JP3055702B2 - 集積回路内の高周波供給電圧の変動を抑止する能動的バイパス - Google Patents

集積回路内の高周波供給電圧の変動を抑止する能動的バイパス

Info

Publication number
JP3055702B2
JP3055702B2 JP3006346A JP634691A JP3055702B2 JP 3055702 B2 JP3055702 B2 JP 3055702B2 JP 3006346 A JP3006346 A JP 3006346A JP 634691 A JP634691 A JP 634691A JP 3055702 B2 JP3055702 B2 JP 3055702B2
Authority
JP
Japan
Prior art keywords
integrated circuit
transistor
power supply
circuit according
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3006346A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04212512A (ja
Inventor
ゴドフリー メイアー ロバート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JPH04212512A publication Critical patent/JPH04212512A/ja
Application granted granted Critical
Publication of JP3055702B2 publication Critical patent/JP3055702B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/30Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
    • H03F1/302Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in bipolar transistor amplifiers
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05FSYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F1/00Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
    • G05F1/10Regulating voltage or current 
    • G05F1/46Regulating voltage or current  wherein the variable actually regulated by the final control device is DC
    • G05F1/613Regulating voltage or current  wherein the variable actually regulated by the final control device is DC using semiconductor devices in parallel with the load as final control devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Networks Using Active Elements (AREA)
JP3006346A 1990-01-25 1991-01-23 集積回路内の高周波供給電圧の変動を抑止する能動的バイパス Expired - Lifetime JP3055702B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US469903 1990-01-25
US07/469,903 US5049764A (en) 1990-01-25 1990-01-25 Active bypass for inhibiting high-frequency supply voltage variations in integrated circuits

Publications (2)

Publication Number Publication Date
JPH04212512A JPH04212512A (ja) 1992-08-04
JP3055702B2 true JP3055702B2 (ja) 2000-06-26

Family

ID=23865491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3006346A Expired - Lifetime JP3055702B2 (ja) 1990-01-25 1991-01-23 集積回路内の高周波供給電圧の変動を抑止する能動的バイパス

Country Status (5)

Country Link
US (1) US5049764A (ref)
EP (1) EP0439230B1 (ref)
JP (1) JP3055702B2 (ref)
KR (1) KR910015048A (ref)
DE (1) DE69121254T2 (ref)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5701098A (en) * 1995-12-21 1997-12-23 National Semiconductor Corporation AC bypass circuit which provides stabilization of high frequency transient noise
US6456107B1 (en) 2001-01-04 2002-09-24 Sun Microsystems, Inc. CMOS-microprocessor chip and package anti-resonance method
US6483341B2 (en) 2001-01-04 2002-11-19 Sun Microsystems, Inc. CMOS-microprocessor chip and package anti-resonance apparatus
US6441640B1 (en) 2001-01-04 2002-08-27 Sun Microsystems, Inc. CMOS-microprocessor chip and package anti-resonance pass-band shunt apparatus
FI112560B (fi) * 2001-06-27 2003-12-15 Micro Analog Syst Oy RF-suoja Integroidulla piirillä
WO2004074947A2 (en) * 2003-02-14 2004-09-02 Dresser, Inc. Method, system and storage medium for performing online valve diagnostics
US7283894B2 (en) * 2006-02-10 2007-10-16 Dresser, Inc. System and method for fluid regulation
US7539560B2 (en) 2007-01-05 2009-05-26 Dresser, Inc. Control valve and positioner diagnostics
US20110090725A1 (en) * 2009-10-20 2011-04-21 Texas Instruments Inc Systems and Methods of Synchronous Rectifier Control
WO2012157155A1 (ja) 2011-05-16 2012-11-22 パナソニック株式会社 参照電圧安定化回路およびそれを備えた集積回路
EP2761384A4 (en) * 2011-09-30 2015-11-04 Intel Corp DEVICE AND METHOD FOR IMPROVING INTEGRATED VOLTAGE REGULATORS
US9194884B1 (en) * 2012-08-28 2015-11-24 Maxim Integrated Products, Inc. Integrated circuit with analog device fault detection
JPWO2017179301A1 (ja) * 2016-04-13 2019-02-21 株式会社ソシオネクスト 参照電圧安定化回路およびこれを備えた集積回路

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE709376C (de) * 1938-04-30 1941-08-14 Siemens & Halske Akt Ges Schaltungsanordnung mit steilheitsgesteuerten Blindwiderstaenden
US3619659A (en) * 1969-12-02 1971-11-09 Honeywell Inf Systems Integrator amplifier circuit with voltage regulation and temperature compensation
DE2946306C2 (de) * 1979-11-16 1987-02-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verstärkerschaltung mit vorgebbarem Wechselstrominnenwiderstand
DE2946305A1 (de) * 1979-11-16 1981-05-21 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Impedanzschaltung mit steuerbarem widerstandswert
SE423659B (sv) * 1980-09-26 1982-05-17 Ericsson Telefon Ab L M Kopplingsanordning
GB8321549D0 (en) * 1983-08-10 1983-09-14 British Telecomm Electronic switch
US4739193A (en) * 1986-10-30 1988-04-19 Rca Corporation Drive circuit with limited signal transition rate for RFI reduction
US4740717A (en) * 1986-11-25 1988-04-26 North American Philips Corporation, Signetics Division Switching device with dynamic hysteresis
US4947063A (en) * 1987-10-09 1990-08-07 Western Digital Corporation Method and apparatus for reducing transient noise in integrated circuits
NL8702781A (nl) * 1987-11-20 1989-06-16 Philips Nv Geintegreerde logische schakeling met "hot-carrier-stress"-reduktie en instabiliteiten-demping.
JPH07105446B2 (ja) * 1988-01-11 1995-11-13 株式会社東芝 Mos型半導体装置の入力保護回路
US4894567A (en) * 1988-10-17 1990-01-16 Honeywell Inc. Active snubber circuit
US4939616A (en) * 1988-11-01 1990-07-03 Texas Instruments Incorporated Circuit structure with enhanced electrostatic discharge protection
US4893212A (en) * 1988-12-20 1990-01-09 North American Philips Corp. Protection of power integrated circuits against load voltage surges

Also Published As

Publication number Publication date
DE69121254T2 (de) 1997-01-30
KR910015048A (ko) 1991-08-31
EP0439230A3 (en) 1993-05-26
EP0439230A2 (en) 1991-07-31
US5049764A (en) 1991-09-17
US5049764B1 (ref) 1992-12-15
JPH04212512A (ja) 1992-08-04
EP0439230B1 (en) 1996-08-14
DE69121254D1 (de) 1996-09-19

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