JP2504167B2 - IC cap - Google Patents
IC capInfo
- Publication number
- JP2504167B2 JP2504167B2 JP4522389A JP4522389A JP2504167B2 JP 2504167 B2 JP2504167 B2 JP 2504167B2 JP 4522389 A JP4522389 A JP 4522389A JP 4522389 A JP4522389 A JP 4522389A JP 2504167 B2 JP2504167 B2 JP 2504167B2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- wave absorber
- electromagnetic wave
- ring
- inner upper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はTO−８型IC等用キャップに関し、特に電波吸
収体の固定構造に改良を施したIC用キャップに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a cap for a TO-8 type IC or the like, and more particularly to an IC cap having an improved fixing structure of a radio wave absorber.
［従来の技術］ 従来、TO−８型IC等キャップの内側に電波吸収体を取
付けるIC用キャップの電波吸収体固定構造においては、
エポキシ系接着剤を使用して電波吸収体をIC用キャップ
の内側上面部に直接接着するようにしていた。[Prior Art] Conventionally, in the electric wave absorber fixing structure of the IC cap for attaching the electric wave absorber inside the cap of the TO-8 type IC or the like,
The electromagnetic wave absorber was directly adhered to the inner upper surface of the IC cap using an epoxy adhesive.
［解決すべき課題］ 上述した従来のIC用キャップの電波吸収体固定構造に
おけるようなエポキシ系接着剤による電波吸収体の直接
接着では、電波吸収体を接着するキャップの肉厚が薄い
ため、振動または外的衝撃等により電波吸収体がキャッ
プの内面から離脱しやすく、電波吸収体がIC用キャップ
から離脱してしまうとその目的である電波吸収という機
能をほとんだ果たさなくなる。[Problems to be solved] Direct bonding of the electromagnetic wave absorber with an epoxy-based adhesive as in the above-described conventional structure for fixing the electromagnetic wave absorber of the IC cap causes vibration due to the thin wall thickness of the cap that adheres the electromagnetic wave absorber. Alternatively, the electromagnetic wave absorber is easily detached from the inner surface of the cap due to an external impact, etc., and if the electromagnetic wave absorber is detached from the IC cap, its intended function of electromagnetic wave absorption cannot be fulfilled.
このため、従来のIC用キャップは、この点で信頼性が
高くないという問題があった。Therefore, the conventional IC cap has a problem that the reliability is not high in this respect.
本発明は上述した問題点にかんがみなされたもので、
電波吸収体を接着するIC用キャップの肉厚が薄くても振
動や外的衝撃等による電波吸収体の離脱が生じにくく、
電波吸収体の固定が確実となり、信頼性を向上させるこ
とができるIC用キャップの提供を目的とする。The present invention has been made in view of the above-mentioned problems,
Even if the thickness of the IC cap to which the radio wave absorber is attached is thin, it is difficult for the radio wave absorber to come off due to vibration or external shock.
It is an object of the present invention to provide a cap for an IC, in which the electromagnetic wave absorber is securely fixed and the reliability is improved.
［課題の解決手段］ 上記目的を達成するため本発明は、内側上面部に電波
吸収体を接着するTO−８型IC等のIC用キャップにおい
て、IC用キャップの中空部の内径より広径であって一部
に空隙部を設けた弾性を有するリングで、前記電波吸収
体を前記内側上面部との間に挟んで固定し、かつ前記電
波吸収体とリングを導電性接着剤で前記内側上面部に接
着するようにした構成としてある。[Means for Solving the Problems] In order to achieve the above object, the present invention provides an IC cap, such as a TO-8 type IC, in which a radio wave absorber is adhered to the inner upper surface, and has a diameter larger than the inner diameter of the hollow portion of the IC cap. The electromagnetic wave absorber is sandwiched and fixed between the electromagnetic wave absorber and the inner upper surface portion by an elastic ring having a void portion, and the electromagnetic wave absorber and the ring are electrically conductive adhesive to the inner upper surface. It is configured to be bonded to the section.
［実施例］ 以下、本発明の一実施例について図面を参照して説明
する。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明に係るIC用キャップの電波吸収体固定
構造の一実施例について一部を破断して示す部分破断斜
視図、第２図は第１図の例に用いている電波吸収体を固
定するためのリングを拡大して示す斜視図である。1 is a partially cutaway perspective view showing an embodiment of a structure for fixing a radio wave absorber of an IC cap according to the present invention, and FIG. 2 is a radio wave absorber used in the example of FIG. It is a perspective view which expands and shows the ring for fixing.
図示の例はTO−８型ICに用いるIC用キャップに本発明
に係る電波吸収体固定構造を適用した状態を示すもの
で、図中１はIC用キャップ、２は電波吸収体、３はリン
グ、そして４は空隙部である。The illustrated example shows a state in which the electromagnetic wave absorber fixing structure according to the present invention is applied to an IC cap used for a TO-8 type IC. In the figure, 1 is an IC cap, 2 is an electromagnetic wave absorber, and 3 is a ring. , And 4 are voids.
IC用キャップ１は、サブストレート上にICを搭載して
構成したパッケージ（図示せず）上に被せるもので、下
縁につばを設けた中空円筒形状を有する。The IC cap 1 covers a package (not shown) formed by mounting the IC on a substrate, and has a hollow cylindrical shape with a collar at the lower edge.
図中２が電波吸収体で、上述したIC用キャップ１の内
面側上部に取付けられるものである。Reference numeral 2 in the figure denotes a radio wave absorber, which is attached to the upper portion of the inner surface side of the IC cap 1 described above.
また図中３がリングで、弾性を有する金属製のリング
材の一部を切り欠いて空隙４を形成したもので、周囲か
らリング径を縮める方向で外力が掛かっていない状態で
は、IC用キャップ１の中空部の内径よりも若干広径とな
るように形成してある。In addition, reference numeral 3 in the drawing denotes a ring, which is formed by cutting out a part of an elastic metal ring material to form a void 4, and when no external force is applied in the direction of reducing the ring diameter from the surroundings, the IC cap The inner diameter of the hollow portion 1 is slightly larger than the inner diameter.
即ち、まずIC用キャップ１の中空部内に電波吸収体２
を挿入し、IC用キャップ１の上面部内側に密着させる。
ついで、リング３を径を縮めた状態でIC用キャップ１内
に挿入する。この時、リング３が電波吸収体２に接触
し、かつIC用キャップ１の内側上面に接触するよう深く
挿入する。これによって、電波吸収体２をリング３の弾
性によってキャップ１の内側上面に固定する。That is, first, the electromagnetic wave absorber 2 is placed in the hollow portion of the IC cap 1.
Is inserted into the upper surface of the IC cap 1 so as to be in close contact therewith.
Then, the ring 3 is inserted into the IC cap 1 with the diameter reduced. At this time, the ring 3 is deeply inserted so as to come into contact with the radio wave absorber 2 and also with the inner upper surface of the IC cap 1. As a result, the electromagnetic wave absorber 2 is fixed to the inner upper surface of the cap 1 by the elasticity of the ring 3.
そして、エポキシ系導電性接着剤を塗布することによ
って、リング３と電波吸収体２とをIC用キャップ１の内
側上面部に一体的に接着する。Then, the ring 3 and the electromagnetic wave absorber 2 are integrally bonded to the inner upper surface of the IC cap 1 by applying an epoxy-based conductive adhesive.
［発明の効果］ 以上説明したように本発明に係るIC用キャップは、内
側上面部に電波吸収体を接着するTO−８型IC等のIC用キ
ャップにおいて、一部を切り欠いて空隙部を設けた弾性
を有するリングで前記電波吸収体を前記内側上面部との
間に挟んで固定し接着するようにしたことにより、電波
吸収体の固定が確実となり、電波吸収体を接着するIC用
キャップの肉厚が薄くても、振動や外的衝撃等による電
波吸収体のキャップの内面からの離脱が生じにくくなっ
て、信頼性を向上させることができるようになるという
効果がある。[Effects of the Invention] As described above, the IC cap according to the present invention is an IC cap such as a TO-8 type IC in which a radio wave absorber is adhered to the inner upper surface part, and a part of the cap is cut away to form a void. Since the electromagnetic wave absorber is sandwiched and fixed between the inner upper surface portion and the inner ring by the provided elastic ring, the electromagnetic wave absorber is securely fixed and the IC cap that adheres the electromagnetic wave absorber is secured. Even if the wall thickness is thin, the radio wave absorber is less likely to be separated from the inner surface of the cap due to vibration or external shock, and the reliability can be improved.
第１図は本発明に係るIC用キャップの電波吸収体固定構
造の一実施例の部分破断斜視図、第２図は第１図の例に
用いている電波吸収体を固定するためのリングを拡大し
て示す斜視図である。 1:キャップ 2:電波吸収体 3:リング 4:空隙部1 is a partially cutaway perspective view of an embodiment of a structure for fixing a radio wave absorber of an IC cap according to the present invention, and FIG. 2 shows a ring for fixing the radio wave absorber used in the example of FIG. It is an enlarged perspective view. 1: Cap 2: Electromagnetic wave absorber 3: Ring 4: Gap
Claims (1)
型IC等のIC用キャップにおいて、 IC用キャップの中空部の内径より広径であって一部に空
隙部を設けた弾性を有するリングで、前記電波吸収体を
前記内側上面部との間に挟んで固定し、かつ前記電波吸
収体とリングを導電性接着剤で前記内側上面部に接着す
るようにしたことを特徴としたIC用キャップ。1. A TO-8 in which a radio wave absorber is adhered to the inner upper surface.
In an IC cap such as a type IC, a ring having elasticity that is wider than the inner diameter of the hollow part of the IC cap and has a void in a part, and the electromagnetic wave absorber between the inner upper surface part An IC cap characterized in that it is sandwiched and fixed, and that the electromagnetic wave absorber and the ring are bonded to the inner upper surface portion with a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4522389A JP2504167B2 (en) | 1989-02-28 | 1989-02-28 | IC cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4522389A JP2504167B2 (en) | 1989-02-28 | 1989-02-28 | IC cap |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02226747A JPH02226747A (en) | 1990-09-10 |
| JP2504167B2 true JP2504167B2 (en) | 1996-06-05 |
Family
ID=12713270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4522389A Expired - Fee Related JP2504167B2 (en) | 1989-02-28 | 1989-02-28 | IC cap |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504167B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100899901B1 (en) * | 2008-10-27 | 2009-05-29 | 대한민국 | A container lid with a rfid tag |
-
1989
- 1989-02-28 JP JP4522389A patent/JP2504167B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02226747A (en) | 1990-09-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |