JP3139064B2 - Double-sided simultaneous polishing machine - Google Patents
Double-sided simultaneous polishing machineInfo
- Publication number
- JP3139064B2 JP3139064B2 JP03193826A JP19382691A JP3139064B2 JP 3139064 B2 JP3139064 B2 JP 3139064B2 JP 03193826 A JP03193826 A JP 03193826A JP 19382691 A JP19382691 A JP 19382691A JP 3139064 B2 JP3139064 B2 JP 3139064B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- polished
- storage hole
- rectangular
- sun gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、矩形の薄いガラスまた
はこれと同様な被研磨物の両面を同時に平面状に研磨す
る場合に好適なキャリヤを用いる両面同時平面研磨機に
関するものである。BACKGROUND OF THE INVENTION This invention relates <br/> the double-sided simultaneous surface grinding machine using a suitable carrier in case of polishing both surfaces of a rectangular thin glass or similar as workpiece simultaneously in a plane Things.
【0002】[0002]
【従来の技術】従来、この種の両面同時平面研磨機は、
図4のA、Bに示す様に、同軸配置された太陽歯車
(1)及びこの太陽歯車(1)を取り囲む内歯車(2)
と、被研磨物(3)を収納保持する矩形収納孔(4)を
有して前記太陽歯車(1)と内歯車(2)とに噛合し、
該太陽歯車(1)の周りを公転しながら自転するキャリ
ヤ(5)と、このキャリヤ(5)を挾んで上下に対向し
その対向面には研磨表面が設けられかつそれぞれ回転駆
動される上定盤(6)及び下定盤(7)とを備えてい
る。2. Description of the Related Art Conventionally, this kind of double-sided simultaneous plane polishing machine has
As shown in FIGS. 4A and 4B, a sun gear (1) coaxially arranged and an internal gear (2) surrounding the sun gear (1).
Having a rectangular storage hole (4) for storing and holding the object to be polished (3), meshing with the sun gear (1) and the internal gear (2),
A carrier (5) which rotates while revolving around the sun gear (1), and a polishing surface which is vertically opposed to the carrier (5) and has a polished surface provided on its facing surface, and each of which is rotationally driven; A board (6) and a lower stool (7) are provided.
【0003】また、従来のキャリヤ(5)は、図4のC
に示す様に、矩形収納孔(4)の外周に近い1辺の垂直
2等分線がキャリヤ(5)の中心を通るように形成され
ており、かつ、研磨時、キャリヤ(5)の矩形収納孔
(4)を上下定盤(6)(7)の内外周から食み出さな
いように矩形収納孔(4)の形成位置を設定していた。[0003] Further, the conventional carrier (5) has a structure shown in FIG.
As shown in, one side of the vertical close to the outer periphery of the rectangular housing holes (4)
A bisector is formed so as to pass through the center of the carrier (5), and the rectangular storage holes (4) of the carrier (5) are formed from the inner and outer peripheries of the upper and lower platens (6) and (7) during polishing. The formation position of the rectangular storage hole (4) is set so as not to protrude.
【0004】[0004]
【発明が解決しようとする課題】上記した両面同時平面
研磨機において、例えば、厚さ0.2 〜0.5mm でたて、よ
こが100 ×100mm くらいの薄いガラスを研磨するには、
スエーデン鋼などの板材に矩形収納孔(4)をあけたキ
ャリヤ(5)を用いてラップ研磨を行うと、鋳鉄製の上
下定盤(6)(7)に偏摩耗が生じ、ガラスの研磨面の
平行度が悪くなる。それを解消するため、鋳鉄製の修正
キャリヤ(図示省略)で上下定盤(6)(7)の研磨表
面の平行度を頻繁に修正する必要があり、研磨作業能率
が著しく低下する欠点があった。In the above-described simultaneous double-sided polishing machine, for example, in order to polish a thin glass having a thickness of 0.2 to 0.5 mm and a width of about 100 × 100 mm,
When lap polishing is performed using a carrier (5) having a rectangular storage hole (4) formed in a plate material such as Swedish steel, uneven wear occurs on the upper and lower platens (6) and (7) made of cast iron, and the polished surface of the glass is formed. Becomes less parallel. In order to solve this, it is necessary to frequently correct the parallelism of the polished surfaces of the upper and lower stools (6) and (7) with a correction carrier (not shown) made of cast iron, which has a drawback that the polishing work efficiency is significantly reduced. Was.
【0005】そこで、本発明者は、上記修正キャリヤに
よる修正作業を少なくするため、上下定盤(6)(7)
の外径を小さくし、定盤(6)(7)の内孔の径を大き
くし、上下定盤(6)(7)の内外周から被研磨物
(3)の一部を大きく食み出させて研磨することによ
り、上下定盤(6)(7)を内周縁から外周縁まで均一
に、摩耗させて偏摩耗を防止することを試行したが、次
のような不具合があった。The inventor of the present invention has proposed an upper and lower platen (6) (7) in order to reduce the number of correction operations by the correction carrier.
The outer diameter of the platen is reduced, the diameter of the inner hole of the platens (6) and (7) is increased, and a part of the workpiece (3) is largely eroded from the inner and outer circumferences of the upper and lower platens (6) and (7). Attempts were made to wear the upper and lower stools (6) and (7) uniformly from the inner peripheral edge to the outer peripheral edge to prevent uneven wear by taking out and polishing, but there were the following problems.
【0006】即ち、上下定盤(6)(7)の内外周から
被研磨物(3)を食み出させる量が大き過ぎる場合、研
磨中に、キャリヤ(5)の外周に近い矩形収納孔(4)
の一辺が、上下定盤(6)(7)の外側に完全に食み出
し、この食み出した辺が、キャリヤ(5)の公転と自転
とによって上下定盤(6)(7)の内側へ再進入する際
に、上下定盤(6)(7)の外周に上記辺の一部が引っ
かかり、キャリヤ(5)自体がしばしば亀裂破損した。
この傾向は、被研磨物(3)が薄くなる程、顕著であ
る。尚、円形の被研磨物の場合には、このような問題は
ない。In other words, if the amount of the object to be polished (3) protruding from the inner and outer peripheries of the upper and lower platens (6) and (7) is too large, a rectangular storage hole close to the outer perimeter of the carrier (5) during polishing. (4)
Of the upper and lower platens (6) and (7) completely protrudes outside the upper and lower platens (6) and (7). when re-advances enter into the inside, a part of the edge on the outer periphery of the upper and lower surface plates (6) (7) is caught, the carrier (5) itself is often crack failure.
This tendency is more remarkable as the object to be polished (3) becomes thinner. In the case of a circular object to be polished, there is no such problem.
【0007】本発明は従来の両面同時平面研磨機用キャ
リヤの上記欠点に鑑みて研究開発されたもので、その目
的とするところは、修正キャリヤによる上下定盤の修正
作業を減少させると共にキャリヤの亀裂破損を防止し得
る両面同時平面研磨機を提供しようとするものである。The present invention has been developed in view of the above-mentioned drawbacks of the conventional carrier for a simultaneous double-sided surface polishing machine, and has as its object to reduce the work of repairing the upper and lower platens by the repair carrier, and to reduce the work of the carrier. An object of the present invention is to provide a double-sided simultaneous plane polishing machine capable of preventing crack breakage.
【0008】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、同軸配置された太陽歯車及び該太陽歯車
を取り囲む内歯車と、被研磨物を収納保持する矩形収納
孔を有して前記太陽歯車と内歯車とに噛合し、該太陽歯
車の周囲を公転しながら自転するキャリヤと、該キャリ
ヤを挟んで上下に対向しその対向面にはそれぞれ前記被
研磨物の表裏面を研磨する研磨表面が設けられかつそれ
ぞれ回転駆動される上定盤および下定盤とを備え、キャ
リヤの矩形収納孔の一部を上下定盤から食み出させて研
磨する両面同時平面研磨機において、キャリヤに形成さ
れる矩形収納孔のキャリヤ外周に近い一辺の垂直2等分
線がキャリヤ中心を通らない位置にあり、かつ、前記キ
ャリヤの上下定盤から一部食み出す矩形収納孔のキャリ
ヤ外周に近い一辺が上下定盤から完全には食み出さずそ
の一部が上下定盤内に残存する位置関係になるように前
記矩形収納孔を形成したキャリヤを用いるものである。In order to achieve the above object, the present invention comprises a sun gear coaxially arranged, an internal gear surrounding the sun gear, and a rectangular housing hole for housing and holding a workpiece. A carrier that meshes with the sun gear and the internal gear, revolves around the sun gear while revolving around the sun gear, and faces the upper and lower surfaces of the carrier with the carrier interposed therebetween. An upper surface plate and a lower surface plate each provided with a polishing surface and respectively driven to rotate, and a double-sided simultaneous plane polishing machine for polishing a portion of a rectangular storage hole of the carrier by protruding from the upper and lower surface plates, and polishing the carrier. A vertical bisector of one side close to the outer periphery of the carrier of the formed rectangular storage hole is located at a position not passing through the center of the carrier, and close to the outer periphery of the carrier of the rectangular storage hole partially protruding from the upper and lower platens of the carrier. One side Is to use a carrier part not protrude completely from the lower platen was formed the rectangular receiving hole so that the positional relationship remaining in the upper and lower surface plates.
【0009】[0009]
【作用】本発明におけるキャリヤの矩形収納孔は、外周
に近い一辺の垂直2等分線がキャリヤ中心を通らない位
置にあり、かつ、前記キャリヤの上下定盤から一部食み
出す矩形収納孔のキャリヤ外周に近い一辺が上下定盤か
ら完全には食み出さずその一部が上下定盤内に残存する
位置関係になるように前記矩形収納孔をキャリヤに形成
したから、被研磨物が薄い矩形ガラス等であっても、キ
ャリヤの矩形収納孔の一辺が上下定盤の外周から完全に
は食み出さないため、上下定盤に引っかからず、破損し
ない。しかし、矩形収納孔の一部は上下定盤より食み出
させて研磨させることができるため、上下定盤の偏摩耗
が防止され修正キャリヤによる上下定盤の修正作業を減
少させ得る。[Action] rectangular receiving hole of the carrier in the present invention is at a position one side of the vertical bisector close to the outer periphery does not pass the carrier center, and run off a portion from the upper and lower platens before Symbol carrier
Side close to the carrier the outer periphery of the rectangular housing hole part of its not protrude completely from the upper and lower surface plates were formed before Symbol rectangular receiving hole so that the positional relationship remaining in the upper and lower surface plates to the carrier issuing Therefore, even if the object to be polished is thin rectangular glass or the like, one side of the rectangular storage hole of the carrier does not completely protrude from the outer periphery of the upper and lower platens, so that the upper and lower platens are not caught and do not break. However, since a part of the rectangular storage hole can be polished by protruding from the upper and lower platens, uneven wear of the upper and lower platens can be prevented, and the repair work of the upper and lower platens by the correction carrier can be reduced.
【0010】[0010]
【実施例】図1のA、B、Cは本発明に用いるキャリヤ
(5)の3通りの実施例を示す平面図であって、矩形収
納孔(4)が5等分配置で形成してあり、各矩形収納孔
(4)の外周に近い一辺(4a)の垂直2等分線(a)
をキャリヤ(5)の中心を通る直線(b)から夫々
(e)(f)(g)だけ平行移動させてずらせて形成し
ている。これに伴って、各矩形収納孔(4)のキャリヤ
中心に近い一辺(4b)までのキャリヤ中心からの距離
(h)(i)(j)も、前記ずれ量(e)(f)(g)
が大きい程、キャリヤ(5)の中心に接近させて形成し
ている。この場合、各矩形収納孔(4)間の最接近距離
及びキャリヤ(5)の外周縁までの最接近距離を、キャ
リヤ(5)に要求される強度を維持する範囲で小さく設
定する。1A, 1B, and 1C are plan views showing three embodiments of a carrier (5) used in the present invention, in which rectangular receiving holes (4) are formed in five equal parts. A vertical bisector (a) of one side (4a) near the outer periphery of each rectangular storage hole (4)
Are shifted from the straight line (b) passing through the center of the carrier (5) by parallel movements (e), (f), and (g), respectively. Along with this, the distances (h), (i), and (j) from the carrier center to one side (4b) near the carrier center of each rectangular storage hole (4) also vary with the shift amounts (e), (f), and (g). )
The larger the is, the closer it is to the center of the carrier (5). In this case, the closest distance between the rectangular storage holes (4) and the closest distance to the outer peripheral edge of the carrier (5) are set to be small as long as the strength required for the carrier (5) is maintained.
【0011】さらに、図2に示す様に、上記キャリヤ
(5)の上下定盤から一部食み出す矩形収納孔(4)の
キャリヤ(5)の外周に近い一辺(4a)が上下定盤
(6)(7)から完全には食み出さずその一部が上下定
盤(6)(7)内に残存する位置関係になるように矩形
収納孔(4)をキャリヤ(5)に形成する。Further, as shown in FIG. 2, one side (4a) near the outer periphery of the carrier (5) of the rectangular storage hole (4) which partially protrudes from the upper and lower platens of the carrier (5 ) is formed by the upper and lower platens. (6) partially polishing plates full protrude is not its from (7) (6) (7) rectangle accommodating hole so that the positional relationship remaining in the (4) the carrier (5) Formed.
【0012】[0012]
また、別の表現をすると、上下定盤(6)In other words, the upper and lower surface plate (6)
(7)の外径は、図3に示す様に、矩形収納孔(4)のThe outer diameter of (7) is, as shown in FIG.
キャリヤ外周に近い一辺が上下定盤(6)(7)の接線One side near the outer periphery of the carrier is the tangent to the upper and lower platens (6) and (7)
と平行になる位置で、その接線と、前記一辺の距離And the distance between the tangent and the side
(L)をできるだけ小さく設定する。(L) is set as small as possible.
【0013】次に、たて、よこ、厚さが、105 ×105 ×
0.5mm の硼珪酸ガラスのラップ研磨に適用した実施例を
説明する。Next, the vertical, horizontal, thickness is 105 × 105 ×
An embodiment applied to lapped polishing of 0.5 mm borosilicate glass will be described.
【0014】この場合、使用した研磨機及びキャリヤの
寸法諸元と研磨条件等は下記の通りである。In this case, the dimensions and polishing conditions of the used polishing machine and carrier are as follows.
【0015】上下定盤(6)(7)の寸法:外径1060m
m、内孔径354mm キャリヤ(5)の外径:PCD=402.17mm 単位面積当り荷重:120g/cm2 使用研磨剤:#1200 下定盤回転数:60rpm 但し、キャリヤ(5)は、図1のA、B、Cの3通りの
キャリヤ(5)を製作し、e=20.5mm 、f=26.5mm、g=3
3.5mm、h=69mm、i=67mm、j=62mmとしたものである。そ
して、このキャリヤ(5)を使用して前記した被研磨物
の平行度が0.008mm 以下に保持できる研磨時間を、図4
のCに示した従来のキャリヤを使用した場合と比較した
結果を下記に示す。The dimensions of the upper and lower platens (6) and (7): outer diameter 1060m
m, the outer diameter of the inner hole diameter 354mm carrier (5): PCD = 402.17mm per unit area load: 120 g / cm @ 2 using abrasives: # 1200 under plate rotation: 60 rpm, however, the carrier (5) is, in FIG. 1 A , B and C were prepared, e = 20.5mm, f = 26.5mm, g = 3
3.5 mm, h = 69 mm, i = 67 mm, and j = 62 mm. Then, the polishing time can hold parallelism below 0.008mm in polishing object described above by using this carrier (5), 4
The result of comparison with the case where the conventional carrier shown in FIG.
【0016】 従来のキャリヤ 24分 図1のAのキャリヤ 120分 図1のBのキャリヤ 240分以上 図1のCのキャリヤ 180分 上記比較結果より明らかな通り、本発明に用いるキャリ
ヤ(5)によれば、図1のBのキャリヤ(5)が最良で
あり、図1のCおよびAのキャリヤ(5)でも従来の場
合よりも長時間に亘って連続研磨することができる。Conventional carrier: 24 minutes Carrier of FIG. 1A: 120 minutes Carrier of FIG. 1B: 240 minutes or more Carrier of FIG. 1C: 180 minutes As is clear from the above comparison results, the carrier used in the present invention. According to the carrier (5), the carrier (5) of FIG. 1B is the best, and the carriers (5) of FIGS. 1C and 1A can be continuously polished for a longer time than the conventional case. .
【0017】尚、上記実施例のe〜jの各数値を適用し
た場合、図3に示す距離(L)は、2mm 以内であるよう
に構成する。When the numerical values e to j of the above embodiment are applied, the distance (L) shown in FIG. 3 is configured to be within 2 mm.
【0018】本発明に用いるキャリヤ(5)は以上の構
成からなり、その厚さは、被研磨物よりも薄く形成さ
れ、かつ、矩形収納孔(4)の形成数は、1個の場合で
も本発明を適用することによって同様な作用効果が得ら
れる。The carrier (5) used in the present invention has the above-mentioned structure, is formed to be thinner than the object to be polished, and has only one rectangular storage hole (4). Similar effects can be obtained by applying the present invention.
【0019】[0019]
【発明の効果】本発明によれば、修正キャリヤによる上
下定盤の修正作業を減少させて長時間連続して研磨する
ことができ、研磨作業能率を著しく向上させることがで
きると共に、薄い矩形の被研磨物に対してもキャリヤの
亀裂破損を防止することができる。 I to the present invention lever, reduce the correction operation of the upper and lower surface plates by modifying the carrier can be polished for a long time continuously, with the polishing operation efficiency can be remarkably improved, thin rectangular It is also possible to prevent the carrier from being cracked and broken even for the object to be polished.
【図1】Aは本発明に用いるキャリヤの第1実施例の平
面図 Bは本発明に用いるキャリヤの第2実施例の平面図 Cは本発明に用いるキャリヤの第2実施例の平面図[1] A plan view of a second embodiment of the carrier used in the plan view B of the first embodiment of the carrier used in the present invention is a plan view C of the second embodiment of the carrier used in the present invention present invention
【図2】本発明に用いるキャリヤと定盤の関係を示す平
面図FIG. 2 is a plan view showing a relationship between a carrier and a surface plate used in the present invention.
【図3】本発明における定盤外周とキャリヤの矩形収納
孔の外周に近い一辺の位置関係を示す平面図FIG. 3 is a plan view showing the positional relationship between the outer periphery of the base plate and one side close to the outer periphery of the rectangular storage hole of the carrier in the present invention
【図4】Aは従来の両面同時平面研磨機の概略構造を示
す平面図 Bはその縦断側面図 Cは従来のキャリヤの平面図FIG. 4A is a plan view showing a schematic structure of a conventional double-sided simultaneous surface polishing machine. FIG. 4B is a longitudinal side view. C is a plan view of a conventional carrier.
1 太陽歯車 2 内歯車 3 被研磨物 4 矩形収納孔 5 キャリヤ DESCRIPTION OF SYMBOLS 1 Sun gear 2 Internal gear 3 Object to be polished 4 Rectangular storage hole 5 Carrier
フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B24B 37/04 Continuation of front page (58) Field surveyed (Int. Cl. 7 , DB name) B24B 37/04
Claims (1)
を取り囲む内歯車と、被研磨物を収納保持する矩形収納
孔を有して前記太陽歯車と内歯車とに噛合し、該太陽歯
車の周囲を公転しながら自転するキャリヤと、該キャリ
ヤを挟んで上下に対向しその対向面にはそれぞれ前記被
研磨物の表裏面を研磨する研磨表面が設けられかつそれ
ぞれ回転駆動される上定盤および下定盤とを備え、キャ
リヤの矩形収納孔の一部を上下定盤から食み出させて研
磨する両面同時平面研磨機において、 キャリヤに形成される矩形収納孔のキャリヤ外周に近い
一辺の垂直2等分線がキャリヤ中心を通らない位置にあ
り、かつ、前記キャリヤの上下定盤から一部食み出す矩
形収納孔のキャリヤ外周に近い一辺が上下定盤から完全
には食み出さずその一部が上下定盤内に残存する位置関
係になるように前記矩形収納孔を形成したキャリヤを用
いることを特徴とする両面同時平面研磨機。 1. A sun gear coaxially arranged, an internal gear surrounding the sun gear, and a rectangular storage hole for storing and holding an object to be polished, meshing with the sun gear and the internal gear, and A carrier that revolves around its periphery while revolving around, and an upper surface plate that is provided with a polishing surface that vertically opposes the carrier and polishes the front and back surfaces of the object to be polished, and is respectively driven to rotate. A lower surface plate, wherein a part of the rectangular storage hole of the carrier is protruded from the upper and lower surface plates and polished. One side close to the outer periphery of the carrier of the rectangular storage hole, which is located at a position where the equal line does not pass through the center of the carrier and partially protrudes from the upper and lower stool of the carrier, does not completely protrude from the upper and lower stool. The part is upper and lower surface plate Use a carrier wherein the formation of the rectangular receiving hole so that the positional relationship remaining
Double-sided simultaneous surface grinding machine, characterized in that there.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03193826A JP3139064B2 (en) | 1991-08-02 | 1991-08-02 | Double-sided simultaneous polishing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03193826A JP3139064B2 (en) | 1991-08-02 | 1991-08-02 | Double-sided simultaneous polishing machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0538671A JPH0538671A (en) | 1993-02-19 |
JP3139064B2 true JP3139064B2 (en) | 2001-02-26 |
Family
ID=16314394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03193826A Expired - Fee Related JP3139064B2 (en) | 1991-08-02 | 1991-08-02 | Double-sided simultaneous polishing machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3139064B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6435969B1 (en) | 1998-11-03 | 2002-08-20 | Nintendo Co., Ltd. | Portable game machine having image capture, manipulation and incorporation |
US7827488B2 (en) | 2000-11-27 | 2010-11-02 | Sitrick David H | Image tracking and substitution system and methodology for audio-visual presentations |
US7867086B2 (en) | 1992-05-22 | 2011-01-11 | Sitrick David H | Image integration with replaceable content |
US8821276B2 (en) | 1992-05-22 | 2014-09-02 | Bassilic Technologies Llc | Image integration, mapping and linking system and methodology |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07101441A (en) * | 1993-09-30 | 1995-04-18 | Tsuchida Kibutsu Kogyosho:Kk | Production of metallic double-container |
JP5381555B2 (en) * | 2009-09-25 | 2014-01-08 | 日本電気硝子株式会社 | Plate workpiece polishing apparatus and plate workpiece polishing method |
JP5785837B2 (en) * | 2010-09-27 | 2015-09-30 | Hoya株式会社 | Mask blank substrate manufacturing method, mask blank manufacturing method, transfer mask manufacturing method, reflective mask blank manufacturing method, and reflective mask manufacturing method |
-
1991
- 1991-08-02 JP JP03193826A patent/JP3139064B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7867086B2 (en) | 1992-05-22 | 2011-01-11 | Sitrick David H | Image integration with replaceable content |
US8317611B2 (en) | 1992-05-22 | 2012-11-27 | Bassilic Technologies Llc | Image integration, mapping and linking system and methodology |
US8758130B2 (en) | 1992-05-22 | 2014-06-24 | Bassilic Technologies Llc | Image integration, mapping and linking system and methodology |
US8764560B2 (en) | 1992-05-22 | 2014-07-01 | Bassilic Technologies Llc | Image integration with replaceable content |
US8795091B2 (en) | 1992-05-22 | 2014-08-05 | Bassilic Technologies Llc | Image integration, mapping and linking system and methodology |
US8821276B2 (en) | 1992-05-22 | 2014-09-02 | Bassilic Technologies Llc | Image integration, mapping and linking system and methodology |
US8905843B2 (en) | 1992-05-22 | 2014-12-09 | Bassilic Technologies Llc | Image integration, mapping and linking system and methodology |
US6435969B1 (en) | 1998-11-03 | 2002-08-20 | Nintendo Co., Ltd. | Portable game machine having image capture, manipulation and incorporation |
US7827488B2 (en) | 2000-11-27 | 2010-11-02 | Sitrick David H | Image tracking and substitution system and methodology for audio-visual presentations |
Also Published As
Publication number | Publication date |
---|---|
JPH0538671A (en) | 1993-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5060424A (en) | Surface grinding apparatus | |
JP2716653B2 (en) | Wafer polishing apparatus and polishing method | |
JP3933432B2 (en) | Glass substrate clamping jig, glass substrate processing method, and glass substrate | |
JPH07186022A (en) | Plate glass end surface polishing working method | |
JP3139064B2 (en) | Double-sided simultaneous polishing machine | |
JPH11254303A (en) | Lapping machine | |
US6554689B2 (en) | Work holding member for mechanical abrasion, abrading method, and abrading machine | |
JP2552306B2 (en) | Single side polishing machine | |
JP2000084834A (en) | Grinding carrier | |
JPH11233462A (en) | Both surfaces polishing method of semiconductor wafer | |
JPH07156061A (en) | Both side polishing attachment of base plate | |
JP2000198068A (en) | Sheet type polishing machine | |
JP2001030161A (en) | Carrier for polishing device | |
JP2000198064A (en) | Polishing machine carrier | |
JPH06179165A (en) | Surface plate for lapping work | |
JP2660925B2 (en) | Carrier for double side polishing machine | |
JP2000153458A (en) | Flush mounting method and device of grinding wheel surface plate in double-sided work machine | |
JPS5936367Y2 (en) | Double-sided polishing device | |
JPS6393561A (en) | Method of grinding one side by both-side grinding device | |
JPS6339764A (en) | Structure for carrier in lapping machine | |
JP2001328063A (en) | Grinding device and grinding method using it | |
JP2001138220A (en) | Plate glass grinding apparatus | |
JPS5859764A (en) | Lapping surface plate | |
JPH0425372A (en) | Double face polishing device | |
JP2004306236A (en) | Grinding wheel correcting device of vertical-type double-ended surface grinding machine |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |