JP2533164Y2 - Connection structure between solid board and flexible board - Google Patents

Connection structure between solid board and flexible board

Info

Publication number
JP2533164Y2
JP2533164Y2 JP470593U JP470593U JP2533164Y2 JP 2533164 Y2 JP2533164 Y2 JP 2533164Y2 JP 470593 U JP470593 U JP 470593U JP 470593 U JP470593 U JP 470593U JP 2533164 Y2 JP2533164 Y2 JP 2533164Y2
Authority
JP
Japan
Prior art keywords
fastening means
substrate
solid
solid substrate
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP470593U
Other languages
Japanese (ja)
Other versions
JPH0662469U (en
Inventor
健二 池上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP470593U priority Critical patent/JP2533164Y2/en
Publication of JPH0662469U publication Critical patent/JPH0662469U/en
Application granted granted Critical
Publication of JP2533164Y2 publication Critical patent/JP2533164Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Multi-Conductor Connections (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案はソリッド基板とフレキシ
ブル基板との接続構造に関し、特に、計器等の樹脂製筐
体上にねじでソリッド基板を取り付け、このソリッド基
板の取付部にねじを介してフレキシブル基板が電気的に
接続されて取り付けられるような場合のソリッド基板と
フレキシブル基板との接続構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection structure between a solid substrate and a flexible substrate. In particular, the solid substrate is mounted on a resin housing such as an instrument with a screw, and the mounting portion of the solid substrate is connected via a screw. The present invention relates to a connection structure between a solid substrate and a flexible substrate in a case where the flexible substrate is electrically connected and mounted.

【0002】[0002]

【従来の技術】近年、マイクロコンピュータを搭載した
電子部品や、電気機器や自動車の電装品等においては、
従来のソリッド基板に加えて、自由に基板を折り曲げる
ことができるフレキシブル基板が併用されることが多
い。このようにソリッド基板とフレキシブル基板とが併
用されるような場合、両者の電気的な接続をとる必要が
ある。
2. Description of the Related Art In recent years, electronic components equipped with a microcomputer, electric devices and electric components of automobiles, etc.
In addition to the conventional solid substrate, a flexible substrate capable of freely bending the substrate is often used in combination. When the solid substrate and the flexible substrate are used together as described above, it is necessary to make an electrical connection between them.

【0003】図4は計器用の樹脂製のケース41にタッ
ピングねじ44を介してフレキシブル基板42とソリッ
ド基板43とを取り付け、フレキシブル基板42の回路
パターン(図示せず)とソリッド基板43の回路パター
ン43aとを電気的に接続する従来のソリッド基板とフ
レキシブル基板との接続構造を示すものである。
FIG. 4 shows a circuit board (not shown) of the flexible board 42 and a circuit board of the solid board 43, in which a flexible board 42 and a solid board 43 are attached via a tapping screw 44 to a resin case 41 for an instrument. 43 shows a conventional connection structure between a solid substrate and a flexible substrate for electrically connecting the flexible substrate 43a to the solid substrate.

【0004】ケース41の要部にはボス41aが設けら
れ、このボス41aにねじ穴41bが設けられている。
また、ケース41の上に置かれるフレキシブル基板42
にはねじ穴41bに重なるねじ挿通孔42aとこのねじ
挿通孔42aの周囲にランドが形成された回路パターン
(図示せず)が設けられている。そして、ソリッド基板
43上に設けられた取付穴43bの表面側の周囲には回
路パターン43aが設けられている。従来はこの取付穴
43bに“鳩目”とよばれる導電性の部材46を嵌め込
んで取り付け、表面側を半田Hによって回路パターン4
3aと接続し、裏面側にこの導電性部材46を露出させ
ていた。そして、この導電性部材46の表面側にワッシ
ャ45を置き、タッピングねじ44をワッシャ45、導
電性部材46、およびねじ挿通孔42aを挿通させてね
じ穴41bに螺着し、タッピングねじ44による導電性
部材46とフレキシブル基板42との接触圧を利用し
て、回路パターン43aとフレキシブル基板42の回路
パターンとの導通が取られていた。
A boss 41a is provided on a main part of the case 41, and a screw hole 41b is provided in the boss 41a.
Also, a flexible substrate 42 placed on the case 41
Is provided with a screw insertion hole 42a overlapping the screw hole 41b and a circuit pattern (not shown) in which a land is formed around the screw insertion hole 42a. A circuit pattern 43a is provided around the surface side of the mounting hole 43b provided on the solid substrate 43. Conventionally, a conductive member 46 called "eyelet" is fitted and mounted in the mounting hole 43b, and the surface side of the circuit pattern 4 is soldered with solder H.
3a, and the conductive member 46 was exposed on the back surface side. Then, a washer 45 is placed on the surface side of the conductive member 46, and the tapping screw 44 is inserted through the washer 45, the conductive member 46, and the screw insertion hole 42 a to be screwed into the screw hole 41 b, and the conductive by the tapping screw 44. By using the contact pressure between the flexible member 46 and the flexible substrate 42, the circuit pattern 43a and the circuit pattern of the flexible substrate 42 are electrically connected.

【0005】[0005]

【考案が解決しようとする課題】しかしながら、このよ
うな従来のソリッド基板43とフレキシブル基板42と
の接続構造においては、ソリッド基板43に常に導通媒
体となる導電性部材46の取り付けが必要であり、ま
た、導電性部材46とソリッド基板43の回路パターン
43aとの半田付けも必要であるので、導電性部材46
のソリッド基板43への取り付け工数がかかり、高価な
構造となっているという問題があった。
However, in such a conventional connection structure between the solid substrate 43 and the flexible substrate 42, it is necessary to attach a conductive member 46 which is always a conductive medium to the solid substrate 43. Also, since it is necessary to solder the conductive member 46 and the circuit pattern 43a of the solid substrate 43, the conductive member 46
This requires a lot of man-hours to attach to the solid substrate 43, and has a problem of an expensive structure.

【0006】そこで、本考案は、ソリッド基板とフレキ
シブル基板とを接続するに際して、ソリッド基板への特
殊な導電性部材の取付工数がかからず、また、コストも
低減することができるソリッド基板とフレキシブル基板
との接続構造を提供することを目的とする。
Accordingly, the present invention provides a solid board and a flexible board which can reduce the cost and cost of attaching a special conductive member to the solid board when connecting the solid board and the flexible board. It is an object to provide a connection structure with a substrate.

【0007】[0007]

【課題を解決するための手段】前記目的を達成する本考
案のソリッド基板とフレキシブル基板との接続構造は、
計器等の筐体の一部に、フレキシブル基板を挟んでソリ
ッド基板を締結手段で取り付け、このソリッド基板の表
面側に形成された回路パターンと前記フレキシブル基板
の回路パターンとを、前記締結手段を介して電気的に接
続する際の構造であって、前記筐体には、前記ソリッド
基板取り付け用の第1の締結手段挿通孔の周囲に凸部を
設け、この筐体に取り付けられる前記ソリッド基板に
は、重ねられた時に前記凸部の先端部を見通せる貫通孔
を設けると共に、この貫通孔の周囲に前記回路パターン
を配置し、前記フレキシブル基板には、前記ソリッド基
板上の第1の締結手段挿通孔と同程度の第2の締結手段
挿通孔を設け、前記締結手段は、前記貫通孔の周囲に設
けられた回路パターンを前記ソリッド基板の裏面側に連
絡するように構成し、前記フレキシブル基板の第2の締
結手段挿通孔を前記筐体上の第1の締結手段挿通孔に合
わせた状態で前記ソリッド基板を前記締結手段によって
筐体上に取り付けたときに、前記フレキシブル基板の回
路パターンが前記凸部によって前記締結手段に当接する
ことを特徴としている。
The connecting structure between the solid substrate and the flexible substrate according to the present invention for achieving the above object is as follows.
A solid board is attached to a part of a casing of an instrument or the like by a fastening means with a flexible board interposed therebetween, and a circuit pattern formed on the surface side of the solid board and a circuit pattern of the flexible board are connected to each other through the fastening means. The housing is provided with a projection around the first fastening means insertion hole for mounting the solid substrate, and the solid substrate attached to the housing is provided with a projection. Is provided with a through-hole through which the tip of the convex portion can be seen when overlapped, and the circuit pattern is arranged around the through-hole. A second fastening means insertion hole having the same size as the hole is provided, and the fastening means is configured to connect a circuit pattern provided around the through hole to a back surface side of the solid substrate. When the solid substrate is mounted on the housing by the fastening means in a state where the second fastening means insertion hole of the flexible substrate is aligned with the first fastening means insertion hole on the housing, The circuit pattern is in contact with the fastening means by the convex portion.

【0008】[0008]

【作用】本考案のソリッド基板とフレキシブル基板との
接続構造によれば、筐体にある第1の締結手段挿通孔
に、フレキシブル基板の第2の締結手段挿通孔とソリッ
ド基板の貫通孔とを位置合わせして重ねた後に、これら
を締結手段で挿通して締結すれば、自動的に締結手段を
介してソリッド基板表面の回路パターンとフレキシブル
基板の回路パターンとが電気的に接続される。
According to the connection structure between the solid substrate and the flexible substrate of the present invention, the second fastening device insertion hole of the flexible substrate and the through hole of the solid substrate are inserted into the first fastening device insertion hole of the housing. If they are inserted and fastened by fastening means after the alignment and stacking, the circuit pattern on the solid substrate surface and the circuit pattern on the flexible board are automatically electrically connected via the fastening means.

【0009】[0009]

【実施例】以下添付図面を用いて本考案の実施例を詳細
に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

【0010】図1は本考案のソリッド基板とフレキシブ
ル基板との接続構造の一実施例の構成を説明する組立斜
視図であり、図において、1はメータ等の計器の筐体を
構成する樹脂製のケース、2はフレキシブル基板、3は
ソリッド基板、Mは締結手段、4は締結手段Mを構成す
る取付ねじ部、5は締結手段Mを構成する導通部材を示
している。
FIG. 1 is an assembly perspective view for explaining the structure of one embodiment of a connection structure between a solid substrate and a flexible substrate according to the present invention. In FIG. 1, reference numeral 1 denotes a resin made of a casing of an instrument such as a meter. , 2 is a flexible board, 3 is a solid board, M is a fastening means, 4 is a mounting screw portion constituting the fastening means M, and 5 is a conductive member constituting the fastening means M.

【0011】ケース1が薄い板状の場合には、ねじを取
り付ける部分にボス部1aが設けられて肉厚が確保され
ており、このボス部1aに第1の締結手段挿通孔を構成
するねじ穴11が設けられている。この実施例において
は、ケース1の表面側のねじ穴11の周囲に環状の凸部
12が設けられている。この環状の凸部12の高さは
0.5〜1mm程度であり、この実施例では連続したリ
ング状になっているが、凸部12は不連続であっても、
また、円周上に並んでなくても良いものである。また、
ケース1の表面側の所定箇所には後述するフレキシブル
基板2をこのケース1上で位置決めするための位置きめ
突起13が設けられている。
When the case 1 has a thin plate shape, a boss 1a is provided at a portion where a screw is to be attached to secure a sufficient thickness, and the boss 1a has a screw for forming a first fastening means insertion hole. A hole 11 is provided. In this embodiment, an annular convex portion 12 is provided around a screw hole 11 on the front side of the case 1. The height of this annular convex portion 12 is about 0.5 to 1 mm, and in this embodiment, it has a continuous ring shape, but even if the convex portion 12 is discontinuous,
In addition, they do not have to be arranged on the circumference. Also,
At a predetermined position on the front surface side of the case 1, a positioning protrusion 13 for positioning a flexible substrate 2 described later on the case 1 is provided.

【0012】フレキシブル基板2は電気絶縁性の薄いシ
ート状の柔軟な材料、例えば、ポリエステルフィルムや
ポリイミドフィルムで構成されており、その片面に回路
パターン22が形成され、所要箇所に第2の締結手段挿
通孔を構成するねじ挿通孔21および位置決め穴23が
設けられている。ねじ挿通孔21は、位置決め穴23に
前述の位置決め突起13を挿通させた状態でフレキシブ
ル基板2をケース1の上に載置した時に、ケース1上の
ねじ穴11にちょうど重なる位置に設けられている。ま
た、ソリッド基板3と電気的に接続される回路パターン
22はこのねじ挿通孔21の周りにランド部22aを形
成している。
The flexible substrate 2 is made of an electrically insulating thin sheet-like flexible material, for example, a polyester film or a polyimide film. A circuit pattern 22 is formed on one side of the flexible substrate 2, and a second fastening means is provided at a required position. A screw insertion hole 21 and a positioning hole 23 forming an insertion hole are provided. The screw insertion hole 21 is provided at a position just overlapping the screw hole 11 on the case 1 when the flexible substrate 2 is placed on the case 1 in a state where the positioning protrusion 13 is inserted through the positioning hole 23. I have. The circuit pattern 22 electrically connected to the solid board 3 forms a land 22a around the screw insertion hole 21.

【0013】また、この実施例においては、上記ランド
部22aの外側に図1に示すようにスリットSが設けら
れており、このフレキシブル基板2をケース1の上に載
置した際、ケース1上の環状の凸部12によって上記ラ
ンド部22aが押し上げられるのをこのスリットSによ
って容易化し、このランド部22aが導通部材5の底面
に容易に密着できるようになっている。
In this embodiment, a slit S is provided outside the land 22a as shown in FIG. 1, and when the flexible substrate 2 is placed on the case 1, The slit S facilitates the land portion 22 a to be pushed up by the annular convex portion 12, so that the land portion 22 a can easily adhere to the bottom surface of the conductive member 5.

【0014】ソリッド基板3は電気絶縁性の所定の厚さ
を有する樹脂板、例えば、紙基材エポキシ樹脂や紙基材
フェノール樹脂で構成されており、その片面に回路パタ
ーン32が形成されている。また、ソリッド基板3の所
要箇所にはフレキシブル基板2に設けられたねじ挿通孔
21の回りに設けられたランド部22aの直径と同じ程
度の大きさを備えた貫通孔31が設けられている。そし
て、フレキシブル基板2と電気的な接続が必要な回路パ
ターン32は、この貫通孔31の回りに形成されたラン
ドパターン33に接続している。
The solid substrate 3 is made of an electrically insulating resin plate having a predetermined thickness, for example, a paper base epoxy resin or a paper base phenol resin, and a circuit pattern 32 is formed on one surface thereof. . Further, a through hole 31 having a size approximately equal to the diameter of the land portion 22a provided around the screw insertion hole 21 provided in the flexible substrate 2 is provided at a required portion of the solid substrate 3. The circuit pattern 32 that needs to be electrically connected to the flexible substrate 2 is connected to a land pattern 33 formed around the through hole 31.

【0015】ソリッド基板3に設けられた貫通孔31に
は導電性の材料、例えば、銅または鉄で作られた締結手
段Mを構成する前記導通部材5が表面側から挿入され
る。この導通部材5にはフランジ部5aと胴部5bがあ
り、フランジ部5aの外径は前述のランドパターン33
に重なる程度の大きさを備え、フランジ部5aの下面に
はランドパターン33との接触を確実にするための小突
起52が複数個(4〜6個)設けられている。導通部材
5の胴部5bは貫通孔31の内径より僅かに小さい外径
と、ソリッド基板3の肉厚程度の長さを備えており、導
通部材5を貫通孔31に挿入した時に胴部5bの底面が
ソリッド基板3の裏面側に露出するようになっている。
また、導通部材5にはその中央部に取付ねじ4を挿通す
るための挿通孔51が設けられている。
The conductive member 5 constituting the fastening means M made of a conductive material, for example, copper or iron, is inserted into the through hole 31 provided in the solid substrate 3 from the front side. The conductive member 5 has a flange portion 5a and a body portion 5b.
A plurality (four to six) of small projections 52 are provided on the lower surface of the flange portion 5a to ensure contact with the land pattern 33. The trunk 5b of the conductive member 5 has an outer diameter slightly smaller than the inner diameter of the through hole 31 and a length approximately equal to the thickness of the solid substrate 3, and the trunk 5b is inserted when the conductive member 5 is inserted into the through hole 31. Is exposed on the back side of the solid substrate 3.
The conduction member 5 has an insertion hole 51 at the center thereof for inserting the mounting screw 4.

【0016】取付ねじ4は例えばタッピングねじであ
り、頭部4aとねじ部4bがあり、ねじ部4bはケース
1の表面側のねじ穴11に螺着するようになっている。
The mounting screw 4 is, for example, a tapping screw, and has a head portion 4a and a screw portion 4b. The screw portion 4b is screwed into a screw hole 11 on the front surface of the case 1.

【0017】図2は図1のように構成されたケース1に
フレキシブル基板2を位置決め突起13と位置決め穴2
3を合わせて取り付け、その上にソリッド基板3を載
せ、ソリッド基板3の貫通孔31に導通部材5を挿入し
て、ケース1、フレキシブル基板2、ソリッド基板3、
および導通部材5を取付ねじ4で締めつけて構成される
ソリッド基板とフレキシブル基板との接続構造を示す断
面図であり、図1と同じ構成部材には同じ符号を付して
ある。
FIG. 2 shows a case 1 constructed as shown in FIG.
3, the solid substrate 3 is placed thereon, and the conductive member 5 is inserted into the through hole 31 of the solid substrate 3, and the case 1, the flexible substrate 2, the solid substrate 3,
2 is a cross-sectional view showing a connection structure between a solid substrate and a flexible substrate formed by fastening a conductive member 5 with a mounting screw 4, and the same components as those in FIG. 1 are denoted by the same reference numerals.

【0018】以上のように構成された実施例のソリッド
基板とフレキシブル基板との接続構造では、図2に示す
ように、ケース1上の環状の凸部12がフレキシブル基
板2のランド部22aを押し上げて導通部材5の底面に
密着させて電気的な接続を行う。また、導通部材5のフ
ランジ部5aの下面に設けられた小突起52により確実
にソリッド基板3の回路パターン32に電気的に接続し
ている。
In the connection structure between the solid substrate and the flexible substrate according to the embodiment configured as described above, as shown in FIG. 2, the annular convex portion 12 on the case 1 pushes up the land portion 22a of the flexible substrate 2. The electrical connection is made by bringing the conductive member 5 into close contact with the bottom surface. In addition, the small projections 52 provided on the lower surface of the flange portion 5a of the conductive member 5 ensure reliable electrical connection to the circuit pattern 32 of the solid substrate 3.

【0019】このように図1,2に示した実施例では、
従来必要であった鳩目のような導電性部材をソリッド基
板の回路パターンに半田付けすることなく、ケース1上
の感情の凸部12と導通部材5によって直接フレキシブ
ル基板2の回路パターン22とソリッド基板3の回路パ
ターン32とを電気的に接続することができるので、シ
ンプルかつ安価なソリッド基板とフレキシブル基板との
接続構造を提供することができる。
As described above, in the embodiment shown in FIGS.
The circuit pattern 22 of the flexible board 2 and the solid board are directly connected by the convex part 12 of emotion on the case 1 and the conductive member 5 without soldering a conductive member such as an eyelet, which is conventionally required, to the circuit pattern of the solid board. Since the third circuit pattern 32 can be electrically connected, a simple and inexpensive connection structure between the solid substrate and the flexible substrate can be provided.

【0020】なお、以上説明した実施例では、ケース
1、フレキシブル基板2、ソリッド基板3、および導通
部材5を取付ねじ4で締めつけてソリッド基板とフレキ
シブル基板との接続構造を構成していたが、導通部材5
と取付ねじ4は一体化しても良く、この場合には組立工
数が減る。
In the embodiment described above, the case 1, the flexible board 2, the solid board 3, and the conductive member 5 are tightened with the mounting screws 4 to form a connection structure between the solid board and the flexible board. Conductive member 5
And the mounting screw 4 may be integrated, in which case the number of assembling steps is reduced.

【0021】図3(a) は導通部材5と取付ねじ4を一体
化して構成した締結手段Mの外観を示すものである。図
において、6aはねじ頭、6bはねじ部、6cはフラン
ジ部、6dは導通部材5を構成する胴部、6eは突起で
あり、図3(b) はこの締結手段Mを用いてソリッド基板
とフレキシブル基板との接続構造を構成した場合の断面
図であって、前述の実施例と同じ構成部材には同じ符号
を付してある。
FIG. 3 (a) shows the appearance of the fastening means M in which the conducting member 5 and the mounting screw 4 are integrated. In the figure, 6a is a screw head, 6b is a screw portion, 6c is a flange portion, 6d is a trunk portion forming the conductive member 5, 6e is a projection, and FIG. FIG. 10 is a cross-sectional view showing a case where a connection structure between the first embodiment and a flexible substrate is formed, and the same reference numerals are given to the same components as those in the above-described embodiment.

【0022】図3(a) ,(b) に示した実施例において
も、従来必要であった鳩目のような導電性部材をソリッ
ド基板の回路パターンに半田付けすることなく、ケース
1上の感情の凸部12と導通部材5を構成する胴部6d
によって直接フレキシブル基板2の回路パターン22と
ソリッド基板3の回路パターン32とを電気的に接続す
ることができるので、シンプルかつ安価なソリッド基板
とフレキシブル基板との接続構造を提供することができ
る。
In the embodiment shown in FIGS. 3 (a) and 3 (b), the conductive member such as eyelets, which has been conventionally required, is not soldered to the circuit pattern of the solid board, and the emotion on the case 1 is not changed. 6d that constitutes conductive member 5 with convex portion 12 of
Accordingly, the circuit pattern 22 of the flexible substrate 2 and the circuit pattern 32 of the solid substrate 3 can be electrically connected directly, so that a simple and inexpensive connection structure between the solid substrate and the flexible substrate can be provided.

【0023】このように、本考案のソリッド基板とフレ
キシブル基板との接続構造によれば、部品点数の削減
と、組立工数の削減の両方を図ることができる。
As described above, according to the connection structure between the solid substrate and the flexible substrate of the present invention, both the number of components and the number of assembly steps can be reduced.

【0024】[0024]

【考案の効果】以上説明したように、本考案によれば、
ソリッド基板とフレキシブル基板とを接続するに際し
て、ソリッド基板への特殊な導電性部材の取付工数がか
からず、また、コストも低減することが可能なソリッド
基板とフレキシブル基板との接続構造を提供することが
できるという効果がある。
[Effects of the Invention] As described above, according to the present invention,
Provided is a connection structure between a solid substrate and a flexible substrate, which can reduce the cost of attaching a special conductive member to the solid substrate and reduce the cost when connecting the solid substrate and the flexible substrate. There is an effect that can be.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案のソリッド基板とフレキシブル基板との
接続構造の一実施例の構成を示す組立斜視図である。
FIG. 1 is an assembly perspective view showing a configuration of an embodiment of a connection structure between a solid substrate and a flexible substrate of the present invention.

【図2】図1のソリッド基板とフレキシブル基板との接
続構造の断面図である。
FIG. 2 is a sectional view of a connection structure between a solid substrate and a flexible substrate in FIG. 1;

【図3】(a) は本考案のソリッド基板とフレキシブル基
板との接続構造に使用する締結手段の別の構成例を示す
斜視図であり、(b) は(a) のねじを使用したソリッド基
板とフレキシブル基板との接続構造の実施例の要部断面
図である。
FIG. 3 (a) is a perspective view showing another example of the structure of the fastening means used for the connection structure between the solid board and the flexible board of the present invention, and FIG. 3 (b) is a solid view using the screw of FIG. 3 (a). It is principal part sectional drawing of the Example of the connection structure of a board | substrate and a flexible board.

【図4】従来のソリッド基板とフレキシブル基板との接
続構造の構成を示す断面図である。
FIG. 4 is a cross-sectional view showing a configuration of a conventional connection structure between a solid substrate and a flexible substrate.

【符号の説明】[Explanation of symbols]

1 樹脂製のケース(筐体) 2 フレキシブル基板 3 ソリッド基板 M 締結手段 4 タッビングねじ 5 導通部材 5a,6c フランジ部 5b,6d 胴部 11 ねじ穴(第1の締結手段挿通孔) 12 凸部 13 位置あわせ突起 21 ねじ挿通孔(第2締結手段挿通孔) 22 回路パターン 22a ランド部 23 位置あわせ穴 31 貫通孔 32 回路パターン 33 ランドパターン 51 挿通孔 52 小突起 M 締結手段 DESCRIPTION OF SYMBOLS 1 Resin case (housing) 2 Flexible board 3 Solid board M Fastening means 4 Tubbing screw 5 Conducting member 5a, 6c Flange part 5b, 6d Body 11 Screw hole (first fastening means insertion hole) 12 Convex part 13 Alignment projection 21 Screw insertion hole (second fastening means insertion hole) 22 Circuit pattern 22a Land part 23 Alignment hole 31 Through hole 32 Circuit pattern 33 Land pattern 51 Insertion hole 52 Small projection M Fastening means

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 計器等の筐体の一部に、フレキシブル基
板を挟んでソリッド基板を締結手段で取り付け、このソ
リッド基板の表面側に形成された回路パターンと前記フ
レキシブル基板の回路パターンとを、前記締結手段を介
して電気的に接続する際の構造であって、 前記筐体には、前記ソリッド基板取り付け用の第1の締
結手段挿通孔の周囲に凸部を設け、この筐体に取り付け
られる前記ソリッド基板には、重ねられた時に前記凸部
の先端部を見通せる貫通孔を設けると共に、この貫通孔
の周囲に前記回路パターンを配置し、前記フレキシブル
基板には、前記ソリッド基板上の第1の締結手段挿通孔
と同程度の第2の締結手段挿通孔を設け、前記締結手段
は、前記貫通孔の周囲に設けられた回路パターンを前記
ソリッド基板の裏面側に連絡するように構成し、 前記フレキシブル基板の第2の締結手段挿通孔を前記筐
体上の第1の締結手段挿通孔に合わせた状態で前記ソリ
ッド基板を前記締結手段によって筐体上に取り付けたと
きに、前記フレキシブル基板の回路パターンが前記凸部
によって前記締結手段に当接するようにしたことを特徴
とするソリッド基板とフレキシブル基板との接続構造。
1. A solid substrate is attached to a part of a casing of an instrument or the like by a fastening means with a flexible substrate interposed therebetween, and a circuit pattern formed on a surface side of the solid substrate and a circuit pattern of the flexible substrate are A structure for electrically connecting via the fastening means, wherein the housing is provided with a convex portion around a first fastening means insertion hole for mounting the solid substrate, and is attached to the housing. The solid substrate is provided with a through-hole through which the tip of the convex portion can be seen when overlapped, and the circuit pattern is arranged around the through-hole, and the flexible substrate has a third surface on the solid substrate. A second fastening means insertion hole, which is substantially the same as the first fastening means insertion hole, is provided, and the fastening means communicates a circuit pattern provided around the through hole to the back side of the solid substrate. When the solid substrate is mounted on the housing by the fastening means in a state where the second fastening means insertion hole of the flexible substrate is aligned with the first fastening means insertion hole on the housing. A connection pattern between the solid substrate and the flexible substrate, wherein the circuit pattern of the flexible substrate is brought into contact with the fastening means by the projection.
JP470593U 1993-02-16 1993-02-16 Connection structure between solid board and flexible board Expired - Lifetime JP2533164Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP470593U JP2533164Y2 (en) 1993-02-16 1993-02-16 Connection structure between solid board and flexible board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP470593U JP2533164Y2 (en) 1993-02-16 1993-02-16 Connection structure between solid board and flexible board

Publications (2)

Publication Number Publication Date
JPH0662469U JPH0662469U (en) 1994-09-02
JP2533164Y2 true JP2533164Y2 (en) 1997-04-23

Family

ID=11591302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP470593U Expired - Lifetime JP2533164Y2 (en) 1993-02-16 1993-02-16 Connection structure between solid board and flexible board

Country Status (1)

Country Link
JP (1) JP2533164Y2 (en)

Also Published As

Publication number Publication date
JPH0662469U (en) 1994-09-02

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