに、半田濡れ性についても、同様に評
価した。半田濡れ性の評価は、表面処理した銅箔をオー
トフラックスJS−64〔山栄化学(株)製〕で処理
し、255℃の半田浴(JIS H64A)に1秒間浸
漬した後の半田濡れの状態を観察した。これらの結果
を、未処理銅箔の結果と併せて表15に示した。
Further, the solder wettability was evaluated in the same manner. The solder wettability was evaluated by treating the surface-treated copper foil with Autoflux JS-64 (manufactured by Sanei Chemical Co., Ltd.) and dipping it in a solder bath (JIS H64A) at 255 ° C for 1 second. The condition was observed. These results are shown in Table 15 together with the result of the untreated copper foil.

【0082】[0082]

【表15】 [Table 15]

【0083】実施例16 銅平板(11×4.5cm、厚さ0.35mm、表面粗
さRmax0.1μm)を、トリクロロエタンで5日間ソ
ックスレー抽出により脱脂し、エッチング溶液(過酸化
水素50ml、硫酸10ml、イオン交換水1リット
ル)に60秒間浸漬した後、5%硫酸水溶液に1分間浸
漬し、次いでイオン交換水に1分間2回浸漬して水洗
し、ドライヤーで乾燥した。この銅板に表16に示すよ
うな条件で8種のイミダゾールフッ素誘導体(前記式番
号で示した)を、膜厚が0.02μになるようにスピン
コートし、その後、100℃で30分間乾燥した。イミ
ダゾールフッ素誘導体の潤滑性及び皮膜の剪断耐久性を
評価するため、バウデン・レーベン式往復動摩擦試験機
で転がり軸受用鋼球(直径3.96mm、軸受鋼2種)
を用いて、表17の条件で試験した。試験中の皮膜の平
均摩擦係数及び皮膜が破断した時の摩擦回数を表16に
示した。なお、イミダゾールフッ素誘導体をスピンコー
トしていない銅板の摩擦係数は0.35であり、本発明
のイミダゾールフッ素誘導体で表面処理した銅板表面の
摩擦係数は大幅に減っており、非常に良好な潤滑性を有
していることが分かる。さらに、この表面皮膜が、厳し
い条件での摩擦であっても、破断されず、耐久性に優れ
ていることが分かる。
Example 16 A copper plate (11 × 4.5 cm, thickness 0.35 mm, surface roughness R max 0.1 μm) was degreased by Soxhlet extraction for 5 days with trichloroethane, and the etching solution (hydrogen peroxide 50 ml, It was dipped in 10 ml of sulfuric acid and 1 liter of ion-exchanged water) for 60 seconds, then dipped in a 5% sulfuric acid aqueous solution for 1 minute, then dipped in ion-exchanged water twice for 1 minute, washed with water, and dried with a dryer. Eight imidazole fluorine derivatives (shown by the above formula number) were spin-coated on this copper plate under the conditions shown in Table 16 to a film thickness of 0.02 μ, and then dried at 100 ° C. for 30 minutes. . Steel balls for rolling bearings (diameter 3.96 mm, bearing steel 2 types) with a Bowden-Leben reciprocating friction tester to evaluate the lubricity of the imidazole fluorine derivative and the shear durability of the film.
Was tested under the conditions shown in Table 17. Table 16 shows the average friction coefficient of the coating during the test and the number of frictions when the coating broke. The coefficient of friction of the copper plate not spin-coated with the imidazole fluorine derivative was 0.35, and the coefficient of friction of the surface of the copper plate surface-treated with the imidazole fluorine derivative of the present invention was greatly reduced, showing very good lubricity. It turns out that it has. Further, it can be seen that this surface film is not broken even if it is rubbed under severe conditions and has excellent durability.

【0084】[0084]

【表16】 [Table 16]

【0085】MeOH:メタノール、HFP:ヘキサフ
ルオロ−2−プロパノール
MeOH: methanol, HFP: hexafluoro-2-propanol

【0086】[0086]

【表17】 [Table 17]

【0087】実施例17 実施例14と同様の方法で前記式(1−2)のイミダゾ
ールフッ素誘導体を用いて銅箔の表面を処理した。冷蔵
庫等の冷凍システムで使用できるか否かを見る目的で、
冷媒に対する耐久性を評価した。評価は、表面処理した
銅箔をガラスアンプルに入れ、これに冷媒R−134a
を注入し、真空ポンプで脱気した後、封管して、50
℃、100℃の恒温槽に67時間入れ、銅箔表面の水の
接触角の変化を測定することで行った。この結果、試験
前の処理銅箔の接触角は114度で、50℃の試験後は
111度、100℃の試験後は114度で、殆ど変化は
見られず、冷媒に対する耐久性を有し、冷蔵庫等の冷凍
システムで使用できることが分かった。
Example 17 In the same manner as in Example 14, the surface of the copper foil was treated with the imidazole fluorine derivative of the above formula (1-2). For the purpose of checking whether it can be used in a refrigeration system such as a refrigerator,
The durability against the refrigerant was evaluated. For evaluation, the surface-treated copper foil was put in a glass ampoule, and the refrigerant R-134a was placed in this.
Was injected, degassed with a vacuum pump, sealed, and
It was carried out by placing it in a constant temperature bath of 100 ° C. and 67 ° C. for 67 hours and measuring the change in the contact angle of water on the surface of the copper foil. As a result, the contact angle of the treated copper foil before the test was 114 degrees, after the test at 50 ° C. was 111 degrees, and after the test at 100 ° C. was 114 degrees, showing almost no change and having durability against the refrigerant. It was found that it can be used in refrigeration systems such as refrigerators.

【0088】[0088]

【発明の効果】以上説明したように、本発明の新規イミ
ダゾールフッ素誘導体は、表面に顕著な撥水、撥油性、
防錆性及び潤滑性を付与することができる。
As described above, the novel imidazole fluorine derivative of the present invention has remarkable water and oil repellency on the surface.
Rust prevention and lubricity can be imparted.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のイミダゾールフッ素誘導体{式(1−
1)}の1H−NMRスペクトル
FIG. 1 shows an imidazole fluorine derivative of the present invention (formula (1-
1)} 1 H-NMR spectrum

【図2】本発明のイミダゾールフッ素誘導体{式(1−
1)}のIRスペクトル
FIG. 2 shows an imidazole fluorine derivative of the present invention (formula (1-
1)} IR spectrum

【図3】本発明のイミダゾールフッ素誘導体{式(1−
1)}の19F−NMRスペクトル
FIG. 3 shows an imidazole fluorine derivative of the present invention (formula (1-
1)} 19 F-NMR spectrum

【図4】本発明のイミダゾールフッ素誘導体{式(1−
2)}の1H−NMRスペクトル
FIG. 4 shows an imidazole fluorine derivative of the present invention (formula (1-
2)} 1 H-NMR spectrum

【図5】本発明のイミダゾールフッ素誘導体{式(1−
2)}のIRスペクトル
FIG. 5 shows an imidazole fluorine derivative of the present invention (formula (1-
2)} IR spectrum

【図6】本発明のイミダゾールフッ素誘導体{式(1−
3)}の1H−NMRスペクトル
FIG. 6 shows an imidazole fluorine derivative of the present invention (formula (1-
3)} 1 H-NMR spectrum

【図7】本発明のイミダゾールフッ素誘導体{式(1−
3)}のIRスペクトル
FIG. 7 shows an imidazole fluorine derivative of the present invention (formula (1-
3)} IR spectrum

【図8】本発明のイミダゾールフッ素誘導体{式(1−
4)}の1H−NMRスペクトル
FIG. 8 shows an imidazole fluorine derivative of the present invention {formula (1-
4)} 1 H-NMR spectrum

【図9】本発明のイミダゾールフッ素誘導体{式(1−
4)}のIRスペクトル
FIG. 9 shows an imidazole fluorine derivative of the present invention (formula (1-
4)} IR spectrum

【図10】本発明のイミダゾールフッ素誘導体{式(1
−4)}の19F−NMRスペクトル
FIG. 10 shows an imidazole fluorine derivative of the present invention {formula (1
-4)} 19 F-NMR spectrum

【図11】本発明のイミダゾールフッ素誘導体{式(1
−5)}の1H−NMRスペクトル
FIG. 11 shows an imidazole fluorine derivative of the present invention (formula (1
-5)} 1 H-NMR spectrum

【図12】本発明のイミダゾールフッ素誘導体{式(1
−5)}のIRスペクトル
FIG. 12 shows an imidazole fluorine derivative of the present invention (formula (1
-5)} IR spectrum

【図13】本発明のイミダゾールフッ素誘導体{式(1
−5)}の19F−NMRスペクトル
FIG. 13 shows an imidazole fluorine derivative of the present invention {formula (1
-5)} 19 F-NMR spectrum

【図14】本発明のイミダゾールフッ素誘導体{式(1
−6)}の1H−NMRスペクトル
FIG. 14 shows an imidazole fluorine derivative of the present invention (formula (1
-6)} 1 H-NMR spectrum

【図15】本発明のイミダゾールフッ素誘導体{式(1
−6)}のIRスペクトル
FIG. 15 shows an imidazole fluorine derivative of the present invention {formula (1
-6)} IR spectrum

【図16】本発明のイミダゾールフッ素誘導体{式(1
−6)}の19F−NMRスペクトル
FIG. 16 shows an imidazole fluorine derivative of the present invention (formula (1
-6)} 19 F-NMR spectrum

【図17】本発明のイミダゾールフッ素誘導体{式(1
−7)}の1H−NMRスペクトル
FIG. 17 shows an imidazole fluorine derivative of the present invention (formula (1
-7)} 1 H-NMR spectrum

【図18】本発明のイミダゾールフッ素誘導体{式(1
−7)}のIRスペクトル
FIG. 18 shows an imidazole fluorine derivative of the present invention {formula (1
-7)} IR spectrum

【図19】本発明のイミダゾールフッ素誘導体{式(1
−7)}の16F−NMRスペクトル
FIG. 19 shows an imidazole fluorine derivative of the present invention (formula (1
-7)} 16 F-NMR spectrum

【図20】本発明のイミダゾールフッ素誘導体{式(1
−8)}の1H−NMRスペクトル
FIG. 20 shows an imidazole fluorine derivative of the present invention {formula (1
-8)} 1 H-NMR spectrum

【図21】本発明のイミダゾールフッ素誘導体{式(1
−8)}のIRスペクトル
FIG. 21 shows an imidazole fluorine derivative of the present invention {formula (1
-8)} IR spectrum

【図22】本発明のイミダゾールフッ素誘導体{式(1
−8)}の16F−NMRスペクトル
FIG. 22 shows an imidazole fluorine derivative of the present invention (formula (1
-8)} 16 F-NMR spectrum

【図23】本発明のイミダゾールフッ素誘導体{式(1
−9)}の1H−NMRスペクトル
FIG. 23 shows an imidazole fluorine derivative of the present invention (formula (1
-9)} 1 H-NMR spectrum

【図24】本発明のイミダゾールフッ素誘導体{式(1
−9)}のIRスペクトル
FIG. 24 shows an imidazole fluorine derivative of the present invention (formula (1
-9)} IR spectrum

【図25】本発明のイミダゾールフッ素誘導体{式(1
−9)}の16F−NMRスペクトル
FIG. 25 shows an imidazole fluorine derivative of the present invention (formula (1
−9)} 16 F-NMR spectrum

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C09K 3/18 103 8318−4H 13/06 C23G 5/036 9271−4K // C07D 303/08 C08J 7/04 A C10M 133/46 9159−4H C10N 30:12 40:00 Z 8217−4H 40:18 50:02 (72)発明者 吉田 一雄 埼玉県戸田市新曽南三丁目17番35号 共石 製品技術研究所内 (72)発明者 荻野 幸男 埼玉県戸田市新曽南三丁目17番35号 日本 鉱業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location C09K 3/18 103 8318-4H 13/06 C23G 5/036 9271-4K // C07D 303/08 C08J 7/04 A C10M 133/46 9159-4H C10N 30:12 40:00 Z 8217-4H 40:18 50:02 (72) Inventor Kazuo Yoshida 3-17-35, Shinsōnan, Toda City, Saitama Prefecture Kyoseki products Inside the Technical Research Institute (72) Inventor Yukio Ogino 3-17-35, Shinsōnan, Toda City, Saitama Prefecture Japan Mining Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 下記一般式(1)で表わされる新規イミ
ダゾールフッ素誘導体。 【化1】 (式中、R1は水素、ビニル基又はポリエチレン基を示
し、R2は下記一般式(2)で表わされる基を、R3は水
素又は下記一般式(3)で表わされる基をそれぞれ示
し、下記一般式(2)中のR4は、フッ素又はトリフル
オロメチル基を示し、nは1〜15の整数である。) 【化2】
1. A novel imidazole fluorine derivative represented by the following general formula (1). [Chemical 1] (In the formula, R 1 represents hydrogen, a vinyl group or a polyethylene group, R 2 represents a group represented by the following general formula (2), and R 3 represents hydrogen or a group represented by the following general formula (3). , R 4 in the following general formula (2) represents a fluorine or trifluoromethyl group, and n is an integer of 1 to 15.)
【請求項2】 イミダゾール又は4−ビニルイミダゾー
ルと下記一般式(4)で表わされる1,2−エポキンプ
ロパン化合物とを反応させることを特徴とする請求項1
に記載のイミダゾールフッ素誘導体の製造方法。 【化3】 (式中、R2は下記一般式(2)で表わされる基を示
し、該一般式(2)中のR4はフッ素又はトリフルオロ
メチル基を示し、nは1〜15の整数である。) 【化4】
2. The imidazole or 4-vinylimidazole is reacted with a 1,2-epokinpropane compound represented by the following general formula (4).
The method for producing the imidazole fluorine derivative as described in 1. [Chemical 3] (In the formula, R 2 represents a group represented by the following general formula (2), R 4 in the general formula (2) represents a fluorine or trifluoromethyl group, and n is an integer of 1 to 15. ) [Chemical 4]
【請求項3】 請求項1に記載の一般式(1)で表わさ
れたイミダゾールフッ素誘導体の少なくとも一種を有効
成分とすることを特徴とする表面処理剤。
3. A surface treatment agent comprising at least one kind of the imidazole fluorine derivative represented by the general formula (1) according to claim 1 as an active ingredient.
JP8343593A 1992-09-22 1993-04-09 Novel fluorine derivative of imidazole, method for producing the same, and surface treating agent using the same Expired - Lifetime JP3171986B2 (en)

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