JP3056033U - Sockets and contacts for ball grid array integrated circuit chips - Google Patents

Abstract

(57) [Problem] To provide a socket and a contact of a ball grid array integrated circuit chip for preventing a contact failure. SOLUTION: The present invention relates to a socket and a contact of a ball grid array integrated circuit chip (BGA IC chip), and the socket includes an upper cover 10, a slider 20, a plastic housing 30, and a handle bar 4.
After the BGA IC chip is mounted in the socket, the metal ball at the lower end of the BGA IC chip and the metal contact in the socket are securely contacted by lateral pressure.
The accuracy of soldering the contact foot with the inclined angle to the PCB is also improved. Further, the quality of the soldering operation can be visually observed using the viewing hole in the upper part of the housing, so that defective soldering can be reduced.

Description

[Detailed description of the invention]

[0001]

[Industrial applications]

 The present invention relates to the structure of a socket and a contact of a BGA IC chip (Ball grid array integrated circuit chip). In particular, by using a slider movement, a metal contact accommodated in a socket and a metal under a BGA IC chip are provided. This relates to sockets and contacts that transmit the signal accurately by uniformly contacting the ball with lateral pressure.

[0002]

[Prior art]

 IC chips are widely used in equipment such as computers. Conventionally, the connection method between the IC chip and a PC board (PCB) is a direct insertion soldering (DIP) method or a foot portion of a contact of the IC chip. There is a spherical SMT (surface mount technology) method.

[0003]

[Problems to be solved by the invention]

 With the DIP method, it is difficult to control the soldering operation, and the contact foot of the IC chip is bent or broken. In the case of the SMT method, when the number of contact feet is very large, the heat required for soldering cannot reach the deep inside of the contact foot where the forest is established, and the quality of the soldering work is degraded. It is difficult to inspect the quality of work. In the case of replacement of a defective IC chip or a large-scale change of computer equipment, the actual situation is that efficiency cannot be improved and good work quality cannot be expected if the above-mentioned DIP method or SMT method is used. . To solve these problems, Republic of China Utility Model Registration No. 119885 "BGA IC Chip Socket Structure" and Republic of China Utility Model Registration No. 86219485 " Although there is an improvement in the socket structure for BGA IC chips, when the socket is placed on the PCB and soldered, it is necessary to ensure that the contacts housed in the socket and the metal balls at the lower end of the chip are in contact with each other. However, there is a problem that the PCB is damaged or deformed by receiving pressure because the lower pressure method is used. The present invention aims to solve these problems.

[0004]

[Means for solving the problem]

 The socket and the contact used for the ball grid array integrated circuit chip according to the first aspect of the present invention are formed by a hollow upper cover and a rectangular plastic body having a concave central portion. A rectangular hole is set up, a convex block is formed at the front end, a slider with a synovial tank on both left and right sides, and a plastic-formed square with a concave central part, and a contact in the central concave part. A plurality of square holes facing the slider to be housed are formed, stereotactic blocks are installed on both left and right sides of the recess, a circular cavity is formed at the front end, and hooks are provided on both sides to fix the handlebar A plastic housing, an L-shaped handlebar having one end forming a shaft, a part of the shaft being an eccentric part having a different center, and an entire upper end being slightly Forming an arc, the contact end forming a V-shape, having a plurality of metal contacts having inclined pin-shaped feet, four fixed legs and a spring, the metal contacts being in a plastic housing; The handlebar is fixed to the plastic housing by fixed legs, and after the ball grid array integrated circuit chip is mounted in the socket, the eccentric portion of the handlebar is actuated. Then, the slider in the plastic housing is moved to bring the metal ball and the metal contact under the ball grid array integrated circuit chip into contact with the side pressure, so that the deformation and breakage of the PCB due to the low pressure are prevented. Also, by forming the upper end of the metal contact in an arc shape and the contact portion in a V shape, the contact between the contact and the metal ball at the lower end of the BGA IC chip is improved. Also, by providing the metal contact foot with an appropriate inclination angle, the effect of soldering between the contact and the PCB is improved. In addition, by forming a peephole on the plastic housing, the quality of the contact soldering work can be roughly determined by visual measurement, and the inspection can be easily performed without using a precise inspection device as in the past.

[0005]

【Example】

 The socket and the contacts used in the ball grid array integrated circuit chip according to one embodiment of the present invention will be described in detail. The structure of the socket and contact of the BGA IC chip according to the present invention mainly includes an upper cover 10, a slider 20, a plastic housing 30, a handle bar 40, a plurality of metal contacts 50, a spring 60, and a four as shown in FIGS. It has two fixed legs 70.

[0006] The upper cover 10 is a plate-like lid having an open central portion, and has two pawls 12 at its front end. When the upper cover 10 is closed, the pawls 12 are inserted into slots 31 of the plastic housing 30. It is fitted and fixed.

The slider 20 is formed of a rectangular plastic body having a concave central portion, a plurality of rectangular holes facing the plastic housing 30 is provided at the central portion, and a convex block 22 is formed at the front end. The tank 25 is provided on both left and right sides.

The plastic housing 30 is formed of a rectangular plastic body with a concave central portion, and a plurality of rectangular holes 33 for receiving contacts are formed in the central concave portion. Is formed. A circular cavity 35 is formed at the front end of the plastic housing 30, and hooks 39 for fixing the handlebar 40 are formed on both sides of the housing 30. The handlebar 40 is L-shaped, one end of which forms a shaft 43, and a portion of the shaft 43 is an eccentric portion 46 having a different center. In addition, there are a plurality of metal contacts 50, four fixing legs 70, and springs 60.

The plurality of metal contacts 50 are housed in the housing 30, the handle bar 40 is fixed to the housing 30 by the fixing legs 70, and the shaft 43 is inserted into a circular cavity 35 formed at the front end of the housing 30. The slider 20 is fitted in the housing 30 along the slide tank 25 and fixed by the positioning block 37. The upper cover 10 is fixed to the upper end of the housing 30 by the fixed legs 70.

As shown in FIG. 3, the upper end of the metal contact 50 has a slightly arcuate shape, and a metal ball 85 located below is pressed, and the contact portion 53 is formed in a V-shape to form the contact 50 with the contact 50. The contact surface between the balls 85 is increased, and as shown in FIG. 8, the contact foot 56 includes a liquid solder in a space formed at the inclined angle to improve the contact with the metal ball 85. Let it. This ensures soldering between metal contact 50 and PCB 95. FIG. 4 shows a state in which the plurality of metal contacts 50 accommodated in the square holes 33 in the plastic housing 30 are not subjected to a force.

As shown in FIGS. 5 and 6, when the BGA IC chip 80 is mounted in the socket 90, the metal ball 85 under the chip 80 also enters the rectangular hole 33 and is already housed in the hole 33. Make a light contact with the existing contact 50. If soldering is performed as it is, it is difficult to perform reliable soldering, and contact 80 and metal ball 85 that are not in contact at all may be generated. Cause Therefore, as shown in FIG. 7, the handlebar 40 is pushed downward, and the eccentric part 46 of the shaft 43 pushes the convex block 22 at the front end of the slider 20 to move the slider 20 inside the housing 30 to move the metal contact 50. And the metal ball 85 at the lower end of the chip 80 are securely brought into contact with each other by the lateral pressure.

With the above configuration, the contact between each contact 50 and the metal ball 85 is ensured, and the signal transmission after completion can be ensured. As shown in FIG. 8, the greatest feature of the present embodiment is that the metal contact 50 and the metal ball 85 are brought into contact with each other by a lateral pressure instead of a lower pressure.

On the other hand, when the metal ball at the lower end of the BGA IC chip 80 comes into contact with the metal contact 50 by lateral pressure due to the movement of the slider 20, the operator can see through a peephole (shown in the figure) provided above the plastic housing 30 of the socket 90. ), The soldering state of the foot 56 of the contact 50 and the PCB 95 can be visually observed, and a defect in the soldering state can be found at an early stage, thereby preventing an accident from occurring.

[0014]

[Effect of the invention]

 As described above, according to the socket and contact used for the ball grid array integrated circuit chip of the present invention, the contact and the contact of the metal ball by the side pressure prevent the deformation and breakage of the PCB due to the conventional lower pressure contact, and the movement of the slider, The soldering condition of the contact foot and PCB95 can be visually observed from the peephole at the top of the housing, and defective soldering can be detected at an early stage without using a precision measuring instrument as in the past, and metal contacts The upper end is formed in an arc shape, and the contact touches the metal ball below, so that there is no danger that the chip will jump out of the socket due to the movement of the slider, and the contact end of the contact has a V-shape. As a result, the contact surface becomes large, the contact state between the contact and the metal ball is improved, and the foot of the metal contact has a certain inclination angle. , Including a solder liquid to the space, to improve the effect of soldering.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an assembled state of a socket and a contact of a BGA IC chip according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a socket and a contact of the BGA IC chip according to the embodiment of the present invention are disassembled.

3A is a front view of the contact according to the embodiment of the present invention, FIG. 3B is a side view thereof, and FIG.

4A is a sectional view of a socket and a contact of the BGA IC chip according to the embodiment of the present invention, and FIG. 4B is a partially enlarged view thereof.

FIG. 5 is a plan view illustrating a state in which a BGA IC chip according to an embodiment of the present invention is mounted on a socket of the present invention;

FIG. 6A is a sectional view of a socket and a contact of a BGA IC chip according to an embodiment of the present invention before a slider operation, and FIG.

7A is a cross-sectional view after the operation of the slider in FIG. 6, and FIG. 7B is a partially enlarged view of FIG.

8 (a) is a sectional view showing the operation of each component of the socket and the contact of the BGA IC chip according to the present invention, and FIG.
FIG. 8 is a partially enlarged view of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Top cover 12 Stopper 20 Slider 22 Convex block 25 Smooth tank 28 Square hole 30 Plastic housing 31 Slot 33 Square 35 Circular sinus 32 Localization block 39 Hook 40 Handlebar 43 Shaft 46 Eccentric part of shaft 50 Metal contact 53 Contact end 56 Feet Part 60 Spring 70 Fixed leg 80 BGA IC chip 85 Metal ball 90 Socket 95 PC board (PCB)

Claims (1)

[Utility model registration claims] 1. A socket and a contact for use in a ball grid array integrated circuit chip, comprising: a hollow upper cover; and a rectangular plastic body having a concave central portion, and a plurality of rectangular holes formed in the central portion. Is installed, a convex mass is formed at the front end, and a slider having a synovial tank on both left and right sides, and a square formed of plastic with a concave central part, which accommodates a contact in the central concave part. A plastic housing having hooks for fixing handlebars on both sides, a rectangular housing is provided on each of the left and right sides of the recess, a stereotactic block is provided on both left and right sides of the recess, and a shaft at one end. A part of the shaft is an L-shaped handlebar with an eccentric part having a different center, and the entire upper end part forms a slightly arcuate shape, The contact end has a V-shape and includes a plurality of metal contacts having inclined pin-shaped feet, four fixing legs, and a spring, wherein the metal contacts are housed in the plastic housing; The shaft is housed in the cavity, the handlebar is fixed to the plastic housing with the fixing legs, and after the ball grid array integrated circuit chip is mounted in the socket, the handlebar is eccentrically operated. A socket and a contact of the ball grid array integrated circuit chip, wherein the slider in the plastic housing is moved to contact a metal ball under the ball grid array integrated circuit chip with the metal contact by lateral pressure.