JPH07221584A - Sealed package - Google Patents

Abstract

PURPOSE:To improve the moisture resistance of the sealed package for a crystal oscillation module or the like. CONSTITUTION:The sealed package is made up of a base plate 1 and a cap 2 sealed to an outer circumference of the base plate 1 to seal a crystal vibrator 3 and an integrated circuit element 4 or the like air-tightly, and one of the cross section of the base plate 1 and the cap 2 is formed in a flat plate, and the other cross section is formed in a channel shape. A slope face 2b onto which one end face inner circumferential ridge is pressed into contact in a line contact state is formed to the other outer circumferential part, and a sealing member 6 is filled in a gap between the other outer circumferential part and the one end face produced by the presence of the slope face 2b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for a device such as a crystal oscillation module, which is constructed by encapsulating a crystal oscillator, an integrated circuit element or the like in a single container. It concerns a container.

[0002]

2. Description of the Related Art As a conventional technique, for example, a crystal oscillation module shown in FIGS. That is, in the crystal oscillation module shown in FIG. 3, the crystal resonator 3 and the integrated circuit element 4 are mounted on the bottom surface of the recess 101a in the center of the box-shaped base substrate 101 formed in a U-shaped cross section. In addition, the base substrate 101 is sealed by a cap 102 having a flat plate cross section. Here, the base substrate 101 and the cap 10
In No. 2, the outer peripheral portion 102a of the cap 102 and the end surface 101b of the base substrate 101 are in surface contact with each other and sealed by a sealing member 106 such as an epoxy adhesive filled between them.

Further, the crystal oscillation module shown in FIG.
This is the case where the shapes of the base substrate 101 and the cap 102 in FIG. 3 are opposite. That is, the crystal oscillation module has the crystal oscillator 3 mounted on the base substrate 111 formed in a flat plate cross section.
The integrated circuit element 4 and the like are mounted and sealed by a box-shaped cap 112 having a U-shaped cross section.

[0004]

In the conventional crystal oscillation module, the end face of the base substrate, which is the sealing container, and the cap are in contact with each other, and the outer peripheral portion of the cap is flat, and the sealing member ( In general, the moisture resistance is poor), so even if the base substrate and the cap itself have high moisture resistance, moisture (moisture) in the external environment will escape from the layer of the sealing member formed after the sealing member is cured. Sometimes it got inside. The infiltration of moisture (water) into the sealed container causes a change in the output characteristics of the crystal oscillation module, and in extreme cases, it may cause output stoppage. The sealed container of 1 had a problem in long-term moisture resistance.

Therefore, the present invention is intended to improve the moisture resistance of a sealed container used for sealing a crystal oscillation module or the like.

[0006]

In order to achieve the above object, in the present invention, in order to hermetically seal a crystal oscillator, an integrated circuit element or the like, a base substrate and an outer periphery of the base substrate are sealed. In a sealed container that is configured by a cap, and one of the base substrate and the cap is formed in a flat plate-shaped cross section and the other is formed in a U-shaped cross section, one outer peripheral portion has a line with the inner peripheral edge portion of the other end surface. An inclined surface that abuts in a contact state is formed, and a sealing member is filled in a gap between one outer peripheral portion and the other end surface caused by the existence of the inclined surface.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the preferred embodiments shown in the accompanying drawings.

FIG. 1 shows a sectional view of a crystal oscillation module which is an embodiment using the sealed container of the present invention.

Base substrate 1 formed of ceramics or the like
Is a box type having a U-shaped cross section. A circuit pattern 5 such as a crystal resonator connecting pattern 5a and a die bonding pattern 5b is laid on the recess 1a of the base substrate 1 by a well-known circuit technique such as screen printing. The integrated circuit element 4 is die-bonded on the die-bonding pattern 5b and wire-bonded to the predetermined pattern by the wire 4a. The crystal unit 3 is attached by attaching and holding a holding member 3a formed of a leaf spring or the like on which the crystal unit 3 is mounted on the crystal unit connection pattern 5a.

The cap 2 made of metal, ceramics or the like is formed in a flat plate shape in cross section, but an inclined surface 2b is formed on the outer peripheral portion 2a of the cap which contacts the inner peripheral edge portion 1c of the end surface of the base substrate 1. ing. Therefore, since the inclined surface 2b is formed on the outer peripheral portion 2a of the cap 2, the base substrate 1 and the cap 2 are in line contact with each other.

The outer peripheral portion 2a of the cap 2 caused by the presence of the inclined surface 2b formed on the outer peripheral portion 2a of the cap 2.
A gap between the end surface 1b of the base substrate 1 and the base substrate 1 is filled with a sealing member 6 such as an epoxy adhesive. By filling the sealing member 6, the crystal unit 3 and the integrated circuit element 4 arranged in the recess 1a of the base substrate 1 are hermetically sealed.

The crystal oscillating module shown in FIG. 2 has the base substrate 11 and the cap 12 whose shapes are opposite to those of the embodiment shown in FIG. 1, and is formed on the base substrate 11 having a flat cross section. Box-shaped cap 1 in which a crystal oscillator 3 and an integrated circuit element 4 are mounted and which is formed in a U-shaped cross section.
It is formed by sealing at 2.

In the case of FIG. 2 as well, as in the case of FIG. 1, a slanted surface 11b is formed on the outer peripheral portion 11a of the ceramic base substrate 11 formed in a flat plate shape in cross section, and the crystal oscillator 3 and the integrated circuit are integrated. At the time of sealing the circuit element 4 and the like, the inner peripheral edge portion 12c of the metal or ceramic cap 12 and the inclined surface 11b of the outer peripheral portion 11a of the base substrate 11 are in line contact with each other. The space between the outer peripheral portion 11a of the base substrate 11 and the end surface 12b of the cap 12 is filled with a sealing member 6 such as an epoxy adhesive, and the crystal unit 3 disposed on the base substrate 11 or The integrated circuit element 4 and the like are hermetically sealed in the recess 12a of the cap 12.

In the case of the conventional sealed container, the layer of the sealing member 106, which is filled between the base substrate 101 and the cap 102 for sealing, has a uniform thickness from the outside to the inside of the sealed container. And it's done (see Figure 3),
Moisture (moisture) from the outside is passed through the layer of the sealing member 106 into the inside of the sealed container, and there is a problem in moisture resistance as a sealed container for the crystal unit 3, the integrated circuit element 4, etc. In the embodiment, since the base substrate 1 and the cap 2 constituting the sealing container are in line contact with each other, the layer of the sealing member 6 interposed between the contacting portions of the two is the base substrate 1. Since the cap 2 and the cap 2 are formed to be extremely thin in the range where they are in line contact with each other, the infiltration of moisture (moisture) into the sealed container is more effective than the conventional sealed container. It becomes possible to prevent it.

[0015]

According to the structure of the present invention, almost no moisture (moisture) is allowed to pass through the inside of the sealing member, so that a sealed container, such as a crystal oscillation module, which requires airtight sealing, has excellent moisture resistance. It becomes a sealed container.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a crystal oscillation module that is an embodiment using the sealed container of the present invention.

FIG. 2 is an example showing a case where the base substrate and the cap of the example shown in FIG. 1 have opposite shapes.

FIG. 3 is an example showing a conventional crystal oscillation module.

FIG. 4 is a conventional example showing a case where the base substrate and the cap of the embodiment shown in FIG. 3 have opposite shapes.

[Explanation of symbols]

 1 Base Substrate 1b End Face 1c End Face Inner Edge 2 Cap 2a Outer Perimeter 2b Inclined Surface 3 Quartz Resonator 4 Integrated Circuit Element 6 Sealing Member

Claims (1)

[Claims] 1. A base substrate and a cap sealed to the outer periphery of the base substrate in order to hermetically seal a crystal oscillator, an integrated circuit device or the like, and one of the base substrate and the cap is provided. In a sealed container having a flat cross-section and a U-shaped cross-section, the one outer periphery has an inclined surface with which the inner peripheral edge of the other end abuts in line contact. The sealing container is filled with a sealing member in a gap between the one outer peripheral portion and the other end surface caused by the presence of the inclined surface.