JP3057999B2 - Semiconductor chip test equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test apparatus for testing the characteristics of a semiconductor chip, and more specifically, to a probe for testing a chip before cutting it into chips in a wafer state. The present invention relates to a semiconductor chip test apparatus subjected to the above.

[0002]

2. Description of the Related Art A semiconductor chip testing apparatus for testing chip characteristics in a wafer state and performing a wafer probe test has been proposed and implemented. Much research has been done on burn-in tests or accelerated aging tests of semiconductor ICs, and burn-in tests have been performed on chips cut out of a wafer, connected to a lead frame, and molded. The burn-in test can solve the problem of so-called initial failure. However, if a defective chip can be eliminated at an earlier stage than when a defective product is produced at the time of completion, waste is reduced. The data obtained by the burn-in test can be used immediately for the analysis of the manufacturing process, and the data for improving the process can be obtained. Therefore, there is a strong demand for performing a burn-in test before cutting out chips in a wafer state. For example, the invention of a burn-in test at the wafer level of an integrated circuit (Japanese Patent Application Laid-Open No. 3-86528) proposes a configuration in which a contact pad is provided in a portion separated by a scrub lane. Also, the invention of a method and an apparatus for sorting semiconductor chips (Japanese Patent Application Laid-Open No. 3-38850) proposes a probe in which a conductive rubber sheet is locally pressurized and the portion is used as a contact.

[0003]

Providing a structure for performing a burn-in test on the wafer side as in the above-mentioned invention not only lowers the utilization factor of the wafer but also may complicate the process. A probe using the conductive rubber sheet as a contact point by locally pressurizing the conductive rubber sheet is extremely excellent, but there are a few problems to be solved. That is, there is a problem in that the contacts corresponding to all the pads of the chip are formed (turned on) at the same time in view of the resolution accuracy. Even if it is desired to separate a specific chip from the circuit, it is difficult to selectively operate the probe for each chip. Further, it is not easy to sufficiently reduce the contact resistance of the contact portion. SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor chip test apparatus capable of performing simultaneous and parallel tests without providing a special configuration for inspection on a wafer and before separating the individual semiconductor chips. is there. Still another object of the present invention is to provide a semiconductor chip test apparatus capable of selecting a contact operation of a probe corresponding to a chip.

[0004]

In order to achieve the above object, a semiconductor chip test apparatus according to the present invention provides a semiconductor chip test apparatus in a state before the characteristics of a plurality of semiconductor chips formed on a semiconductor wafer are separated into individual semiconductor chips. This is a device for testing in parallel and in parallel with each semiconductor chip on a semiconductor wafer.
Correspondingly movably supported in the wafer direction.
Insulation blocks, facing the wafer in each block
Electrical contacts for one corresponding semiconductor chip
And the electrical contact is led to another surface through a conductor wiring.
A plurality of insulation blocks,
Wiring to connect to the conductor wiring on the other surface and connect to the outside
And the soft wiring board having, individually the respective insulating block
A plurality of driving means for driving and the arbitrary driving block
Of the semiconductor chip driven by the
Information includes electrical contacts, conductor wiring of insulating blocks, and flexible wiring bases.
It is configured to be connected to the outside via the panel. Previous
Each electrical contact is a separate metal sphere or metal hemisphere.
Are welded or soldered to form electrical contacts.
Can be. The electrical contacts are each independently conductive
The electrical contact can be made by making the rubber convex. The electric
The air contact is made of metal by electroplating on the surface of the conductor film group.
Can be formed into a convex shape to form an electrical contact.
You. The contact portion of the insulating block has a plurality of electrical contacts.
I will follow the surface of the semiconductor chip with elastic force
Comb structure of elastic insulating material such as ceramics and glass
The individual electrical contacts near the tips of the individual comb teeth.
The structure can be provided. Further, according to the present invention,
Other semiconductor chip test equipment formed on a semiconductor wafer
The characteristics of multiple semiconductor chips
This is a device that performs simultaneous and parallel testing before separation into
Corresponding to the individual semiconductor chips on the semiconductor wafer.
A plurality of insulating blocks movably supported in the wafer direction
Locks and a plurality of individually driving each of said insulating blocks.
Driving means, between the insulating block and the semiconductor chip
Yes, the contact group corresponding to each chip and the contacts
A part that has wiring corresponding to each chip and has electrodes
Is pushed by the corresponding insulation block and separated from other parts
A soft material whose contact can be easily brought into contact with a semiconductor chip.
And a dielectric film made of film-like structure of fees, the arbitrary drive
Semiconductor driven by a block and contacted with the electrical contacts
Information on the body chip is connected to the outside via electrical contacts and wiring.
It is configured to be. The power supply corresponding to each chip
In the area with poles, the electrical contact group is cut from the surroundings in a peninsula shape.
It can be a separated structure. For each chip
The part with the corresponding electrode and the corresponding insulating block
A rubber-like pad may be provided between them.
The driving force of the driving means is deformation of the piezoelectric element, electromagnetic force, or
Can be provided by air pressure.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to the drawings. FIG. 1 is a schematic diagram showing a basic configuration of an entire semiconductor chip test apparatus according to the present invention. FIG. 8 is a partially enlarged view showing a semiconductor wafer provided with a large number of semiconductor chips to be tested by the semiconductor chip testing apparatus. The semiconductor wafer 10 has a large number of semiconductor chips 1
1, 12, 13, 14, 15, ... are provided,
1 to 20 pads 16 are provided on the periphery of each chip, and circuits inside the chip are connected to these pads. Usually, a semiconductor IC is configured by connecting these pads and a lead frame and packaging them after cutting these chips. The semiconductor chip testing apparatus according to the present invention can perform necessary tests including a burn-in test before cutting and separating these chips. As shown in FIG. 1, the semiconductor chip test apparatus according to the present invention basically includes a wafer jig A and a probe jig B. The semiconductor wafer W is supported by the wafer jig A,
The probe assembly P is supported by the probe jig B. A jig positioning means ALD is provided in association with each of the jigs A and B, whereby the probe jig B and the wafer jig A are aligned and face-to-face coupled. The aforementioned semiconductor chips 11 to 1 formed on the semiconductor wafers W and 10
The characteristics of 5... Are tested in parallel before being separated into individual semiconductor chips. Probe assembly P
Are formed with electrical contacts at positions where they face and contact the individual bonding pads 16 formed on the surface of the semiconductor chip formed on the wafer W. This part will be described later in detail with reference to the embodiments.

The relative positional relationship between the electric contacts and the jig positioning means ALD on the probe jig B side is adjusted by position adjusting means AJD on the probe jig side. The probe jig B and wafer jig A
Is made of a material having a linear expansion coefficient close to the linear expansion coefficient, for example, an Invar alloy. This prevents a failure in the coupling between the jig and the semiconductor wafer due to a temperature change of the semiconductor chip test apparatus. That is, the semiconductor chip and the contact group corresponding to the semiconductor chip have a structure in which a positional shift due to a temperature change does not occur. The relative positional relationship between the positions of the bonding pads of the individual semiconductor chips formed on the semiconductor wafer W and the jig positioning means ALD on the wafer jig A side is determined by adjusting the relative position on the wafer jig A side. Adjusted by means AJD. The relative position adjusting means AJD may be performed on both the probe jig side and the wafer jig side as described above, or may be performed on either one side. If the wafer jig A and the probe jig B are arranged on substantially the same plane and are aligned using a tool microscope or the like, extremely high-precision position adjustment becomes possible.

A heating means H for heating the respective jigs is provided on the wafer jig A side and the probe jig B side. The temperature of the wafer W heated by the heating means is detected by the contact sensor S, and the temperature of the heating means is controlled by the detection output. On the probe jig B side, there is provided a relay circuit CPD for driving the probe, supplying operating power to the wafer W via the probe, and relaying chip information obtained from the wafer chip to the outside.

FIG. 2 is a front partial sectional view showing a first embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention. FIG. 3 is a plan view showing the insulating block of the first embodiment. It is a front view and a bottom view. The supporting insulator includes the insulating block 20 and the flexible wiring board 40. Each of the insulating blocks 20 has a corresponding one of the electrical contacts 21, 21... Corresponding to the number of pads for one semiconductor chip.
21 are arranged as a group. Each of the insulating blocks 20 is simultaneously or independently moved in the direction of the surface of the wafer 10 so that each of the electrical contact groups 21, 21,... Supported. The electrical contacts 21, 21,... 21 are connected to the wiring connections 22, 22 to the connecting connection ends 23,.
..22. The flexible wiring board 40 is connected to the connection terminals 23 on the rear surface, and each of the wiring connections 22,
22 are connected to the outside (CPD in FIG. 1). The insulating block guide 30 is formed of a material having a linear expansion coefficient similar to that of the wafer 10. A guide hole is provided in the insulating block guide 30 at a position corresponding to the insulating block 20. The driving member 50 is provided corresponding to the insulating block 20 and drives the insulating block 20 toward the wafer 10.

The electrical contact has a diameter and a thickness of 10 to 2
Although it is extremely small at about 00 μm, it can be manufactured by accurately arranging it as follows. The electrical contacts 21,
21 can be formed as electrical contacts by spot welding or soldering independent metal spheres or metal hemispheres to the ends of the wiring connections 22, 22,. Alternatively, the electrical contacts 21, 21,... 21 may be formed of independent conductive rubber by printing or using a dispenser to form a convex shape, and that portion may be used as an electrical contact. The conductive rubber is different from a conventional rubber having a structure having anisotropic conductivity. In this case, even if it is made uniform from the back side, only the convex portion conducts and operates as a contact. A metal may be formed in a convex shape on the surface of the conductive film group by electroplating to form an electrical contact.

As the driving member 50 for driving the above-mentioned contact, an electromagnetic actuator, an electrostrictive actuator, or a fluid actuator can be used. As the driving means 50 for individually driving the area corresponding to the individual chip area of the film-like structure and bringing the contact group into contact with the pad, the stroke may be as small as about 10 to 100 μm, A piezoelectric element actuator which can be expanded and contracted can be used. Driving means 50 for individually driving an area corresponding to each chip area of the film-like structure and bringing the contact group into contact with a pad uses an electromagnetic actuator which can be individually moved in the direction of the semiconductor wafer surface by an electromagnetic force. You can also. The driving means for individually driving the areas corresponding to the individual chip areas of the film-like structure to bring the contact groups into contact with the pads can use an air actuator for individually moving in the direction of the semiconductor wafer surface by air pressure .

FIG. 4 is a front partial sectional view showing a second embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention. FIG. 5 is the second embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention. FIG. 4 is a plan view and a front view of the contact bar taken out of FIG. At the upper end of the insulating block, a comb-shaped structure 24 made of a ceramic elastic insulating material is formed so that the electric contacts 21, 21,... 21 respectively follow the irregularities (pad portions) of the semiconductor chip surface by elastic force.
24. Each of the electrical contacts 21, 21,... 21 is arranged near the tip of each of the comb teeth 24,. This embodiment there is a structure suitable for dual in-line package chip also applicable to what has pads on four sides as shown in FIG.

FIG. 6 is a front partial sectional view showing a third embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention, and FIG. 7 is an enlarged view of a supporting insulator of the semiconductor chip test apparatus according to the present invention. FIG. 7 shows the supporting insulator .
In this way, the electrical contacts 21, 21,... 21 are formed on the film-like structure 70 of a soft material so as to freely follow the irregularities of the surface of the semiconductor chip. The driving means 50 individually drives an area corresponding to each chip area of the film-like structure 70 to bring the contact group into contact with the pads of the semiconductor chips on the wafer. In the film-like structure 70 shown in FIG. 7, the electrical contacts 21 corresponding to the individual semiconductor chips of the supporting insulator are arranged such that the electrical contacts 21,... 21 ・ ・ 21 is groove 7
1 is a structure separated from the surroundings by a peninsula. A rubber-like pad 51 is provided at the upper end of the driving means 50, and a peninsula-shaped portion is adhesively fixed to the driving means 50 via the pad 51. Therefore, when the position of the driving unit 50 is regulated by the main body 60 of the probe jig B, the position of the peninsula-shaped portion is regulated to a position facing the semiconductor chip of the wafer. Further, at this time, the linear expansion coefficient between the film-like structure 70 and the semiconductor wafer is reduced by reducing the width of the bridge connecting the peninsula-shaped portions to facilitate expansion and contraction, or by forming them in a zigzag or maze shape. Even if they are different, it is possible to prevent the tensile stress of the film from being applied to the peninsula-shaped portion due to expansion and contraction due to the temperature change of the film-shaped structure, and therefore, no positional displacement occurs between the semiconductor chip and the peninsula-shaped portion. In addition, since the size of each peninsula-shaped portion is as small as several mm square, the dimensional change due to the temperature of the peninsula-shaped portion itself can be designed to be sufficiently small with respect to the allowable position error of the probe contact. As the driving unit 50, the above-described electromagnetic actuator or electrostrictive actuator can be used.

[0013]

As described in detail above, the semiconductor chip test apparatus according to the present invention tests the characteristics of a plurality of semiconductor chips formed on a semiconductor wafer simultaneously and in parallel before separating them into individual semiconductor chips. Device for performing
A conductive film group facing each bonding pad formed on the surface of the semiconductor chip and a wiring for connecting them to the outside are formed on the supporting insulator, and an electric wire is formed on the surface of the conductive film group facing the individual bonding pad. It is configured with contact points. By partially driving the electrical contacts, information on the chip can be extracted.

[Brief description of the drawings]

FIG. 1 is a schematic front sectional view showing a basic configuration of an entire semiconductor chip test apparatus according to the present invention.

FIG. 2 is a front partial sectional view showing a first embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention.

FIG. 3 is a plan view and a bottom view of a contact bar in which the contact bar of the probe assembly of the semiconductor chip test apparatus according to the first embodiment of the present invention is taken out and shown.

FIG. 4 is a front partial sectional view showing a second embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention.

FIGS. 5A and 5B are a plan view and a front view, respectively, of the contact bar taken out of the probe chip of the semiconductor chip test apparatus according to the second embodiment of the present invention.

FIG. 6 is a front partial sectional view showing a third embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention.

FIG. 7 is a plan view showing a supporting insulator film of the third embodiment of the probe assembly of the semiconductor chip test apparatus according to the present invention.

FIG. 8 shows a test sequence of the semiconductor chip test apparatus according to the present invention.
2 is a schematic diagram showing an enlarged structure of a wafer as an elephant.

[Explanation of symbols]

A wafer jig B probe jig C chamber H heating means P probe assembly S wafer temperature sensor ALD jig positioning means AJD probe, wafer position adjustment means CPD (probe drive, chip drive, chip information) relay circuit W, 10 wafer 11, 12, 13, 14, 15 Chip 16 Pad 20 Insulation Block 21 Electrical Contact 22 Conductor Wiring 23 Communication Connection Pad 30 Insulation Block Guide 40 Flexible Connection Means (Soft Wiring Board) 50 Drive Block 51 Rubber Pad 60 Drive Block guide 70 Insulating film 71 Insulating film cutout groove 80 Air actuator

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-48171 (JP, A) JP-A-5-218150 (JP, A) JP-A-59-214235 (JP, A) JP-A-62-1987 162979 (JP, A) Japanese Utility Model 1-146534 (JP, U) Japanese Utility Model 2-21578 (JP, U)

Claims (9)

(57) [Claims] 1. A device for testing simultaneously in parallel in a state before the separation of characteristics of a plurality of semiconductor chips formed on a semiconductor wafer into individual semiconductor chips, corresponding to each of the semiconductor chips of the semiconductor wafer And the wafer
Plural insulating blocks movably supported in direction C
Corresponding to the surface of each block facing the wafer.
Electrical contacts for one semiconductor chip are provided.
The air contact is connected to the other surface via conductor wiring.
Connected to the insulating block and the conductor wiring on the other surface of each of the insulating blocks,
Flexible wiring board having wiring for connecting to each other, and a plurality of driving means for individually driving each of the insulating blocks
And the electric contacts driven by the arbitrary driving block
The information on the contacted semiconductor chip is stored in electrical contacts and insulation blocks.
Connected to the outside via the conductor wiring of the
Semiconductor chip testing device configured as described above . 2. The semiconductor chip test apparatus according to claim 1, wherein said electric contact has a structure in which an independent metal ball or metal hemisphere is welded or soldered to form an electric contact. 3. The electric contact according to claim 1, wherein each of the electric contacts has a structure in which an independent conductive rubber is formed into a convex shape to form an electric contact.
A semiconductor chip test apparatus according to claim 1. 4. The semiconductor chip testing apparatus according to claim 1, wherein the electric contact has a structure in which a metal is formed in a convex shape by electroplating on a surface of the conductor film group to be an electric contact. 5. The power supply according to claim 5 , wherein said contact portion of said insulating block is provided with
A comb-shaped structure made of an elastic insulating material such as ceramics or glass so that the air contacts individually follow the unevenness of the surface of the semiconductor chip with elastic force, with a structure in which the individual electric contacts are arranged near the tips of the individual comb teeth. The semiconductor chip test apparatus according to claim 1. 6. A plurality of semiconductors formed on a semiconductor wafer.
Before separating the characteristics of the body chip into individual semiconductor chips
An apparatus for simultaneously and parallel testing in a state , wherein the wafers correspond to individual semiconductor chips of a semiconductor wafer.
Plural insulating blocks movably supported in direction C
And a plurality of driving means for individually driving each of the insulating blocks.
Between the insulating block and the semiconductor chip.
Contact group corresponding to the
The parts with electrodes corresponding to each chip
The contact is pushed by the edge block and separated from the other parts.
Film-like structure of soft material that can be easily contacted with semiconductor chip
Comprising an insulating film comprising:
Information on the contacted semiconductor chip is transmitted via electrical contacts and wiring.
A semiconductor chip testing device configured to be connected to the outside . 7. A portion having electrodes corresponding to each of said chips.
The structure is such that the electrical contact group part is separated from the surroundings like a peninsula.
The semiconductor chip test apparatus according to claim 6, wherein 8. A portion having electrodes corresponding to each of said chips
Rubber pad between the minute and the corresponding insulation block
7. The semiconductor chip test apparatus according to claim 6, further comprising: 9. The driving force of the driving means is changed by the piezoelectric element.
Given by shape, electromagnetic force or air pressure
The semiconductor chip test apparatus according to claim 1 .