JPS61214496A - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a hybrid integrated circuit device.

[Conventional technology]

FIG. 2 is a schematic cross-sectional view showing a conventional hybrid integrated circuit device wt, showing a state in which a chip component 3 is temporarily attached to an electrode 2 on an integrated circuit board 1 with an adhesive 4 and then soldered with a solder 5. It is something.

In the conventional hybrid integrated circuit device as described above, a printing machine is used to print an appropriate amount of adhesive 4 for temporary bonding between the electrodes 2 constituting the components on the integrated circuit board 1, and then the chips are bonded together. V-thing part 3'.

After applying the adhesive 4, the integrated circuit board 1 is subjected to solder dipping, whereby the chip component 3 is soldered between the electrodes 2 with the solder 5, and the assembly of the hybrid integrated circuit device is completed.

[Problem that the invention seeks to solve]

However, in the case of tacking using the conventional adhesive 4, the printed film thickness of the ff1 adhesive 4 is constant due to variations in the physical properties of the adhesive 4 and variations in printing conditions, etc. could not be obtained, and even if chip part 3 was placed, it could not be temporarily attached.

There were problems such as too much adhesive 4 adhering to the electrodes 2 and chip components 3, resulting in appearance or electrical defects.

This invention was made to solve the above problems, and it is designed to maintain a constant film thickness when adhesive is applied and to prevent bonding defects during temporary bonding of parts to be adhered. The object of the present invention is to provide a hybrid product circuit device that can be assembled by using the following methods.

[Means for solving problems]

The hybrid integrated circuit device of the present invention mixes a stable substance consisting of a solid substance of a predetermined shape, such as silica or alumina, into an adhesive for temporarily attaching layer components to be bonded, and uses this adhesive. This is for temporarily attaching parts to be adhered.

[Effect]

In this invention, since a stable substance having a predetermined shape is mixed into the adhesive, the adhesive coated on the integrated circuit board can have a constant thickness.

〔Example〕

FIG. 1 is a schematic sectional view of a hybrid integrated circuit device showing an embodiment of the present invention. In FIG. 1, -40 is an adhesive used for temporarily attaching parts to be bonded according to the present invention, 41 is a stable substance of a predetermined shape such as silica or alumina mixed in the adhesive 40, and the others are secondary FIG. 9 is the same as FIG. 3.

Next Km arrival process will be explained.

A 40% adhesive used for temporary attachment of the bonded components according to the present invention is printed between the electrodes 2 on which the bonded components 1, for example, the chip components 3, are to be placed on the integrated circuit board 1. Since the adhesive 40 is impregnated with a stable substance 41 having a certain shape to obtain an appropriate printing film thickness, the thickness of the printed adhesive 40 is kept constant depending on its size. Therefore, when the chip component 3 is temporarily attached, there is too little adhesive 40.

Also, there is no possibility of poor adhesion due to too much.

In the above embodiment, the description has been made regarding the chip component 3, but the present invention can be similarly applied to other components that need to maintain a gap with the integrated circuit board.

In addition, in the above embodiment, the printing method was explained, but
In addition to this, for example, even if the adhesive 40 is applied by a dispensing method, the adhesive 4 (l) containing this stable substance 41 may be used.
By using K, a stable film thickness can be obtained.

〔Effect of the invention〕

As explained above, in this invention, a stable @'X' having a predetermined shape is mixed into the adhesive, so that the adhesive spread over the integrated circuit board can maintain a constant film thickness. There is an advantage that a hybrid integrated circuit device with a high yield can be obtained since there is no possibility of defective parts in the contact layer due to too little or too much agent.

[Brief explanation of drawings]

FIG. 1 is a partial sectional view of a hybrid integrated circuit device showing an embodiment of the present invention, and FIGS. 2 and 3 are partial sectional views of a conventional hybrid integrated circuit device. In the figure, 1 is an integrated circuit board, 2 is an electrode, 3 is a chip component, 5 is solder, 40 is an adhesive for temporary bonding, and 41 is a stable substance. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Figure 3 Procedural amendment (voluntary)

Claims (1)

[Claims] In a hybrid integrated circuit device in which an adhesive is applied onto an integrated circuit board, parts to be adhered are temporarily attached with the adhesive, and then soldered between electrodes on the integrated circuit board, a required film is added to the adhesive. A hybrid integrated circuit device characterized in that a stable substance having a predetermined shape that can obtain a thickness is mixed therein.