JP3169353U - 太陽電池及びその電極構造 - Google Patents
太陽電池及びその電極構造 Download PDFInfo
- Publication number
- JP3169353U JP3169353U JP2011002662U JP2011002662U JP3169353U JP 3169353 U JP3169353 U JP 3169353U JP 2011002662 U JP2011002662 U JP 2011002662U JP 2011002662 U JP2011002662 U JP 2011002662U JP 3169353 U JP3169353 U JP 3169353U
- Authority
- JP
- Japan
- Prior art keywords
- screen printing
- electrode
- solar cell
- bus bar
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007650 screen-printing Methods 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 56
- 239000004065 semiconductor Substances 0.000 claims description 15
- 230000035699 permeability Effects 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 3
- 239000010419 fine particle Substances 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000007639 printing Methods 0.000 abstract description 14
- 238000006243 chemical reaction Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 19
- 238000007711 solidification Methods 0.000 description 12
- 230000008023 solidification Effects 0.000 description 12
- 238000010248 power generation Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
10 基板
11 くし型電極
12 バスバー電極
30,40 スクリーン版
31,41 ペースト透過可能なエリア
Claims (12)
- 太陽電池の基板に設置される太陽電池の電極構造であって、
導電材質を含む材料によって間隔をおいて前記基板に設置されて形成される複数のバスバー電極と、
導電材質を含む材料によって間隔をおいて前記隣合うバスバー電極間を繋ぐように設置されるくし型電極を備え、
前記バスバー電極及び前記くし型電極は、二回のスクリーン印刷によって形成され、第一次スクリーン印刷は、前記くし型電極の下部を形成し、第二次スクリーン印刷は、前記くし型電極の上部及び前記バスバー電極を形成することを特徴とする太陽電池の電極構造。 - 前記第一次スクリーン印刷の材料成分と前記第二次スクリーン印刷の材料成分は異なることを特徴とする請求項1に記載の電極構造。
- 前記第二次スクリーン印刷材料の導電度は、前記第一次スクリーン印刷材料の導電度より高いことを特徴とする請求項2に記載の電極構造。
- 前記第一次スクリーン印刷材料の透過性は、前記第二次スクリーン印刷材料の透過性より高いことを特徴とする請求項2に記載の電極構造。
- 前記第一次スクリーン印刷の材料成分及び前記第二次スクリーン印刷の材料成分は、銀金属の微粒及びガラス粉を含むことを特徴とする請求項1に記載の電極構造。
- 基板と、
導電材質を含む材料によって間隔をおいて前記基板に設置されて形成される複数のバスバー電極と、
導電材質を含む材料によって間隔をおいて前記隣合うバスバー電極間を繋ぐように設置されるくし型電極を備え、
前記バスバー電極及び前記くし型電極は、二回のスクリーン印刷によって形成され、第一次スクリーン印刷は、前記くし型電極の下部を形成し、第二次スクリーン印刷は、前記くし型電極の上部及び前記バスバー電極を形成することを特徴とする太陽電池。 - 前記第一次スクリーン印刷の材料成分と前記第二次スクリーン印刷の材料成分は異なることを特徴とする請求項6に記載の太陽電池。
- 前記第二次スクリーン印刷材料の導電度は、前記第一次スクリーン印刷材料の導電度より高いことを特徴とする請求項7に記載の太陽電池。
- 前記第一次スクリーン印刷材料の透過性は、前記第二次スクリーン印刷材料の透過性より高いことを特徴とする請求項7に記載の太陽電池。
- 前記第一次スクリーン印刷の材料成分及び前記第二次スクリーン印刷の材料成分は、銀金属の微粒及びガラス粉を含むことを特徴とする請求項6に記載の太陽電池。
- 前記基板は、非結晶シリコン基板、単結晶シリコン基板、多結晶シリコン基板またはガリウム砒素基板であることを特徴とする請求項6に記載の太陽電池。
- 前記基板は、N型半導体基板またはP型半導体基板であることを特徴とする請求項6に記載の太陽電池。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099214419U TWM393802U (en) | 2010-07-28 | 2010-07-28 | Solar cell and electrode structure therefor |
TW099214419 | 2010-07-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3169353U true JP3169353U (ja) | 2011-07-28 |
Family
ID=44276655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011002662U Expired - Fee Related JP3169353U (ja) | 2010-07-28 | 2011-05-13 | 太陽電池及びその電極構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110174372A1 (ja) |
EP (1) | EP2413370A3 (ja) |
JP (1) | JP3169353U (ja) |
TW (1) | TWM393802U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015523707A (ja) * | 2012-04-18 | 2015-08-13 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | 太陽電池接点の印刷方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5903600B2 (ja) * | 2011-09-29 | 2016-04-13 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール及びこれの製造方法 |
CN103171260A (zh) * | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | 一种太阳能电池电极的配套网板及其印刷方法 |
TWI492397B (zh) * | 2012-11-13 | 2015-07-11 | 茂迪股份有限公司 | 太陽能電池與太陽能電池模組 |
CN103165693B (zh) * | 2013-02-18 | 2016-03-16 | 友达光电股份有限公司 | 太阳能模块 |
TWI565220B (zh) * | 2014-08-25 | 2017-01-01 | zhong-cheng Zhang | Method and device for improving power generation efficiency of solar cell |
JP1695074S (ja) | 2020-09-25 | 2021-09-21 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4004114B2 (ja) * | 1997-09-26 | 2007-11-07 | 三洋電機株式会社 | 太陽電池素子の製造方法及び太陽電池素子 |
JPH11186572A (ja) * | 1997-12-22 | 1999-07-09 | Canon Inc | 光起電力素子モジュール |
DE112004002853B4 (de) * | 2004-05-07 | 2010-08-26 | Mitsubishi Denki K.K. | Verfahren zum Herstellen einer Solarbatterie |
CN101656276A (zh) * | 2009-09-17 | 2010-02-24 | 中电电气(南京)光伏有限公司 | 一种利用套印方式制备晶体硅太阳能电池电极的方法 |
-
2010
- 2010-07-28 TW TW099214419U patent/TWM393802U/zh not_active IP Right Cessation
-
2011
- 2011-03-11 EP EP11157815.9A patent/EP2413370A3/en not_active Withdrawn
- 2011-03-25 US US13/072,675 patent/US20110174372A1/en not_active Abandoned
- 2011-05-13 JP JP2011002662U patent/JP3169353U/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015523707A (ja) * | 2012-04-18 | 2015-08-13 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | 太陽電池接点の印刷方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2413370A3 (en) | 2017-12-20 |
EP2413370A2 (en) | 2012-02-01 |
US20110174372A1 (en) | 2011-07-21 |
TWM393802U (en) | 2010-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3169353U (ja) | 太陽電池及びその電極構造 | |
JP3168227U (ja) | 太陽電池の電極構造 | |
Tobías et al. | Crystalline silicon solar cells and modules | |
CN102184973B (zh) | 太阳能电池片的正电极结构 | |
Kim et al. | Development of thin-film solar cells using solar spectrum splitting technique | |
CN108922938B (zh) | 一种背接触异质结太阳能电池及其制备方法 | |
CN102593248B (zh) | 一种基于等离子刻蚀技术的背面接触晶体硅太阳电池的制备方法 | |
JP7023974B2 (ja) | P型perc両面太陽電池及びそのモジュール、システムと製造方法 | |
CN102945866A (zh) | 一种n型太阳能电池片及其印刷方法和印刷丝网 | |
WO2019095662A1 (zh) | Mwt与hit结合的太阳能电池及其制备方法 | |
CN102738302A (zh) | 一种hit太阳能电池电极的形成方法 | |
US7927910B2 (en) | Manufacturing method of solar cell | |
CN102082209B (zh) | 一种丝网印刷技术印刷晶硅太阳电池细栅线方法 | |
CN101728459A (zh) | 一种晶体硅太阳能电池的制备方法 | |
Lin et al. | Progress and Perspectives of Solar Cells: A Critical Review | |
TWI475707B (zh) | 在太陽能電池表面形成金屬電極的方法 | |
CN110808314B (zh) | 一种改善异质结太阳电池光电性能的方法 | |
Govindarajan et al. | Fundamentals, basic components and performance evaluation of energy storage and conversion devices | |
CN101478009B (zh) | 一种背接触式太阳能电池及其制作方法 | |
CN107068799A (zh) | 一种光伏电站集成控制系统 | |
CN110416345A (zh) | 双层非晶硅本征层的异质结太阳能电池结构及其制备方法 | |
CN102522450A (zh) | 缺陷修复方法和系统 | |
CN208738284U (zh) | 一种太阳能电池的绕线层压装置 | |
Tripathi et al. | Solar energy from cells to grid | |
Matteocci et al. | Perovskite Solar Modules: Correlation Between Efficiency and Scalability |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R150 | Certificate of patent or registration of utility model |
Ref document number: 3169353 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140706 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |