JP3159606U - 刃物 - Google Patents
刃物 Download PDFInfo
- Publication number
- JP3159606U JP3159606U JP2010001445U JP2010001445U JP3159606U JP 3159606 U JP3159606 U JP 3159606U JP 2010001445 U JP2010001445 U JP 2010001445U JP 2010001445 U JP2010001445 U JP 2010001445U JP 3159606 U JP3159606 U JP 3159606U
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- blade
- diamond fine
- composite plating
- plating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims abstract description 122
- 239000010432 diamond Substances 0.000 claims abstract description 104
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 104
- 239000010419 fine particle Substances 0.000 claims abstract description 93
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 239000002245 particle Substances 0.000 claims abstract description 29
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims description 79
- 125000000524 functional group Chemical group 0.000 claims description 12
- 229920001477 hydrophilic polymer Polymers 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 4
- 239000002736 nonionic surfactant Substances 0.000 claims description 4
- 239000002563 ionic surfactant Substances 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 45
- 239000002105 nanoparticle Substances 0.000 abstract description 6
- 239000000243 solution Substances 0.000 description 54
- 238000000034 method Methods 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000006185 dispersion Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- -1 gold ions Chemical class 0.000 description 12
- 239000003999 initiator Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000003638 chemical reducing agent Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000004094 surface-active agent Substances 0.000 description 8
- 125000003277 amino group Chemical group 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 6
- 235000013305 food Nutrition 0.000 description 6
- 229910021645 metal ion Inorganic materials 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 125000000129 anionic group Chemical group 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 5
- 239000008139 complexing agent Substances 0.000 description 5
- 239000002023 wood Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005119 centrifugation Methods 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- 150000001409 amidines Chemical group 0.000 description 3
- 239000003125 aqueous solvent Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013611 frozen food Nutrition 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910001453 nickel ion Inorganic materials 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 3
- 238000009210 therapy by ultrasound Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000003021 water soluble solvent Substances 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 208000019300 CLIPPERS Diseases 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- LWMFAFLIWMPZSX-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene Chemical compound N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 LWMFAFLIWMPZSX-UHFFFAOYSA-N 0.000 description 2
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- PIIRYSWVJSPXMW-UHFFFAOYSA-N 1-octyl-4-(4-octylphenoxy)benzene Chemical compound C1=CC(CCCCCCCC)=CC=C1OC1=CC=C(CCCCCCCC)C=C1 PIIRYSWVJSPXMW-UHFFFAOYSA-N 0.000 description 1
- XMJBDTDLTXVBRA-UHFFFAOYSA-N 2-[(1-amino-1-benzylimino-2-methylpropan-2-yl)diazenyl]-n'-benzyl-2-methylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.C=1C=CC=CC=1CNC(=N)C(C)(C)N=NC(C)(C)C(=N)NCC1=CC=CC=C1 XMJBDTDLTXVBRA-UHFFFAOYSA-N 0.000 description 1
- MYECVPCGFLCGQX-UHFFFAOYSA-N 2-[(1-amino-2-methyl-1-phenyliminopropan-2-yl)diazenyl]-2-methyl-n'-phenylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.C=1C=CC=CC=1NC(=N)C(C)(C)N=NC(C)(C)C(=N)NC1=CC=CC=C1 MYECVPCGFLCGQX-UHFFFAOYSA-N 0.000 description 1
- JSXJQCUORJYVDN-UHFFFAOYSA-N 2-[(1-amino-2-methyl-1-prop-2-enyliminopropan-2-yl)diazenyl]-2-methyl-n'-prop-2-enylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.C=CCNC(=N)C(C)(C)N=NC(C)(C)C(=N)NCC=C JSXJQCUORJYVDN-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- QRGNGVOBMOHGED-UHFFFAOYSA-N 2-[2-[2-(5-hydroxy-1,4,5,6-tetrahydropyrimidin-2-yl)propan-2-yldiazenyl]propan-2-yl]-1,4,5,6-tetrahydropyrimidin-5-ol;dihydrochloride Chemical compound Cl.Cl.N=1CC(O)CNC=1C(C)(C)N=NC(C)(C)C1=NCC(O)CN1 QRGNGVOBMOHGED-UHFFFAOYSA-N 0.000 description 1
- FLKBKUFGKQPPRY-UHFFFAOYSA-N 2-[2-[2-[2-[1-(2-hydroxyethyl)-4,5-dihydroimidazol-2-yl]propan-2-yldiazenyl]propan-2-yl]-4,5-dihydroimidazol-1-yl]ethanol;dihydrochloride Chemical compound Cl.Cl.N=1CCN(CCO)C=1C(C)(C)N=NC(C)(C)C1=NCCN1CCO FLKBKUFGKQPPRY-UHFFFAOYSA-N 0.000 description 1
- DKESBEUCKHTHLQ-UHFFFAOYSA-N 2-[[1-amino-1-(2-hydroxyethylimino)-2-methylpropan-2-yl]diazenyl]-n'-(2-hydroxyethyl)-2-methylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.OCCNC(=N)C(C)(C)N=NC(C)(C)C(=N)NCCO DKESBEUCKHTHLQ-UHFFFAOYSA-N 0.000 description 1
- BMROYLZOZRHCAI-UHFFFAOYSA-N 2-[[1-amino-1-(4-chlorophenyl)imino-2-methylpropan-2-yl]diazenyl]-n'-(4-chlorophenyl)-2-methylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.C=1C=C(Cl)C=CC=1NC(=N)C(C)(C)N=NC(C)(C)C(=N)NC1=CC=C(Cl)C=C1 BMROYLZOZRHCAI-UHFFFAOYSA-N 0.000 description 1
- QRYPVXBEPZJBRR-UHFFFAOYSA-N 2-[[1-amino-1-(4-hydroxyphenyl)imino-2-methylpropan-2-yl]diazenyl]-n'-(4-hydroxyphenyl)-2-methylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.C=1C=C(O)C=CC=1NC(=N)C(C)(C)N=NC(C)(C)C(=N)NC1=CC=C(O)C=C1 QRYPVXBEPZJBRR-UHFFFAOYSA-N 0.000 description 1
- ZFSPZXXKYPTSTJ-UHFFFAOYSA-N 5-methyl-2-propan-2-yl-4,5-dihydro-1h-imidazole Chemical compound CC(C)C1=NCC(C)N1 ZFSPZXXKYPTSTJ-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000006845 Michael addition reaction Methods 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000005576 amination reaction Methods 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- NBXSIUSZCHNKCZ-UHFFFAOYSA-N bis[2-(1,4,5,6-tetrahydropyrimidin-2-yl)propan-2-yl]diazene;dihydrochloride Chemical compound Cl.Cl.N=1CCCNC=1C(C)(C)N=NC(C)(C)C1=NCCCN1 NBXSIUSZCHNKCZ-UHFFFAOYSA-N 0.000 description 1
- GSZJXKXRHCJVCI-UHFFFAOYSA-N bis[2-(4,5,6,7-tetrahydro-1h-1,3-diazepin-2-yl)propan-2-yl]diazene;dihydrochloride Chemical compound Cl.Cl.N=1CCCCNC=1C(C)(C)N=NC(C)(C)C1=NCCCCN1 GSZJXKXRHCJVCI-UHFFFAOYSA-N 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000007033 dehydrochlorination reaction Methods 0.000 description 1
- 239000000412 dendrimer Substances 0.000 description 1
- 229920000736 dendritic polymer Polymers 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-M dihydrogenphosphate Chemical compound OP(O)([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-M 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 235000021059 hard food Nutrition 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
Landscapes
- Knives (AREA)
- Surgical Instruments (AREA)
Abstract
Description
−(CH2CH2O)n−(nは約4以上、好ましくは約10以上の整数)
が挙げられる。また、PDMS残基としては、
−[Si(CH3)2−O]m−(mは約3以上、好ましくは40以上の整数)
が挙げられる(特開2006−219591号公報参照)。
<無電解複合めっき液の組成>
・硫酸ニッケル六水和物 25〜30g/リットル
・界面活性剤 0.5〜10g/リットル
・ダイヤモンド微粒子 0.5〜10g/リットル
・リンゴ酸(錯化剤) 10〜50g/リットル
・コハク酸(錯化剤) 10〜50g/リットル
・次亜リン酸ナトリウム(還元剤) 20〜50g/リットル
ダイヤモンド微粒子は、住石マテリアルズ株式会社製のSCMファインダイヤ(平均粒径;250nm)を用いた。また、ダイヤモンド微粒子の表面にアニオン性官能基を導入するマクロアゾ開始剤として、和光純薬工業株式会社製の「V−501(4,4’−azobis(4−cyanoantanoic acid))」(以下「V−501」という)を使用した。
<複合めっき液の組成>
・硫酸ニッケル六水和物 30g/リットル
・界面活性剤 5g/リットル
・酢酸ナトリウム 12g/リットル
・クエン酸ナトリウム 12g/リットル
・次亜リン酸ナトリウム 24g/リットル
・ダイヤモンド微粒子 2g/リットル
平均粒径が250nmのダイヤモンド微粒子を用いて実施例1と同様の方法でステンレス製の包丁の刃先部分に膜厚約7μmの複合めっき膜を形成し、刃付け処理を行って刃先尖端の刃先角度を26度に設定した。
包丁として市販のステンレス製包丁を3本用意し、2本の包丁にのみ平均粒径が50nmのダイヤモンド微粒子を用いて実施例1と同様の方法でステンレス製の包丁の刃先部分に膜厚15μmの複合めっき膜を形成し、刃付け処理を行って刃先尖端の刃先角度を26度に設定した。めっき処理していない包丁を包丁Aとし、めっき処理した包丁を包丁B1及びB2とする。
2 めっき膜
3 把持部
10 刃付け面
11 刃先尖端
Claims (4)
- 金属マトリックス中に平均粒径1nm〜1000nmのダイヤモンド微粒子を均一に分散した複合めっき膜が少なくとも刃先に形成されていることを特徴とする刃物。
- 前記複合めっき膜中の前記ダイヤモンド微粒子の含有率が0.1〜30容量%であることを特徴とする請求項1に記載の刃物。
- 前記複合めっき膜は、金属めっき液中に、親水性ポリマー又はイオン性官能基が導入された平均粒径1nm〜1000nmのダイヤモンド微粒子及びイオン性又は非イオン性の界面活性剤が均一に分散している複合めっき液を用いて無電解めっき処理により形成されていることを特徴とする請求項1又は2に記載の刃物。
- 前記金属は、ニッケル又はニッケル合金であることを特徴とする請求項1から3のいずれかに記載の刃物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010001445U JP3159606U (ja) | 2010-03-08 | 2010-03-08 | 刃物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010001445U JP3159606U (ja) | 2010-03-08 | 2010-03-08 | 刃物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3159606U true JP3159606U (ja) | 2010-05-27 |
Family
ID=54862861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010001445U Expired - Lifetime JP3159606U (ja) | 2010-03-08 | 2010-03-08 | 刃物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3159606U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017066437A (ja) * | 2015-09-28 | 2017-04-06 | 株式会社ダイセル | ナノダイヤモンド含有メッキ膜およびナノダイヤモンド含有メッキ物 |
JP6194437B2 (ja) * | 2015-06-22 | 2017-09-06 | 京セラ株式会社 | 刃物 |
-
2010
- 2010-03-08 JP JP2010001445U patent/JP3159606U/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6194437B2 (ja) * | 2015-06-22 | 2017-09-06 | 京セラ株式会社 | 刃物 |
JPWO2016208646A1 (ja) * | 2015-06-22 | 2017-09-14 | 京セラ株式会社 | 刃物 |
JP2017066437A (ja) * | 2015-09-28 | 2017-04-06 | 株式会社ダイセル | ナノダイヤモンド含有メッキ膜およびナノダイヤモンド含有メッキ物 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5435477B2 (ja) | ダイヤモンド微粒子を分散させた複合めっき液及びその製造方法 | |
JP5614538B2 (ja) | 複合めっき被膜の形成方法 | |
JP6076138B2 (ja) | カーボンブラックと金属との複合体 | |
JP5674655B2 (ja) | 基材上に金属を電着する方法 | |
Afroukhteh et al. | Corrosion behavior of Ni–P/nano-TiC composite coating prepared in electroless baths containing different types of surfactant | |
Góral et al. | Influence of current density on microstructure and properties of electrodeposited nickel-alumina composite coatings | |
TWI271444B (en) | Polytetrafluoroethylene dispersion for electroless nickel plating applications | |
Nwosu et al. | On the influence of surfactant incorporation during electroless nickel plating | |
JP2016503452A (ja) | 電気伝導性の基材をコーティングする方法および関連する電着可能組成物 | |
JP3159606U (ja) | 刃物 | |
KR20000053456A (ko) | 무전해 복합 도금액 및 무전해 복합 도금방법 | |
Abdel Hamid et al. | Performance of Ni–Cu–ZrO2 nanocomposite coatings fabricated by electrodeposition technique | |
Wang et al. | Electrochemical preparation and characterization of nickel/ultra-dispersed PTFE composite films from aqueous solution | |
TW201249602A (en) | Electrodeposition liquid for fixed-abrasive saw wire | |
EP3098334A1 (en) | Electrolytic process for coating metal surfaces to provide high wear resistance | |
JP6332986B2 (ja) | ナノカーボン繊維被覆ダイヤモンド粒子の製造方法 | |
Li et al. | Effect of bath temperature on nanocrystalline Ni-polytetrafluoroethylene composite coatings prepared by brush electroplating | |
JP5877003B2 (ja) | 無電解複合めっき液用分散剤 | |
JP2020180326A (ja) | 共析めっき液 | |
CN103966579A (zh) | 金属表面制备纳米金刚石复合镍磷镀层的工艺 | |
JP2020117797A (ja) | 共析めっき液 | |
JP2022091384A (ja) | 共析めっき液 | |
JP2019090063A (ja) | 複合めっき用めっき液、複合めっき物、および複合めっき用ポリオレフィン樹脂水性分散体 | |
CN108754549A (zh) | 一种镀镍层应力调节剂及其应用 | |
JP6051423B2 (ja) | 亜鉛めっき浴添加剤、亜鉛めっき浴、亜鉛めっき皮膜形成方法、および、添加剤製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R150 | Certificate of patent or registration of utility model |
Ref document number: 3159606 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130428 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140428 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |