TWM304623U - Improved structure on arrangement of LEDs of a LED lamp - Google Patents

Improved structure on arrangement of LEDs of a LED lamp Download PDF

Info

Publication number
TWM304623U
TWM304623U TW095211388U TW95211388U TWM304623U TW M304623 U TWM304623 U TW M304623U TW 095211388 U TW095211388 U TW 095211388U TW 95211388 U TW95211388 U TW 95211388U TW M304623 U TWM304623 U TW M304623U
Authority
TW
Taiwan
Prior art keywords
light
emitting diodes
led lamp
circuit
led
Prior art date
Application number
TW095211388U
Other languages
English (en)
Chinese (zh)
Inventor
Pai-Chiou Wang
Original Assignee
Augux Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Augux Co Ltd filed Critical Augux Co Ltd
Priority to TW095211388U priority Critical patent/TWM304623U/zh
Priority to DE202006015882U priority patent/DE202006015882U1/de
Publication of TWM304623U publication Critical patent/TWM304623U/zh
Priority to AU2007100197A priority patent/AU2007100197A4/en
Priority to KR2020070004643U priority patent/KR200449626Y1/ko
Priority to JP2007002047U priority patent/JP3133397U/ja

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW095211388U 2006-06-29 2006-06-29 Improved structure on arrangement of LEDs of a LED lamp TWM304623U (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW095211388U TWM304623U (en) 2006-06-29 2006-06-29 Improved structure on arrangement of LEDs of a LED lamp
DE202006015882U DE202006015882U1 (de) 2006-06-29 2006-10-17 LED-Lampe mit mehreren Leuchtdioden
AU2007100197A AU2007100197A4 (en) 2006-06-29 2007-03-08 Arrangement of light-emitting diodes of LED lamp
KR2020070004643U KR200449626Y1 (ko) 2006-06-29 2007-03-21 엘이디 램프의 발광다이오드 배열구조
JP2007002047U JP3133397U (ja) 2006-06-29 2007-03-27 Ｌｅｄ照明具の発光ダイオード配列構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095211388U TWM304623U (en) 2006-06-29 2006-06-29 Improved structure on arrangement of LEDs of a LED lamp

Publications (1)

Publication Number Publication Date
TWM304623U true TWM304623U (en) 2007-01-11

Family

ID=37576243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095211388U TWM304623U (en) 2006-06-29 2006-06-29 Improved structure on arrangement of LEDs of a LED lamp

Country Status (5)

Country Link
JP (1) JP3133397U (ja)
KR (1) KR200449626Y1 (ja)
AU (1) AU2007100197A4 (ja)
DE (1) DE202006015882U1 (ja)
TW (1) TWM304623U (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
KR101308698B1 (ko) * 2013-03-12 2013-09-13 주식회사 이디엠아이 방열효과가 우수한 led 회로기판
US9195281B2 (en) 2013-12-31 2015-11-24 Ultravision Technologies, Llc System and method for a modular multi-panel display

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328094A (ja) 2001-05-02 2002-11-15 Nidec Tosok Corp Ｌｅｄリング照明及びそれを備えた画像検査装置
JP2005159262A (ja) 2003-10-30 2005-06-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
KR100750666B1 (ko) 2006-09-28 2007-08-23 (주)애니칩 분수용 조명등

Also Published As

Publication number Publication date
AU2007100197A4 (en) 2007-04-19
DE202006015882U1 (de) 2006-12-21
KR200449626Y1 (ko) 2010-07-23
JP3133397U (ja) 2007-07-12
KR20080000007U (ko) 2008-01-03

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees