JPH02226747A - Cap for ic use - Google Patents
Cap for ic useInfo
- Publication number
- JPH02226747A JPH02226747A JP4522389A JP4522389A JPH02226747A JP H02226747 A JPH02226747 A JP H02226747A JP 4522389 A JP4522389 A JP 4522389A JP 4522389 A JP4522389 A JP 4522389A JP H02226747 A JPH02226747 A JP H02226747A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- wave absorber
- radio wave
- ring
- absorber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006096 absorbing agent Substances 0.000 claims abstract description 38
- 230000035939 shock Effects 0.000 abstract description 3
- 239000007767 bonding agent Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はＴｏ−８型ＩＣ等用キャップに関し。[Detailed description of the invention] [Industrial application field] The present invention relates to a cap for To-8 type IC, etc.
特に電波吸収体の固定構造に改良を施したＩＣ用キャッ
プに関する。In particular, the present invention relates to an IC cap with an improved fixing structure for a radio wave absorber.
〔従来の技術］
従来、Ｔｏ−８型ＩＣ等キャップの内側に電波゛吸収体
を取付けるＩＣ用キャップの電波吸収体固定構造におい
ては、エポキシ系接着剤を使用して電波吸収体をＩＣ用
キャップの内側上面部に直接接着するようにしていた。[Prior Art] Conventionally, in the radio wave absorber fixing structure of an IC cap in which a radio wave absorber is attached to the inside of a To-8 type IC cap, an epoxy adhesive is used to attach the radio wave absorber to the IC cap. It was intended to be directly adhered to the inner upper surface of the.
［解決すべき課題］
上述した従来のＩＣ用キャップの電波吸収体固定構造に
おけるようなエポキシ系接着剤による電波吸収体の直接
接着では、電波吸収体を接着するキャップの肉厚が薄い
ため、振動または外的衝撃°等により電波吸収体がキャ
ップの内面から離脱しやすく、電波吸収体がＩＣ用キャ
ップから離脱してしまうとその目的である電波吸収とい
う機部をほとんだ果たさなくなる。[Problems to be Solved] Direct adhesion of the radio wave absorber using an epoxy adhesive, as in the conventional IC cap fixing structure for the radio wave absorber described above, is difficult because the thickness of the cap to which the radio wave absorber is attached is thin. Alternatively, the radio wave absorber easily separates from the inner surface of the cap due to external shocks, etc., and if the radio wave absorber separates from the IC cap, it will almost no longer fulfill its purpose of absorbing radio waves.
このため、従来のＩＣ用キャップは、この点で信頼性が
高くないという問題があった。For this reason, conventional IC caps have had the problem of not being highly reliable in this respect.
本発明は上述した問題点にかんがみなされたもので、電
波吸収体を接着するＩＣ用キャップの肉厚が薄くても振
動や外的衝撃等による電波吸収体の離脱が生じにくく、
電波吸収体の固定が確実となり、信頼性を向上させるこ
とができるＩＣ用キャップの提供を目的とする。The present invention has been developed in view of the above-mentioned problems, and even if the thickness of the IC cap to which the radio wave absorber is bonded is thin, the radio wave absorber is less likely to come off due to vibrations, external shocks, etc.
The purpose of the present invention is to provide an IC cap that can securely fix a radio wave absorber and improve reliability.
［課題の解決手段］
上記目的を達成するために本発明は、内側上面部に電波
吸収体を接着するＴｏ−８型ＩＣ等のＩＣ用キャップに
おいて、一部を切り欠いて空隙部を設けた弾性を有する
リングで前記電波吸収体を前記内側上面部との間に挟ん
で固定し接着するようにした構成としである。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a cap for an IC such as a To-8 type IC, in which a radio wave absorber is adhered to the inner upper surface, by cutting out a portion to provide a void. The electromagnetic wave absorber is sandwiched and fixed between the inner upper surface part and the inner upper surface part using an elastic ring, and the electromagnetic wave absorber is bonded thereto.
［実施例］
以下、本発明の一実施例について図面を参照して説明す
る。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は本発明に係るＩＣ用キャップの電波吸収体固定
構造の一実施例について一部を破断して示す部分破断斜
視図、第２図は第１図の例に用いている電波吸収体を固
定するためのリングを拡大して示す斜視図である。FIG. 1 is a partially cutaway perspective view showing an example of the radio wave absorber fixing structure of an IC cap according to the present invention, and FIG. 2 is a radio wave absorber used in the example of FIG. It is a perspective view which expands and shows the ring for fixing.
図示の例はＴＯ−８型ＩＣに用いるＩＣ用キャップに本
発明に係る電波吸収体固定構造を適用した状態を示すも
ので、図中１はＩＣ用キ＋ −／プ、２は電波吸収体、
３はリング、モして４は空隙部である。The illustrated example shows a state in which the radio wave absorber fixing structure according to the present invention is applied to an IC cap used for a TO-8 type IC. In the figure, 1 is an IC cap, and 2 is a radio wave absorber. ,
3 is a ring, and 4 is a cavity.
ＩＣ用キャップ１は、サブストレート上にＩＣを搭載し
て構成したパッケージ（図示せず）上に被せるもので、
下縁につばを設けた中空円筒形状を有する。The IC cap 1 is intended to be placed over a package (not shown) configured by mounting an IC on a substrate.
It has a hollow cylindrical shape with a brim on the lower edge.
図中２が電波吸収体で、上述したＩＣ用キャップｌの内
面側上部に取付けられるものである。In the figure, reference numeral 2 denotes a radio wave absorber, which is attached to the upper inner surface of the above-mentioned IC cap 1.
また図中３がリングで、弾性を有する金属製のリング材
の一部を切り欠いて空隙４を形成したもので、周囲から
リング径を縮める方向で外力が掛かっていない状態では
、ＩＣ用キャップｌの中空部の内径よりも若干広径とな
るように形成しである。In addition, 3 in the figure is a ring, which has a gap 4 formed by cutting out a part of an elastic metal ring material. It is formed to have a slightly wider diameter than the inner diameter of the hollow part of the cylinder.
即ち、まずＩＣ用キャップ１の中空部内に電波吸収体２
を挿入し、ＩＣ用キャップ１の上面部内側に密着させる
。ついで、リング３を径を縮めた状１占でＩＣ用キャッ
プｌ内に挿入する。この時リング３が電波吸収体２に接
触し、かつＩＣ用キャップｌの内側上面に接触するよう
深く挿入する。That is, first, the radio wave absorber 2 is placed inside the hollow part of the IC cap 1.
is inserted and brought into close contact with the inside of the upper surface of the IC cap 1. Next, the ring 3 is inserted into the IC cap 1 with its diameter reduced. At this time, the ring 3 is deeply inserted so that it contacts the radio wave absorber 2 and contacts the inner upper surface of the IC cap 1.
そして、最後に導電性接着剤でリング３と電波吸収体２
とをＩＣ用キャップｌの内側上面部に接着し固定する。Finally, use conductive adhesive to attach ring 3 and radio wave absorber 2.
and are adhered and fixed to the inner upper surface of the IC cap l.
［発明の効果］
以上説明したように本発明に係るＩＣ用キャップは、内
側上面部に電波吸収体を接着するＴＯ−８型ＩＣ等のＩ
Ｃ用キャップにおいて、一部を切り欠いて空隙部を設け
た弾性を有するリングで前記電波吸収体を前記内側上面
部との間に挟んで固定し接着するようにしたことにより
、電波吸収体の固定が確実となり、電波吸収体を接着す
るＩＣ用キャップの肉厚が薄くても、振動や外的衝撃等
による電波吸収体のキャップの内面からの離脱が生じに
くくなって、信頼性を向上させることができるようにな
るという効果がある。[Effects of the Invention] As explained above, the IC cap according to the present invention is suitable for IC caps such as TO-8 type ICs that have a radio wave absorber adhered to the inner upper surface.
In the cap for C, the electromagnetic wave absorber is sandwiched and fixed between the inner upper surface part using an elastic ring with a gap formed by cutting out a part, and the electromagnetic wave absorber is The fixation becomes more secure, and even if the thickness of the IC cap to which the radio wave absorber is attached is thin, the radio wave absorber is less likely to come off the inner surface of the cap due to vibration or external impact, improving reliability. This has the effect of making it possible to
第１図は本発明に係るＩＣ用キャップの電波吸収体固定
構造の一実施例の部分破断斜視図、第２図はｔ５１図の
例に用いている電波吸収体を固定するためのリングを拡
大して示す斜視図である。
ｌ：キャップ
２：１を波吸収体
３：リング
４：空隙部
代理人 弁理士 渡 辺 喜 平Fig. 1 is a partially cutaway perspective view of an embodiment of the radio wave absorber fixing structure for an IC cap according to the present invention, and Fig. 2 is an enlarged view of a ring for fixing the radio wave absorber used in the example of diagram t51. FIG. L: Cap 2:1 Wave absorber 3: Ring 4: Gap agent Patent attorney Kihei Watanabe
Claims (1)
のＩＣ用キャップにおいて、 一部を切り欠いて空隙部を設けた弾性を有するリングで
前記電波吸収体を前記内側上面部との間に挟んで固定し
接着するようにしたことを特徴としたＩＣ用キヤップ。[Claims] In a cap for an IC, such as a TO-8 type IC, in which a radio wave absorber is adhered to the inner upper surface, the radio wave absorber is attached to the cap using an elastic ring that is partially cut out and has a gap. An IC cap characterized by being sandwiched between the inner upper surface part, fixed and adhesively bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4522389A JP2504167B2 (en) | 1989-02-28 | 1989-02-28 | IC cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4522389A JP2504167B2 (en) | 1989-02-28 | 1989-02-28 | IC cap |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02226747A true JPH02226747A (en) | 1990-09-10 |
| JP2504167B2 JP2504167B2 (en) | 1996-06-05 |
Family
ID=12713270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4522389A Expired - Fee Related JP2504167B2 (en) | 1989-02-28 | 1989-02-28 | IC cap |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504167B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100899901B1 (en) * | 2008-10-27 | 2009-05-29 | 대한민국 | A container lid with a rfid tag |
-
1989
- 1989-02-28 JP JP4522389A patent/JP2504167B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100899901B1 (en) * | 2008-10-27 | 2009-05-29 | 대한민국 | A container lid with a rfid tag |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504167B2 (en) | 1996-06-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |