JPH06349670A - Feeder of conducting film for transfer and feeder of conducting film laminated ceramic green sheet - Google Patents

Abstract

PURPOSE:To enable adjusting the peeling force from a retainer to be a suitable value, by arranging many pin holes having a specified aperture area ratio, in a release agent layer interposed between the retainer and a conducting film. CONSTITUTION:A release agent layer 2 is formed on a retainer 1. The release agent layer 2 is composed of material having releasing action for a conducting film and a ceramic green sheet, e.g., silicon resin or the like. Pin holes 3 are formed in the release agent layer 2. The pin poles 3 are the parts in the release agent layer where the release agent is not present, so that the upper surface 1a of the retainer 1 is exposed in the pin holes 3. The ratio occupied by the total aperture area of a plurality of the pin holes 3 to the region where the release agent layer 2 is formed, e.g. the aperture area ratio, is set to be in the range of 1-70%. A conducting film 4 is formed on the retainer 1 where the release agent layer 2 is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive film supplier for transfer and a conductive film for facilitating transfer of a conductive film or a conductive film-ceramic green sheet laminated sheet supported on a support. TECHNICAL FIELD The present invention relates to a laminated ceramic green sheet supply body, for example, to a transfer conductive film supply body and a transfer conductive film laminated ceramic green sheet supply body which are used to form an internal electrode or a surface electrode of a ceramic laminated electronic component or a ceramic multilayer substrate. .

[0002]

2. Description of the Related Art A ceramic laminated electronic component is constructed by using a sintered body in which a plurality of internal electrodes are separated by ceramic layers. In this type of sintered body, a conductive paste is printed on a ceramic green sheet, the ceramic green sheets printed with the conductive paste are laminated, and the ceramic green sheets on which the conductive paste is not printed are laminated on the upper and lower sides as necessary. Then, the obtained laminate is pressure-bonded in the thickness direction and then fired. Alternatively, it is manufactured by repeating the molding of the ceramic green sheet and the pattern printing of the conductive paste on the stacking stage to obtain the above stack, and sintering the obtained stack.

In recent years, ceramic laminated electronic components have been made thinner and smaller. Along with this thinning and miniaturization, the thickness of the ceramic layer between the internal electrodes is also thinning, and it is required to manufacture a ceramic laminated electronic component using a thinner ceramic green sheet.

A ceramic green sheet having a thickness of 20 μm or more can be independently peeled from a support made of a synthetic resin film or the like on which the ceramic green sheet is supported. However, in response to the above requirements, when a thinner ceramic green sheet is formed, for example, in the case of a ceramic green sheet having a thickness of 8 μm or less, the strength of the ceramic green sheet itself becomes extremely small. Therefore, it is very difficult to separately peel only the ceramic green sheet from the support and supply it to a process such as lamination.

Then, a ceramic green sheet is formed on a support film made of a synthetic resin, and a conductive paste is printed on the ceramic green sheet to prepare a composite, and the composite is printed on the ceramic green sheet with the conductive paste. A method has been proposed in which a laminate is obtained by repeating the steps of pressure-bonding from the side on which the support film is attached and then peeling off the support film (JP-A-62-63413). In this method, since it is not necessary to separate and handle only the ceramic green sheet from the support film, it is possible to form the laminate by using a thinner ceramic green sheet.

Further, in forming the ceramic laminate, a sheet supply band formed by supporting the ceramic green sheet on the first support film and an electrode material supply band formed by supporting the conductive paste on the second support film are prepared. Then, the sheet supply band is pressure-bonded onto the support from the ceramic green sheet side, and then the first support film is peeled off, and the electrode material supply band is electrically conductive paste on the peeled ceramic green sheet of the first support film. A method has also been proposed in which a laminate is obtained by repeating the step of transferring the conductive paste onto the ceramic green sheet by thermally transferring from the side and then peeling off the second supporting film (JP-A-63-32909). . Also in this method, since it is not necessary to separate only the ceramic green sheets from the support film and handle them individually, it is possible to form a laminate using thinner ceramic green sheets.

As described above, in the case of a thin ceramic green sheet, it is possible to obtain a laminate by avoiding the handling of the ceramic green sheet alone and handling it while being supported by a support film or the like. However, in any of the above-mentioned lamination methods, the mechanical strength of the sheet is extremely low in the case of a ceramic green sheet having a very thin thickness of 8 μm or less. Therefore, when the force required to peel the conductive film made of a conductive paste or the ceramic green sheet formed by printing the conductive film from the support film (hereinafter referred to as peeling force) is large, the conductive film or There was a problem that the ceramic green sheet was damaged.

Therefore, conventionally, in order to reduce the peeling force of the conductive film or the conductive film laminated ceramic green sheet from the support film that is finally peeled off, a release agent layer is formed on the support film, and the release agent layer is formed. A conductive film and a ceramic green sheet were formed on the agent layer.

[0009]

As described above, by providing the release agent layer on the support film, it is possible to reduce the peeling force when the conductive film or the conductive film laminated ceramic green sheet is peeled from the support film. You can However, the smaller the peeling force, the better.

For example, when a laminated body having a thickness between the internal electrodes, that is, a ceramic green sheet to be prepared having a thickness of 5 μm or less is to be obtained, the peeling force when finally peeling the support film is It is required to be very small. However, when the peeling force is too small, the conductive film or the ceramic green sheet is displaced or partially peeled in the step of forming the conductive film on the supporting film or the step of molding the ceramic green sheet on the supporting film. There is something to do. Therefore, the peeling force must be determined so that it has a certain peeling force in the conductive film forming step and the ceramic green sheet forming step and can be easily peeled in the laminating step.

However, in the conventional constitution in which the release agent layer is simply provided on the support film, the peeling force can be reduced, but it is very difficult to control such peeling force to an optimum size. Met.

An object of the present invention is to provide a transfer structure having a structure capable of easily peeling a conductive film or a laminated ceramic green sheet of a conductive film from a support and controlling the peeling force to an optimum level. An object is to provide a conductive film supply body and a conductive film laminated ceramic green sheet supply body for transfer.

[0013]

According to a first aspect of the present invention, there is provided a support and a large number of pinholes formed on the support and having an opening area ratio of 1 to 70%. A transfer conductive film supply body comprising a formed release agent layer and a conductive film formed on the surface of the support on which the release agent layer is formed.

Further, the invention according to claim 2 is a support and a spacer formed on the support and having a large number of pinholes so that the opening area ratio is 1 to 70%. Transferring conductive film laminated ceramic green sheet supply body including a mold agent layer, a conductive film formed on the surface of the support on which the release agent layer is formed, and a ceramic green sheet laminated on the conductive film Is.

According to a third aspect of the present invention, there is provided a conductive film-containing ceramic green sheet, wherein at least a part of the conductive film-containing ceramic green sheet is transferred from the conductive film-containing ceramic green sheet supplier. It is characterized in that it is a ceramic laminated body containing a conductive film.

That is, in each of the inventions described in claims 1 to 3, a large number of pinholes are formed so that the opening area ratio is 1 to 70% in the release agent layer formed on the support. In common, the above-mentioned problems are achieved thereby.

[0017]

In the invention described in claim 1, the release agent layer interposed between the support and the conductive film has a large number of pinholes so as to realize the opening area ratio of 1 to 70% as described above. Have. Therefore, since the release agent does not act on the portion where the pinhole is formed, the opening area ratio is set to 1
The magnitude of the peeling force can be adjusted to an optimum value by adjusting in the range of ˜70%.

Also, in the invention described in claim 2,
The release agent layer is formed between the conductive film laminated ceramic green sheet and the support, and the release agent layer is formed.
As in the case of the invention described in (1), it has a large number of pinholes so as to realize an opening area ratio of 1 to 70%. Therefore, since the release agent does not act in the portion where the pinhole is formed, the peeling force between the support and the conductive film laminated ceramic green sheet is set to an optimum value by adjusting the opening area ratio. be able to.

Further, in the invention described in claim 3, the conductive film laminated ceramic green sheet is transferred from the conductive film laminated ceramic green sheet supply body according to claim 2 to obtain a laminated body. In this case, The peeling of the conductive film laminated ceramic green sheet from the support can be smoothly performed by forming pinholes so that the opening area ratio becomes an optimum value.

That is, in the invention described in any one of claims 1 to 3, the peeling force when peeling the conductive film or the ceramic green sheet containing a conductive film from the support is the opening of the pinhole provided in the release agent layer. By selecting the area ratio, it can be made sufficiently low, and in the step of forming / molding the conductive film or the ceramic green sheet, it can be set to an optimum value so that the peeling force does not become excessively small.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be clarified by describing the embodiments of the present invention. 1 (a) and (b)
FIG. 4A is a perspective view and a partially cutaway sectional view for explaining the functions of a support and a release agent layer in the present invention.

A release agent layer 2 is formed on the support 1. The release agent layer 2 is made of a material that has a release action on the conductive film or the ceramic green sheet, such as a silicone resin. A pinhole 3 is formed in the release agent layer 2. The pinhole 3 is a portion of the release agent layer 2 where the release agent does not exist, and therefore, the lower support 1 is provided.
The upper surface 1a of the is exposed in the pinhole 3.

In the present invention, in the release agent layer 2 in which a large number of pinholes 3 are formed as described above, the area of the release agent layer 2 having the total opening area of the plurality of pinholes 3 is formed. The ratio, that is, the opening area ratio is selected in the range of 1 to 70%.

As shown in FIG. 1B, it is assumed that the conductive film 4 is formed on the support 1 having the release agent layer 2 formed thereon. In this case, the conductive film 4 is in close contact with the upper surface 1a of the support 1 with the release agent layer 2 interposed therebetween, but in the portion where the pinhole 3 is formed, the upper surface 1a of the support 1 is directly contacted. Is in close contact with. Therefore, the peeling force of the conductive film 4 from the support 1 can be adjusted by adjusting the opening area ratio of the pinhole 3. However, the opening area ratio is changed depending on the surface properties of the support 1, the composition of the conductive film 4, the surface properties, etc.
It is necessary to select in the range of%. In the present invention, the opening area ratio of the pinhole 3 is selected to be in the range of 1 to 70% because the effect of providing the pinhole 3 is not sufficient if it is less than 1%, that is, the peeling force is appropriately increased. This is because the opening area of the pinhole 3 is 70
If it exceeds%, the action of the release agent cannot be fully utilized and the peeling force becomes too large.

Next, a concrete experimental example will be described. Experiment 1 A polyethylene terephthalate (hereinafter referred to as PET) film having a thickness of 50 μm was prepared as a support. This PET
Using the film, conductive film supply bodies of the following Examples 1 to 3 and Comparative Example 1 were prepared.

EXAMPLE 1 As shown in FIG. 2A, PE
Alumina powder 12 having an average particle size of about 10 μm was uniformly adhered to the upper surface 11a of the T film 11. When examined with a microscope, the area where the alumina powder 12 is attached is PE.
It was about 0.1% of the entire T film 21.

Next, as shown in FIG. 2B, the reverse coater 13 is used and the upper surface 11a of the PET film 11 is formed.
A silicone resin was applied from the side so that the thickness after drying was 1 μm to form a release agent layer 14 having a thickness of 1 μm. When the release agent layer 14 is examined by a microscope, the silicone resin is repelled in the portion where the alumina powder 12 is attached, and as a result, the release agent layer 14 has a diameter of about 100 μm.
Of the pinholes 14a were formed. The ratio of the total area of the pinholes 14a to the area of the upper surface 11a of the PET film 11, that is, the opening area ratio was about 10%.

The PET film 11 of Example 1 in which the PET film 11 was washed to remove the alumina powder 12 and the release agent layer 14 having a pinhole opening area ratio of 10% was formed.
Was obtained (see FIG. 3).

Example 2 ... A PET film having a release agent layer of Example 2 was obtained in the same manner as in Example 1 except that the pinhole opening area ratio of the release agent layer was 30%. It was Example 3 A PET film provided with a release agent layer having a pinhole opening area ratio of 50% was prepared in the same manner as in Example 1 except that the pinhole opening area ratio of the release agent layer was set to 50%. Obtained.

Comparative Example 1 The release agent used in Example 1 was applied on the upper surface 11a of the PET film 11 prepared in Example 1 by a reverse coater so that the thickness after drying was 1 μm, and the thickness of 1 μm was obtained. A release agent layer without pinholes was formed to obtain a PET film of Comparative Example 1.

Nickel was vapor-deposited from the upper surface 11a side of each PET film on which the release agent layer of Examples 1 to 3 and Comparative Example 1 was formed by an electron beam vapor deposition method to form a conductive film. The first embodiment will be described with reference to FIG. That is, in the PET film 11 of Example 1, Ni having a purity of 99.9% by weight or more was used from the upper surface 11a side, the vacuum degree was 5 × 10 ⁻⁵⁰ Torr, the electron beam output was 10 kW,
The distance between the crucible and the film 11 is 400 mm and N
i was vapor-deposited to form the conductive film 15. When the thickness of the formed conductive film 15 was measured, it was 1.5 μm.

In each of Examples 2 and 3 and Comparative Example 1, a conductive film made of nickel and having a thickness of 1.5 μm was formed in the same manner as in Example 1 above. The peeling force of the conductive film formed as described above from each PET film was measured in the following manner.

Fix the PET film on the surface plate,
The conductive film was peeled so as to form an angle of 90 degrees with respect to the T film, and the tension at that time was measured and taken as the peeling force. The results are shown in Table 1 below.

[0034]

[Table 1]

As is clear from Table 1, in Examples 1 to 3, the pinhole opening area ratio in the release agent layer was 10%,
It can be seen that the peeling force can be controlled by changing it to 30% and 50%.

Experiment 2 Using the PET film with the release agent layer of Examples 1 to 3 and Comparative Example 1 prepared in Experiment 1, a conductive paste was screen-printed on the upper surface of the PET film to form a conductive film. The conductive paste used has an average particle size of about 1.0μ in the dry state.
50% by weight of nickel powder of m and 50% by weight of resin content.

The thickness of the formed conductive film after drying is about 4 μm.
It was m. PE of the conductive film formed as described above
The peeling force from the T film was measured by the 90-degree peeling method as in Experiment 1. The results are shown in Table 2 below.

[0038]

[Table 2]

As is clear from Table 2, in Examples 1 to 3 which fall within the scope of the present invention, the peeling force from the PET film, which is the support, can be obtained even in the case of the conductive film formed using the conductive paste. It can be seen that this can be controlled by adjusting the pinhole opening area ratio of the release agent layer.

Experiment 3 PET films with a release agent layer of Comparative Example 1 and Examples 1 to 3 prepared in Experiment 1 were prepared, and Experiment 1 was conducted from the upper surface 11a side.
Ni was vapor-deposited under the same conditions as above to form a conductive film having a thickness of 1.5 μm. Next, with reference to the drawings, the first embodiment will be described representatively. After forming the conductive film 15 made of Ni as shown in FIG. 4A, photoresist is formed on both surfaces of the conductive film 15 in a predetermined pattern. Then, the conductive film 15A having a desired pattern was formed by performing coating so as to obtain the desired pattern and then performing etching (see FIG. 4B).

Next, a reduction-resistant ceramic powder containing BaTiO ₃ as a main component, and a ceramic slurry containing an organic binder and a dispersant are coated on the conductive film 15A formed in a predetermined pattern, as shown in FIG. Thus, the ceramic green sheet 16 was formed. When the thickness of the formed ceramic green sheet 16 was measured, it was about 15 μm.

Similarly in Examples 2 and 3 and Comparative Example 1, the conductive film was patterned by photolithography to form ceramic green sheets. The peeling force from the PET film of the conductive film-laminated ceramic green sheet obtained as described above was evaluated by measuring the 90-degree peeling force in the same manner as in Experiment 1. The results are shown in Table 3 below.
Shown in.

[0043]

[Table 3]

As is clear from Table 3, even in the conductive film laminated ceramic green sheet, the peeling force from the PET film was changed by changing the pinhole opening area ratio of the release agent layer to 10%, 30% and 50%. It turns out that you can adjust.

Experiment 4 The conductive film laminated ceramic green sheet supply zones of Examples 1 to 3 and Comparative Example 1 in which the conductive film laminated ceramic green sheet prepared in Experiment 3 was supported on the PET film were prepared.

Using the ceramic slurry prepared in Experiment 3, a green sheet having a thickness of about 100 μm and containing no conductive film was formed. Next, the green sheet was cut into a rectangular shape having a predetermined size to obtain a rectangular ceramic green sheet 21 shown in FIG. Green sheet 21
The conductive film laminated ceramic green sheet support of Example 1 was thermocompression bonded together with the PET film 11 from the ceramic green sheet 16 side, and then the PET film 11 was peeled off to obtain a laminated body (note that in FIG. The mold is not shown). Thereafter, a new conductive film laminated ceramic green sheet support is thermocompression-bonded onto the laminated body obtained as described above so as to form a capacitor, that is, so as to form a laminated capacitor, and the PET film is peeled off. By repeating the above process, a predetermined number of conductive film laminated ceramic green sheets were laminated.

Further, the above rectangular ceramic green sheet having no built-in conductive film was pressure-bonded onto the laminated body to obtain a laminated body. The obtained laminated body was cut in the thickness direction so as to obtain individual laminated capacitors, and fired under predetermined conditions to form internal electrodes to obtain laminated capacitors. The obtained multilayer capacitor is shown in FIG.

In FIG. 7, reference numeral 31 represents a multilayer capacitor, and the multilayer capacitor 31 has a sintered body 32 obtained by firing the above laminated body. A plurality of internal electrodes 33 are formed in the sintered body 32. The plurality of internal electrodes 33 are completed as internal electrodes by baking the above-described conductive film 14 during sintering of the sintered body 32. Reference numerals 34 and 35 denote external electrodes.

The conductive film laminated ceramic green sheet supports prepared in Examples 2 and 3 and Comparative Example 1 were used and laminated in the same manner as in the case where the conductive film laminated ceramic green sheet supplier of Example 1 was used. I made a capacitor. The capacitance, dielectric loss, insulation resistance and breakdown voltage of the obtained multilayer capacitors of Examples 1 to 3 and Comparative Example 1 were measured. The results are shown in Table 4 below.

[0050]

[Table 4]

As is clear from Table 4, in the multilayer capacitors of Examples 1 to 3 and Comparative Example 1, there was no difference in the electrical characteristics, and the theoretically obtained values were satisfied. I was confirmed.

Although the conductive film laminated ceramic green sheet support of the present invention was used in the manufacture of the laminated capacitor in the above-mentioned embodiments, the present invention is not limited to the laminated capacitor, but may be a ceramic multilayer substrate or other ceramic laminated electronic parts. The manufacturing method of can be generally used. In addition, claim 1
The invention described in (1) can be used not only for the ceramic laminated electronic component but also for transferring the conductive film onto the synthetic resin substrate.

[0053]

According to the first and second aspects of the invention, the release agent layer has pinholes so that the opening area ratio is 1 to 70%, and the release agent layer is used to form a conductive film or a conductive film. A membrane laminated ceramic green sheet is separated from the support.
Therefore, by adjusting the opening area ratio of the pinhole in the range of 1 to 70%, the peeling force of the conductive film or the conductive film laminated ceramic green sheet from the support can be adjusted to an appropriate size.

Similarly, in the invention described in claim 3, since the laminated body is formed by transferring the conductive film laminated ceramic green sheet on which the release agent layer having the above-mentioned opening area ratio is formed, the ceramic green sheet is formed. Since the conductive film and the ceramic green sheet are unlikely to be displaced or peeled off on the support even when the thickness of the film is very thin, 8 μm or less, and the peeling from the support can be performed smoothly. A smaller ceramic laminated electronic component can be obtained.

[Brief description of drawings]

1A and 1B are a perspective view and a partially cutaway cross-sectional view, respectively, for explaining the action of a support and a release agent layer formed on the support.

2A and 2B are partially cutaway cross-sectional views showing a state in which alumina powder is adhered to a PET film and a release agent are applied as Example 1;

FIG. 3 is a partially cutaway cross-sectional view showing a state after the alumina powder is removed in Example 1.

4A and 4B are partially cutaway cross-sectional views showing a state in which a conductive film is formed and a state in which the conductive film is patterned in Example 1. FIGS.

5 is a partially cutaway cross-sectional view showing a state in which a ceramic green sheet is laminated on a conductive film on a support in Example 1. FIG.

FIG. 6 is a partially cutaway cross-sectional view for explaining a step of laminating conductive film laminated ceramic green sheets in Experiment 3.

FIG. 7 is a sectional view showing a multilayer capacitor obtained in Experiment 3.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Support 2 ... Release agent layer 3 ... Pinhole 4 ... Conductive film 11 ... PET film as a support 14 ... Release agent layer 14a ... Pinhole 15, 15A ... Conductive film 16 ... Ceramic green sheet

Claims (3)

[Claims] 1. A support, and a support formed on the support and having an opening area ratio of 1 to 1.
A transfer agent, comprising: a release agent layer having a large number of 70% pinholes, and a conductive film formed on a support surface on which the release agent layer is formed. Conductive film supplier. 2. A support, formed on the support, and having an opening area ratio of 1 to
A release agent layer having a large number of 70% pinholes, a conductive film formed on the surface of the support on which the release agent layer is formed, and a ceramic laminated on the conductive film. A conductive film laminated ceramic green sheet supplier for transfer, comprising a green sheet. 3. A conductive-layer-embedded ceramic multilayer body, wherein at least a part is the conductive-layer multilayer ceramic green sheet transferred from the conductive-layer multilayer ceramic green sheet supply body according to claim 2.