JP2001015196A - Connector for flexible board and its mounting structure - Google Patents

Connector for flexible board and its mounting structure

Info

Publication number
JP2001015196A
JP2001015196A JP11185888A JP18588899A JP2001015196A JP 2001015196 A JP2001015196 A JP 2001015196A JP 11185888 A JP11185888 A JP 11185888A JP 18588899 A JP18588899 A JP 18588899A JP 2001015196 A JP2001015196 A JP 2001015196A
Authority
JP
Japan
Prior art keywords
housing
lower plate
lead
connector
flexible board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11185888A
Other languages
Japanese (ja)
Inventor
Taiichiro Miyao
泰一郎 宮尾
Kazuto Miura
一登 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JST Mfg Co Ltd
Original Assignee
JST Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JST Mfg Co Ltd filed Critical JST Mfg Co Ltd
Priority to JP11185888A priority Critical patent/JP2001015196A/en
Publication of JP2001015196A publication Critical patent/JP2001015196A/en
Pending legal-status Critical Current

Links

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PROBLEM TO BE SOLVED: To enhance reliability in soldering and to cut a mounting area to a PCB, as for a connector for a flexible board. SOLUTION: A lead part 37 is extended downward from a linking part 36 to link the fixed piece part 33 and the elastic piece part 35 of a contact 11. The lead part 37 has a first part 39 extending downward along the rear end 42 of the lower plate part 12 of a housing 4 and a second part 41 extending frontward along the lower surface 26 of the lower plate part 12. The upper part of the second part 41 is stored in a recessed part 43 formed on the lower surface 26 of the lower plate part 12. The height from a PCB 29 to the lower plate part 12 gets higher by the depth of the recessed part 43, and solder is prevented from rising. The lead parts 22, 37 of each contact 11 are in the projected space A of the housing 4 and a lid part 7 in a closed state.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はFPCと称される平
形柔軟ケーブルやPCBを接続するために用いるフレキ
シブル基板用コネクタ及びその取付構造に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for a flexible board used for connecting a flat flexible cable or PCB called an FPC and a mounting structure thereof.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】従来、
PCBの表面に実装されるコネクタでは、PCBの表面
の導電性部材にはんだ付けするためのL字型のリード部
の脚部をコネクタの側方に出している。このため、PC
Bの表面において、コネクタを実装する面積が広くな
り、小型化の要請に対応できない。
2. Description of the Related Art
In a connector mounted on the surface of a PCB, legs of an L-shaped lead portion for soldering to a conductive member on the surface of the PCB are exposed to the side of the connector. Therefore, PC
On the surface of B, the area for mounting the connector becomes large, and it is not possible to meet the demand for miniaturization.

【0003】一方、ICチップを外部リードを用いずに
基板上に実装するボールグリッドアレイ技術(BGA技
術)を応用して、コネクタにおいても、コンタクトをは
んだボールを介してコネクタハウジングの直下の基板の
導電パッドに通電可能に接合することが提案されている
(例えば特開平10−162909号公報)。この場
合、コネクタハウジングの側方に突出する外部リードを
なくすことができ、小型化できるという利点はある。
On the other hand, by applying a ball grid array technology (BGA technology) in which an IC chip is mounted on a substrate without using external leads, even in a connector, contacts are formed on a substrate directly below a connector housing via solder balls. It has been proposed to electrically connect to a conductive pad (for example, JP-A-10-162909). In this case, there is an advantage that the external leads protruding to the side of the connector housing can be eliminated and the size can be reduced.

【0004】しかしながら、上記のはんだボールを用い
る場合、はんだ付けの前段階で、はんだボールは、ハウ
ジングの下面と基板の表面の両者の間にあって、両者間
の隙間を規制しており、この規制された隙間を通して熱
風を送って、はんだボールをリフロー処理することにな
る。上記の隙間を広くとった場合は、十分な量の熱風を
送ることができるため、良好なはんだ付けが行える一
方、小型の要請に反する。逆に、上記の隙間を狭くした
場合は、小型化には寄与できるが、熱風の量が不足し
て、はんだ付けの信頼性が低下する。このため、上記の
隙間の量を精度良く設定する必要がある。
However, when the above-mentioned solder ball is used, the solder ball is located between the lower surface of the housing and the surface of the substrate and regulates a gap between the two before the soldering. Hot air is sent through the gap to reflow the solder balls. If the gap is widened, a sufficient amount of hot air can be sent, so that good soldering can be performed, but this is contrary to the demand for small size. Conversely, if the gap is narrowed, it can contribute to miniaturization, but the amount of hot air is insufficient and the reliability of soldering decreases. For this reason, it is necessary to accurately set the amount of the gap.

【0005】ところが、上記のBGA技術においては、
はんだボールの一部がコンタクトの収容孔の下端に収容
されるため、上記の隙間の量は、収容孔の開口径、およ
びはんだボールの径の両者によって規定されることにな
る。その結果、両者の各寸法精度および両者の組合せ精
度のばらつきの影響のために、上記の隙間の量を精度良
く設定することは非常に困難である。したがって、実装
の小型化とはんだ付けの信頼性とを両立することが困難
である。
[0005] However, in the above BGA technology,
Since a part of the solder ball is housed in the lower end of the housing hole of the contact, the amount of the gap is determined by both the opening diameter of the housing hole and the diameter of the solder ball. As a result, it is very difficult to accurately set the amount of the gap due to the influence of variations in the dimensional accuracy of the two and the combination accuracy of the two. Therefore, it is difficult to achieve both miniaturization of mounting and reliability of soldering.

【0006】また、はんだボールの一部がコンタクトの
収容孔の下端に収容されるため、溶融はんだが収容孔に
吸い上げられるウィッキング(wicking)を生じ易い。こ
れを防止するため、コンタクトの中間部に、例えばはん
だぬれ性を有しない材料をコーティングしたり、メッキ
したりする等の処理を施す必要があり、製造コストが高
くなる。
[0006] Further, since a part of the solder ball is accommodated in the lower end of the contact hole, wicking in which the molten solder is sucked up into the hole tends to occur. In order to prevent this, it is necessary to apply a treatment such as coating or plating a material having no solder wettability to the intermediate portion of the contact, which increases the manufacturing cost.

【0007】本発明は上記課題に鑑みてなされたもので
あり、PCBへの実装の省スペース化を図ることができ
且つはんだ付けの信頼性の高い基板表面実装用コネクタ
を提供することを目的とする。
The present invention has been made in view of the above problems, and has as its object to provide a board surface mounting connector which can save space for mounting on a PCB and has high soldering reliability. I do.

【0008】[0008]

【課題を解決するための手段及び発明の効果】上記目的
を達成するための課題解決手段として、請求項1記載の
発明は、上方に開放するハウジングの開口部に臨むよう
に複数配列された接触子と、ハウジングの開口部を開閉
自在な蓋部材とを備え、この接触子は、ハウジングの上
下に対向するフレキシブル基板押圧用の弾性片部及びハ
ウジングの収容溝に固定される固定片部と、これら固定
片部と弾性片部の基端部同士を連結する連結部と、この
連結部から延設されてPCBの表面の導体パターンに半
田付けされるリード部とを含むフレキシブル基板用コネ
クタにおいて、上記接触子はプレスにより打ち抜き形成
されたものからなると共に、上記リード部のみがハウジ
ングの下板部の前端又は後端に露出しており、上記リー
ド部は、連結部から下方に延びる第1の部分と第1の部
分からハウジングの下板部の下面に沿って延びる第2の
部分とを含むと共に、ハウジング及び閉じ状態の蓋部材
の上下方向の投影空間内に配置されており、上記リード
部の第2の部分と上記連結部との間にハウジングの下板
部を挟持しており、上記第2の部分の上部はハウジング
の下板部の下面に形成された凹部に収容されていること
を特徴とする。
Means for Solving the Problems and Effects of the Invention As a means for solving the above problems, the invention according to the first aspect of the present invention comprises a plurality of contacts arranged so as to face openings of a housing which opens upward. And a lid member capable of opening and closing the opening of the housing, and the contactor has an elastic piece for pressing the flexible substrate facing up and down of the housing and a fixing piece fixed to the housing groove of the housing, In a flexible board connector including a connecting portion for connecting the base portions of the fixed piece portion and the elastic piece portion to each other, and a lead portion extended from the connecting portion and soldered to a conductor pattern on the surface of the PCB, The contact is formed by stamping with a press, and only the lead is exposed at the front end or the rear end of the lower plate of the housing. A first portion extending downward and a second portion extending from the first portion along the lower surface of the lower plate portion of the housing are disposed in a vertical projection space of the housing and the closed lid member. A lower plate portion of the housing is sandwiched between the second portion of the lead portion and the connecting portion, and an upper portion of the second portion has a concave portion formed on a lower surface of the lower plate portion of the housing. Characterized by being housed in

【0009】本発明では、リード部がハウジングの下板
部の下面に沿わさる、いわゆる内出しリードとなるの
で、ハウジングの前方や後方に突出するいわゆる外出し
リードの場合のように障害物と干渉して変形したりする
おそれが少ない。また、リード部がハウジング及び閉じ
状態の蓋部材の上下方向の投影空間内に配置されるの
で、PCBへの実装面積を削減して省スペースを図るこ
とができる。
In the present invention, since the lead portion is a so-called outgoing lead extending along the lower surface of the lower plate portion of the housing, it interferes with an obstacle as in the case of a so-called outgoing lead protruding forward or backward of the housing. It is less likely to be deformed. In addition, since the lead portion is arranged in the vertical projection space of the housing and the closed lid member, the mounting area on the PCB can be reduced and space can be saved.

【0010】また、リード部と連結部との間にハウジン
グの下板部を挟持するように接触子を圧入するだけで、
ハウジングの下板部からのリード部の突出量を容易且つ
精度良く規定することができる。しかも、接触子がプレ
ス打ち抜き形成されているので、曲げ形成する場合と比
較してばらつきのない寸方精度が達成される結果、簡単
な構成と簡単な工程で精度良くリード部の先端の共平面
性を確保することができる。
[0010] Further, by simply press-fitting the contact so that the lower plate of the housing is sandwiched between the lead and the connecting portion,
The amount of protrusion of the lead from the lower plate of the housing can be easily and accurately defined. In addition, since the contact is formed by press punching, dimensional accuracy is achieved with less variation than in the case of bending, and as a result, the coplanarity of the tip of the lead portion is accurately obtained with a simple configuration and a simple process. Nature can be secured.

【0011】また、リード部の第2の部分の上面がハウ
ジングの下板部の凹部内に収容されるので、リード部近
傍において、凹部の深さ分だけ、PCBの表面からハウ
ジングの下板部までの高さを高くすることができ、これ
により、半田や半田付けのためのフラックスが上方へ吸
い上げられる現象(ウィッキング。フラックス上がりと
もいう)の発生を防止することができる。
Further, since the upper surface of the second portion of the lead portion is accommodated in the concave portion of the lower plate portion of the housing, the lower plate portion of the housing is separated from the surface of the PCB by the depth of the concave portion near the lead portion. This can prevent a phenomenon in which solder or flux for soldering is sucked upward (wicking, also referred to as flux rise).

【0012】請求項2記載の発明は、請求項1記載のフ
レキシブル基板用コネクタを基板に取り付けるフレキシ
ブル基板用コネクタの取付構造であって、PCBの表面
に形成されて上記リード部に接続される導体パターン
が、ハウジング及び閉じ状態の蓋部材の上下方向投影空
間に対応する領域内に配置されることを特徴とするもの
である。本発明では、PCBにおいてコネクタを実装す
る面積を狭くすることができる。
According to a second aspect of the present invention, there is provided a mounting structure of a flexible board connector for mounting the flexible board connector according to the first aspect on a board, wherein the conductor is formed on a surface of a PCB and connected to the lead portion. The pattern is arranged in a region corresponding to the vertical projection space of the housing and the lid member in the closed state. According to the present invention, the area for mounting the connector on the PCB can be reduced.

【0013】[0013]

【発明の実施の形態】本発明の好ましい実施の形態につ
いて添付図面を参照しつつ説明する。図1(a)及び
(b)は蓋部材を開放した状態を示すフレキシブル基板
用コネクタの平面図及び前面図であり、図2は図1のII
−II線に沿う断面図であり、図3は図1のIII −III 線
に沿う断面図である。これらの図を参照して、本フレキ
シブル基板用コネクタ1(以下では、単にコネクタ1と
もいう)は、前方からフレキシブル基板2(以下では、
単にFPC2ともいう)が挿抜される挿抜空間3を区画
する合成樹脂製のハウジング4を備えている。このハウ
ジング4の前半分は、ハウジング4の上板部5の開口部
6を介して上方に向け開放しており、この開口部6を回
動により開閉することのできる合成樹脂成形品からなる
蓋部材7が設けられている。蓋部材7は回動軸線8の回
りに回動自在にハウジング4に取り付けられている。9
はハウジングの強度を向上させる金属製の補強タブであ
り、回動軸線8を含む回動支軸(図示せず)をハウジン
グに支持している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described with reference to the accompanying drawings. 1 (a) and 1 (b) are a plan view and a front view of a flexible board connector showing a state where a lid member is opened, and FIG.
FIG. 3 is a cross-sectional view taken along a line II-III in FIG. 1. With reference to these drawings, the flexible board connector 1 (hereinafter, also simply referred to as the connector 1) includes a flexible board 2 (hereinafter, simply referred to as a connector 1) from the front.
A housing 4 made of a synthetic resin is provided to define an insertion / extraction space 3 into which an FPC 2 is inserted / extracted. The front half of the housing 4 is opened upward through an opening 6 of the upper plate 5 of the housing 4 and a lid made of a synthetic resin molded product that can be opened and closed by turning the opening 6. A member 7 is provided. The lid member 7 is attached to the housing 4 so as to be rotatable around a rotation axis 8. 9
Is a metal reinforcing tab for improving the strength of the housing, and supports a rotation support shaft (not shown) including the rotation axis 8 on the housing.

【0014】ハウジング4の挿抜空間3には、ハウジン
グ4の挿抜空間3に前側から挿入されて固定される複数
の第1の接触子10と、ハウジング4の挿抜空間3に後
側から挿入されて固定される複数の第2の接触子11が
横並びに交互に配列されている。第2の接触子11の前
端はハウジングの下板部12の前端13よりも所定距離
後退した位置にある。
A plurality of first contacts 10 which are inserted into the insertion / extraction space 3 of the housing 4 from the front side and fixed thereto, and are inserted into the insertion / extraction space 3 of the housing 4 from the rear side. A plurality of second contacts 11 to be fixed are arranged side by side and alternately. The front end of the second contact 11 is located at a position retracted by a predetermined distance from the front end 13 of the lower plate portion 12 of the housing.

【0015】図1及び図2を参照して、第1の接触子1
0はプレスにより打ち抜き形成された金属部材からな
る。第1の接触子10は、ハウジング4の下板部12の
上面に形成された収容溝14に前側からFPC2の挿入
方向Xに沿って収容される固定片部15と、この固定片
部15の前端16と連結部17を介して互いに連結され
る第1の弾性片部18と、固定片部15の後端19の近
傍から立ち上がる横向きJ字形形状をなして前方へ延
び、第1の弾性片部18の後部上方まで達する第2の弾
性片部20とを備えている。
Referring to FIGS. 1 and 2, a first contact 1
Numeral 0 is a metal member stamped and formed by pressing. The first contact 10 includes a fixing piece 15 that is housed in a housing groove 14 formed on the upper surface of the lower plate 12 of the housing 4 from the front side along the insertion direction X of the FPC 2, A first elastic piece 18 connected to each other via a front end 16 and a connecting portion 17; a first elastic piece extending in a lateral J-shape rising from the vicinity of a rear end 19 of the fixed piece 15 and extending forward; And a second elastic piece 20 reaching above the rear of the part 18.

【0016】31は第2の弾性片部20の前端に設けら
れた下向きに突出する山形突起であり、第1の弾性片部
18の後端との間にFPC2を弾性的に挟持して接圧を
確保する。固定片部15の後端19は被圧入突起を有し
ていると共に、ハウジング4の後部に設けられた固定孔
21に圧入固定されている。連結部17の下部には逆T
字状をなすリード部22が延設されている。リード部2
2は、ハウジング4の下板部12の前端13に沿って下
方へ延びる第1の部分23と、第1の部分23の下端か
ら後方へ延びる第2の部分24と、第1の部分23の下
端から前方へ延びる第3の部分25とを含む。リード部
22の第2の部分24と連結部17との間に、ハウジン
グ4の下板部12が挟持され、これにより、第1の接触
子10の前側部分である連結部17がハウジング4に固
定されている。
Numeral 31 denotes a downwardly protruding chevron provided at the front end of the second elastic piece 20. The FPC 2 is elastically sandwiched and in contact with the rear end of the first elastic piece 18. Ensure pressure. The rear end 19 of the fixing piece 15 has a press-fitting projection and is press-fitted and fixed in a fixing hole 21 provided in the rear part of the housing 4. The lower part of the connecting part 17 has an inverted T
A lead portion 22 having a character shape is extended. Lead 2
2 includes a first portion 23 extending downward along the front end 13 of the lower plate portion 12 of the housing 4, a second portion 24 extending rearward from the lower end of the first portion 23, and a first portion 23. A third portion 25 extending forward from the lower end. The lower plate part 12 of the housing 4 is sandwiched between the second part 24 of the lead part 22 and the connecting part 17, whereby the connecting part 17, which is the front part of the first contact 10, is attached to the housing 4. Fixed.

【0017】図2の断面において、ハウジング4の下板
部12の下面26は、前端13から所定距離までの部分
に凹部27を形成しており、リード部22の第2の部分
24はこの凹部27に沿って後方へ延びている。リード
部22の第2の部分24の下面28がPCB29の表面
30に接することになるが、上記の第2の部分24の下
面28と下板部12の下面26との間の距離が、上記の
凹部27の深さ分だけ遠ざけられるので、いわゆる半田
上がりの発生を防止することができる。
In the cross section of FIG. 2, the lower surface 26 of the lower plate portion 12 of the housing 4 has a concave portion 27 formed at a predetermined distance from the front end 13, and the second portion 24 of the lead portion 22 is formed by the concave portion. It extends rearward along 27. The lower surface 28 of the second portion 24 of the lead portion 22 comes into contact with the surface 30 of the PCB 29, and the distance between the lower surface 28 of the second portion 24 and the lower surface 26 of the lower plate portion 12 is , So that the so-called solder wicking can be prevented.

【0018】脚部となる第2及び第3の部分24,25
を含むリード部22は、ハウジング4及び閉じ状態の蓋
部材7の外郭形状の上下方向の投影空間A内に含まれて
おり、その結果、PCB29の表面30において、リー
ド部22と接続される導体パターン(図示せず)は、投
影空間Aに対応する領域B内に配置されることになり、
PCB29上でのコネクタ1の実装スペースを削減する
ことができる。
Second and third portions 24, 25 serving as legs
Is included in the vertical projection space A of the outer shape of the housing 4 and the lid member 7 in the closed state, and as a result, a conductor connected to the lead portion 22 on the surface 30 of the PCB 29 The pattern (not shown) will be arranged in the area B corresponding to the projection space A,
The mounting space for the connector 1 on the PCB 29 can be reduced.

【0019】次いで、図1及び図3を参照して、第2の
接触子11はプレスにより打ち抜き形成された金属部材
からなり、ハウジング4の挿脱空間3に後側からFPC
2の引き抜き方向Yに沿って挿入されて固定されてい
る。第2の接触子11は、ハウジング4の上部の固定孔
32に後側から挿入されて固定される係止突起付きの固
定片部33と、ハウジング4の下板部12の上面に形成
された収容溝34に後側から収容され、固定片部33の
下方に位置する弾性片部35と、固定片部33と弾性片
部35の後端部同士を連結する連結部36と、連結部3
6の下部に延設されたリード部37とを備える。
Next, referring to FIGS. 1 and 3, the second contactor 11 is made of a metal member stamped and formed by pressing, and is inserted into the insertion / removal space 3 of the housing 4 from the rear side by FPC.
2 and is fixed along the withdrawal direction Y. The second contactor 11 is formed on the upper surface of the lower plate portion 12 of the housing 4 with a fixing piece portion 33 having a locking projection inserted from the rear side and fixed in the fixing hole 32 on the upper portion of the housing 4. An elastic piece 35 accommodated from the rear side in the accommodation groove 34 and positioned below the fixed piece 33, a connecting part 36 for connecting the fixed piece 33 and the rear end of the elastic piece 35 to each other, and a connecting part 3
6 and a lead portion 37 extended below the lower end of the lead 6.

【0020】固定片部33及び弾性片部35のそれぞれ
の前端はハウジング4の前後方向の中間部まで延びてい
る。弾性片部35の前端にはFPC2と接圧を確保する
ための上向きの山形突起38が形成されている。リード
部37は、連結部36の下部から下方へ延びる第1の部
分39と、この第1の部分39の下端と傾斜状のコーナ
部40を介して連結されハウジング4の下板部12の下
面26に沿って前方へ延びる第2の部分41とを含み、
全体が略J字形形状をなしている。
The front ends of the fixed piece portion 33 and the elastic piece portion 35 extend to an intermediate portion of the housing 4 in the front-rear direction. At the front end of the elastic piece portion 35, an upwardly projecting projection 38 for securing a contact pressure with the FPC 2 is formed. The lead portion 37 is connected to a first portion 39 extending downward from a lower portion of the connecting portion 36, and a lower end of the first portion 39 via an inclined corner portion 40. A second portion 41 extending forward along 26;
The whole has a substantially J-shape.

【0021】図3の断面において、ハウジング4の下板
部12の下面26は、後端42から所定距離の領域で凹
部43を形成しており、リード部37の第2の部分41
はこの凹部43に沿って前方へ延びている。リード部3
7の第2の部分41の下面46がPCB29の表面30
に接することになるが、上記の第2の部分41の下面4
6と下板部12の下面26との間の距離が、上記の凹部
43の深さ分だけ遠ざけられるので、いわゆる半田上が
りの発生を防止することができる。
In the cross section of FIG. 3, the lower surface 26 of the lower plate portion 12 of the housing 4 forms a concave portion 43 at a predetermined distance from the rear end 42, and the second portion 41 of the lead portion 37 is formed.
Extends forward along the recess 43. Lead part 3
The lower surface 46 of the second part 41 of FIG.
, But the lower surface 4 of the second portion 41
Since the distance between the lower surface portion 6 and the lower surface 26 of the lower plate portion 12 is set apart by the depth of the concave portion 43, it is possible to prevent so-called solder rising.

【0022】脚部となる第2の部分41を含むリード部
37は、ハウジング4及び閉じ状態の蓋部材7の外郭形
状の上下方向の投影空間A内に含まれている。その結
果、PCB29の表面30において、リード部22及び
リード部37とそれぞれ接続される導体パターン44,
45は、投影空間Aに対応する領域B内に配置されるこ
とになり、PCB29上でのコネクタ1の実装面積を削
減することができる。
The lead portion 37 including the second portion 41 serving as a leg is included in the projection space A in the vertical direction of the outer shape of the housing 4 and the closed lid member 7. As a result, on the surface 30 of the PCB 29, the conductor patterns 44, which are respectively connected to the lead portions 22 and 37,
45 is arranged in the area B corresponding to the projection space A, and the mounting area of the connector 1 on the PCB 29 can be reduced.

【0023】以上の如く本実施の形態によれば、リード
部22,37がハウジング4の下板部12の下面26に
沿わさる、いわゆる内出しリードとなるので、いわゆる
外出しリードの場合のように障害物と干渉して変形した
りするおそれが少ない。また、リード部22,37の第
2の部分28,41と連結部17,36との間にハウジ
ング4の下板部12を挟持するように接触子10,11
を圧入するだけで、ハウジング4の下板部12からのリ
ード部22,37の突出量を容易且つ精度良く規定する
ことができる。しかも、接触子10,11がプレス打ち
抜き形成されているので、曲げ形成する場合と比較して
ばらつきのない寸方精度が達成される結果、簡単な構成
と簡単な工程で精度良くリード部22,37の先端の共
平面性を確保することができる。
As described above, according to the present embodiment, the lead portions 22 and 37 are so-called outgoing leads along the lower surface 26 of the lower plate portion 12 of the housing 4, so that the so-called outgoing leads are used. It is less likely to deform due to interference with obstacles. Further, the contacts 10, 11 are sandwiched between the second portions 28, 41 of the leads 22, 37 and the connecting portions 17, 36 so as to sandwich the lower plate 12 of the housing 4.
By simply press-fitting, the amount of protrusion of the lead portions 22 and 37 from the lower plate portion 12 of the housing 4 can be easily and accurately defined. In addition, since the contacts 10 and 11 are formed by press stamping, dimensional accuracy with no variation is achieved as compared with the case where the contacts are formed by bending. As a result, the leads 22, 22 can be accurately formed with a simple configuration and a simple process. The coplanarity of the tips of the 37 can be ensured.

【0024】また、リード部22,37の第2の部分2
4,41の上部がハウジング4の下板部12の凹部2
7,43内に収容されるので、リード部22,37近傍
において、凹部27,43の深さ分だけ、PCB29の
表面30からハウジング4の下板部12までの高さを高
くすることができ、これにより、半田や半田付けのため
のフラックスが上方へ吸い上げられる現象(ウィッキン
グ。フラックス上がりともいう)の発生を防止すること
ができる。
The second portion 2 of the lead portion 22, 37
4 and 41 are recesses 2 of lower plate 12 of housing 4.
7 and 43, the height from the surface 30 of the PCB 29 to the lower plate portion 12 of the housing 4 can be increased by the depth of the concave portions 27 and 43 in the vicinity of the lead portions 22 and 37. Thus, it is possible to prevent a phenomenon in which the solder or the flux for soldering is sucked upward (wicking, also referred to as flux rising).

【0025】なお、第1の接触子10のリード部22の
第2の部分24は凹部27に密着しており、表面張力に
よる溶融半田の吸い上げをより確実に防止できる。一
方、第2の接触子11のリード部37の第2の部分41
は凹部43との間に隙間を設けているが、吸い上げられ
た溶融半田が凹部43との間の隙間に溜められるので、
問題ない。
The second portion 24 of the lead portion 22 of the first contact 10 is in close contact with the recess 27, so that the suction of the molten solder due to the surface tension can be more reliably prevented. On the other hand, the second portion 41 of the lead portion 37 of the second contact 11
Has a gap between the recess 43, but the sucked molten solder is stored in the gap between the recess 43,
no problem.

【0026】なお、本発明は上記実施の形態に限定され
るものではなく、例えば第1の接触子10のリード部2
2の第3の部分25を廃止し、リード部を略L字形形状
にしても良い。この場合、PCB29への実装面積をよ
り削減することができる。その他、本発明の範囲で種々
の変更を施すことができる。
The present invention is not limited to the above-described embodiment. For example, the lead 2 of the first contact 10
The third portion 25 of FIG. 2 may be omitted, and the lead portion may have a substantially L-shape. In this case, the mounting area on the PCB 29 can be further reduced. In addition, various changes can be made within the scope of the present invention.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)及び(b)はそれぞれ蓋部材を開放した
状態を示すフレキシブル基板用コネクタの平面図及び前
面図である。
FIGS. 1 (a) and 1 (b) are a plan view and a front view of a flexible board connector showing a state where a lid member is opened, respectively.

【図2】図1のII−II線に沿う断面図であり、各接触子
の断面のハッチングを省略してある。
FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1, in which hatching of a cross section of each contact is omitted.

【図3】図1のIII −III 線に沿う断面図であり、各接
触子の断面のハッチングを省略してある。
FIG. 3 is a cross-sectional view along the line III-III in FIG. 1, in which hatching in a cross section of each contact is omitted.

【符号の説明】[Explanation of symbols]

1 コネクタ 2 FPC 4 ハウジング 6 開口部 7 蓋部材 10 第1の接触子 11 第2の接触子 12 下板部 13 前端 15 固定片部 17 連結部 18 第1の弾性片部 22 リード部 23 第1の部分 24 第2の部分 26 下面 27 凹部 29 PCB 30 表面 33 固定片部 35 弾性片部 36 連結部 37 リード部 39 第1の部分 41 第2の部分 42 後端 43 凹部 44,45 導体パターン A 投影空間 B 領域 Reference Signs List 1 connector 2 FPC 4 housing 6 opening 7 lid member 10 first contact 11 second contact 12 lower plate 13 front end 15 fixing piece 17 connecting part 18 first elastic piece 22 lead part 23 first Part 24 second part 26 lower surface 27 concave part 29 PCB 30 front surface 33 fixing piece part 35 elastic piece part 36 connecting part 37 lead part 39 first part 41 second part 42 rear end 43 concave part 44, 45 conductor pattern A Projection space B area

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】上方に開放するハウジングの開口部に臨む
ように複数配列された接触子と、ハウジングの開口部を
開閉自在な蓋部材とを備え、 この接触子は、ハウジングの上下に対向するフレキシブ
ル基板押圧用の弾性片部及びハウジングの収容溝に固定
される固定片部と、これら固定片部と弾性片部の基端部
同士を連結する連結部と、この連結部から延設されてP
CBの表面の導体パターンに半田付けされるリード部と
を含むフレキシブル基板用コネクタにおいて、 上記接触子はプレスにより打ち抜き形成されたものから
なると共に、上記リード部のみがハウジングの下板部の
前端又は後端に露出しており、 上記リード部は、連結部から下方に延びる第1の部分と
第1の部分からハウジングの下板部の下面に沿って延び
る第2の部分とを含むと共に、ハウジング及び閉じ状態
の蓋部材の上下方向の投影空間内に配置されており、 上記リード部の第2の部分と上記連結部との間にハウジ
ングの下板部を挟持しており、 上記第2の部分の上部はハウジングの下板部の下面に形
成された凹部に収容されていることを特徴とするフレキ
シブル基板用コネクタ。
A plurality of contacts arranged so as to face an opening of a housing opened upward, and a lid member capable of opening and closing the opening of the housing, wherein the contacts are opposed to the top and bottom of the housing. An elastic piece for pressing the flexible substrate and a fixing piece fixed to the housing groove of the housing, a connecting part for connecting these fixed pieces and the base ends of the elastic pieces, and extending from the connecting part. P
A connector for a flexible substrate including a lead portion soldered to a conductor pattern on a surface of a CB, wherein the contact is formed by punching out a press, and only the lead portion is a front end of a lower plate portion of a housing or Exposed at the rear end, the lead portion includes a first portion extending downward from the connecting portion, and a second portion extending from the first portion along a lower surface of the lower plate portion of the housing. And a lower plate portion of the housing is interposed between the second portion of the lead portion and the connecting portion, and is disposed in the vertical projection space of the lid member in the closed state. A flexible board connector characterized in that an upper portion of the portion is accommodated in a recess formed on a lower surface of a lower plate portion of the housing.
【請求項2】請求項1記載のフレキシブル基板用コネク
タを基板に取り付けるフレキシブル基板用コネクタの取
付構造であって、PCBの表面に形成されて上記リード
部に接続される導体パターンが、ハウジング及び閉じ状
態の蓋部材の上下方向投影空間に対応する領域内に配置
されることを特徴とするフレキシブル基板用コネクタの
取付構造。
2. A mounting structure for a flexible board connector according to claim 1, wherein the conductive pattern formed on the surface of the PCB and connected to the lead portion comprises a housing and a closing member. A mounting structure for a connector for a flexible board, wherein the mounting structure is arranged in a region corresponding to a vertical projection space of a lid member in a state.
JP11185888A 1999-06-30 1999-06-30 Connector for flexible board and its mounting structure Pending JP2001015196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11185888A JP2001015196A (en) 1999-06-30 1999-06-30 Connector for flexible board and its mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11185888A JP2001015196A (en) 1999-06-30 1999-06-30 Connector for flexible board and its mounting structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004130367A Division JP2004221092A (en) 2004-04-26 2004-04-26 Connector for flexible substrate and mounting structure thereof

Publications (1)

Publication Number Publication Date
JP2001015196A true JP2001015196A (en) 2001-01-19

Family

ID=16178648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11185888A Pending JP2001015196A (en) 1999-06-30 1999-06-30 Connector for flexible board and its mounting structure

Country Status (1)

Country Link
JP (1) JP2001015196A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231348A (en) * 2001-02-07 2002-08-16 D D K Ltd Connector
US6921293B2 (en) 2002-05-07 2005-07-26 J.S.T. Mfg. Co. Ltd. Connector structure
WO2006043381A1 (en) * 2004-10-21 2006-04-27 Iriso Electronics Co., Ltd. Connector
KR100602338B1 (en) * 2005-08-10 2006-07-19 주식회사 현대오토넷 Wide overlap snap-in fixing typed body control module
US7261588B2 (en) 2003-09-26 2007-08-28 J.S.T. Mfg. Co., Ltd. Connector having a lever for opening and closing upper and lower arms of forked contact members
WO2009093586A1 (en) * 2008-01-21 2009-07-30 Tyco Electronics Amp K.K. Surface-mount component and electric connector

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231348A (en) * 2001-02-07 2002-08-16 D D K Ltd Connector
JP4607348B2 (en) * 2001-02-07 2011-01-05 第一電子工業株式会社 connector
US6921293B2 (en) 2002-05-07 2005-07-26 J.S.T. Mfg. Co. Ltd. Connector structure
US7261588B2 (en) 2003-09-26 2007-08-28 J.S.T. Mfg. Co., Ltd. Connector having a lever for opening and closing upper and lower arms of forked contact members
WO2006043381A1 (en) * 2004-10-21 2006-04-27 Iriso Electronics Co., Ltd. Connector
JP2006120429A (en) * 2004-10-21 2006-05-11 Iriso Denshi Kogyo Kk Connector
JP4510581B2 (en) * 2004-10-21 2010-07-28 イリソ電子工業株式会社 connector
KR100602338B1 (en) * 2005-08-10 2006-07-19 주식회사 현대오토넷 Wide overlap snap-in fixing typed body control module
WO2009093586A1 (en) * 2008-01-21 2009-07-30 Tyco Electronics Amp K.K. Surface-mount component and electric connector

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