JP3436491B2 - Board surface mount connector - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board surface mounting connector mounted on the surface of a board.

[0002]

[Prior Art and Problems to be Solved by the Invention]
An L-shaped lead portion for soldering to a conductive member on the surface of the substrate is provided on the side of the connector. For this reason,
On the surface of the board, the area for mounting the connector becomes large, and it is not possible to meet the demand for miniaturization. On the other hand, by applying the ball grid array technology (BGA technology) for mounting an IC chip on a substrate without using external leads, even in a connector, a contact is connected to a conductive pad on the substrate directly below the connector housing via a solder ball. It has been proposed to join so as to be able to conduct electricity (for example, Japanese Patent Laid-Open No. 10-16290).
No. 9). In this case, there is an advantage that the external leads protruding laterally of the connector housing can be eliminated and the size can be reduced.

However, when the above-mentioned solder balls are used, the solder balls are present between the lower surface of the housing and the surface of the substrate in the pre-soldering stage, and the gap between them is regulated. The hot air is sent through the gap to reflow the solder balls. When the above-mentioned gap is wide, a sufficient amount of hot air can be sent, so that good soldering can be performed, but it is against the requirement of small size. On the contrary, if the above gap is narrowed, it can contribute to downsizing, but the amount of hot air is insufficient and the reliability of soldering is reduced. Therefore, it is necessary to accurately set the amount of the above gap.

However, in the above BGA technology,
Since a part of the solder ball is accommodated in the lower end of the accommodating hole of the contact, the amount of the above gap is defined by both the opening diameter of the accommodating hole and the diameter of the solder ball. As a result, it is very difficult to set the amount of the gap with high accuracy due to the influence of variations in the dimensional accuracy of the both and the accuracy of the combination of the two. Therefore, it is difficult to achieve both miniaturization of mounting and reliability of soldering.

Further, since a part of the solder ball is accommodated in the lower end of the accommodation hole of the contact, wicking in which the molten solder is sucked up into the accommodation hole is likely to occur. In order to prevent this, it is necessary to perform processing such as coating or plating with a material having no solder wettability on the intermediate portion of the contact, which increases the manufacturing cost.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a board surface mounting connector which can save mounting space on a board and has high reliability in soldering. To do.

[0007]

As a means for solving the above problems, the aspect of the invention according to claim 1 is as follows.
In a board surface mounting connector mounted on the surface of a board having a pattern-arranged conductive member, an insulative housing having an outer surface facing the surface of the board,
And a contact number poles embedded in alignment in the housing, each contact, the corresponding counterpart
Open the contact area that contacts the contact and the outer surface of the housing.
A press-fitting portion that is press-fitted into the mouth containing hole, and protrudes from the press-fitting side rear end of the press-fitting portion in order to solder to the conductive member via paste solder previously applied to the conductive member.
Is formed to protrude from the outer surface of the housing consists of a press molded article having a lead portion extending to the surface of the substrate, the upper
Serial lead portions are included in the region of the outer surface of the housing in plan view, between the outer surface and the substrate surface of the housing to make room for the reflow process, the co
The rear end of the contact part of the contact is the outer surface of the housing.
The outer surface of the housing is flush with the opening of the accommodation hole.
Prevents the rise of solder, etc. during the reflow process on the periphery of
It has established a relief recess for press-fit portion of the contact
The rear end of the press-fitting side of is adjacent to the lead part during reflow processing.
A relief recess is provided to prevent the rise of solder etc.
It is characterized in that that.

In this aspect, the lead portion of the contact soldered to the conductive member of the substrate is included in the area of the outer surface of the housing in plan view, that is, the lead portion extends into the projection space of the outer surface of the housing. Unlike the conventional L-shaped lead portion projecting to the side of the housing, the mounting plane space is not widened. Further, since the projecting lead portion forms a space for the reflow process between the outer surface of the housing and the surface of the substrate, it is possible to send a sufficient amount of hot air to the paste solder for reflow. The gap between the outer surface of the housing and the surface of the substrate is preferably at least 0.2 mm in order to improve the reflow process.

Further , since the contacts are integrally punched and formed by pressing, the contacts can be manufactured at low cost. Here, it is preferable that the tip of the lead portion is tapered so that the joint area between the tip of the lead portion and the solder is widened.

Further , the press-fitting side rear end edge of the press-fitting portion of the contact
The amount of protrusion of the lead portion from the outer surface of the housing can be easily and accurately defined by simply press-fitting the contact such that the contact is flush with the outer surface of the housing. Since the contact itself achieves dimensional accuracy without variation by press molding, as a result, the coplanarity of the tip of the lead portion can be secured with high accuracy by a simple configuration and a simple process.

[0011] Since a recess in the periphery of the receiving hole in the outer surface of the housing, it is possible by the depth of the recess, to increase the height from the surface of the substrate to the periphery of the insertion hole.
This causes the flux for soldering or soldering to reach the lower surface of the housing and rise in the insertion hole due to surface tension (wicking, also called flux rising).
Can be prevented. Also, the contact pressure
Reflow processing is also possible by the relief recess at the rear end of the press-fitting side of the insertion part.
It is possible to prevent unnecessary rise of solder or the like at the time.

An aspect of the present invention according to claim 2 is the same as that of claim 1.
In addition, the lead part is located approximately in the center of the press-fitting side rear end of the press-fitting part.
Formed on the outer surface of the housing so as to project
Are provided in pairs with the corresponding contacts in between,
The relief recess at the rear end of the press-fitting side of the contact
A pair is provided on both sides of the part, and a pair of
A pair of reliefs at the rear end of the press-fitting side of the relief recess and the press-fitting part of the contact.
So that it surrounds the periphery of the lead part.
It is characterized by being present. In this aspect, how
The lead and the relief recess of the contact
Since it surrounds the surroundings, it is not necessary to use solder etc. during the reflow process.
It is possible to prevent a necessary rise. According to a third aspect of the present invention, in the first or second aspect, the lower end of the lead portion is formed in a hemispherical shape. A mounting technique using solder balls (BGA technique described above) has already spread, but in this technique, the board engaging surfaces of the solder balls are arranged in a common plane to form a substantially flat mounting interface. This is very important. Therefore, the coplanarity of the solder balls (coplanarit
Inspection machines etc. that inspect y) are already popular. In this aspect, since the lower end of the lead portion is formed in a hemispherical shape similar to a solder ball, it is possible to divert and use the above-described solder ball inspection machine. Further, by forming the conductive member on the surface of the board into a circular shape, it becomes possible to densely arrange the connection terminals between the board and the connector in a high-density grid.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 shows a pair of connectors as a substrate surface mounting connector according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II in FIG. In the present embodiment, description will be given in accordance with an example applied to each of the connector on the plug side and the connector on the receptacle side for connecting the substrate to each other, but the present invention is not limited to this, and for example, Alternatively, it may be a connector on the board side used for connecting the board and the flexible wiring.

Referring to FIGS. 1 and 2, with reference to
The first circuit board (PC
B: PRINT CIRCUIT BOARD) 2 and the second circuit board 4 on which the receptacle-side connector 3 is mounted are connected to each other via the connectors 1 and 3 connected to each other. Plug-side Connector First, the plug-side connector 1 will be described. The housing 5 of the plug-side connector 1 is formed by molding an insulative polymer capable of withstanding the surface mounting reflow temperature described below, and has a lower surface 6 that can face the surface 2a of the first circuit board 2. There is. On the lower surface 6 of the housing 5,
Accommodating holes 9,1 for accommodating a large number of contacts 7,8
0 is open. The contacts 7 and 8 housed in the housing holes 9 and 10 are arranged in a staggered staggered array as shown in FIG. The arrangement pitch of the contacts 7 and 8 may be very small, for example, 0.4 mm.

Lead portions 11, 12 of the contacts 7, 8
Is a conductive member 1 which projects from the accommodation holes 9 and 10 and extends right below the housing 5 and is arranged on the surface 2a of the first circuit board 2 in the same arrangement pattern as the contacts 7 and 8.
3 (see FIG. 4). Housing 5
A space d1 (see FIG. 2) is defined by the lead portions 11 and 12 between the lower surface 6 of the substrate and the surface 2a of the first circuit board 2, and when the lead portions 11 and 12 are soldered between the two. The space for reflow is formed.

Further, referring to FIGS. 1, 2 and 3,
Reinforcing tabs 14 to be soldered to the conductive member on the surface 2 a of the first circuit board 2 are projected in the vicinity of the four corners of the lower surface 6 of the housing 5. Since the four corners of the lower surface 6 of the housing 5 are firmly supported by the front surface 2a of the first circuit board 2 via the reinforcing tabs 14, the contact 7, 8, lead portion 11,
It is possible to prevent an unnecessary load from being applied to the soldered portion of 12.

With reference to FIGS. 2, 3 and 5, the contact 7 is integrally formed by punching by press molding. Each contact 7 integrally has a substantially L-shaped main body portion 7 a and a lead portion 11. The main body portion 7 a extends along the height direction H of the housing 5 and contacts the corresponding counterpart contact 27, and the main body portion 7 a extends along the width direction W of the housing 5 and the accommodation hole 9 of the housing 5.
And a press-fitting portion 7c that is press-fitted in.

The contact portion 7b has an engaging concave portion 7d for elastically engaging the engaging protrusion 27d of the counterpart contact 27 at a substantially central portion in the height direction H. Contact part 7b
Is the housing 5 on the rear surface of the side where the recess 7d is provided.
It is positioned along the inner wall surface of the accommodation hole 9. A lead portion 11 is formed so as to project at a substantially central portion of a lower end 7g which is a rear end of the press-fitting portion 7c on the press-fitting side. The press-fitting portion 7c has a pair of escape recesses 7e that are recessed upward with the lead portion 11 interposed therebetween, and a wedge-shaped retaining protrusion 7f that bites into the inner wall surface of the accommodation hole 9. Further, referring to FIGS. 3 and 5, lead portion 11 has a rectangular cross section, and lower end 15 of lead portion 11 is chamfered into a truncated pyramid shape to be tapered. In this way, it is preferable to make the tip of the lead portion 11 tapered so as to widen the joint area between the tip of the lead portion 11 and the solder.

Similarly, referring to FIGS. 3 and 5, the contact 8 is also integrally punched and formed by press molding. Each contact 8 integrally has an inverted T-shaped main body portion 8a and a lead portion 12. The main body portion 8 a extends along the height direction H of the housing 5 and contacts the corresponding counterpart contact, and the main body portion 8 a extends along the width direction W of the housing 5 and is press-fitted into the accommodation hole 10 of the housing 5. And a press-fitting portion 8c.

The contact portion 8b has an engaging concave portion 8d for elastically engaging the engaging protrusion 28d of the mating contact 28 at a substantially central portion in the height direction H. Contact part 8b
Is the housing 5 on the rear side of the surface on which the recess 8d is provided.
It is positioned along the inner wall surface of the accommodation hole 10.
A lead portion 12 is formed so as to project at a substantially central portion of a lower end 8g which is a rear end of the press-fitting portion 8c on the press-fitting side. The press-fitting portion 7c includes a pair of escape recesses 8e that are recessed upward with the lead portion 12 interposed therebetween, and a wedge-shaped retaining protrusion 8 that bites into the inner wall surface of the accommodation hole 10.
f and. Further, the lead portion 12 has a quadrangular cross section, and the lower end 16 of the lead portion 12 is chamfered into a truncated pyramid shape to be tapered.

Further, referring to FIG. 2, each contact 7,
The press-fitting portions 7c, 8c of 8 are the lower end 7 which is the edge after the press-fitting.
g and 8g are press-fitted so as to be flush with the lower surface 6 of the housing 5. With reference to FIG. 6 which is a cross-sectional view taken along line VI-VI of FIG. 3 and FIG. 2, a pair of escape recesses 17, 1 are provided at the peripheral edge of the opening of the accommodation hole 9 formed in the lower surface 6 of the housing 5.
8 are formed to prevent flux or solder for soldering from entering the accommodation hole 9 of the contact 7. The pair of escape recesses 17 and 18 are arranged along the longitudinal direction L of the housing 5 with the contact 7 interposed therebetween. On the other hand, as described above, in the width direction W of the housing 5, the pair of escape recesses 7e provided in the contact 7 itself are arranged so as to sandwich the lead portion 11. As a result, the escape recesses 7e, 17 and 18 are arranged so as to surround the periphery of the lead portion 11, and unnecessary rise of solder during reflow processing is prevented.

With respect to the accommodation hole 10 of the contact 8, escape recesses 17 and 18 are formed for the same purpose. Receptacle Side Connector Next, the receptacle side connector 3 will be described with reference to FIGS. 1, 2, 7, and 8. The housing 25 of the receptacle-side connector 3 is formed by molding an insulative polymer that can withstand the surface mounting reflow temperature described below, and has an upper surface 26 that can face the surface 4a of the second circuit board 4. There is. Upper surface 2 of housing 5
Housing holes 29 and 30 for housing a large number of contacts 27 and 28 are opened at 6. Each accommodation hole 29, 30
The contacts 27 and 28 housed in the are arranged in a staggered staggered arrangement. The arrangement pitch of the contacts 27, 28 may be very small, for example 0.4 mm.

Lead portions 31, 3 of the contacts 27, 28
Reference numeral 2 denotes a conductive member (not shown) which projects from the accommodation holes 29 and 30 and extends right above the housing 5 and is arranged on the surface 4a of the second circuit board 4 in the same arrangement pattern as the contacts 27 and 28. ) Is soldered to. A space d2 (see FIG. 2) is defined between the upper surface 26 of the housing 25 and the surface 4a of the second circuit board 4 by the lead portions 31 and 32, and the lead portions 31 and 32 are soldered between them. A space for reflow when forming is formed.

Further, referring to FIGS. 1, 2 and 7,
In the vicinity of the four corners of the upper surface 26 of the housing 25, reinforcing tabs 34 to be soldered to the conductive member on the surface 4a of the second circuit board 4 are projected. Since the four corners of the upper surface 26 of the housing 25 are firmly supported by the surface 4a of the second circuit board 4 via the reinforcing tabs 34, when the second circuit board 4 is twisted, the contacts 27, It is possible to prevent an unnecessary load from being applied to the soldered portions of the lead portions 31 and 32 of 28.

Referring to FIGS. 2 and 8, the contact 2
7 is integrally formed by punching by press molding. Each contact 27 integrally has a substantially T-shaped main body portion 27a and a lead portion 31. The main body portion 27 a has a contact portion 27 b that extends substantially along the height direction H of the housing 25 and is elastically in contact with the corresponding contact 7 of the plug-side connector 1, and has a hook shape that is long in the width direction W of the housing 25. And a press-fitting portion 27c that is press-fitted into the accommodation hole 29 of the housing 25.

The contact portion 27b is cantilevered by the press-fitting portion 27c, and is elastically bendable along the width direction W of the housing 25. At the lower end (tip) of the contact portion 27b, a hook-shaped engagement protrusion 27 that elastically engages with the recess 7d of the contact portion 7b of the contact 7 of the plug-side connector 1 is formed.
d is formed. A lead portion 31 is formed so as to project at a substantially central portion of an upper end 27g which is a rear end of the press-fitting portion 27c on the press-fitting side. The press-fitting portion 27c has a pair of recessed recesses 27e that are recessed downward with the lead portion 31 interposed therebetween, and a wedge-shaped retaining protrusion 27f that bites into the inner wall surface of the accommodation hole 9. Further, referring to FIGS. 7 and 8, lead portion 31 has a quadrangular cross section, and upper end 35 of lead portion 31 is chamfered in the shape of a truncated pyramid to be tapered.

Similarly, the contacts 28 are integrally punched by press molding. Each contact 28 is reverse L
The main body 28a having a character shape and the lead portion 32 are integrally provided. The main body portion 28a is in the height direction H of the housing 25.
The contact 8 of the plug-side connector 1
It has a contact portion 28b that elastically contacts with, and a press-fitting portion 28c that has a hook shape that is long in the width direction W of the housing 25 and that is press-fitted into the housing hole 30 of the housing 25.

The contact portion 28b is supported by the press-fitting portion 28c in a cantilevered manner, and is elastically bendable along the width direction W of the housing 25. At the lower end (tip) of the contact portion 28b, a hook-shaped engagement protrusion 28d that elastically engages with the engagement recess 8d of the contact portion 8b of the contact 8 of the plug-side connector 1 is formed.
Are formed. A lead portion 32 is formed so as to project at a substantially central portion of an upper end 28g which is a rear end of the press-fitting portion 28c on the press-fitting side. The press-fitting portion 28c has a pair of escape recesses 28e that are recessed downward with the lead portion 32 interposed therebetween, and a wedge-shaped retainer protrusion 28f that bites into the inner wall surface of the accommodation hole 30. Further, the lead portion 32 has a quadrangular cross section, and the upper end 36 of the lead portion 32 is chamfered in the shape of a truncated pyramid to be tapered.

Further, referring to FIG. 2, each contact 2
The press-fitting portions 27c and 28c of 7 and 28 are press-fitted so that the upper ends 27g and 28g, which are the rear edges of the press-fitting, are flush with the upper surface 26 of the housing 25. A pair of escape recesses 37, 38 are formed at the periphery of the openings of the respective accommodation holes 29, 30 formed in the upper surface 26 of the housing 25, so that the lead portions 31, 32 are surrounded. Escape recesses 27e or 28e, and 37 and 3
8 is arranged, which prevents unnecessary rise of solder during reflow. Mounting the Connector on the Board When mounting the plug-side connector 1 on the first circuit board 2, for example, cream solder is screen-printed on the surface of each conductive member 13 on the surface 2a of the first circuit board 2. After applying in a pattern arrangement in the same manner, the plug-side connector 1 is placed on the surface 2a of the first circuit board 2 and the conductive members 13 to which the lead portions 11 and 12 of the contacts 7 and 8 correspond.
Place it so that it abuts against. At this time, a gap d1 capable of introducing hot air for the reflow process is accurately provided between the lower surface 6 of the housing 5 and the surface 2a of the first circuit board 2. Next, the plug-side connector 1 arranged on the first circuit board 2 is conveyed and passed through a known reflow furnace by reflowing the above-mentioned paste solder, and the lead portions 1 of the contacts 7 and 8 are reflowed.
1 and 12 are the corresponding conductive members 1 of the first circuit board 2.
3 electrically and mechanically connected. The same applies to the procedure for mounting the receptacle-side connector 3 on the second circuit board 4.

In the present embodiment, the leads 11, 11 of the contacts 7, 8;
12; 31 and 32 extend into the projection space of the lower surface 6 or the upper surface 26 of the housings 5 and 25, so that it is possible to take a wide flat space like the lead portion protruding laterally of the conventional housings 5 and 25. Absent. In addition, the lead portion 11,
12; 31 and 32, the minimum necessary clearances d1 and d for the reflow process between the surfaces 6 and 26 of the housings 5 and 25 and the corresponding surfaces 2a and 4a of the circuit boards 2 and 4.
Since 2 can be formed with high accuracy, reliability of soldering can be increased through a reliable reflow process while reducing the mounting space.

Particularly, by simply press-fitting the contacts 7, 8; 27, 28, the lower surface 6 or the upper surface 2 of the housing 5, 25 can be obtained.
The amount of protrusion of the lead portions 11, 12; 31, 32 from 6 can be defined easily and accurately. Contact 7,
Since 8; 27, 28 themselves achieve dimensional accuracy without variation by press molding, as a result, the lead portions 11, 12; 31, 3 can be accurately manufactured with a simple configuration and a simple process.
The coplanarity of the tip of 2 can be secured.

The amount of protrusion of the lead portions 11, 12; 31, 32 is 0.2 mm to 0.4 mm.
It is preferable for improving the reflow process while achieving downsizing. In addition, the housing holes 9 and 10 of the housings 5 and 25,
At the periphery of the openings of 29 and 30, escape recesses 17, 18, 37,
Since 38 is formed, it is possible to prevent flux or solder for soldering from entering the accommodation holes 9, 10, 29, 30 of the contacts 7, 8, 27, 28.

The present invention is not limited to the above-described embodiment, and for example, the tip of the lead portion 41 of the contact 40 is made into a hemisphere by press-molding by imitating a known solder ball as shown in FIG. You can leave it. In FIG.
The contact 40 is an elastically deformable hollow contact portion 4
The main body portion 43 having the number 2, the press-fitting portion 45 having the wedge-shaped projection 44 that is press-fitted into the accommodation hole, and the lead portion 41 are integrally punched and formed by press molding. In the embodiment shown in FIG. 9, the coplanarity of the lead portion 41 can be inspected at low cost by using a solder ball inspection machine that has been widely used. In addition, it is possible to arrange the land shape of each conductive member on the surface of the board as a circular shape, and as a result, it is possible to arrange the connection terminals between the board and the connector in a high-density grid, and arrange them per unit area. The number of connection terminals that can be made can be significantly increased compared to the conventional one.

The lower surface 5 or the upper surface 25 of the housing 5
The lead portions 11, 12, 31, 32 of the contacts 7, 8, 27, 28 protruding from may extend vertically from the lower surface 5 or the upper surface 6 as in the above-described embodiment, or
It may have a bent portion on the way. In the case of having a bent portion, the bent portion is elastically deformed,
Since it is possible to absorb errors in the coplanarity of the tips of many lead portions, good soldering is ensured. Besides, various modifications can be made within the scope of the present invention.

[0035]

According to the first aspect of the invention, since the lead portion of the contact extends into the projection space of the outer surface of the housing, the plane space can be reduced. Further, since the lead portion forms a space for the reflow process between the outer surface of the housing and the surface of the substrate, there is no problem in soldering the lead portion.

[0036] Also, since the press-molded by an integral of punching the contact, it is possible to cost inexpensive to manufacture the contact. Also , just press fit the contact,
The amount of protrusion of the lead portion from the outer surface of the housing can be easily and accurately defined, and the coplanarity of the lead portion can be accurately ensured with a simple configuration and a simple process.

Further, it is possible to flux or solder for soldering can be prevented from entering the contact of the receiving hole. In the invention according to claim 2, the housing and
And the contact recesses
Since it surrounds, unnecessary rise of solder etc. during reflow processing
Can be prevented. In the invention according to claim 3 , since the lower end of the lead portion is formed into a spherical shape similar to a solder ball, the coplanarity of the lead portion can be inspected by using a solder ball inspection machine which has been widely used. It can be implemented at low cost. Further, the connection terminals between the board and the connector can be arranged in a high density grid.

[Brief description of drawings]

FIG. 1 is a schematic side view showing a state in which a pair of substrates are connected via a plug-side connector as a substrate surface-mounting connector and a receptacle-side connector according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 is a schematic perspective view of the plug-side connector as seen from below.

FIG. 4 is a schematic perspective view of the surface of the substrate.

5A and 5B are perspective views of each contact of the plug-side connector.

6 is a sectional view taken along line VI-VI in FIG.

FIG. 7 is a schematic perspective view of the upper surface of the receptacle-side connector.

8A and 8B are perspective views of each contact of the receptacle-side connector.

9A and 9B are a front view and a side view of a contact according to another embodiment of the present invention.

[Explanation of symbols]

1 Flag side connector 2 First circuit board 3 Receptacle side connector 4 Second circuit board 5 housing 6 Lower surface (outer surface) 7, 8, 27, 28 contacts 7a, 8a, 27a, 28a Main body 7b, 8b, 27b, 28b Contact part 7c, 8c, 27c, 28c Press-fitting part 7d, 8d Engagement recess 7e, 8e, 27e, 28e escape recess 7g, 8g Lower end (press-fitting side rear end) 27g, 28g Upper end (press-fitting side rear end) 9, 10, 29, 30 accommodation holes 17, 18, 37, 38 Escape recess 20 solder 27d, 28d engagement protrusion 11,12,31,32 Lead part 13 Conductive member 14,34 Reinforcement tab 26 Upper surface (outer surface)

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01R 12/22 H01R 12/16 H01R 12/32

Claims (3)

(57) [Claims] 1. A board surface mounting connector mounted on the surface of a board having a conductive member in a pattern arrangement, and an insulative housing having an outer surface facing the surface of the board, and a connector arranged in the housing. With a built-in multi-pole contact, each of the above contacts is connected to the corresponding counterpart contact.
The contact part to be touched and the housing hole opened on the outer surface of the housing
A press fit portion to be press-fitted, for soldering to the conductive member through the previously applied paste solder the conductive member, which protrudes through a compression side rear end of the press-fit portion projects from the outer surface of the housing made from the press-molded article and a lead portion extending to the surface of the substrate, the lead portions are included in the region of the outer surface of the housing in plan view, between the outer surface and the substrate surface of the housing, reflow A space for processing is formed, and the press-fitting side rear end of the press-fitting portion of the contact is the housing.
The outer surface of the housing is flush with the outer surface of the housing, and
Relief recess to prevent solder etc. from rising during brazing
Is provided, and the press-fitting side rear end of the press-fitting part of the contact is adjacent to the lead part.
To prevent solder etc. from rising during reflow processing.
A board surface mount connector, which is provided with an escape recess for the purpose. 2. The lead portion is substantially at the rear end of the press-fitting portion on the press-fitting side.
The relief recess formed on the outer surface of the housing is formed so as to project from the central portion, and
And a relief recess is provided at the rear end of the press-fitting side of the press-fitting part of the contact.
A pair is provided with the card part in between, and a pair of relief recesses and contacts are press-fitted on the outer surface of the housing.
Of the lead part by the pair of relief recesses at the rear end of the press-fitting side
The board surface mounting connector according to claim 1, wherein the connector surrounds the periphery of the board. 3. The tip of the lead portion is formed in a hemispherical shape.
Surface mount connector of claim 1 or 2, wherein the are.