JPH05339718A - Vacuum vapor deposition device - Google Patents

Abstract

PURPOSE:To supply gas, such as oxygen, with a uniform distribution to a vacuum vapor deposited film. CONSTITUTION:This vacuum vapor deposition device consists of a crucible 15 for housing a metal to be evaporated, an electron gun 19 for generating an electron beam 2 to be directed within this crucible 15, a rotary drum 3 provided to face this crucible 15, supply and take-up means 9, 7 for feeding a plastic base body 5 along the surface of this rotary drum 3, a mask 11 which is provided along the surface of the rotary drum 3 and has an aperture partly facing the crucible 15, a shutter member 13 for closing and opening the mask and a gas supply nozzle 25 disposed to release the gas from this opening toward the drum 3. This gas supply nozzle 25 has an outlet slit formed by wall surfaces facing each other. This slit has a reinforcing rib spanned between the wall surfaces facing each other at a prescribed spacing in its longitudinal direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal vapor deposition apparatus,
In particular, it relates to a vapor deposition apparatus for Co or Co alloy.

[0002]

2. Description of the Related Art In a vacuum chamber, an electron beam is generated from an electron gun, which is made into a spot by squeezing it by a lens and colliding with a metal to be evaporated contained in a crucible and melting it to melt and melt it. A method of evaporating a metal vapor from a temperature metal to deposit it on a substrate is used. Such techniques are disclosed in Japanese Examined Patent Publication No. 3-41897 and Japanese Examined Patent Publication No. 3-3.
8340, JP-A-59-178626, JP-A-3-1.
No. 26823 and the like.

In a vacuum vapor deposition apparatus using such an electron gun, a high energy electron beam emitted from the electron gun is made to go straight toward a crucible. The crucible is usually in the shape of a rectangle elongated in the width direction of the substrate, and the electron beam is scanned in the length direction of the crucible under the action of a deflecting magnetic field or electric field in order to heat the metal surface of the crucible almost uniformly. For example, when manufacturing a vapor-deposited metal magnetic recording medium of oblique orientation type, C
O or Co alloy metal is housed in a crucible (boat) made of high-purity magnesia (MgO), and maximum 30kV from electron gun
With an accelerating voltage of a certain degree, the electron beam is directed straight toward the crucible and collides with the metal. At that time, the electron beam is scanned in the length direction of the crucible (and in the width direction in some cases) to uniformly heat the metal (Japanese Patent Publication No. 3-41897).

In the above conventional vapor deposition method, sufficient adhesion strength of the vapor deposited metal to the substrate cannot be ensured, and a vapor deposited film having sufficient durability cannot be provided. The cause is that the electron beam power is about 120 to 150 kW (about 4 to 5 A at 30 kV).
In the above case, the electrons ejected from the surface of the molten metal together with the metal vapor and the electrons from the electron gun repel each other and the electrons cannot be converged, and the effective power cannot be increased to about 100 kW or more, and the vapor velocity is sufficiently improved. Because I couldn't. Here, the effective power is a power in a range in which the evaporation rate changes depending on the power of the electron gun (for example, 100 to 100).
If the evaporation rate does not change even after adding 150 kW, the maximum effective power is 100 kW). is there.

The effective electric power of the electron gun is arranged by intersecting the axis of the electron beam emitted by the electron gun with the axis connecting the center of the rectangular crucible and the center of the opening substantially at right angles, and by applying a magnetic field to the electron beam. It has been found that a substantial increase can be obtained by deflecting the light at a substantially right angle to form an image in the crucible.

More specifically, such an apparatus is provided so as to face an elongate crucible containing a metal to be vaporized, an electron gun for generating an electron beam directed in the crucible, and the crucible. A rotating drum, a feeding and winding means for feeding a plastic substrate along the surface of the rotating drum, a mask provided along the surface of the rotating drum, a mask having a part of the opening facing the crucible, and the mask. It can be realized in a vacuum vapor deposition apparatus including a shutter member for opening and closing. Such a vapor deposition device is, for example, C
The o or Co alloy can be used for producing a magnetic recording medium having oblique anisotropy by obliquely depositing it on polyester (PET or the like). At that time, a gas such as oxygen, carbon dioxide, nitrogen, ammonia, styrene or the like, particularly oxygen is introduced during vapor deposition for the purpose of adjusting magnetic properties (Japanese Patent Publication No. Sho 41-41897). That is, the gas is discharged from a supply nozzle having a slit-shaped outlet. A pressure equalizing tank may be used between the gas supply source and the nozzle to keep the flow rate distribution of the discharged gas constant.

[0007]

When the power of the electron gun is increased, the vapor-deposited metal adheres to the member of the shutter or the mask on the side of the crucible at a high temperature to raise the temperature of the nozzle, and thermal stress causes slits. Deform the wall around the vent. If the dimension of the nozzle outlet in the short side direction is defined as the height and the dimension in the long side direction is defined as the width, the height changes due to thermal deformation, so the flow rate becomes non-uniform in the width direction, and the characteristics of the deposited film such as vertical When the orientation is another magnetic recording medium, the magnetic characteristics of the product vary from place to place in the width direction. Therefore, it is necessary to provide a means for making the flow rate distribution in the width direction of the gas supply nozzle constant.

Another problem is that even if the height of the slit-shaped outlet is constant, the gas flowing from the supply source is likely to fluctuate in the width direction, and even if a pressure equalizing tank is used, the flow rate at the downstream side is increased. May fluctuate, and the effect of fluctuations becomes noticeable unless the distance to the drum (can) is made as small as possible. However, in order to avoid the effects of high heat and extend the life of the nozzle, it is necessary to separate the nozzle from the drum as much as possible. Therefore, even if the distance between the drum and the nozzle is increased, a means that can keep the flow rate distribution in the width direction constant is required.

Further, if the nozzle is fixed, even if the shutter is opened / closed to adjust the incident angle of the metal vapor, the gas supply position is not linked accordingly, so that proper gas supply cannot be performed. Therefore, an object of the present invention is to provide a means capable of supplying an appropriate gas even when adjusting the incident angle.

[0010]

A vacuum vapor deposition apparatus according to the present invention is provided with a crucible containing a metal to be evaporated, an electron gun for generating an electron beam directed in the crucible, and a crucible facing the crucible. Rotary drum, feeding and winding means for feeding a plastic substrate along the surface of the rotary drum, mask provided along the surface of the rotary drum and having a part of the opening facing the crucible, the mask And a gas supply nozzle arranged so as to discharge gas directed toward the drum from the opening, and the supply nozzle is characterized by an outlet slit formed by facing wall surfaces. The slits have reinforcing ribs which are arranged between the opposed wall surfaces at predetermined intervals in the longitudinal direction thereof. According to another aspect, the supply nozzle is attached to an edge portion of the shutter member on the opening side. According to still another aspect, the supply nozzle has an outlet slit formed by the opposing wall surfaces, the depth of the outlet slit is three times or more the height of the slit, and the upstream side of the outlet slit is Further, it is characterized in that a pressure equalizing tank is provided.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows a vapor deposition apparatus 1 of the present invention. However, the illustrated portion is housed in a vacuum chamber (not shown) and has a predetermined exhaust device. 3 is a rotating drum that rotates in the direction of the arrow (or the opposite direction),
A base film 5 made of polyester or the like, which constitutes a vapor deposition base, is passed around it, and is wound around a winding roll 7 from a pay-out roll 9 through the peripheral surface of the rotary drum 3. A mask 11 having an opening is provided in the vicinity of the rotary drum 3 so that the vapor deposition metal is not vapor deposited on the film 5 except at a predetermined angle. A shutter 13 is provided along the outer surface (or inner surface) of the mask 11, and it is slid in the direction of the arrow in the initial and final stages of vapor deposition to block the opening of the mask 11 to prevent unnecessary vapor deposition. Mask 11
The size of the opening is selected so that a predetermined vapor deposition width can be obtained on the film 5 in the axial direction of the rotary drum 3 and a predetermined vapor deposition angle θ can be obtained on the film in the circumferential direction of the rotary drum. . A gas supply nozzle 25 is arranged between the shutter 13 and the mask 11 to introduce a gas such as oxygen.

A crucible 15 made of high-purity magnesia (MgO) or the like is arranged so as to face the opening of the mask 11, and a raw material metal 17 to be vapor-deposited is charged therein. Crucible 1
Reference numeral 5 is elongated in the axial direction of the rotary drum 3 sufficiently to obtain a required vapor deposition width. The crucible 15 is arranged so as to obtain a predetermined vapor deposition angle θ (which slightly varies depending on the position in the opening of the mask). The raw metal 17 charged in the crucible 15 is heated by the electron beam 21 emitted from the electron gun 19. According to the present invention, the electron beam 21 of the electron gun 19 is emitted in a direction forming an angle of about 90 degrees with respect to the line connecting the crucible 15 and the opening of the mask 11. This electron beam is bent by about 90 degrees by the action of a magnetic field 23 by an appropriate condenser lens, a converging lens, and a deflection coil (not shown), and at the same time, it is converged into a small spot and collides with the raw material metal 17. Experiments have shown that a significant increase in power can be achieved as compared to the conventional straight-ahead electron gun 19 'arranged at the chain line position in FIG.

The optimum minimum angle of incidence θ min depends on the application, but especially Co or Co for magnetic recording media is used.
-If the Ni alloy is obliquely vapor-deposited on a base film such as polyester such as polyethylene terephthalate to make the easy magnetization direction oblique to the base, the minimum incident angle θmi
n is 10 ° to 60 °, preferably 20 ° to 50 °. Examples of the Co alloy include those described in Japanese Patent Publication No. 3-41897.

A specific operation example of the apparatus of FIG. 1 is as follows. The average minimum incident angle θ min is 30 degrees, and the average distance between the liquid surface of the crucible and the vapor deposition surface of the rotating drum 3 is about 300.
mm, the opening width of the mask is 500 mm, the vacuum chamber is evacuated to 1 × 10 ⁻⁵ Torr, and a polyethylene terephthalate film (PET) having a thickness of 7 μm is 100 to 2
Co-Ni alloy (80: 2) was run at 50 m / min.
The driving power of the electron gun 19 is 40 kV × (3 to 5 A) = 120 to 2 while intermittently supplying the pellet of 0) to the crucible 15.
It melts at 00 kW and vapor deposition is performed. Adjusting the film transport speed while keeping the electron gun power constant, the deposition film thickness is about 18
00 Å. In addition, the amount of the gas containing oxygen as the main component introduced into the gas supply nozzle 25 during vapor deposition is also appropriately adjusted to form a film so that equivalent magnetic characteristics can be obtained. Next, a specific example of the gas supply nozzle 25 will be described below.

FIG. 2 is a perspective view of the gas supply nozzle of the present invention. Gas is introduced from the supply pipe 27 into the pressure equalizing tank 29. The pressure equalizing tank 29 diffuses the introduced gas and adjusts the entire pressure to a constant pressure, and then the inner surface dimensions are height h and width w.
And to the slit portion 31 of depth (length) t. These dimensions are designed in advance according to the purpose of use,
The flow rate is adjusted by the supply pressure. The height h is constant, w is at least the vapor deposition width, and t is made as long as possible so as to direct the gas flow as far as possible while keeping the gas flow as uniform as possible. Desirably, the desired effect is obtained by making the height of the slit 5 times. Reinforcing ribs 35 having preferably a streamlined front end and a rear end on at least the outlet side are provided in the slit portion 31 at regular intervals in the width direction of the slit so as to extend between parallel walls facing each other of the slit. is there. This reinforcing rib is for suppressing the variation of the slit height h due to thermal strain. Further, in the case of the conventional nozzle in which t is not particularly taken into consideration, when t is 3 times or more of the slit height, the distance between the nozzle and the drum is 5 cm in the conventional case, whereas in the case of the present invention, it is 10 cm.
Even if an interval is provided, the same diffusion state will be obtained.

FIG. 4 shows a nozzle fixed to the surface of the shutter 13. The nozzle 25 is positioned rearward of the opening side edge 37 of the mask to avoid the influence of evaporated metal. Since the nozzle can be moved together with the shutter, the incident angle can be changed.

[0017]

As described above, according to the present invention, it is possible to provide a gas supply nozzle which has a uniform flow rate distribution of the supply gas and can be directed far, or which can easily cope with a change in the incident angle of the metal vapor.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a vapor deposition device of the present invention.

FIG. 2 is a perspective view of a gas supply nozzle of the present invention.

FIG. 3 is a partial cross-sectional plan view of the gas supply nozzle of the present invention.

FIG. 4 is a diagram showing a relationship between a gas supply nozzle and a shutter of the present invention.

[Explanation of symbols]

 1 Vapor Deposition Device 3 Rotating Drum 5 Base Film 7 Winding Roll 9 Feeding Roll 11 Mask 13 Shutter 15 Crucible 17 Raw Material Metal 19 Electron Gun 21 Electron Beam 23 Deflection Magnetic Field 25 Gas Supply Nozzle 27 Supply Pipe 29 Pressure Equalizing Tank 31 Slit Section 33 Exit 35 Reinforcing rib

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiyuki Otsuka 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Shinji Miyazaki 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Within the corporation

Claims (5)

[Claims] 1. A crucible containing a metal to be evaporated, an electron gun for generating an electron beam directed in the crucible, a rotary drum provided opposite to the crucible, and along a surface of the rotary drum. Feeding and winding means for feeding the plastic substrate, a mask provided along the surface of the rotating drum and having an opening, a part of which faces the crucible,
In a vacuum vapor deposition device comprising a shutter member for opening and closing the mask, and a gas supply nozzle arranged so as to discharge gas directed toward the drum from the opening, the supply nozzle is formed by facing wall surfaces. A vacuum vapor deposition apparatus having an outlet slit formed therein, the slit having reinforcing ribs extending between the opposed wall surfaces at predetermined intervals in the longitudinal direction thereof. 2. A crucible containing a metal to be evaporated, an electron gun for generating an electron beam directed in the crucible, a rotary drum provided opposite to the crucible, and along a surface of the rotary drum. Feeding and winding means for feeding the plastic substrate, a mask provided along the surface of the rotating drum and having an opening, a part of which faces the crucible,
In a vacuum vapor deposition apparatus comprising a shutter member for opening and closing the mask, and a gas supply nozzle arranged so as to discharge a gas directed toward the drum from the opening, the supply nozzle is the shutter member of the shutter member. A vacuum vapor deposition device characterized in that it is attached to the edge portion on the opening side. 3. A crucible containing a metal to be vaporized, an electron gun for generating an electron beam directed in the crucible, a rotary drum provided opposite to the crucible, and along a surface of the rotary drum. Feeding and winding means for feeding the plastic substrate, a mask provided along the surface of the rotating drum and having an opening, a part of which faces the crucible,
In a vacuum vapor deposition device comprising a shutter member for opening and closing the mask, and a gas supply nozzle arranged so as to discharge gas directed toward the drum from the opening, the supply nozzle is formed by facing wall surfaces. A vacuum vapor deposition apparatus, characterized in that the outlet slit has a depth equal to or more than 3 times the height of the slit, and a pressure equalizing tank is further provided on the upstream side of the outlet slit. 4. The electron gun is driven at 150 to 300 kW (effective power 120 to 240 kW), and the axis of the electron beam emitted by the electron gun is substantially aligned with the axis connecting the center of the rectangular crucible and the center of the opening. Place them at right angles,
The vapor deposition apparatus according to claim 1, 2 or 3, wherein the electron beam is deflected at a substantially right angle by a magnetic field to form an image in the crucible. 5. The vapor deposition apparatus according to claim 1, 2 or 3, wherein the metal to be vapor deposited is Co or a Co alloy.