JP3132465B2 - Semiconductor device and probe unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a probe unit, and more particularly to a semiconductor device and a probe unit suitable for fixing a probe unit used for measuring electric characteristics of the semiconductor device.

[0002]

2. Description of the Related Art Packaged IC (Integrated C)
As a method of testing whether an ircuit is good or defective, there is a method of measuring voltage and current characteristics (electrical characteristics) between terminals of an IC package. As a method for measuring such electrical characteristics, a method using a probe unit is conventionally known.

FIG. 17 is a rear view of a conventional IC package, and FIG. 18 is a view showing a probe unit used in combination with the IC package of FIG.
(A) is a perspective view, (b) is a plan view. As shown in these figures, the IC package 8 includes a plurality of terminals 83 connected to the IC chip by bonding on four sides of the IC package body 80 in which the IC chip is sealed.

The probe unit 9 is roughly composed of a probe unit main body 99 having a hollow inner cylindrical tube shape, and a guide plate 98 mounted on the upper surface of the probe unit main body 99. A handle 97 used for removing the probe unit 9 is provided at the center of the guide plate 98.
Is attached. A plurality of terminals 95 connected to the terminals 83 of the IC package 8 are provided below the inner surface of the probe unit main body 99. Terminal 95
Are pins 96 positioned on guide plate 98, respectively.
A probe connected to a measuring instrument such as an oscilloscope is applied to the pin 96.

Next, a method for measuring the electrical characteristics between the terminals 83 of the IC package 8 using the probe unit 9 will be described. FIG. 19 is a diagram illustrating a mounting state of the IC package 8 and the probe unit 9.
As shown in this figure, the probe unit 9 is mounted so as to cover an IC package 8 (hidden by the probe unit 9 in this figure) mounted on the substrate 3. At this time, the guide plate 98 on which the pins 96 are positioned appears on the upper surface.

At this time, the lower end of the probe unit main body 99 slightly expands in accordance with the IC package 8 due to its elasticity, as shown in the sectional view of FIG.
The probe unit main body 99 is fixed by being pressed against the terminal 83 of the IC package 8 by elasticity.

[0007]

However, it is difficult to sufficiently fix the conventional probe unit 9 when it is mounted on the IC package 8 mounted on the board. In particular, when the substrate on which the IC package 8 is mounted stands vertically, it is particularly difficult to fix the probe unit 9. Therefore, there is a disadvantage that the probe unit 9 is easily detached from the IC package 8 when measuring the electric characteristics. Further, it is difficult to uniformly contact the terminals 95 of the probe unit 9 with the terminals 83 of the IC package 8.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and has a probe unit which can be securely fixed to a packaged semiconductor device.
It is another object of the present invention to provide a semiconductor device suitable for fixing a probe unit.

[0009]

[0010]

[0011]

[0012]

In order to achieve the above object, a semiconductor device according to a first aspect of the present invention is a semiconductor device having a plurality of terminals protruding from a package body, wherein a side surface of the package body is provided. A plurality of fitting holes for fitting balls are formed in portions where the plurality of terminals are not provided.
(A semiconductor device of this configuration, in the description of this section, semi
Called conductor device 1 . )

[0013]

[0014]

[0015]

In order to achieve the above object, a second aspect of the present invention is provided.
The probe unit according to the viewpoint is an inner surface of a hollow cylinder
There are several terminals at the bottom for connecting to the terminals of the semiconductor device.
A main body provided at the top of the main body;
To apply a probe connected to each of a number of terminals
And a guide plate on which a plurality of pins are arranged.
A unit inside the main body at a lower portion of the main body.
It has a plurality of claws formed toward the surface side, the main body,
The plurality of claws are made of a flexible material, and the plurality of claws are formed integrally with the main body using the same material as the main body.

In this case, the main body and the plurality of claws are
It is preferable that it is made of a material having an insulating property.

Further, it is preferable that the plurality of claws are formed corresponding to portions where the plurality of terminals are not provided. (A probe unit having this configuration is referred to as a probe unit 1 in this section.)

For example, a plurality of terminals are
Protruding, on the back side of the package body, the plurality of ends
Multiple grooves are formed in the area where no
Semiconductor device (in this section, referred to as semiconductor device X )
When measuring the electrical characteristics between the terminals, the second invention
By using the probe unit according to the above aspect, the probe unit mounted on the semiconductor device mounted on the substrate can be reliably fixed.

[0020] For example, the probe unit 1, in particular package
The cage body has a square planar shape, and multiple grooves
When mounting the semiconductor device X formed at the four corners of the over-di, flop
A plurality of claws of the lobe unit 1 are fitted into grooves formed on the back side of the package body of the semiconductor device 2.
By fitting the claws into the grooves, the probe unit can be fixed to the semiconductor device.

In the probe unit according to the second aspect of the present invention, for example, when a gap is formed between the semiconductor device and the board when the semiconductor device is mounted on the board, a claw enters the gap. The probe unit can be mounted as described above. At this time, if a sufficient coefficient of friction is obtained between the package body of the semiconductor device and the probe unit, the probe unit can be fixed to the semiconductor device even when it is mounted on a semiconductor device other than the semiconductor device X. Becomes

In order to achieve the above object, a probe unit according to a third aspect of the present invention comprises a main body provided with a plurality of terminals for connecting to terminals of a semiconductor device below an inner surface of an inner hollow tube. A probe plate provided on an upper portion of the main body, and a guide plate on which a plurality of pins for applying probes connected to each of the plurality of terminals are arranged. A plurality of balls are embedded in a portion where no terminal is provided. (The probe unit of this configuration, in the description of this section, the probe unit
Call it 2 . )

When measuring the electrical characteristics between the terminals of the semiconductor device according to the first aspect of the present invention, the semiconductor device mounted on the substrate by using the probe unit according to the third aspect of the present invention. It is possible to reliably fix the probe unit mounted on the semiconductor device.

[0024] That is, if it is assumed that the position of a ball embedded in fitting holes and main body of the probe unit 2 on which the semiconductor device 1 is provided corresponding, Purobuyu
When the knit 2 is mounted on the semiconductor device 1 , the ball is fitted into the fitting hole. By fitting the ball into the fitting hole in this manner, the probe unit is fixed to the semiconductor device.

[0025]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In the following embodiments, an IC package and a probe unit configured to securely fix the probe unit when the probe unit is used to measure the electrical characteristics of the IC package will be described.

[First Embodiment] FIG. 1 is a view showing an IC package according to this embodiment, and shows a state viewed from the back (the board side at the time of mounting). As shown in the figure, the IC package 1 has an IC chip 15 and bonding wires 16 on four sides of a package body 10 in which the IC chip is sealed. Terminals 1 connected by
3 is provided.

At the four corners on the back side of the IC package body 10 where the terminals 13 are not provided, there are provided grooves 12 to be fitted with claws of the probe unit as described later. As can be seen from FIG. 1, the bonding wire 16 does not pass through the portion where the groove 12 is formed.

FIGS. 2A and 2B are views showing a probe unit according to this embodiment, wherein FIG. 2A is a perspective view and FIG. 2B is a plan view. As shown, the probe unit 2
Probe unit body 29 having an inner hollow hollow cylindrical shape
And a guide plate 28 attached to the upper surface of the probe unit main body 29, and a claw 24 attached to the four corners of the probe unit main body 29 through the guide plate 28.

At the center of the guide plate 28, a handle 27 for fixing the guide plate 28 to the probe unit main body 29 by screwing or the like and for removing the probe unit 2 is attached. The terminal 13 of the IC package 1 is provided below the inner surface of the probe unit main body 29.
Are provided with a plurality of terminals 25 respectively connected thereto. Each of the terminals 25 is connected to a pin 26 positioned on a guide plate 28, and a probe connected to a measuring instrument such as an oscilloscope is applied to the pin 26. Outside the pins 26 of the guide plate 28, there are provided positioning holes 21 which are fitted into protrusions projecting from the upper part of the probe unit main body 29 and position the guide plate 28.

The probe unit main body 29 is made of an insulating material. The claw portion 24 is made of a flexible and insulating material such as plastic, and has a claw 24a integrally formed toward the inside of the probe unit main body 29 at the tip of the support portion. The claw 24a is fitted into the groove 12 of the IC package 1. That is, the probe unit 2 is fixed to the IC package 1 by fitting the claws 24 a formed at the lower part of the probe unit main body 29 into the grooves 12 of the IC package 1.

Hereinafter, using the probe unit 2,
A method for measuring the electrical characteristics between the terminals 13 of the IC package 1 will be described. For measuring the electrical characteristics between the terminals 13 of the IC package 1, the probe unit 2 is mounted on the IC package 1 mounted on the substrate 3 as shown in FIG.

When mounting the probe unit 2 on the IC package 1, the measurer holds the handle 27 and covers the probe unit 2 on the IC package 1. next,
Claw portions 24 provided at four corners of probe unit 2
Is pulled outward until the end of the nail 24a is located outside the IC package body 10. Then, the IP package main body 10 is covered with the probe unit main body 29, lowered to the lower side, and the claw portion 24 is returned.

As a result, as shown in FIGS. 4A and 5, the claw 24 at the tip of the claw portion 24a is fitted into the groove 12 of the IC package body 10. As a result, the probe unit 2 is fixed to the IC package 1. At this time, FIG.
As shown in (2), the terminal 25 connected to the pin 26 of the probe unit 2 comes into contact with the terminal 13 of the IC package 1. When this state is viewed from above, FIG.
It becomes as shown in.

When measuring the electrical characteristics between the terminals 13 of the IC package 1, the two probes 41 connected to the oscilloscope 4 are connected to the terminals 13 of the IC package 1 to be measured, as shown in FIG. To the pin 26 connected via the terminal 25. This makes it possible to measure the electrical characteristics between the terminals 13 corresponding to the pins 26 to which the probes 41 have been applied.

As described above, according to the IC package 1 and the probe unit 2 according to this embodiment, when the probe unit 2 is mounted on the IC package 1, the claws 24a are fitted into the grooves 13 of the IC package 1. Is done. As a result, the probe unit 2 can be securely fixed. Further, since the probe unit 2 is securely fixed in this manner, even if a force is applied to the probe unit 2 from the outside, the contact surface between the terminal 13 of the IC package 1 and the terminal 25 of the probe unit 2 may be shifted. Absent.

[Second Embodiment] FIG. 8 is a view showing an IC package according to this embodiment, and shows a state viewed from the back (the board side at the time of mounting). As shown, the IC package 5 includes a plurality of terminals 53 connected to the IC chip by bonding on four sides of a package body 50 in which the IC chip is sealed.

On the back side of the IC package body 50, a plurality of grooves 52 are formed between the terminals 53 so as to be fitted with claws of the probe unit as described later.

FIGS. 9A and 9B are views showing a probe unit according to this embodiment, wherein FIG. 9A is a perspective view and FIG. 9B is a plan view. As shown, the probe unit 6
Probe unit body 69 having an inner hollow hollow cylindrical shape
And a guide plate 68 attached to the upper surface of the probe unit main body 69.

At the center of the guide plate 68, a handle 67 for fixing the guide plate 68 to the probe unit main body 69 by screwing or the like and for removing the probe unit 6 is attached. The terminal 53 of the IC package 5 is located below the inner surface of the probe unit body 69.
And a plurality of terminals 65 respectively connected thereto. Each of the terminals 65 is connected to a pin 66 positioned on a guide plate 68, and a probe connected to a measuring instrument such as an oscilloscope is applied to the pin 66. Outside the pins 66 of the guide plate 68, there are provided positioning holes 61 which are fitted into projections projecting from the upper part of the probe unit main body 69 and position the guide plate 68.

The probe unit body 69 is made of a flexible and insulating material such as plastic. The probe unit main body 69 includes a plurality of claws 69a integrally formed at the lower portion thereof at intermediate positions of the terminals 65 and formed toward the inside of the probe unit main body 69. Each of the claws 69a is an IC
The probe unit 6 is fitted into the groove 52 of the package 5, thereby fixing the probe unit 6 and the IC package 5.

Hereinafter, using the probe unit 6,
A method for measuring the electrical characteristics between the terminals 53 of the IC package 5 will be described. Also in this embodiment,
The measurement of the electrical characteristics between the terminals 53 of the IC package 5 is as follows.
As in the case of the first embodiment, the IC package 5 is mounted on the substrate 3, and the probe unit 6 is mounted thereon.

When mounting the probe unit 6 on the IC package 5, the measurer holds the handle 67 and covers the probe unit 6 on the IC package 5. next,
The measurer pushes the probe unit 6 as it is. Then, since the probe unit main body 69 and the claws 69a are made of a flexible material, the probe unit main body 69 and the claw 69a are pushed to the back while bending by the pushing force. Then, the elasticity of the claw 69a returns, and the claw 69a returns to its original state as shown in FIG.
As shown in FIG. 11, the claws 69 are fitted into the grooves 52 formed in the IC package body 5, and the probe unit 6
Are fixed to the IC package 5.

The method for measuring the electrical characteristics between the terminals 53 of the IC package 5 is the same as that of the first embodiment.

As described above, in the IC package 5 according to this embodiment, the claws 6 of the probe unit 6
Grooves 52 for fitting 9 are provided between the terminals 52. For this reason, the present invention can be applied to an IC package having a large number of pins, in which grooves of a sufficient size cannot be formed at the four corners.

[Third Embodiment] FIG. 12 is a view showing an IC package according to the third embodiment, as viewed from the back (the side of the board at the time of mounting). As illustrated, the IC package 7 includes a plurality of terminals 73 connected to the IC chip by bonding on four sides of a package body 70 in which the IC chip is sealed.

As shown in FIG. 12, the terminal 73 is configured so that the lower part is thinner than the upper part, and only the lower part of the terminal 73 fits into the hole formed in the substrate. Therefore, the IC package 7 is mounted on the substrate 3 so that a gap is formed between the substrate 3 and the IC package body 70 as shown in FIG.

In this embodiment, the probe unit shown in the second embodiment (FIG. 9) can be used as a probe unit for measuring the electrical characteristics between the terminals 73 of the IC package 7. The IC package body 7
It is desirable that the material of No. 0 and the material of the probe unit main body 69 have a large friction coefficient when they are brought into contact with each other.

IC package 7 according to this embodiment
The method for attaching the probe unit 6 to the IC package 7 and the method for measuring the electrical characteristics of the IC package 7 are the same as those of the second embodiment except that the claws 69a enter between the terminals 73 in the gap between the IC package body 70 and the substrate 3. This is the same as in the case of the form. In this case, the probe unit 6 can be fixed by the frictional force between the claw 69a and the IC package body 70.

As described above, when the IC package 7 is mounted on the substrate 3, a gap is formed between the IC package 7 and the substrate 3, and the claw 69 a is inserted into the gap, whereby the IC package is mounted. Even if the main body 70 is not provided with a groove, the probe unit 6 can be fixed.

[Fourth Embodiment] FIG. 14 is a view showing an IC package according to this embodiment, and FIG.
FIG. 1B is a plan view, and FIG. 2B is a sectional view taken along line DD of FIG. As shown in these drawings, this IC package is also provided with a plurality of terminals 113 on the side surface of the IC package body 110.
A fitting hole 112 into which a ball provided in a probe unit described later is fitted is provided.

FIG. 15 is a partially cutaway perspective view showing a probe unit according to this embodiment. As shown in FIG. 15, this probe unit also has a probe unit main body 129 having terminals 125 disposed below, and a guide plate 128.
And a handle 127, and balls 124 to be fitted into the ball insertion holes 112 of the IC package of FIG. 14 are embedded in the four inner corners of the probe unit main body 129.

When the probe unit shown in FIG. 15 is mounted on the IC package shown in FIG. 14 mounted on the substrate, the probe unit may be pushed in as it is after the IC package is inserted. Thus, the balls 124 embedded in the four inner corners of the probe unit main body 129 are fitted into the fitting holes 112 on the side surface of the IC package main body 110, and the probe unit is fixed to the IC package main body.

[Modification of Embodiment] In the first to fourth embodiments, the terminals 13, 53, and 73 of the IC packages 1, 5, and 7 are vertically downward. However, for example, FIG.
As shown in FIG. 7, the groove 03 can be formed on the back side of the IC package body 00 also in the IC package 0 called PLCC in which the terminals 03 are lead-formed inward in a J-shape.

In the first to fourth embodiments, the IC
Packages 1, 5, 7, and 0 had a rectangular shape.
In accordance with this, the probe unit main bodies 29 and 69 of the probe units 2 and 6 have an inner hollow cylindrical shape. However, the present invention can also be applied to IC packages having shapes other than squares (polygons, circles, etc.). In this case, the shape of the probe unit main body may be adjusted to the shape of the IC package.

In the first embodiment, the probe unit 2 has the claws 24a at the tips of the claws 24 provided at the four corners of the probe unit main body 29. In the above-described second embodiment, the probe unit 6 includes a plurality of claws 69 integrally formed below the probe unit body 69a.
a. Correspondingly, the grooves 12, 25 were provided in the IC package bodies 10, 50, respectively.

However, the position and the method of disposing the nail on the probe unit are not limited to those described above, and are arbitrary as long as the probe unit can be fixed. A groove may be provided in the IC package body in accordance with the positions of these claws. However, if the probe unit can be fixed, as in the IC package according to the third embodiment, it is not necessary to provide a groove in the IC package body.

In the fourth embodiment, the ball fitting holes 112 are provided at the four corners of the IC package body 110, and the balls 124 fitted to the ball fitting holes 22 are provided at the four corners of the probe unit body 129. . However, the number of ball insertion holes provided on the side surface of the IC package main body and the number and positions of the balls provided on the probe unit main body are arbitrary as long as the probe unit is fixed to the IC package.

[0058]

As described above, according to the present invention,
When a probe unit is used for measuring electrical characteristics between terminals of a semiconductor device, the probe unit can be securely fixed to the semiconductor device.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a back surface of an IC package according to a first embodiment of the present invention.

FIGS. 2A and 2B are diagrams showing a probe unit according to the first embodiment of the present invention, wherein FIG. 2A is a perspective view and FIG. 2B is a plan view.

FIG. 3 is a view showing a state where the IC package of FIG. 1 is mounted on a substrate.

4A and 4B are diagrams showing a mounting state of the probe unit in FIG. 2, wherein FIG. 4A is a perspective view and FIG. 4B is a plan view.

FIG. 5 is a sectional view taken along line AA of FIG. 4 (b).

FIG. 6 is a sectional view taken along line BB of FIG. 4 (b).

FIG. 7 is a diagram illustrating a use state of the probe unit of FIG. 2;

FIG. 8 is a diagram illustrating a back surface of an IC package according to a second embodiment of the present invention.

FIG. 9 is a view showing a probe unit according to a second embodiment of the present invention, wherein (a) is a perspective view and (b) is a plan view.

10A and 10B are diagrams showing a mounting state of the IC package of FIG. 8 and the probe unit of FIG. 9; FIG.
(B) is a plan view.

FIG. 11 is a sectional view taken along the line CC of FIG. 10 (b).

FIG. 12 is a side view showing an IC package according to a third embodiment of the present invention.

FIG. 13 is a diagram showing a state where the IC package of FIG. 11 is mounted on a substrate.

14A and 14B are diagrams showing an IC package according to a fourth embodiment of the present invention, wherein FIG. 14A is a plan view, and FIG. 14B is a cross-sectional view taken along line DD of FIG.

FIG. 15 is a partially cutaway perspective view showing a probe unit according to a fourth embodiment of the present invention.

FIGS. 16A and 16B are diagrams showing an IC package according to a modification of the embodiment of the present invention, wherein FIG. 16A shows a rear surface and FIG.

FIG. 17 is a diagram illustrating a back surface of an IC package according to a conventional example.

18A and 18B are diagrams showing a probe unit according to a conventional example, wherein FIG. 18A is a perspective view and FIG. 18B is a plan view.

19 is a perspective view showing a mounted state of the IC package of FIG. 17 and the probe unit of FIG. 17;

20 is a sectional view taken along the line EE of FIG. 19;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC package 2 Probe unit 3 Substrate 4 Oscilloscope 5 IC package 6 Probe unit 7 IC package 0 IC package 10 IC package main body 12 Groove 13 Terminal 15 IC chip 16 Bonding wire 21 Positioning hole 24 Claw 24a Claw part 25 Terminal 26 Pin 27 Handle 28 guide plate 29 probe unit main body 41 probe 50 IC package main body 52 groove 53 terminal 61 positioning hole 65 terminal 66 pin 67 handle 68 guide plate 69 probe unit main body 69a claw 7 IC package 70 IC package main body 73 terminal 00 IC package main body 02 groove 03 Terminal 110 IC package body 112 Ball fitting hole 120 Probe unit 124 Ball 129 Probe unit body

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/04 G01R 1/073 G01R 31/26 H01L 21/66

Claims (5)

(57) [Claims] 1. A semiconductor device having a plurality of terminals protruding from a package body, wherein a plurality of fittings for fitting a ball to a portion of the side surface of the package body where the plurality of terminals are not provided. A semiconductor device, wherein a hole is formed. 2. An end of a semiconductor device is provided at a lower portion of an inner surface of a hollow cylinder.
Body with multiple terminals for connection with
Provided at an upper portion of the main body, and connected to each of the plurality of terminals.
Multiple pins are provided to apply the connected probe.
A probe unit having a guide plate, wherein the probe unit is formed at a lower portion of the main body toward an inner surface side of the main body.
A probe unit comprising: a plurality of claws; wherein the main body is made of a flexible material; and the plurality of claws are integrally formed on the main body with the same material as the main body. 3. The probe unit according to claim 2 , wherein the main body and the plurality of claws are made of an insulating material. 4. The probe unit according to claim 2 , wherein the plurality of claws are formed corresponding to portions where the plurality of terminals are not provided. 5. A main body provided with a plurality of terminals for connecting to terminals of a semiconductor device at a lower portion of an inner surface of an inner hollow cylinder, and provided at an upper portion of the main body and connected to each of the plurality of terminals. A probe unit comprising: a guide plate on which a plurality of pins for applying a probe are arranged, wherein a plurality of balls are embedded in a portion where the plurality of terminals are not provided at a lower portion of an inner surface of the main body. A probe unit, characterized in that: