JP3134600B2 - Transferring conductive film supplier and conductive film laminated ceramic green sheet supplier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive film feeder and a conductive film for transferring a conductive film or a conductive film-ceramic green sheet laminated sheet supported on a support. The present invention relates to a laminated ceramic green sheet supply, for example, a transfer conductive film supply and a transfer conductive film laminated ceramic green sheet supply used for forming an internal electrode or an electrode on a surface of a ceramic laminated electronic component or a ceramic multilayer substrate. .

[0002]

2. Description of the Related Art A ceramic laminated electronic component is formed using a sintered body in which a plurality of internal electrodes are separated by a ceramic layer. For this type of sintered body, a conductive paste is printed on a ceramic green sheet, a ceramic green sheet on which the conductive paste is printed is laminated, and a ceramic green sheet on which no conductive paste is printed is laminated on top and bottom as necessary. It is obtained by pressing the obtained laminate in the thickness direction and then firing. Alternatively, it has been manufactured by repeatedly forming a ceramic green sheet and printing a pattern of a conductive paste on a lamination stage to obtain the laminate, and sintering the obtained laminate.

In recent years, ceramic multilayer electronic components have been reduced in thickness and size. With the reduction in thickness and size, the thickness of the ceramic layer between the internal electrodes has also been reduced, and there is a demand for manufacturing a ceramic multilayer electronic component using thinner ceramic green sheets.

[0004] A ceramic green sheet having a thickness of 20 µm or more can be separated from a support made of a synthetic resin film or the like on which the ceramic green sheet is supported. However, when a thinner ceramic green sheet is formed in response to the above-mentioned demand, for example, in the case of a ceramic green sheet having a thickness of 8 μm or less, the strength of the ceramic green sheet itself becomes very small. Therefore, it has been very difficult to separate only the ceramic green sheet from the support and supply it to a process such as lamination.

Therefore, a ceramic green sheet is formed on a support film made of a synthetic resin, and a composite is prepared by printing a conductive paste on the ceramic green sheet. The composite is printed on the ceramic green sheet with the conductive paste. A method has been proposed in which a laminate is obtained by repeating the step of pressing the support film from the side where it is pressed and then peeling off the support film (JP-A-62-63413). In this method, it is not necessary to separate and handle only the ceramic green sheets from the support film, so that the laminate can be formed using ceramic green sheets having a smaller thickness.

In forming a ceramic laminate, a sheet supply band for supporting a ceramic green sheet on a first support film and an electrode material supply band for supporting a conductive paste on a second support film are prepared. Then, the sheet supply band is pressed on the support from the ceramic green sheet side, and then the first support film is peeled off, and the electrode material supply band is placed on the ceramic green sheet from which the first support film has been peeled off by the conductive paste. There has also been proposed a method of obtaining a laminate by repeating a process of transferring the conductive paste onto a ceramic green sheet by thermally transferring from the side and then peeling the second support film (Japanese Patent Application Laid-Open No. 63-32909). . Also in this method, since it is not necessary to separate and handle only the ceramic green sheets from the support film, the laminate can be formed using thinner ceramic green sheets.

As described above, in the case of a ceramic green sheet having a small thickness, it is possible to obtain a laminate by avoiding handling the ceramic green sheet alone and handling it while being supported by a support film or the like. However, in any of the lamination methods described above, the mechanical strength of a very thin ceramic green sheet having a thickness of 8 μm or less is extremely low. Therefore, when the force required to peel the conductive film made of the conductive paste or the ceramic green sheet formed by printing the conductive film from the support film (hereinafter, referred to as peeling force) is large, the conductive film or There was a problem that the ceramic green sheet was damaged.

Therefore, conventionally, in order to reduce the peeling force of the conductive film or the ceramic green sheet laminated with the conductive film from the finally peeled support film, a release agent layer is formed on the support film, and the release agent layer is formed. A conductive film and a ceramic green sheet were formed on the agent layer.

[0009]

SUMMARY OF THE INVENTION As described above, by providing a release agent layer on a support film, it is possible to reduce the peeling force when the conductive film or the conductive ceramic laminated green sheet is peeled from the support film. Can be. However, the smaller the peeling force is, the better.

For example, when an attempt is made to obtain a laminate in which the thickness between the internal electrodes, that is, the thickness of the ceramic green sheet to be prepared is 5 μm or less, the peeling force when the support film is finally peeled is reduced. It must be very small. However, if the peeling force is too small, the conductive film or the ceramic green sheet is displaced or partially peeled in the step of forming the conductive film on the support film or the step of forming the ceramic green sheet on the support film. Or you may. Therefore, the peeling force must be determined so as to have a certain peeling force in the process of forming the conductive film and the process of forming the ceramic green sheet, and to be easily peeled in the laminating process.

However, in the conventional configuration in which the release agent layer is simply provided on the support film, although it is possible to reduce the peeling force, it is very difficult to control such a peeling force to an optimum magnitude. Met.

It is an object of the present invention to provide a transfer material having a structure capable of easily peeling a conductive film or a ceramic green sheet laminated with a conductive film from a support and controlling the peeling force to an optimum magnitude. It is an object of the present invention to provide a conductive film supply member and a transfer conductive film laminated ceramic green sheet supply member.

[0013]

According to a first aspect of the present invention, there is provided a support and a plurality of pinholes formed on the support and having an opening area ratio of 1 to 70%. A transfer conductive film supply, comprising: a formed release agent layer; and a conductive film formed on a support surface on which the release agent layer is formed.

According to a second aspect of the present invention, there is provided a support having a plurality of pinholes formed on the support and having an opening area ratio of 1 to 70%. A transfer-conductive-layer-laminated ceramic green sheet supplier comprising: a mold agent layer; a conductive film formed on the surface of the support on which the release agent layer is formed; and a ceramic green sheet laminated on the conductive film. It is.

According to a third aspect of the present invention, there is provided a ceramic laminated body with a built-in conductive film, at least a part of which is a ceramic green sheet laminated with a conductive film transferred from the ceramic green sheet supply material according to the second aspect. It is a ceramic laminate with a built-in conductive film.

That is, each of the inventions according to claims 1 to 3 is characterized in that a large number of pinholes are formed in the release agent layer formed on the support so that the opening area ratio is 1 to 70%. In common, thereby achieving the above-mentioned task.

[0017]

According to the first aspect of the present invention, a large number of pinholes are provided so that the release agent layer interposed between the support and the conductive film achieves the opening area ratio of 1 to 70% as described above. Having. Accordingly, since the release agent does not act on the portion where the pinhole is formed, the opening area ratio is set to 1
By adjusting in the range of up to 70%, the magnitude of the peeling force can be adjusted to an optimum value.

Also, in the invention according to claim 2,
The release agent layer is formed between the conductive film laminated ceramic green sheet and the support, and the release agent layer is formed.
As in the case of the invention described in (1), a large number of pinholes are provided to realize an opening area ratio of 1 to 70%. Therefore, since the release agent does not act on the portion where the pinhole is formed, the peeling force between the support and the conductive film laminated ceramic green sheet is adjusted to an optimum value by adjusting the opening area ratio. be able to.

Further, according to the third aspect of the present invention, the conductive film laminated ceramic green sheet is transferred from the conductive film laminated ceramic green sheet supply body according to the second aspect to obtain a laminate. The peeling of the conductive film laminated ceramic green sheet from the support can be performed smoothly by forming a pinhole so that the opening area ratio has an optimum value.

That is, in the inventions according to the first to third aspects, the peeling force at the time of peeling the conductive film or the ceramic green sheet containing the conductive film from the support is increased by the opening of the pinhole provided in the release agent layer. By selecting the area ratio, it can be made sufficiently low, and in the step of forming and forming the conductive film and the ceramic green sheet, an optimum value can be obtained so that the peeling force does not become excessively small.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be clarified by describing embodiments of the present invention. FIG. 1 (a) and (b)
FIG. 2 is a perspective view and a partially cutaway sectional view for explaining functions of a support and a release agent layer in the present invention.

A release agent layer 2 is formed on a support 1. The release agent layer 2 is made of a material that performs a release effect on the conductive film and the ceramic green sheet, for example, a silicone resin or the like. A pinhole 3 is formed in the release agent layer 2. The pinhole 3 is a portion of the release agent layer 2 where no release agent is present, and therefore the lower support 1
Is exposed in the pinhole 3.

According to the present invention, in the release agent layer 2 in which a large number of pinholes 3 are formed as described above, the area in which the release agent layer 2 has a total opening area of the plurality of pinholes 3 is formed. The occupying ratio, that is, the opening area ratio is selected in the range of 1 to 70%.

As shown in FIG. 1B, it is assumed that a conductive film 4 is formed on the support 1 on which the release agent layer 2 is formed. In this case, the conductive film 4 is in close contact with the upper surface 1a of the support 1 with the release agent layer 2 interposed therebetween, but directly on the upper surface 1a of the support 1 in the portion where the pinhole 3 is formed. Is adhered to. Therefore, the peeling force of the conductive film 4 from the support 1 can be adjusted by adjusting the opening area ratio of the pinhole 3. However, the opening area ratio is changed depending on the surface properties of the support 1, the composition of the conductive film 4, the surface properties, and the like.
It is necessary to select in the range of%. In the present invention, the reason why the opening area ratio of the pinhole 3 is selected in the range of 1 to 70% is that if it is less than 1%, the effect of providing the pinhole 3 is not sufficient, that is, the peeling force is appropriately increased. This is because the opening area of the pinhole 3 is 70
%, The effect of the release agent cannot be sufficiently utilized, and the peeling force becomes too large.

Next, specific experimental examples will be described. Experiment 1 As a support, a polyethylene terephthalate (PET) film having a thickness of 50 μm was prepared. This PET
Using the film, conductive film suppliers of the following Examples 1 to 3 and Comparative Example 1 were prepared.

Example 1 As shown in FIG.
Alumina powder 12 having an average particle size of about 10 μm was uniformly adhered on the upper surface 11 a of the T film 11. When examined with a microscope, the area to which the alumina powder 12 was attached was PE
It was about 0.1% of the entire T film 21.

Next, as shown in FIG. 2B, an upper surface 11a of the PET film 11 is
A silicone resin was applied from the side to a thickness of 1 μm after drying to form a release agent layer 14 having a thickness of 1 μm. When the release agent layer 14 was examined with a microscope, the silicon resin was repelled at the portion where the alumina powder 12 was adhered, and as a result, the diameter of the release agent layer 14 was about 100 μm.
Was formed. The ratio of the total area of the pinholes 14a to the area of the upper surface 11a of the PET film 11, that is, the opening area ratio was about 10%.

The PET film 11 of Example 1 in which the PET film 11 was washed, the alumina powder 12 was removed, and the release agent layer 14 having a pinhole opening area ratio of 10% was formed.
(See FIG. 3).

Example 2 A PET film having a release agent layer of Example 2 was obtained in the same manner as in Example 1 except that the pinhole opening area ratio of the release agent layer was 30%. Was. Example 3 A PET film provided with a release agent layer having a pinhole opening area ratio of 50% was prepared in the same manner as in Example 1 except that the pinhole opening area ratio of the release agent layer was set to 50%. Obtained.

Comparative Example 1 The release agent used in Example 1 was applied on the upper surface 11a of the PET film 11 prepared in Example 1 by a reverse coater so that the thickness after drying became 1 μm. A release agent layer having no pinhole was formed, and a PET film of Comparative Example 1 was obtained.

Nickel was vapor-deposited from the upper surface 11a side of each of the PET films on which the release agent layers of Examples 1 to 3 and Comparative Example 1 were formed by electron beam vapor deposition to form a conductive film. The first embodiment will be described with reference to FIG. That is, in the PET film 11 of Example 1, Ni having a purity of 99.9% by weight or more was used from the upper surface 11a side, the degree of vacuum was 5 × 10 ⁻⁵⁰ Torr, the electron beam output was 10 kW,
When the distance between the crucible and the film 11 is 400 mm, N
i was deposited to form a conductive film 15. When the thickness of the formed conductive film 15 was measured, it was 1.5 μm.

In Examples 2 and 3 and Comparative Example 1, a conductive film made of nickel having a thickness of 1.5 μm was formed in the same manner as in Example 1. The peeling force of the conductive film formed as described above from each PET film was measured in the following manner.

Fix the PET film on the platen,
The conductive film was peeled off at an angle of 90 degrees with respect to the T film, and the tension at that time was measured to obtain the peeling force. The results are shown in Table 1 below.

[0034]

[Table 1]

As is clear from Table 1, in Examples 1 to 3, the pinhole opening area ratio in the release agent layer was 10%,
It can be seen that the peel force can be controlled by changing the values to 30% and 50%.

Experiment 2 Using the PET films with release agent layers prepared in Examples 1 to 3 and Comparative Example 1 prepared in Experiment 1, a conductive paste was screen-printed on the upper surface of the PET film to form a conductive film. The conductive paste used has an average particle size of about 1.0μ in the dry state.
m containing 50% by weight of a nickel powder and 50% by weight of a resin component.

The thickness of the formed conductive film after drying is about 4 μm.
m. PE of the conductive film formed as described above
The peeling force from the T film was measured by the 90 ° peeling method as in Experiment 1. The results are shown in Table 2 below.

[0038]

[Table 2]

As is clear from Table 2, in Examples 1 to 3 which fall within the scope of the present invention, even in the case of a conductive film formed by using a conductive paste, the peeling force from the PET film as the support was reduced. It can be seen that it can be controlled by adjusting the pinhole opening area ratio of the release agent layer.

Experiment 3 The PET films with a release agent layer of Comparative Example 1 and Examples 1 to 3 prepared in Experiment 1 were prepared, and the experiment 1 was performed from the upper surface 11a side.
Under the same conditions as above, Ni was deposited to form a conductive film having a thickness of 1.5 μm. Next, a first embodiment will be described with reference to the drawings. As shown in FIG. 4A, after a conductive film 15 made of Ni is formed, a photoresist is formed on both surfaces of the conductive film 15 in a predetermined pattern. Thus, the conductive film 15A having a desired pattern was formed by performing coating and then etching (see FIG. 4B).

Next, a ceramic slurry comprising a reduction-resistant ceramic powder mainly composed of BaTiO ₃ , an organic binder and a dispersant is coated on the conductive film 15A formed in a predetermined pattern, as shown in FIG. Thus, the ceramic green sheet 16 was formed. When the thickness of the formed ceramic green sheet 16 was measured, it was about 15 μm.

In Examples 2 and 3 and Comparative Example 1, the conductive films were similarly patterned by photolithography to form ceramic green sheets. The peeling force of the conductive film-laminated ceramic green sheet obtained as described above from the PET film was evaluated by measuring the 90 ° peeling force in the same manner as in Experiment 1. The results are shown in Table 3 below.
Shown in

[0043]

[Table 3]

As is clear from Table 3, in the ceramic green sheet laminated with the conductive film, the peeling force from the PET film was changed by changing the pinhole opening area ratio of the release agent layer to 10%, 30%, and 50%. It can be seen that it can be adjusted.

Experiment 4 The conductive film laminated ceramic green sheet supply zones of Examples 1 to 3 and Comparative Example 1 in which the conductive film laminated ceramic green sheets prepared in Experiment 3 were supported on a PET film were prepared.

Using the ceramic slurry prepared in Experiment 3, a green sheet having a thickness of about 100 μm and not containing a conductive film was formed. Next, the green sheet was cut into a rectangular shape having a predetermined size to obtain a rectangular ceramic green sheet 21 shown in FIG. Green sheet 21
The conductive film-laminated ceramic green sheet support of Example 1 was thermocompression-bonded together with the PET film 11 from the ceramic green sheet 16 side, and then the PET film 11 was peeled off to obtain a laminate. The mold is not shown). Thereafter, a new conductive film-laminated ceramic green sheet support is thermocompression-bonded onto the laminate obtained as described above so as to constitute a capacitor, that is, a laminated capacitor, and the PET film is peeled off. By repeating this step, a predetermined number of ceramic green sheets each having a conductive film were laminated.

Further, the rectangular ceramic green sheet having no built-in conductive film was pressed on the laminate to obtain a laminate. The obtained multilayer body was cut in the thickness direction so as to obtain individual multilayer capacitors, fired under predetermined conditions, and internal electrodes were formed to obtain multilayer capacitors. FIG. 7 shows the obtained multilayer capacitor.

In FIG. 7, reference numeral 31 denotes a multilayer capacitor. The multilayer capacitor 31 has a sintered body 32 obtained by firing the above-mentioned multilayer body. A plurality of internal electrodes 33 are formed in the sintered body 32. The plurality of internal electrodes 33 are completed as internal electrodes by baking the above-described conductive film 14 during sintering of the sintered body 32. Reference numerals 34 and 35 denote external electrodes.

Using the conductive film-laminated ceramic green sheet supports prepared in Examples 2 and 3 and Comparative Example 1, the lamination was performed in the same manner as in the case of using the conductive film-laminated ceramic green sheet supply of Example 1. A capacitor was made. The obtained multilayer capacitors of Examples 1 to 3 and Comparative Example 1 were measured for capacitance, dielectric loss, insulation resistance and breakdown voltage. The results are shown in Table 4 below.

[0050]

[Table 4]

As is clear from Table 4, in the multilayer capacitors of Examples 1 to 3 and Comparative Example 1, there is no difference in the electrical characteristics, and the multilayer capacitors satisfy the theoretically determined values. I was assured.

In the above embodiment, the multilayer ceramic capacitor was manufactured by using the conductive green ceramic multilayer sheet support of the present invention. However, the present invention is not limited to the multilayer capacitor but also to a ceramic multilayer substrate and other ceramic multilayer electronic components. Can be generally used. Claim 1
The invention described in (1) can be used not only for ceramic laminated electronic components but also for transferring a conductive film onto a synthetic resin substrate.

[0053]

According to the first and second aspects of the present invention, the release agent layer has a pinhole so that the opening area ratio is 1 to 70%, and the release agent layer forms a conductive film or a conductive film. A film-laminated ceramic green sheet is separated from the support.
Therefore, by adjusting the opening area ratio of the pinhole in the range of 1 to 70%, the peeling force of the conductive film or the ceramic green sheet laminated with the conductive film from the support can be adjusted to an appropriate magnitude.

Similarly, according to the third aspect of the present invention, since a laminate is formed by transferring the conductive film laminated ceramic green sheet on which the release agent layer having the opening area ratio is formed, the ceramic green sheet is formed. Even when the thickness of the substrate is extremely thin, that is, 8 μm or less, the conductive film and the ceramic green sheet are less likely to be displaced or separated on the support, and can be smoothly separated from the support. Thus, a smaller ceramic laminated electronic component can be obtained.

[Brief description of the drawings]

FIGS. 1 (a) and 1 (b) are a perspective view and a partially cutaway sectional view, respectively, for explaining the operation of a support and a release agent layer formed on the support.

FIGS. 2A and 2B are partially cutaway sectional views showing a state in which alumina powder is adhered on a PET film and a state in which a release agent is applied as Example 1. FIG.

FIG. 3 is a partially cutaway sectional view showing a state after removing alumina powder in Example 1.

FIGS. 4A and 4B are partially cutaway sectional views showing a state in which a conductive film is formed and a state in which the conductive film is patterned in Example 1. FIGS.

FIG. 5 is a partially cutaway cross-sectional view showing a state in which a ceramic green sheet is laminated on a conductive film on a support in Example 1.

FIG. 6 is a partially cutaway cross-sectional view for explaining a step of laminating conductive film laminated ceramic green sheets in Experiment 3.

FIG. 7 is a sectional view showing the multilayer capacitor obtained in Experiment 3.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Support 2 ... Release agent layer 3 ... Pinhole 4 ... Conductive film 11 ... PET film as a support 14 ... Release agent layer 14a ... Pinhole 15, 15A ... Conductive film 16 ... Ceramic green sheet

Claims (3)

(57) [Claims] 1. A support, formed on the support, and having an opening area ratio of 1 to 1.
A transfer agent, comprising: a release agent layer having a large number of pinholes formed therein so as to be 70%; and a conductive film formed on a support surface on which the release agent layer is formed. Conductive film supplier. 2. A support, formed on the support, and having an opening area ratio of 1 to 2.
A release agent layer in which a number of pinholes are formed so as to be 70%, a conductive film formed on a support surface on which the release agent layer is formed, and a ceramic laminated on the conductive film A transfer conductive film laminated ceramic green sheet supplier comprising a green sheet. 3. A ceramic laminate with a built-in conductive film, wherein at least a part of the ceramic laminate is a conductive green ceramic sheet transferred from the conductive ceramic green sheet supplier according to claim 2.