JPH05218505A - Led - Google Patents

Led

Info

Publication number
JPH05218505A
JPH05218505A JP4018053A JP1805392A JPH05218505A JP H05218505 A JPH05218505 A JP H05218505A JP 4018053 A JP4018053 A JP 4018053A JP 1805392 A JP1805392 A JP 1805392A JP H05218505 A JPH05218505 A JP H05218505A
Authority
JP
Japan
Prior art keywords
led
printed wiring
wiring board
display
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4018053A
Other languages
Japanese (ja)
Inventor
Yoji Tsukada
洋治 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4018053A priority Critical patent/JPH05218505A/en
Publication of JPH05218505A publication Critical patent/JPH05218505A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To acquire an LED of a simple structure which uses an attaching surface and a display surface to a printed wiring substrate in the same direction for display. CONSTITUTION:Leads 2a and 2b of an LED 1 have an interval, arrangement and elasticity which are proper for compressing and holding a printed wiring substrate 4 and the lead 2b is further provided with a projection 3. The printed wiring substrate 4 is provided with a hole 6 having a conductive land 5 in a periphery thereof and the projection 3 is fit inside the hole 6 for holding the LED 1 stably. In the attachment state, a display surface and an attaching surface of the LED 1 face the same direction, thereby ensuring desired display state and simplifying attachment structure greatly.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はＬＥＤに関し、特に印刷
配線板に実装して表示用に使用するＬＥＤに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED, and more particularly to an LED mounted on a printed wiring board for display.

【０００２】[0002]

【従来の技術】従来、この種のＬＥＤは図３の（ａ）に
示すように、印刷配線基板４に配設した取付穴９に、９
０度屈曲したフォーミングを施したリード８を通し、印
刷配線基板４の裏側でははんだ付け１０を施して固定す
る構造とするか、図３の（ｂ）に示す如く、ＬＥＤ７の
９０度屈曲のリード８の取付状態での安定状態を確保す
るため、リードを合成樹脂のモールド成形部材としての
成形部１１を利用して印刷配線基板４に取り付けてい
た。2. Description of the Related Art Conventionally, as shown in FIG. 3A, an LED of this type has a mounting hole 9 formed in a printed wiring board 4 and a mounting hole 9
A structure in which the leads 8 formed by bending at 0 degrees are passed through and the soldering 10 is performed on the back side of the printed wiring board 4 to fix the leads 8 or the leads of 90 degrees bending of the LED 7 are formed as shown in FIG. 3B. In order to secure a stable state in the mounting state of No. 8, the lead was attached to the printed wiring board 4 by using the molding portion 11 as the synthetic resin molding member.

【０００３】[0003]

【発明が解決しようとする課題】上述した従来のＬＥＤ
は、印刷配線基板の部品取付け面とＬＥＤの表示面とが
異なるため、リードを９０度屈曲するなどのフォーミン
グを施したり、リードをフォーミングしたのち外側を合
成樹脂で成形し、取付状態での安定を図って使用してい
る為、取付構造が複雑化するという問題点があった。DISCLOSURE OF THE INVENTION The conventional LED described above
Since the component mounting surface of the printed wiring board and the LED display surface are different, the leads are formed by bending 90 degrees, or the leads are formed and then the outside is molded with synthetic resin to stabilize the mounting condition. However, there is a problem in that the mounting structure becomes complicated because it is used with the intention.

【０００４】また、ＬＥＤは、印刷配線基板の片面から
突出した状態で取付けるため、表面実装部品を利用した
両面実装の印刷配線基板にあっては、ＬＥＤの表示位置
が片側に片寄ってしまうなどの大きな制約を受け、機能
的な表示ができなくなるという問題点があった。Further, since the LED is mounted in a state of protruding from one side of the printed wiring board, in a double-sided printed wiring board using surface mount components, the display position of the LED may be offset to one side. There was a problem that the functional display could not be performed due to a large restriction.

【０００５】本発明の目的は上述した欠点を除去し、印
刷配線基板に対する取付を簡素化し、かつ機能的な表示
を可能とするＬＥＤを提供することにある。An object of the present invention is to eliminate the above-mentioned drawbacks, to provide an LED which simplifies mounting on a printed wiring board and enables functional display.

【０００６】[0006]

【課題を解決するための手段】本発明のＬＥＤは、印刷
配線基板に装着して表示に供するＬＥＤであって、装着
すべき印刷配線基板をその板厚方向で挟み込み圧着する
に適した間隔と弾性を付与した２本のリードを有し、か
つ取付状態で前記印刷配線基板の厚み方向の中心に表示
位置中心が合致するように前記リードの位置を設定した
構成を有する。An LED of the present invention is an LED mounted on a printed wiring board for display, and has an interval suitable for sandwiching and crimping the printed wiring board to be mounted in the plate thickness direction. It has a structure in which two leads having elasticity are provided, and the positions of the leads are set so that the display position center coincides with the center of the printed wiring board in the thickness direction in the mounted state.

【０００７】また本発明のＬＥＤは、前記印刷配線基板
に形成した、周囲に導電性のランドを有する貫通孔に嵌
入して、ＬＥＤを取付状態に保持する突起を前記リード
に備えた構成を有する。Further, the LED of the present invention has a structure in which the lead is provided with a protrusion which is fitted into a through hole formed on the printed wiring board and having a conductive land on the periphery thereof to hold the LED in an attached state. .

【０００８】[0008]

【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

【０００９】図１は、本発明の一実施例のＬＥＤの側面
図である。図１に示す実施例のＬＥＤ１は、２本のリー
ド２ａ，２ｂを有するこれら２本のリードは、ＬＥＤ１
を装着すべき印刷配線基板を厚み方向で圧着するに適し
た弾性を有するような形状，材質で形成し、かつリード
間隔が設定されている。FIG. 1 is a side view of an LED according to an embodiment of the present invention. The LED 1 of the embodiment shown in FIG. 1 has two leads 2a and 2b.
The printed wiring board to be mounted is formed of a shape and material having elasticity suitable for pressure bonding in the thickness direction, and the lead interval is set.

【００１０】また、リード２ｂには、印刷配線基板に取
付け固定するための突起３が設けられている。Further, the lead 2b is provided with a protrusion 3 for attaching and fixing to the printed wiring board.

【００１１】さらに、リード２ａと２ｂは、ＬＥＤを取
り付けた際にその表示中心が印刷配線基板の厚み中心と
ほぼ合致する位置に配線されている。Further, the leads 2a and 2b are wired at positions where the display center of the leads 2a and 2b substantially coincides with the thickness center of the printed wiring board when the LED is mounted.

【００１２】図２は、図１のＬＥＤ１を印刷配線基板に
取り付けた状態を示す平面図（ａ），断面図（ｂ）およ
び裏面図（ｃ）である。FIG. 2 is a plan view (a), a sectional view (b) and a rear view (c) showing a state in which the LED 1 of FIG. 1 is attached to a printed wiring board.

【００１３】図２の（ｂ）の断面図に示す如く、ＬＥＤ
１を取り付ける印刷配線基板４には、厚み方向で貫通す
る穴６を配設し、かつ穴６の周囲には導電性のランド５
が形成されている。As shown in the sectional view of FIG. 2B, the LED
In the printed wiring board 4 to which 1 is attached, a hole 6 penetrating in the thickness direction is provided, and a conductive land 5 is provided around the hole 6.
Are formed.

【００１４】ＬＥＤ１はリード２ａ，２ｂ間に印刷配線
基板４を挟み込み、リード２ａ，２ｂの弾性で圧着す
る。リード２ｂの突起３は穴６に嵌入してＬＥＤ１を保
持する。この状態でＬＥＤの表示中心と印刷配線基板４
の厚み中心はほぼ一致する。また、リード２ａ，２ｂの
接続は、導電性のランド５を介して確保される。In the LED 1, the printed wiring board 4 is sandwiched between the leads 2a and 2b, and the leads 2a and 2b are elastically pressed. The protrusion 3 of the lead 2b is fitted into the hole 6 to hold the LED 1. In this state, the display center of the LED and the printed wiring board 4
The thickness centers of are almost the same. Further, the connection between the leads 2a and 2b is secured via the conductive land 5.

【００１５】こうして、極めて容易かつ確実にＬＥＤの
取り付けを行なうことができる。Thus, the LED can be mounted extremely easily and reliably.

【００１６】[0016]

【発明の効果】以上説明したように本発明は、ＬＥＤに
印刷配線基板を板厚方向で挟み込むのに適した間隔と弾
性を有するリードを備え、印刷配線基板に設けた取付穴
に、リードに設けた突起を嵌入させて挟み込むことによ
り、ＬＥＤ取付位置が印刷配線基板の板厚方向の中心位
置となるように設定し、両面実装の際でも表示部が片面
側に偏寄することもなく、また、固定する際にはんだ固
定の必要がなく、容易かつ確実に取付できる効果があ
る。As described above, according to the present invention, the LED is provided with the leads having the intervals and elasticity suitable for sandwiching the printed wiring board in the plate thickness direction, and the leads are attached to the mounting holes provided in the printed wiring board. By inserting and sandwiching the provided protrusion, the LED mounting position is set to be the center position in the plate thickness direction of the printed wiring board, and even when double-sided mounting, the display unit is not biased to one side, In addition, there is an effect that it is possible to easily and surely attach without the need for solder fixing.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例のＬＥＤの側面図である。FIG. 1 is a side view of an LED according to an embodiment of the present invention.

【図２】図１のＬＥＤの取付状態を示す平面図（ａ），
断面図（ｂ）および裏面図（ｃ）である。FIG. 2 is a plan view (a) showing a mounting state of the LED of FIG.
It is a sectional view (b) and a rear view (c).

【図３】従来のＬＥＤの取付状態の第一例を示す側面図
（ａ）および第二例を示す側面図（ｂ）である。FIG. 3 is a side view (a) showing a first example of a conventional LED mounting state and a side view (b) showing a second example.

【符号の説明】[Explanation of symbols]

１，７ ＬＥＤ ２ａ，２ｂ リード ３ 突起 ４ 印刷配線基板 ５ ランド ６ 穴 ８ リード ９ 取付穴 １０ ハンダ付 １１ 成形部 1,7 LED 2a, 2b Lead 3 Protrusion 4 Printed wiring board 5 Land 6 Hole 8 Lead 9 Mounting hole 10 Solder 11 Molding part

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 印刷配線基板に装着して表示に供するＬ
ＥＤであって、装着すべき印刷配線基板をその板厚方向
で挟み込み圧着するに適した間隔と弾性を付与した２本
のリードを有し、かつ取付状態で前記印刷配線基板の厚
み方向の中心に表示位置中心が合致するように前記リー
ドの位置を設定して成ることを特徴とするＬＥＤ。1. An L mounted on a printed wiring board for display.
An ED, which has two leads provided with elasticity and elasticity suitable for sandwiching and crimping the printed wiring board to be mounted in the plate thickness direction, and the center of the printed wiring board in the thickness direction in the mounted state. The LED is characterized in that the position of the lead is set such that the center of the display position coincides with the position of the lead. 【請求項２】 前記印刷配線基板に形成した、周囲に導
電性のランドを有する貫通孔に嵌入して、ＬＥＤを取付
状態に保持する突起を前記リードに備えて成ることを特
徴とする請求項１記載のＬＥＤ。2. The lead is provided with a protrusion that is fitted into a through hole formed in the printed wiring board and has a conductive land in the periphery to hold the LED in an attached state. The LED according to 1.
JP4018053A 1992-02-04 1992-02-04 Led Withdrawn JPH05218505A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4018053A JPH05218505A (en) 1992-02-04 1992-02-04 Led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4018053A JPH05218505A (en) 1992-02-04 1992-02-04 Led

Publications (1)

Publication Number Publication Date
JPH05218505A true JPH05218505A (en) 1993-08-27

Family

ID=11960958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4018053A Withdrawn JPH05218505A (en) 1992-02-04 1992-02-04 Led

Country Status (1)

Country Link
JP (1) JPH05218505A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1517164A1 (en) * 2003-09-22 2005-03-23 Alps Electric Co., Ltd. Surface light source
JP2008172560A (en) * 2007-01-12 2008-07-24 Ricoh Co Ltd Image lighting system, image reader and image forming apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1517164A1 (en) * 2003-09-22 2005-03-23 Alps Electric Co., Ltd. Surface light source
JP2008172560A (en) * 2007-01-12 2008-07-24 Ricoh Co Ltd Image lighting system, image reader and image forming apparatus

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990518