JPH02222189A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH02222189A JPH02222189A JP4238289A JP4238289A JPH02222189A JP H02222189 A JPH02222189 A JP H02222189A JP 4238289 A JP4238289 A JP 4238289A JP 4238289 A JP4238289 A JP 4238289A JP H02222189 A JPH02222189 A JP H02222189A
- Authority
- JP
- Japan
- Prior art keywords
- component
- printed circuit
- adhesive
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000004831 Hot glue Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はラジオやテレビジョン受像機、磁気記録再生装
置に用いられるプリント基板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to printed circuit boards used in radios, television receivers, and magnetic recording and reproducing devices.
従来の技術
従来より、テレビジョン受像機等のプリント基板上に載
置される部品が比較的大きい場合、振動や衝撃から守る
ために、部品の周囲に熱溶融接着剤やゴム接着剤が塗布
され、部品をプリント基板に固着させている。Conventional technology Traditionally, when components mounted on a printed circuit board such as a television receiver are relatively large, hot melt adhesive or rubber adhesive is applied around the components to protect them from vibration and shock. , the components are fixed to the printed circuit board.
第３図は士述した従来のプリント基板を示すもので、第
３図に示すように、部品１１とプリント２１、 。FIG. 3 shows the conventional printed circuit board mentioned above, and as shown in FIG. 3, there are a component 11 and a print 21.
基板１２とは、接着剤１３が部品１１の下部をうめつく
すように盛られる状態で固着されていた。The component 11 was fixed to the substrate 12 with adhesive 13 being applied so as to completely fill the lower part of the component 11 .
発明が解決しようとする課題
しかしながら上記した従来の構成では、部品１１に接着
剤１３をつけ接着剤１３を介してプリント基板１２の平
面に接着固定しているので、接着剤１３がプリント基板
１２との間で剥離されやすい。Problems to be Solved by the Invention However, in the conventional configuration described above, the adhesive 13 is applied to the component 11 and the component 11 is fixed to the flat surface of the printed circuit board 12 via the adhesive 13. It is easy to peel off between.
これは、プリント基板１２はベークライト又はエポキシ
系樹脂で形成されており、プリント基板の材質が接着剤
と融合されておらず、接着力が低いからである。This is because the printed circuit board 12 is made of Bakelite or epoxy resin, and the material of the printed circuit board is not fused with adhesive, resulting in low adhesive strength.
本発明はかかる点に鑑み、簡単な構成で、接着剤の接着
力を強化できるプリント基板を提供するものである。In view of this point, the present invention provides a printed circuit board that has a simple structure and can strengthen the adhesive force of an adhesive.
課題を解決するだめの手段
本発明は上記目的を達するため、基板の部品近傍にあけ
られた穴と部品とに接着剤が塗布され、部品を基板に固
着した構成となっている。Means for Solving the Problems In order to achieve the above-mentioned object, the present invention has a structure in which an adhesive is applied to holes drilled in the vicinity of the parts of the board and to the parts, thereby fixing the parts to the board.
作 用
本発明は上記した構成により、接着剤が基板の穴にはい
って固化され、基板が平面である場合に比較して、接着
面積の拡大がはかれ、部品と基板とが強固に固着される
。Effect: With the above-described configuration, the adhesive enters the hole in the substrate and hardens, and the adhesive area is expanded compared to the case where the substrate is flat, and the component and the substrate are firmly fixed. Ru.
実施例
以下本発明の一実施例のプリント基板について図面を参
照しながら説明する。第１図、第２図は本実施例のプリ
ント基板を示すもので、第１図はその斜視図、第２図は
その要部断ｉ？ｉ’ｉ図である。EXAMPLE Hereinafter, a printed circuit board according to an example of the present invention will be described with reference to the drawings. 1 and 2 show the printed circuit board of this embodiment, FIG. 1 is a perspective view thereof, and FIG. 2 is a cross-sectional view of its main parts. It is an i'i diagram.
図中１は抵抗やコンデンサー等の部品、２は部品取付穴
に挿入された部品１をすでに半田等で固着したプリント
基板、３はプリント基板２に形成された一対の穴で、部
品１の近傍で部品１をはさんで対称に設けられている。In the figure, 1 is a component such as a resistor or capacitor, 2 is a printed circuit board to which component 1 inserted into the component mounting hole has already been fixed with solder, etc., and 3 is a pair of holes formed in the printed circuit board 2 near component 1. They are arranged symmetrically with part 1 in between.
４は部品１の下部を包み込むように、かつ、プリント基
板２の一対の穴３に入り込むように塗布されだ熱溶融接
着剤やゴム接着剤等の接着剤で、基板２の裏面の穴３の
周辺部分まで広がるように塗布されている。このため、
接着剤４が固化すると、穴３の周辺部分まで広がった接
着剤４がプリント基板２と、全ての接着′剤４自身とを
強固に同着する。さらに、プリント基板に穴を設けない
場合に比較して接着面積が大幅に増加し、部品１とプリ
ント基板２との接着力が強化され、部品１の固定強化が
図られる。4 is an adhesive such as hot-melt adhesive or rubber adhesive that is applied so as to wrap around the lower part of the component 1 and to enter the pair of holes 3 on the printed circuit board 2. It is applied so that it spreads to the surrounding areas. For this reason,
When the adhesive 4 hardens, the adhesive 4 that has spread to the periphery of the hole 3 firmly adheres the printed circuit board 2 and all of the adhesive 4 itself. Furthermore, compared to the case where no holes are provided in the printed circuit board, the adhesive area is significantly increased, the adhesive force between the component 1 and the printed circuit board 2 is strengthened, and the fixation of the component 1 is strengthened.
尚、本実施例の穴の形状は丸穴としだが、スリット形状
の長穴にすれば、接着剤を塗布する際の範囲の指定にも
有効である。Although the shape of the hole in this embodiment is a round hole, it is also effective to designate a range when applying adhesive if it is made into a slit-shaped elongated hole.
発明の効果
以上のように本発明によれば、プリント基板に穴を設け
、この穴と部品とプリント基板とに接着剤を塗布するこ
とにより、部品とプリント基板とを強固に固着できると
ともに、プリント基板の穴は、部品取付穴を形成する時
と同時に加工できるため容易に加工ができる。さらに、
振動、衝撃を繰り返す機会の多い自動車載用のテレビジ
ョン受像機などは、その振動を吸収でき、信頼性が向上
するものである。Effects of the Invention As described above, according to the present invention, by providing a hole in a printed circuit board and applying an adhesive between the hole, the component, and the printed circuit board, the component and the printed circuit board can be firmly fixed, and the printed circuit board can be firmly fixed. The holes in the board can be easily machined at the same time as forming the component mounting holes. moreover,
Automotive television receivers and the like, which are subject to repeated vibrations and shocks, can absorb the vibrations and have improved reliability.
第１図は本発明の一実施例におけるプリント基板の斜視
図、第２図は同要部断面図、第３図は従来例の斜視図で
ある。
１・・・・・・部品、２・・・・・・プリント基板、３
・・・・穴、４・・・・・・接着剤。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名部品
７°ワンド＠坂
棧清刑
大。FIG. 1 is a perspective view of a printed circuit board according to an embodiment of the present invention, FIG. 2 is a sectional view of the same essential part, and FIG. 3 is a perspective view of a conventional example. 1... Parts, 2... Printed circuit board, 3
...hole, 4...adhesive. Name of agent: Patent attorney Shigetaka Awano and 1 other person Parts 7° Wand @ Kiyoshi Sakamoto University.
Claims (1)
けられた穴とに接着剤が塗布され、前記部品を基板に固
着したことを特徴とするプリント基板。1. A printed circuit board, characterized in that an adhesive is applied to a component provided on the substrate and a hole drilled in the vicinity of the component on the substrate, thereby fixing the component to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4238289A JPH02222189A (en) | 1989-02-22 | 1989-02-22 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4238289A JPH02222189A (en) | 1989-02-22 | 1989-02-22 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02222189A true JPH02222189A (en) | 1990-09-04 |
Family
ID=12634512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4238289A Pending JPH02222189A (en) | 1989-02-22 | 1989-02-22 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02222189A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04237184A (en) * | 1991-01-21 | 1992-08-25 | Hitachi Aic Inc | Printed wiring board |
| JP2021022714A (en) * | 2019-07-30 | 2021-02-18 | パナソニックＩｐマネジメント株式会社 | Circuit board, power supply device, and lighting apparatus |
-
1989
- 1989-02-22 JP JP4238289A patent/JPH02222189A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04237184A (en) * | 1991-01-21 | 1992-08-25 | Hitachi Aic Inc | Printed wiring board |
| JP2021022714A (en) * | 2019-07-30 | 2021-02-18 | パナソニックＩｐマネジメント株式会社 | Circuit board, power supply device, and lighting apparatus |
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