JP3133397U - Led照明具の発光ダイオード配列構造 - Google Patents
Led照明具の発光ダイオード配列構造 Download PDFInfo
- Publication number
- JP3133397U JP3133397U JP2007002047U JP2007002047U JP3133397U JP 3133397 U JP3133397 U JP 3133397U JP 2007002047 U JP2007002047 U JP 2007002047U JP 2007002047 U JP2007002047 U JP 2007002047U JP 3133397 U JP3133397 U JP 3133397U
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- Prior art keywords
- light emitting
- emitting diode
- circuit board
- led lighting
- emitting diodes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【解決手段】 LED照明具の発光ダイオード配列構造であって、表面上に1層の導電回路を設けてなる回路基板と、前記回路基板上にそれぞれ配置され、前記導電回路を電気接続する複数の発光ダイオードと、を含み、前記回路基板が導電回路を設ける表面上に、仮想円を定義し、前記発光ダイオードに前記仮想円に沿って前記回路基板上に分布させ、円形配列を形成させる。
【選択図】図2
Description
表面上に1層の導電回路を設けてなる回路基板と、前記回路基板上にそれぞれ配置され、前記導電回路を電気接続する複数の発光ダイオードと、を含み、前記回路基板が導電回路を設ける表面上に、仮想円を定義し、前記発光ダイオードに前記仮想円に沿って前記回路基板上に分布させ、円形配列を形成させることを特徴とするLED照明具の発光ダイオード配列構造である。
請求項2の考案は、前記導電回路の正負極接点が前記発光ダイオードの外円に位置する請求項1記載のLED照明具の発光ダイオード配列構造である。
請求項3の考案は、更に、複数の仮想円を定義し、各前記仮想円を同心円方式で配列し、且つ各前記仮想円上にいずれも発光ダイオードを分布配置する請求項1記載のLED照明具の発光ダイオード配列構造である。
請求項4の考案は、前記内外仮想円上の各前記発光ダイオードが交替で配置される請求項3記載のLED照明具の発光ダイオード配列構造である。
請求項5の考案は、前記発光ダイオードが配置される回路基板の位置において、各前記発光ダイオードを収容させる凹溝を設けてなる請求項1記載のLED照明具の発光ダイオード配列構造である。
請求項6の考案は、前記発光ダイオード上にいずれも1次レンズを形成してなる請求項1または5記載のLED照明具の発光ダイオード配列構造である。
図1および図2は、本考案の第1実施例の立体図および平面俯瞰図である。本考案は、LED照明具の発光ダイオード配列構造を提供し、回路基板1および前記回路基板1上に設ける複数の発光ダイオード(LED)2を含む。
そのうち、前記回路基板1が、絶縁板体であり、その表面上に1層以上の銅箔等の金属導電材質により形成される導電回路10を鍍金し、その上に配置する各発光ダイオード2を直列、並列接続をするように回路接続させる。前記回路基板1の外型、大きさは、いずれも実際の照明具に合わせて設計することができ、前記発光ダイオード2の数量も実際の状況に応じて決定することができる。
このような配列方式は、一般の照明具の円形照射面の光学2次レンズ設計に適し、同時に回路上に容易に直列または並列の電気接続を行うことができる。
10 導電回路
100 接点
101 接点
11 仮想円
12 凹溝
2 発光ダイオード
20 レンズ
Claims (6)
- LED照明具の発光ダイオード配列構造であって、
表面上に1層の導電回路を設けてなる回路基板と、
前記回路基板上にそれぞれ配置され、前記導電回路を電気接続する複数の発光ダイオードと、を含み、
前記回路基板が導電回路を設ける表面上に、仮想円を定義し、前記発光ダイオードに前記仮想円に沿って前記回路基板上に分布させ、円形配列を形成させることを特徴とするLED照明具の発光ダイオード配列構造。 - 前記導電回路の正負極接点が前記発光ダイオードの外円に位置する請求項1記載のLED照明具の発光ダイオード配列構造。
- 更に、複数の仮想円を定義し、各前記仮想円を同心円方式で配列し、且つ各前記仮想円上にいずれも発光ダイオードを分布配置する請求項1記載のLED照明具の発光ダイオード配列構造。
- 前記内外仮想円上の各前記発光ダイオードが交替で配置される請求項3記載のLED照明具の発光ダイオード配列構造。
- 前記発光ダイオードが配置される回路基板の位置において、各前記発光ダイオードを収容させる凹溝を設けてなる請求項1記載のLED照明具の発光ダイオード配列構造。
- 前記発光ダイオード上にいずれも1次レンズを形成してなる請求項1または5記載のLED照明具の発光ダイオード配列構造。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095211388U TWM304623U (en) | 2006-06-29 | 2006-06-29 | Improved structure on arrangement of LEDs of a LED lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3133397U true JP3133397U (ja) | 2007-07-12 |
Family
ID=37576243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007002047U Expired - Fee Related JP3133397U (ja) | 2006-06-29 | 2007-03-27 | Led照明具の発光ダイオード配列構造 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3133397U (ja) |
KR (1) | KR200449626Y1 (ja) |
AU (1) | AU2007100197A4 (ja) |
DE (1) | DE202006015882U1 (ja) |
TW (1) | TWM304623U (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
KR101308698B1 (ko) * | 2013-03-12 | 2013-09-13 | 주식회사 이디엠아이 | 방열효과가 우수한 led 회로기판 |
US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002328094A (ja) | 2001-05-02 | 2002-11-15 | Nidec Tosok Corp | Ledリング照明及びそれを備えた画像検査装置 |
JP2005159262A (ja) | 2003-10-30 | 2005-06-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
KR100750666B1 (ko) | 2006-09-28 | 2007-08-23 | (주)애니칩 | 분수용 조명등 |
-
2006
- 2006-06-29 TW TW095211388U patent/TWM304623U/zh not_active IP Right Cessation
- 2006-10-17 DE DE202006015882U patent/DE202006015882U1/de not_active Expired - Lifetime
-
2007
- 2007-03-08 AU AU2007100197A patent/AU2007100197A4/en not_active Ceased
- 2007-03-21 KR KR2020070004643U patent/KR200449626Y1/ko not_active IP Right Cessation
- 2007-03-27 JP JP2007002047U patent/JP3133397U/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU2007100197A4 (en) | 2007-04-19 |
DE202006015882U1 (de) | 2006-12-21 |
TWM304623U (en) | 2007-01-11 |
KR20080000007U (ko) | 2008-01-03 |
KR200449626Y1 (ko) | 2010-07-23 |
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