JP3049882B2 - Electroplated whetstone and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposition whetstone in which superabrasive grains are fixed to a base metal with a metal plating phase and a method of manufacturing the same. It relates to the improvement for improving the discharge performance.

[0002]

2. Description of the Related Art FIG. 4 is an enlarged cross-sectional view of an abrasive layer showing an example of a conventional electrodeposition grindstone. In the figure, reference numeral 1 denotes a base metal having various shapes, and a large number of superabrasive grains 2 are fixed in a single layer via a metal plating phase 3 to an abrasive grain layer forming surface 1A of the base metal 1.

[0003] To form the metal plating phase 3, an electrolytic plating method or an electroless plating method is used. In the case of using the electrolytic plating method, the base metal 1 subjected to masking except for the abrasive grain layer forming surface 1A is immersed in an electrolytic plating solution, and at least a part of the abrasive grain layer forming surface 1A is arranged upward and horizontally. .
Then, the superabrasive grains 2 are scattered on the horizontal surface, the base metal 1 is connected to the power supply cathode, and a current is applied between the horizontal surface and the anode disposed opposite to the horizontal surface, so that the metal plating phase 3 is deposited and the superabrasive particles 2 are deposited. Is fixed.

[0004] This operation is repeated over the entire circumference of the abrasive grain layer forming surface 1A while moving the base metal 1 to uniformly form a single-layer abrasive grain layer. When using electroless plating, the same operation as described above is performed except that an electroless plating solution is used as a plating solution and an anode is not used.

[0005] In each case, the metal plating phase 3
Is usually set to about 30 to 75% of the average particle diameter of the superabrasive grains 2. If the wall thickness is less than 30%, sufficient abrasive grain holding power cannot be obtained, and the superabrasive grains 2 will fall off unnecessarily during grinding, thereby lowering the use efficiency of the superabrasive grains. If it is larger than 75%, the amount of protrusion of the superabrasive grains 2 from the metal plating phase 3 is too small, and there is a problem that the amount of the superabrasive grains 2 biting into a work material is insufficient and sharpness is significantly reduced.

[0006]

However, in the electrodeposited grinding wheel as described above, since the surface 3A of the metal plating phase 3 is dense and flat, the chips generated during grinding are removed by the grinding portion as the grinding wheel moves. The effect of discharging from the swarf (chip dischargeability) is small. In particular, when the superabrasive grains 2 are worn and the protrusion amount from the metal plating phase 3 is reduced, the superabrasive grains 2 are clogged and sharpness is extremely reduced, and the grinding resistance is sharply increased. There was a drawback that the service life of the whetstone was short.

[0007]

Means for Solving the Problems The present invention has been made to solve the above problems. First, an electrodeposition grindstone according to the present invention comprises super-abrasive grains on a surface of a base metal on which an abrasive layer is formed. The metal plating phase is raised in a mountain shape at the periphery of each superabrasive grain viewed from a direction orthogonal to the abrasive grain layer forming surface, and the metal plating phase has an average grain size of the superabrasive grains. 50-90
% Of the super-abrasive grains wrapping the super-abrasive grains with an average thickness of about 0.1 %, and the middle part of the adjacent super-abrasive grains is formed as a concave portion. It is characterized by being at least 30% smaller than the average particle size than the thickness.

Further, according to the manufacturing method of the present invention, a large number of superabrasive grains are dispersed on the surface of the base metal on which the abrasive layer is formed, and the superabrasive is formed on the surface of the abrasive layer by electroplating or electroless plating. Forming a base metal plating phase having a thickness of 0.3 to 20% of the average grain size of the grains to fix the superabrasive grains in a single layer, and furthermore, a surface of the base metal plating phase and an exposed surface of the superabrasive grains After subjecting the surface to a surface catalyzing treatment, a base metal plating phase and an upper metal plating phase are formed on the surface of the superabrasive grains using an electroless plating method.

[0009]

SUMMARY OF According to the electrodeposited grindstone and a manufacturing method thereof, Ultra
The metal plating phase rises in a mountain shape at the periphery of the abrasive grains
On the other hand, the portion between other adjacent superabrasives , that is,
Because it is a further portion generally concave around the periphery, this portion is discharged chips from the grinding unit with movement of the grindstone becomes a chip pocket, high cuttings discharge is obtained. Therefore, the abrasive layer is less likely to be clogged, and the operation rate of the grinding wheel and the life of the grinding wheel can be extended.

Further, the metal plating phase raised in individual superabrasive periphery as viewed from a direction perpendicular to the abrasive layer formation surface, because it wraps superabrasive the mountain shape, substantially of metal plating phase Even if the initial wall thickness is small, the holding power of the abrasive grains is large, and the crushing and falling off of the abrasive grains during grinding are small. Furthermore, since all parts other than the cutting edge directly involved in the grinding of the superabrasive grains are wrapped in the upper metal plating phase, the heat generated at the cutting edge is quickly released to the base metal through the upper metal plating phase, Even when used for dry grinding and the like, overheating of superabrasive grains can be prevented, and cooling properties are good.

[0011]

1 to 3 show a method of manufacturing an electrodeposition grindstone according to the present invention, wherein reference numeral 1 denotes a base metal, and 2 denotes superabrasive grains.

In this method, first, as shown in FIG. 1, a base metal 1 having a masked portion except for an abrasive grain layer forming surface 1A.
Is set in a plating bath, and a large number of superabrasive grains 2 are dispersed on the abrasive grain layer forming surface 1A. Then, the base metal plating phase 10 is deposited on the surface 1A by electrolytic plating or electroless plating in the same manner as in the above-described conventional method, and the superabrasive grains 2 are temporarily fixed in a single layer.

The material of the base metal plating phase 10 is N
i, Co, Cu, Zn, etc. can be used, and the thickness D1 is 0.3 to 20% of the average grain size of the superabrasive grains 2, more preferably 5 to 5%.
10%. According to the experiments of the present inventors, the thickness D1
Is thinner than 0.3%, the superabrasive grains 2 cannot be temporarily fixed. On the other hand, if the thickness is more than 20%, the formation of a chip pocket described later becomes insufficient, and the effect of preventing clogging is reduced.

The average distance W between adjacent superabrasive grains 2 is set at 0 which is the average particle diameter of superabrasive grains 2 when the method of spraying superabrasive grains 2 on base metal 1 and performing electrodeposition is employed. 0.7 to 1.5 times.

Next, the surface 10A of the base metal plating phase 10
In addition, the exposed surface of superabrasive 2 is subjected to a surface catalyzing treatment for promoting metal deposition by electroless plating in the next step.
This is a treatment for providing a noble metal catalyst core such as Au, Pt, Pd, and Ag. The base metal 1 with the masking applied is immersed in a salt solution of the noble metal such as PdCl ₂ , for example. Wash with water. At this time, the conditions such as the concentration of the processing solution, the temperature, and the processing time may be the same as those in the case where the electroless plating is conventionally performed.

Next, the base metal 1 is immersed in an electroless plating solution such as Ni, Cu or the like, and the base metal plating phase 10 and the surface Is precipitated. Then, the upper metal plating phase 11
Since the growth rate is relatively high in the concave portion between each superabrasive grain 2 and the underlying metal plating phase 10, the bottom of the superabrasive grain 2 has a gentle skirt at the peripheral edge as shown in FIG. swells the mountain shape enveloping superabrasive 2, an intermediate portion of <br/> each superabrasive 2 contrast, i.e. more of the periphery
A concave portion 11A is formed in a surrounding portion .

In the peripheral portion of each superabrasive grain 2, the average thickness D3 of the upper metal plating phase 11 and the base metal plating phase 10 together is preferably 50 to 90% of the average grain size of the superabrasive grains 2. Is 60-80%. If it is less than 50%, sufficient abrasive holding power cannot be obtained, and if it is more than 90%, a sufficient depth of the tip pocket cannot be secured during use.

Further, an intermediate portion of the superabrasive grains 2 (recess 11A)
, The upper metal plating phase 11 and the lower metal plating phase 1
0 and the thickness D2 is preferably 10% of the average particle size.
%, The average thickness D at the peripheral portion
The average particle size is set to be smaller than the average particle size by 30 or more. Unless it is smaller than the average thickness D3 at the peripheral portion by 30% or more, a sufficient chip pocket forming effect cannot be obtained. Also, the thickness D
If 2 is less than 10% of the average particle size, the abrasive grain holding power is small, and there is a possibility that it cannot be used.

After the electroless plating is completed, the base metal 1 is taken out of the plating tank and washed with water to remove the masking.
If necessary, dressing with a general grindstone or the like is performed, and as shown in FIG. 3, the top metal plating phase 11 of the top portion 2A of the superabrasive grain 2 is removed before use.

According to the electrodeposited whetstone obtained by the above-described manufacturing method , the upper metal plating phase 11 rises at the peripheral portion of the superabrasive grains 2.
On the other hand, the upper metal plating phase excluding this peripheral part
Since the surface of 11 is relatively concave and a concave portion 11A is formed in the middle of adjacent superabrasive grains 2, these concave portions 11A act as chip pockets and discharge chips generated by grinding together with the movement of the grindstone, The chip discharge property is enhanced, and clogging of the abrasive layer is less likely to occur. Therefore, the number of times of dressing can be reduced, and the life of the grinding wheel can be extended.

Further, the upper metal plating phase 1 is formed at the peripheral portion of each superabrasive grain 2 as viewed from a direction orthogonal to the abrasive grain layer forming surface.
Since 1 rises and encloses superabrasive grains 2, even if the thickness of the metal plating phase (10 + 11) as a whole is small, the abrasive grain holding power is large and the abrasive grains are less likely to fall off. Also, during grinding, only the cutting edge 2A of the superabrasive grains 2 is exposed, and all other parts are wrapped in the upper metal plating phase 11, so that the heat generated at the cutting edge 2A is immediately consumed by the upper metal plating phase 11. Through the base 1 to dissipate heat. Therefore, for example, even when used for dry grinding, overheating of the superabrasive grains 2 can be prevented, and more severe grinding conditions can be adopted.

Furthermore, since the surface of the superabrasive grains 2 is also subjected to a surface catalyzing treatment, and then subjected to electroless plating, the bonding strength per unit area between the upper metal plating phase 11 and the superabrasive grains 2 is reduced. Higher than when super-abrasive grains are directly fixed by plating method,
Also from this point, the abrasive grain holding power can be improved.

The base metal used in the present invention may be of any shape, such as a wheel type, a cup type, a block type, and a full-type whetstone, and the average abrasive of superabrasives is not limited.

[0024]

[Experimental Example] Next, the effect of the present invention will be demonstrated with an experimental example. As described above, diamond abrasive grains of various particle diameters were fixed to the outer peripheral surface of a wheel-type base metal having a diameter of 150 mm and an outer peripheral surface width of 6 mm by a base metal plating phase using an electrolytic plating method.

Next, this base metal was immersed in an aqueous solution of palladium chloride having a concentration of 200 mg / l and a temperature of 30 ° C., and the surface thereof was subjected to a catalytic treatment. After washing with water, the base metal was immersed in a Ni electroless plating solution to form an upper metal plating phase.

On the other hand, as comparative examples, electrodeposited whetstones were manufactured by fixing the same diamond abrasive grains as in each example on the same base metal as above by electrolytic plating (Comparative Examples 1, 2-1, 3). -1, 4-1), and those having the same manufacturing method as in each example, but having a difference of 20% between D2 and D3 (Comparative Examples 2-2, 3-2, 4-2).

Next, each of the above grindstones was set on a surface grinder, and a dry grinding test was performed on the FRP test piece. A glass fiber composite epoxy resin having a length of 100 mm and a width of 30 mm was used as a test piece, and the cut amount was changed according to the average particle size of the superabrasive grains. The feed speed was all set to 20 m / min.

Then, the above-mentioned grinding was repeated until the amount of current required for driving the spindle of the surface grinder reached 10 A due to an increase in grinding resistance, and the ratio of the total length of grinding by the grindstone of the present invention and the comparative example was determined.

Table 1 shows the thicknesses D1, D2, D3 of each grinding wheel and the grinding results. D1 to D3 are shown as percentages with respect to the average particle size of the superabrasive particles used. The term “grinding length ratio” indicates the ratio between the grinding length according to each embodiment and the grinding length according to each comparative example corresponding to the embodiment.

[0030]

[Table 1]

As is clear from Table 1, the product of the present invention exhibited a good effect of preventing clogging, and had a much longer life than the comparative example. In addition, the effect of preventing clogging of the present invention is particularly remarkable when the particle size of the superabrasive grains is large, whereas all the comparative examples have severe clogging.

[0032]

As described above, according to the electrodeposition grindstone and the method for manufacturing the same according to the present invention, the peripheral portion of the superabrasive grain is formed.
Since the surface of excluding metal plating phase is a recess, this portion is discharged chips from the grinding unit with movement of the grindstone becomes a chip pocket, high cuttings discharge is obtained. Therefore, the abrasive layer is less likely to be clogged, the frequency of dressing can be reduced, and the operating rate of the grinding wheel and the life of the grinding wheel can be extended.

On the other hand, at the periphery of each superabrasive grain as viewed from a direction perpendicular to the abrasive grain layer forming surface, the metal plating phase swells and envelops the superabrasive grains in a mountain shape. Even if the substantial thickness of the plating phase is small, the holding power of the abrasive grains is large, and the abrasive grains fall off during grinding. Furthermore, since all parts other than the cutting edge directly involved in the grinding of superabrasive grains are wrapped in the upper metal plating phase, the heat generated at the cutting edge is
This has the advantage that the superabrasive grains are less likely to be overheated even when used for dry grinding or the like, being quickly escaped to the base metal through the upper metal plating phase.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view of an abrasive grain layer showing a method for producing an electrodeposition grindstone according to the present invention.

FIG. 2 is an enlarged cross-sectional view of an abrasive grain layer showing a method for manufacturing an electrodeposited whetstone according to the present invention.

FIG. 3 is an enlarged cross-sectional view of an abrasive grain layer, illustrating a method for manufacturing an electrodeposited whetstone according to the present invention.

FIG. 4 is an enlarged cross-sectional view of an abrasive layer of a conventional electrodeposition grindstone.

[Explanation of symbols]

 Reference Signs List 1 base metal 1A abrasive grain layer forming surface 2 superabrasive grains 10 base metal plating phase 11 top metal plating phase D1 thickness of base metal plating phase D2 thickness of entire metal plating phase in intermediate portion between superabrasive grains D3 Wall thickness of the entire metal plating phase at the periphery of the superabrasive

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) B24D 3/06 B24D 3/00 310 B24D 3/00 320 B24D 3/00 340

Claims (2)

(57) [Claims] 1. An electrodeposited whetstone comprising superabrasive grains fixed in a single layer via a metal plating phase to an abrasive grain layer forming surface of a base metal, wherein said metal plating phase is The superabrasives have an average wall thickness of 50 to 90% of the average particle diameter of the superabrasive grains by rising in a mountain shape at the peripheral portion of each superabrasive grain viewed from a direction orthogonal to the superabrasive grains.
The middle part of the superabrasive grains that wrap the grains and are adjacent to each other is concave
The electrodeposited whetstone is characterized in that the average thickness in the concave portion is smaller than the average thickness in the peripheral portion by 30% or more of the average particle size. 2. A method for dispersing a large number of superabrasive grains on a surface of a base metal on which an abrasive grain layer is formed, and forming an average grain size of the superabrasive grains on the abrasive grain layer formed surface by electroplating or electroless plating. .3
After forming a base metal plating phase having a thickness of about 20%, the superabrasive grains are fixed in a single layer, and the surface of the base metal plating phase and the exposed surface of the superabrasive grains are subjected to a surface catalyzing treatment. A method for producing an electrodeposited grinding wheel, comprising forming an upper metal plating phase on the surface of a base metal plating phase and superabrasive grains using an electroless plating method.