JP3123746B2 - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JP3123746B2 JP3123746B2 JP02079224A JP7922490A JP3123746B2 JP 3123746 B2 JP3123746 B2 JP 3123746B2 JP 02079224 A JP02079224 A JP 02079224A JP 7922490 A JP7922490 A JP 7922490A JP 3123746 B2 JP3123746 B2 JP 3123746B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external
- integrated circuit
- hybrid integrated
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は混成集積回路装置に関するものである。Description: BACKGROUND OF THE INVENTION The present invention relates to a hybrid integrated circuit device.
従来のこの種の技術は第３図，第４図に示すように回
路基板８に外部引き出しリード１をスルーホール４によ
ってスルーホールめっき法により接合してあった。スル
ーホール４と外部引き出しリード１の中間は、外部引き
出しのリード１のリード幅と同様となっていた。In this type of conventional technology, as shown in FIGS. 3 and 4, an external lead 1 is joined to a circuit board 8 by a through hole 4 by a through hole plating method. The middle between the through hole 4 and the external lead 1 was the same as the lead width of the external lead 1.
上述した従来の技術は回路基板と外部引き出しリード
との接合に１個のスルーホールめっきを用いる構造とな
っているために外部からの回転方向に対する力に弱いと
いう欠点を有している。また、スルーホールと外部引き
出しリード間のリード幅が同様であるので外部からのリ
ードに対する外力が直接スルーホールめっきに加わるた
め、スルーホールめっきの強度を弱める欠点を有してい
る。更に外装樹脂に対するストッパーもないため引き抜
き強度が弱いという欠点を有している。The above-described conventional technique has a disadvantage that it is weak against external force in the rotation direction because it has a structure using one through-hole plating for joining the circuit board and the external lead. Further, since the lead width between the through-hole and the external lead is the same, an external force applied to the lead from the outside is directly applied to the through-hole plating, so that the strength of the through-hole plating is weakened. Further, there is a drawback that the pull-out strength is weak because there is no stopper for the exterior resin.
上述した従来の技術に対し、本発明は回路基板と外部
引き出しリードとの接合に２個のスルーホールめっき
と、スルーホールと外部引き出しリードとの中間に外力
吸収パターン、凸起状パターン等を設けたという相違点
を有する。In contrast to the conventional technology described above, the present invention provides two through-hole platings at the junction between the circuit board and the external lead, and an external force absorbing pattern, a convex pattern, etc. between the through hole and the external lead. With the difference.
本発明の混成集積回路装置は回路基板と外部引き出し
リードとの接合に２個のスルーホールめっきを用いる構
造となっているために外部からの回転方向に対する力に
対しても回転しないため強度が弱くならないという利点
を有している。またスルーホールと外部引き出しリード
間にリード幅より狭い外力吸収パターンを設けた構造と
なっているため、外部からの外力が吸収出来るためにス
ルーホールめっきの強度が弱くならないという利点を有
している。外装樹脂からのリード引き抜き防止用凸起状
パターンを設けることによりリード抜け防止が出来ると
いう利点を有している。The hybrid integrated circuit device of the present invention has a structure in which two through-hole platings are used for joining the circuit board and the external lead, so that it does not rotate even against a force in the direction of rotation from the outside, so that the strength is weak. It has the advantage that it does not. In addition, the structure is such that an external force absorption pattern narrower than the lead width is provided between the through hole and the external lead, which has the advantage that the strength of the through hole plating is not weakened because external force from the outside can be absorbed. . By providing a protruding pattern for preventing lead extraction from the exterior resin, there is an advantage that lead detachment can be prevented.
第１図は本発明の一実施例を示す平面図であり、第２
図はその断面図である。回路基板８に外部引き出しリー
ド１を第１のスルーホール４および第２のスルーホール
５の２個のスルーホールめっきを用いて接合する。第1,
第２のスルーホール4,5と外部引き出しリード１の中間
に外力吸収パターン３を設ける。更に外力吸収パターン
３と外部引き出しリード１の中間に凸起状パターン２を
設ける。次に回路パターン６上に受動，能動素子等を搭
載し、回路接続を行い外装樹脂７を用いて封止する。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
The figure is a sectional view thereof. The external lead 1 is joined to the circuit board 8 by using two through-hole platings of a first through hole 4 and a second through hole 5. First
An external force absorbing pattern 3 is provided between the second through holes 4 and 5 and the external lead 1. Further, a protruding pattern 2 is provided between the external force absorbing pattern 3 and the external lead 1. Next, passive and active elements and the like are mounted on the circuit pattern 6, circuit connection is performed, and sealing is performed using the exterior resin 7.
以上説明したように本発明は回路基板と外部引き出し
リードとの接合に２個のスルーホールめっきを設けたこ
と。スルーホールと外部引き出しリードとの中間に外力
吸収パターンと凸起状パターンを設けたことにより、外
部より加わる回転方向の力と回転方向を除いた力によっ
て外部引き出しリードに対するダメージを防止するこ
と、および外装樹脂からのリード抜け防止ができるとい
う効果がある。As described above, in the present invention, two through-hole platings are provided at the junction between the circuit board and the external lead. By providing an external force absorbing pattern and a protruding pattern in the middle between the through hole and the external lead, it is possible to prevent damage to the external lead by externally applied force in the rotational direction and force excluding the rotational direction, and There is an effect that the lead can be prevented from coming off from the exterior resin.
第１図は本発明の一実施例を示す平面図、第２図はその
断面図である。第３図は従来技術の平面図、第４図はそ
の断面図である。 １……外部引き出しリード、２……凸起状パターン、３
……外力吸収パターン、４……スルーホール−１、５…
…スルーホール−２、６……回路パターン、７……外装
樹脂、８……回路基板。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view thereof. FIG. 3 is a plan view of the prior art, and FIG. 4 is a sectional view thereof. 1 ... external lead-out 2 ... convex pattern, 3
... external force absorption pattern, 4 ... through-hole-1, 5 ...
... Through holes-2, 6 ... Circuit pattern, 7 ... Outer resin, 8 ... Circuit board.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭56−98852（ＪＰ，Ａ) 特開 昭53−52454（ＪＰ，Ａ) 特開 平１−199497（ＪＰ，Ａ) 特開 昭53−48465（ＪＰ，Ａ) 実開 昭49−116565（ＪＰ，Ｕ) 実開 昭50−81378（ＪＰ，Ｕ) 実開 昭60−140377（ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-56-98852 (JP, A) JP-A-53-52454 (JP, A) JP-A-1-199497 (JP, A) JP-A-53-1982 48465 (JP, A) Fully open 49-116565 (JP, U) Fully open 50-81378 (JP, U) Fully open 60-140377 (JP, U)
Claims (5)
ルーホールめっき法を用いた混成集積回路に於いて、前
記回路基板上に設けた２個以上のスルーホールと外部引
き出しリードとを接合したことを特徴とする混成集積回
路装置。In a hybrid integrated circuit using a through-hole plating method for bonding a circuit board and an external lead, at least two through holes provided on the circuit board and the external lead are bonded. A hybrid integrated circuit device comprising:
に於いて、前記外部引き出しリードの前記２個以上のス
ルーホールが設けられた部分の外側に、前記回路基板外
部の前記外部引き出しリード幅より狭い外力吸収パター
ンを設けたことを特徴とする混成集積回路装置。2. The external integrated circuit according to claim 1, wherein the external extraction outside of the circuit board is provided outside a portion of the external extraction lead provided with the two or more through holes. A hybrid integrated circuit device having an external force absorption pattern narrower than a lead width.
に於いて、前記外部引き出しリードの前記２個以上のス
ルーホールが設けられた部分の外側に、外装樹脂からの
リード引き抜き防止用の凸状のパターンを設けたことを
特徴とする混成集積回路装置。3. The hybrid integrated circuit according to claim 1, wherein a lead is prevented from being pulled out of an exterior resin outside a portion of said external lead-out lead provided with said two or more through holes. A hybrid integrated circuit device, comprising:
に於いて、前記外部引き出しリードの前記２個以上のス
ルーホールが設けられた部分の外側に、前記回路基板外
部の前記外部引き出しリード幅より狭い外力吸収パター
ンを設け、その外側に外装樹脂からのリード引き抜き防
止用の凸起状のパターンを設けたことを特徴とする混成
集積回路装置。4. The external integrated circuit according to claim 1, wherein said external lead outside said circuit board is provided outside a portion of said external lead where said two or more through holes are provided. A hybrid integrated circuit device comprising: an external force absorbing pattern narrower than a lead width; and a protruding pattern for preventing lead extraction from an exterior resin is provided outside the external force absorbing pattern.
に於いて、前記外部引き出しリードの前記２個以上のス
ルーホールが設けられた部分の外側に、回路パターンが
設けられ、該回路パターン上には受動、能動素子が搭載
され、回路接続が行われ、外装樹脂で封止されているこ
とを特徴とする混成集積回路装置。5. The hybrid integrated circuit according to claim 1, wherein a circuit pattern is provided outside a portion of said external lead-out lead provided with said two or more through-holes. A hybrid integrated circuit device, wherein passive and active elements are mounted on a pattern, circuit connections are made, and the pattern is sealed with an exterior resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02079224A JP3123746B2 (en) | 1990-03-28 | 1990-03-28 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02079224A JP3123746B2 (en) | 1990-03-28 | 1990-03-28 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03280367A JPH03280367A (en) | 1991-12-11 |
| JP3123746B2 true JP3123746B2 (en) | 2001-01-15 |
Family
ID=13683945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02079224A Expired - Fee Related JP3123746B2 (en) | 1990-03-28 | 1990-03-28 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3123746B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5546881B2 (en) * | 2010-01-22 | 2014-07-09 | 矢崎総業株式会社 | Wiring board |
-
1990
- 1990-03-28 JP JP02079224A patent/JP3123746B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03280367A (en) | 1991-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |