JP3091573B2 - Vacuum deposition equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a metal deposition apparatus.
In particular, the present invention relates to an apparatus for depositing Co or a Co alloy.

[0002]

BACKGROUND OF THE INVENTION vacuum chamber to generate an electron beam from an electron gun, which squeezed the lens and the spot, by colliding the metal to be evaporated contained in a crucible
This is dissolved, the metal vapor evaporated from lysed high temperature metal process for depositing to the substrate is performed. Such technology is disclosed in Japanese Patent Publication No. Hei 3-41897 and Japanese Patent Publication No. Hei 3-383.
No. 40, JP-A-59-178626, JP-A-3-126
823, etc.

In a vacuum deposition apparatus using such an electron gun, a high-energy electron beam emitted from the electron gun travels straight toward a crucible. The crucible is usually a rectangular shape elongated in the width direction of the substrate, and the electron beam is scanned along the length of the crucible under the action of a deflecting magnetic field or electric field in order to heat the metal surface of the crucible almost uniformly. For example, when manufacturing an obliquely oriented vapor-deposited metal magnetic recording medium, C
o or Co alloy metal is stored in a crucible (boat) made of high-purity magnesia (MgO) and a maximum of 30 kV
The electron beam is made to travel straight toward the crucible at a moderate acceleration voltage to collide with the metal. At that time, the metal is uniformly heated by scanning the electron beam in the length direction of the crucible (and also in the width direction in some cases) (Japanese Patent Publication No. 3-41897).

[0004] In the above-mentioned conventional vapor deposition method, a sufficient adhesion strength of the vapor-deposited metal to the substrate cannot be secured, and a vapor-deposited film having sufficient durability cannot be provided. The cause is that the electron beam power is about 120 to 150 kW (about 4 to 5 A at 30 kV)
In this case, the electrons ejected from the surface of the molten metal together with the metal vapor and the electrons from the electron gun repel each other, so that the electrons cannot be converged, the effective power cannot be increased to about 100 kW or more, and the steam speed is sufficiently improved. Because he couldn't. Here, the effective power is a power in a range where the evaporation rate changes depending on the power of the electron gun (for example, 100 to
If the evaporation rate does not change even when 150 kW is applied, the maximum effective power is 100 kW) .

The effective power of the electron gun is determined by arranging the axis of the electron beam emitted from the electron gun at a right angle with the axis connecting the center of the rectangular crucible and the center of the opening. It has been found that it can be greatly increased by deflecting almost at right angles to form an image in the crucible.

More specifically, such an apparatus is provided with an elongated crucible containing a metal to be evaporated, an electron gun for generating an electron beam directed into the crucible, and provided opposite the crucible. A rotating drum, supply and winding means for feeding a plastic substrate along the surface of the rotating drum, a mask provided along the surface of the rotating drum and having an opening partially facing the crucible, and the mask This can be realized in a vacuum deposition apparatus including a shutter member for opening and closing. Such a deposition apparatus is, for example, C
An o or Co alloy can be used for producing a magnetic recording medium having oblique anisotropy by obliquely depositing it on polyester (PET or the like). At that time, the oxygen during the deposition for the purpose of adjusting the magnetic properties, carbon dioxide, nitrogen, ammonia, a gas such as styrene, to be particularly introduction of oxygen have been made (Japanese <br/> fairness 3-41897 issue). That is, the gas is discharged from a supply nozzle having a slit-shaped outlet. An equalizing tank may be used between the gas supply and the nozzle to keep the flow distribution of the released gas constant.

[0007]

When the power of the electron gun is increased, the vapor deposition metal adheres to the member on the crucible side of the shutter or the mask at a high temperature, and the temperature of the nozzle is increased. Deform the wall around the slit outlet. If the dimension of the short side direction of the nozzle outlet is defined as height and the dimension of the long side direction is defined as width, the height changes due to thermal deformation, so that the flow rate becomes uneven in the width direction, and thus the characteristics of the deposited film, for example, vertical When the orientation is another magnetic recording medium, the magnetic properties of the product vary from place to place in the width direction. Therefore, a means for making the flow rate distribution in the width direction of the gas supply nozzle constant is required.

Another problem is that even if the height of the slit-shaped outlet is constant, the gas flowing from the supply source is likely to fluctuate in the width direction. The flow rate may fluctuate, and unless the distance to the drum (can) is reduced as much as possible, the influence of the fluctuation becomes conspicuous. However, to avoid the effects of high heat and extend the life of the nozzle, it is necessary to pull the nozzle as far away from the drum as possible. Therefore, it is necessary to provide a means capable of keeping the flow rate distribution in the width direction constant even when the distance between the drum and the nozzle is increased.

Further, if the nozzle is located at a fixed position, even if the shutter is opened and closed in order to adjust the angle of incidence of the metal vapor, the gas supply position does not interlock with the opening and closing, so that proper gas supply cannot be performed. Accordingly, it is an object of the present invention to provide a means capable of supplying an appropriate gas even when adjusting the incident angle.

[0010]

The vacuum deposition instrumentation of the present invention, in order to solve the problems],
A crucible containing the metal to be evaporated, an electron gun for generating an electron beam directed into the crucible, a rotating drum provided opposite the crucible, for feeding a plastic substrate along the surface of the rotating drum Supply and take-up means, a mask provided along the surface of the rotating drum and partially having an opening facing the crucible, a shutter member for opening and closing the mask, and directing from the opening toward the drum A gas supply nozzle arranged to discharge a gas, characterized in that the supply nozzle has a predetermined height, width and depth formed by opposing walls.
And a reinforcing rib extending in the height direction between the opposed wall surfaces at predetermined intervals in the width direction of the slit. According to another aspect, the supply nozzle is attached to an edge of the shutter member on the opening side. According to another embodiment, the supply nozzle, where it is formed by the opposing wall surface
An exit slit having a constant height, width and depth , wherein the depth of the exit slit is three times or more the height of the slit;
An equalizing tank is further provided upstream of the outlet slit.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows a vapor deposition apparatus 1 of the present invention. However, the illustrated portion is housed in a vacuum chamber (not shown) and has a predetermined exhaust device. 3 is a rotating drum that rotates in the direction of arrow (or the opposite direction), the base film 5 such as polyester constituting the deposition substrate is passed over therearound, through the peripheral surface of the feed roll 9 or et rotary drum 3 To be taken up by the take-up roll 7. A mask 11 partially open is provided in the vicinity of the rotating drum 3 so that the deposited metal is not deposited on the film 5 except at a predetermined angle. A shutter 13 is provided along the outer surface (or inner surface) of the mask 11, and slides in the directions of arrows at the beginning and end of the vapor deposition to shield the opening of the mask 11, thereby preventing unnecessary vapor deposition. Mask 11
Are selected such that a predetermined vapor deposition width is obtained on the film 5 in the axial direction of the rotary drum 3 and a predetermined vapor deposition angle θ is obtained on the film in the circumferential direction of the rotary drum. . The gas supply nozzle 25 for introducing gas such as oxygen is disposed between the shutter motor 1 3 and the mask 11.

A crucible 15 made of high-purity magnesia (MgO) or the like is arranged opposite to the opening of the mask 11, and a raw material metal 17 to be vapor-deposited therein is charged therein. Crucible 1
Numeral 5 extends in the axial direction of the rotating drum 3 elongate enough to obtain a required vapor deposition width. The crucible 15 is arranged such that a predetermined vapor deposition angle θ (which slightly varies depending on the position in the opening of the mask) is obtained. The raw metal 17 charged in the crucible 15 is heated by an electron beam 21 emitted from an electron gun 19. In this onset bright electron beam 2 of an electron gun 19
The electron beam 21 is emitted in a direction substantially at 90 degrees to the line connecting the crucible 15 and the opening of the mask 11 in the emission direction 1. This electron beam is bent by about 90 degrees by the action of a magnetic field 23 by a suitable condenser lens, converging lens, and deflection coil (not shown), and at the same time is converged into a small spot and collides with the raw metal 17. According to experiments, Figure 1
It has been found that a great increase in power can be achieved as compared with the conventional straight-type electron gun 19 'arranged at the position of the dashed line.

The minimum angle of incidence .theta.min is different from the optimum angle depending on the application.
o-Ni alloy by oblique evaporation on a substrate film of polyethylene <br/> stearyl le such as polyethylene terephthalate, if you want to obliquely easy magnetization direction with respect to the substrate, the minimum incident angle θmi
n is 10 ° to 60 °, preferably 20 ° to 50 °. Examples of the Co alloy include those described in Japanese Patent Publication No. 3-41897.

The specific operation of the apparatus shown in FIG. 1 is as follows. The average minimum incident angle θmin is 30 degrees, and the average distance between the liquid surface of the crucible and the evaporation surface of the rotating drum 3 is about 30 degrees.
0 mm, the opening width of the mask was 500 mm, the vacuum chamber was evacuated to 1 × 10 ⁻⁵ Torr, and a polyethylene terephthalate film (PET) having a thickness of 7 μm was 100 μm.
２５０250 m / min, and the Co-Ni alloy (8
0:20), the driving power of the electron gun 19 × 40 kV × (3 to 5 A) = 1 while intermittently supplying the pellets to the crucible 15.
Dissolve at 20 to 200 kW and perform vapor deposition. The film transport speed is adjusted while keeping the power of the electron gun constant, so that the deposited film thickness is about 1800 °. Gas deposition nozzle 2 during deposition
The amount of the gas containing oxygen as a main component introduced from Step 5 is also adjusted appropriately to form a film so as to obtain equivalent magnetic characteristics. Next, a specific embodiment of the gas supply nozzle 25 will be described.

FIG. 2 is a perspective view of a gas supply nozzle according to the present invention. Gas is introduced from a supply pipe 27 into a pressure equalizing tank 29. The equalizing tank 29 diffuses the introduced gas and adjusts the whole to a constant pressure, and then the inner surface dimensions are height h and width w.
And a slit (31) having a depth (length) t. These dimensions are designed in advance according to the purpose of use,
The flow rate is adjusted by the supply pressure. The height h is constant, w is at least the vapor deposition width, and t is as long as possible without affecting the design in order to direct the gas flow as far as possible while keeping it uniform. Preferably, the desired effect can be obtained by setting the height to 5 times the slit height. The slit portion 31 is provided with reinforcing ribs 35 having preferably a streamlined front end and a rear end at least on the outlet side at regular intervals in the width direction of the slit and so as to pass between opposed parallel walls of the slit. is there. These reinforcing ribs are for suppressing the fluctuation of the slit height h due to thermal strain. In contrast to the conventional nozzle in which t is not particularly taken into consideration, if t is at least three times the height of the slit, the distance between the nozzle and the drum is 5 cm, whereas in the case of the present invention it is 10 cm.
Even if an interval is provided, the diffusion state becomes the same.

[0016] Figure 4 shows a nozzle which is fixed to a surface of the shutter motor 1 3. The nozzle 25 is positioned behind the opening side edge 37 of the mask to avoid the influence of the evaporated metal. Since the nozzle can move together with the shutter, it can cope with a change in the incident angle.

[0017]

As described above, according to the present invention, it is possible to provide a gas supply nozzle having a uniform flow rate distribution of a supply gas, capable of directing the gas to a distant place, or easily adapting to a change in the angle of incidence of metal vapor.

[Brief description of the drawings]

FIG. 1 is a view showing an embodiment of a vapor deposition apparatus of the present invention.

FIG. 2 is a perspective view of a gas supply nozzle of the present invention.

FIG. 3 is a partial sectional plan view of the gas supply nozzle of the present invention.

FIG. 4 is a diagram showing a relationship between a gas supply nozzle and a shutter according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 vapor deposition device 3 rotating drum 5 base film 7 take-up roll 9 feeding roll 11 mask 13 shutter 15 crucible 17 raw metal 19 electron gun 21 electron beam 23 deflection magnetic field 25 gas supply nozzle 27 supply pipe 29 equalizing tank 31 slit section 33 exit 35 Reinforcing rib

Continuation of the front page (72) Inventor Toshiyuki Otsuka 1-1-13 Nihonbashi, Chuo-ku, Tokyo TDC Corporation (72) Inventor Shinji Miyazaki 1-1-13 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (56) References JP-A-63-213118 (JP, A) JP-A-63-24057 (JP, A) JP-A-61-214136 (JP, A) JP-A-62-287426 (JP, A) Kaihei 4-63114 (JP, U) JP-B-60-37531 (JP, B2) (58) Fields investigated (Int. Cl. ⁷ , DB name) C23C 14/00-14/58

Claims (3)

(57) [Claims] 1. A crucible containing a metal to be evaporated, an electron gun for generating an electron beam directed into the crucible, a rotating drum provided opposite the crucible, and a surface along the rotating drum. Supply and winding means for feeding a plastic substrate, a mask provided along the surface of the rotary drum and having an opening partially facing the crucible;
In a vacuum deposition apparatus including a shutter member for opening and closing the mask, and a gas supply nozzle arranged to emit a gas directed from the opening toward the drum, the supply nozzle is formed by opposed wall surfaces. Having an exit slit of predetermined height, width and depth ,
Said exit slit, said at predetermined intervals in the width direction of the outlet slit, a vacuum vapor deposition apparatus characterized by having a reinforcing rib extending in the opposing plugged in the height direction passed the depth direction between the wall surface. 2. A crucible containing a metal to be evaporated, an electron gun for generating an electron beam directed into the crucible, a rotating drum provided opposite the crucible, and a surface along the rotating drum. Supply and winding means for feeding a plastic substrate, a mask provided along the surface of the rotary drum and having an opening partially facing the crucible;
In a vacuum deposition apparatus comprising a shutter member for opening and closing the mask, and a gas supply nozzle arranged to emit a gas directed from the opening toward the drum, the supply nozzle is provided by the shutter member. A vacuum evaporation apparatus, which is attached to an edge on the opening side. 3. A crucible containing a metal to be evaporated, an electron gun for generating an electron beam directed into the crucible, a rotating drum provided opposite to the crucible, and along a surface of the rotating drum. Supply and winding means for feeding a plastic substrate, a mask provided along the surface of the rotary drum and having an opening partially facing the crucible;
In a vacuum deposition apparatus including a shutter member for opening and closing the mask, and a gas supply nozzle arranged to emit a gas directed from the opening toward the drum, the supply nozzle is formed by opposed wall surfaces. Having an exit slit of predetermined height, width and depth ,
The depth of the exit slit is 3 times the height of the exit slit.
A vacuum evaporation apparatus, wherein an equalizing tank is further provided upstream of the exit slit.