JP4235374B2 - Socket for electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component socket that receives and holds an electronic component that includes a plurality of lead terminals that protrude downward from a main body provided with an electronic circuit or the like.
[0002]
As an example of an electronic component such as an IC chip, there is one in which a plurality of lead terminals protrude downward from a side surface of a main body in which an IC circuit or the like is built. Such an electronic component is disposed on a substrate. Electronic equipment is configured. Here, when attaching an electronic component such as an IC chip to the substrate, there is also a method of inserting a lead terminal into the through hole of the substrate and soldering, but in order to be able to replace it by attaching and detaching the electronic component, Sockets for electronic parts are often used.
[0003]
By the way, in gaming machines such as pachinko machines, slot machines, etc., a control board has come to be used for game operation control, etc., and after attaching a socket for electronic parts to this control board, this An IC chip or the like is attached to the socket. Since the control board of such a gaming machine controls the operation of the gaming machine, the control board is crafted to perform illegal operation control, for example, a problem that a big hit state is frequently generated occurs. ing.
[0004]
[Problems to be solved by the invention]
Such illegal work is often performed on an IC chip which is a heart part for performing game operation control. For example, an electronic component or the like for performing an illegal control operation is attached in a socket to which the IC chip is attached. To do. For this reason, it is necessary to check the presence or absence of electronic components etc. that cause such unauthorized operation, but each time it is necessary to remove the IC chip from the socket and inspect the inside, which is difficult and troublesome to check There is.
[0005]
The present invention has been made in view of such a problem, and it is possible to easily visually inspect the presence or absence of unauthorized parts disposed in the socket while the electronic parts are mounted on the electronic component socket attached to the board. The purpose is to do so.
[0006]
[Means for Solving the Problems]
In order to achieve such an object, an electronic component socket according to the present invention includes an electronic component having a main body portion including an electronic circuit and the like and a plurality of lead terminals projecting downward from the main body portion. The socket body is received from above and is held and mounted on the substrate, and has a socket body made of an insulating material and a plurality of contacts disposed vertically extending in the socket body. Each of these contacts includes a lead receiving portion disposed in an arrangement space opened on the upper surface of the socket body, and a connection leg portion extending downward from the lead receiving portion and projecting downward from the socket body. The lead terminal is inserted into the lead receiving portion from the opening on the upper surface of the socket body, the electronic component is mounted on the upper surface side of the socket body, and the connection leg portion is mounted on the board. . In addition, the socket for the electronic component has a transparent or semi-transparent socket body, and a stand-off portion that protrudes downward is integrally formed on the lower surface of the socket body, and the stand-off portion is placed on the substrate to form a socket. The main body is configured to be mounted on the substrate in a state of being separated from the substrate, and the lower surface space of the socket main body is made visible.
[0007]
According to the socket for electronic parts having such a configuration, since the socket body is transparent or translucent, even if unauthorized parts are attached inside the socket, the electronic parts are attached to the upper surface side of the socket body. Thus, it is possible to easily and surely check for the presence of unauthorized parts without removing them.
[0008]
Further, the stand-off portion of the socket for electronic components makes it easier to inspect the socket body with the electronic components attached.
[0009]
Furthermore, this electronic component socket has a plate- like shape in which the connecting legs of a plurality of contacts protrude downward from the socket body in a row, the connecting legs extend up and down, and the width dimension is larger than the plate pressure dimension. The connecting leg portions of the plurality of contacts are arranged so that the width direction thereof is orthogonal to the direction in which the rows extend, and are projected downward from the socket body . In this way, it is easy to look into the inside of the lower surface of the socket body from between the connecting leg portions arranged in a row, and it is easy to check whether or not unauthorized parts are disposed inside.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. 1 to 3 show an IC socket (electronic component socket) 1 according to the present invention, and an IC chip 50 (electronic component) is attached to the upper side of the IC socket 1 as shown in FIG. For convenience of explanation, the arrow X direction shown in FIG. 1 will be described as the front-rear direction, the arrow Y direction as the left-right direction, and the arrow Z direction as the up-down direction.
[0011]
The IC chip 50 has a main body portion 51 in which an IC circuit is incorporated, and a plurality of lead terminals 52 that protrude from the left and right side surfaces of the main body portion 51 so as to be aligned in a row outward and bend downward and extend. Configured. The IC socket 1 includes a socket body 10 made of a transparent or translucent material having electrical insulation, and a plurality of contacts 20 arranged in alignment in the socket body 10.
[0012]
The socket body 10 includes a pair of left and right contact holding portions 11 each having a prismatic shape extending in the front-rear direction, a socket connecting portion 13 that connects these contact holding portions 11, and a columnar stand that protrudes downward from the lower surface side of the contact holding portion 11. It is configured integrally with the off portion 15. Each of the left and right contact holding portions 11 is formed with a plurality of arrangement spaces 12 extending in the vertical direction and having an opening 12a on the upper side in a line in the front and rear direction. In addition, an insertion hole 12 b that opens to the lower surface of the contact holding portion 11 is formed at the bottom of each arrangement space 12.
[0013]
Each contact 20 is connected to the lead receiving portion 21 arranged in the arrangement space 12, the contact connecting portion 22 connected to the lead receiving portion 21 and extending downward through the insertion hole 12b, and the contact connecting portion 22. The connecting leg portion 23 protrudes downward from the lower surface of the contact holding portion 11 and is formed by punching and bending a conductive plate material. The lead receiving portion 21 is composed of a receiving plate 21a extending along the inner wall of the arrangement space 12, and a pressing plate 21b bent and formed so as to face and contact the receiving plate 21a.
[0014]
The lead receiving portion 21 receives and holds the lead terminal 52 when the IC chip 50 is attached to the upper side of the IC socket 1 as indicated by an arrow A in FIG. Therefore, as can be clearly seen from FIG. 3, the receiving plate 21a and the pressing plate 21b are arranged so that the plate pressure direction is the left-right direction Y (the width direction is the front-rear direction X). 21b is pressed by the lead terminal 52 inserted through the opening 12a and elastically deformed inward in the left-right direction (arrow B direction), and is sandwiched between the receiving plate 21a and the pressing plate 21b. As a result, the IC chip 50 is held while the lead terminal 52 is sandwiched between the lead receiving portions 21 in a state where the main body portion 51 is placed on the upper surface of the socket main body 10.
[0015]
The contact connecting portion 22 is connected to the receiving plate 21a and extends downward through the insertion hole 12b so that the plate pressure direction is the left-right direction Y similarly to the contact connecting portion 22a. For this reason, the connecting leg portion 23 that is integrally connected to the lower portion of the contact connecting portion 22 and protrudes downward extends in the front-rear direction X in the plate pressure direction. Here, since the width dimension is larger than the plate pressure dimension of the connection leg 23, the plate leg direction of the connection leg 23 is directed in the front-rear direction as described above, so that The interval between the plate-like members is larger than the thickness in the row direction, and the interval between the connection legs 23 when viewed from the outside in the left-right direction of the IC socket 1 is increased. The space on the lower surface side of the IC socket 1 can be easily seen through 23. For this reason, it is easy to check whether there are any unauthorized parts in the space on the lower surface side of the IC socket 1 with the IC socket 1 mounted on the substrate.
[0016]
In the IC socket 1 configured as described above, the connecting leg 23 is inserted into a through hole of a substrate (not shown), soldered, and attached onto the substrate. At this time, the lower surface of the stand-off portion 15 contacts the surface of the substrate, and the contact holding portion 11 and the socket connecting portion 13 are positioned away from the substrate surface by the height of the stand-off portion. In this way, the IC chip 50 is attached to the IC socket 1 attached to the substrate from above as indicated by an arrow A in FIG. As a result, the mounting state as shown in FIG. 1 is obtained. In this state, when an unauthorized part is mounted in the IC socket 1, the socket body 10 constituting the IC socket 1 is a transparent or translucent component. Therefore, it is possible to easily visually check the presence or absence of unauthorized parts in the state of FIG.
[0017]
In particular, the IC socket 1 is attached away from the substrate by a stand-off portion 15, and visual confirmation in the internal space on the lower surface side of the IC socket 1 is easy. Further, as described above, the connecting leg portions 23 protruding in a line from the lower surface of the contact holding portion 11 extend in the front-rear direction X so that the plate pressure direction extends in the front-rear direction X. Since the space between the connecting legs 23 is large and the space on the lower surface side of the IC socket 1 is easy to see through the connecting legs 23 aligned in a line from the outside in the left-right direction, the IC socket 1 is mounted on the substrate. In this state, it can be easily and easily checked whether there are any unauthorized parts in the space on the lower surface side of the IC socket 1.
[0018]
For such a visual check, an illumination lamp that illuminates the IC socket 1 may be disposed in the vicinity of the IC socket 1 on the substrate. Furthermore, during the visual check, the IC socket 1 may be irradiated with illumination light (for example, laser light) from the outside to check for illegal components inside.
[0019]
In the IC socket, the connection leg 23 is inserted into the through hole of the board. However, the present invention can be applied to an IC socket in which the connection leg 23 is surface-mounted on the terminal pattern of the board.
[0020]
【The invention's effect】
As described above, according to the electronic component socket according to the present invention, since the socket body is transparent or translucent, whether or not unauthorized parts are attached inside the socket is determined on the upper surface side of the socket body. It is possible to easily and surely check without removing the component in the mounted state.
[0021]
Also, it formed integrally with the stand-off portion projecting downward to the lower surface of the socket body, placed so in the socket body to the standoffs of the substrate is configured to be mounted on the substrate in a state away from the substrate Thus, the lower surface space of the socket body can be visually confirmed. Thereby, it becomes easy to inspect the socket body with the electronic component attached.
[0022]
Furthermore, the connection leg portions of the plurality of contacts are protruded from the socket main body in a row, and the connection leg portions are formed from a plate-like member extending vertically and having a width dimension larger than the plate pressure dimension. The contact leg portions of the contacts are arranged so that the width direction thereof is perpendicular to the direction in which the rows extend, and are projected downward from the socket body . In this way, it is easy to look into the inside of the lower surface of the socket body from between the connecting leg portions arranged in a row, and it is easy to check whether or not unauthorized parts are disposed inside.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electronic component socket according to the present invention in a state where an electronic component is mounted.
FIG. 2 is a plan view, a front view, a bottom view, and a side view of the electronic component socket.
3 is a cross-sectional view showing the electronic component socket along arrows III-III in FIG. 2;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC socket 10 Socket main body 11 Contact holding part 15 Stand-off part 20 Contact 21 Lead receiving part 23 Connection leg part 50 IC chip 52 Lead terminal

Claims (1)

An electronic component socket for receiving and holding an electronic component from above and mounting it on a substrate, comprising a main body portion including an electronic circuit and a plurality of lead terminals protruding downward from the main body portion. And
A socket body made of an insulating material and a plurality of contacts disposed in the socket body so as to extend vertically;
Each of the contacts includes a lead receiving portion disposed in an arrangement space opened on an upper surface of the socket body, and a connection leg portion extending downward from the lead receiving portion and projecting downward from the socket body. Comprising
The lead terminal is inserted into the lead receiving part from the opening on the upper surface of the socket body, the electronic component is attached to the upper surface side of the socket body, and the connection leg is attached to the board,
The socket body is transparent or semi-transparent, and a stand-off part protruding downward is integrally formed on the lower surface of the socket body, and the socket body is separated from the board by placing the stand-off part on the board. By being configured to be mounted on the substrate in a state in which the socket body is viewed, the lower surface space of the socket body is made visible.
The connecting leg portion before Symbol plurality of contacts projects in line shape downward from the socket body,
The connecting leg portion is formed of a plate-like member that extends in the vertical direction and has a width dimension larger than a plate pressure dimension, and the connecting leg portions of the plurality of contacts have a width direction orthogonal to a direction in which the row extends. A socket for electronic parts , wherein the socket is configured so as to protrude downward from the socket body .

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