JP3027851B2 - How to connect electrical circuit components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to, for example, a semiconductor product mounting technology,
The present invention relates to a method of connecting electric circuit components to connect electrodes between corresponding electric circuit components, and more particularly to a method of connecting electric circuit components that enables high-density connection.

[Conventional technology]

2. Description of the Related Art As semiconductor products become more highly integrated, there is a demand for high-density connections between electric circuit components in the semiconductor products or peripheral devices thereof. Further, even in a display device, it is necessary to realize a high-density connection between a driver IC and a display or a printer head in order to enable high-quality image display. Under such circumstances, various proposals have been made for anisotropic conductive films as connection members for connecting electrodes between corresponding electric circuit components with high density.

FIG. 4 is a cross-sectional view showing the configuration of an electrical connection member disclosed in, for example, Japanese Patent Application Laid-Open No. 63-237537. For example, a plurality of conductors 42 made of gold, and a holder made of a polyimide resin such that each conductor 42 is in an electrically insulated state.
The electrical connection members 41 are scattered throughout the structure 43. Both ends of each conductor 42 protrude from the holder 43, and the diameter thereof is larger than the diameter of a portion embedded in the holder 43.

Then, the electrical connection member 41 having such a configuration is overlapped on the electrode to be connected, and one end of one conductor 42 is joined to one electrode by, for example, thermocompression bonding. Next, the other end of the conductor 42 is joined to the other corresponding one of the electrodes to achieve an electrical connection between the two electrodes.

[Problems to be solved by the invention]

The method for connecting electric circuit components using the above-described electric connection member has the following problems. Since both ends of the conductor joined to the electrode have a larger cross-sectional area than the part in the holder, the protruding both ends have a significantly increased cross-sectional area by thermocompression bonding, and the adjacent conductors are joined together. The possibility of short-circuit was high, and the connection pitch was limited. In addition, since the holding body that holds the conductor is made of an organic resin such as a polyimide resin, in the step of joining the conductor to the electrode, the electrical connection member is likely to be deformed, such as bending, and it is difficult to perform high-density connection. Was. In addition, in the case of a holder made of an organic resin, a leak current may be generated during a humidity resistance test, and there is a problem in reliability. Furthermore, since one conductor is bonded to one electrode, the two need to be aligned, and this alignment work is troublesome.

The present invention has been made in view of such circumstances, there is no possibility that adjacent conductors are short-circuited, no deformation such as bending occurs, alignment at the time of joining is unnecessary, and high-density connection is achieved. An object of the present invention is to provide a method for connecting electric circuit components that can be easily achieved.

[Means for solving the problem]

The method for connecting electric circuit components according to the present invention is the method for connecting electric circuit components implemented to connect electrodes of corresponding electric circuit components, wherein one end of each is placed in an organic resin formed on a base. Using an electrical connection member in which a plurality of conductors are scattered without being in contact with the base and the other end protruding from the organic resin, removing the organic resin from the electrical connection member and removing the organic resin on the base The plurality of conductors are exposed, the exposed sides thereof are superimposed on one electric circuit component to be connected, and the conductors in contact with each of the electrodes of the electric circuit component are transferred, and are transferred to the electrodes. The method is characterized in that the base is removed while leaving the conductor, and the corresponding electrode of the other electric circuit component is aligned, overlapped, and joined to the remaining conductor.

[Action]

In the present invention, an electrical connection member having no protrusion of the conductor from the organic resin is used. Therefore, an increase in the bonding area at the time of bonding is smaller than that in the case of protruding outside the organic resin, and there is no risk of short-circuiting even when the pitch between adjacent conductors is small. Since the conductor is transferred and formed on the electrode while the base is still attached, the rigidity is increased and deformation such as bending does not occur. In addition, since a plurality of conductors are transferred and formed for one electrode, there is no need to position the electrodes and the conductor. Further, since no organic resin is involved, the reliability of moisture resistance is also excellent.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings showing the embodiments.

FIG. 1 shows an electric connection member 1 used for carrying out a method for connecting electric circuit components according to the present invention (hereinafter referred to as the method of the present invention).
FIG. 2 is a plan view of the electrical connection member 1. FIG. In the figure, reference numeral 2 denotes a substrate made of, for example, glass, ITO, or the like. An organic resin 3 made of, for example, a photosensitive resin is formed on the base 2. In the organic resin 3, a plurality of conductors 4 made of, for example, gold are provided in a dispersed manner without being in contact with each other. One end 4a of each conductor 4
Is in contact with the base 2, and the other end 4 b of each conductor 4 does not protrude from the upper surface of the organic resin 3. The diameter of each conductor 4 is 5 μm, and the formation pitch of the conductors 4 is 7 μm.

Next, a method of manufacturing the electrical connection member having such a configuration will be described.

First, a photosensitive organic resin is applied to a base, and a plurality of holes having a predetermined pattern are formed in the organic resin by photolithography. Next, when the base is conductive, the base is used as a common electrode. When the base is not conductive, a conductive film is formed on the surface of the base and used as a common electrode. To form a plurality of conductors. At this time, it is necessary to set the plating current density and / or the plating time so that the conductor (gold) does not protrude from the organic resin.

In the present embodiment, the conductor is a single layer of gold.
A metal other than gold may be used as long as it can be electrodeposited from an aqueous solution, and may be a single layer or a plurality of layers. In addition, the organic resin is photosensitive. However, in the case where a plurality of holes are formed by, for example, irradiation with a laser beam, the organic resin may not be photosensitive resin.

Next, the procedure of implementing the method of the present invention, which is performed using the electrical connection member having such a configuration, will be described. FIG. 3 is a schematic sectional view showing this procedure.

FIG. 3A shows a thermocompression bonding step of transferring and forming the conductor 4 of the electrical connection member 1 to one electrode to be connected.
After the substrate 11 having the plurality of electrodes 12 to be connected is mounted on the stage 13, the electrical connection member 1 from which the organic resin 3 is removed
Is stacked on the substrate 11 so that the other end 4b of the conductor is in contact with the electrode 12, and a plurality of conductors 4 are transferred and formed on each electrode 12 using a jig 14 for thermal transfer. Here, since the formation pitch of the conductor 4 is sufficiently small with respect to the width of the electrode 12, each electrode can be formed without performing the conventional alignment between the electrode and the conductor.
A plurality of conductors 4 can be transferred and formed on the substrate 12 without fail. next,
As shown in FIG. 3 (b), the transferred conductors 4 are left on the respective electrodes 12, and only the base 2 is peeled off.

Next, as shown in FIG. 3 (c), a substrate 16 having the other electrode 15 to be connected is connected to the substrate
Each of the electrodes 11 is aligned by touching one end 4a of the conductor 4 left on the corresponding electrode 12 and placed on the conductor 4 by thermocompression or crimping using a thermocompression or crimping jig 17. A plurality of conductors 4 are bonded to 15. The bonding method at this time may be either thermocompression bonding or compression bonding, but the compression bonding step is more preferable in order to reduce residual stress after bonding. Alternatively, a light or thermosetting resin may be loaded between the electrode 15 and the conductor 4 and joined by a stress at the time of curing the resin. FIG. 3D shows a state in which the connection between the corresponding electrodes 12, 15 has been completed.

Table 1 shows the results of connecting substrates having high-density wiring lines (electrodes) by the method of the present invention as described above. A substrate having a wiring density of 200 dpi (dot / inch) to 1000 dpi is used, and the pitch and width of the wiring lines and the space width of the wiring lines on each substrate are as shown in Table 1.
Note that the width of the wiring line becomes thinner as the density increases, but is set to a constant value (15 μm) at 700 dpi or more. As the electrical connection member, a member having a size as shown in FIGS. 1 and 2 (that is, a conductor diameter is 5 μm, a conductor formation pitch is 7 μm, and a space between adjacent conductors is 2 μm) is used. used.

For example, in a substrate having a wiring density of 1000 dpi, the space width of a wiring line is 10.4 μm, but in a conductor having a diameter of 5 μm, there is no bridge between the wiring lines. In addition,
It is considered that the occurrence of five defective pins in this case is due to poor positioning accuracy of the upper and lower substrates. Further, since the width of the wiring line is 15 μm or more, one or more conductors are connected to one wiring line (electrode). In any case, the electrical connection member of the present invention had a good conduction state and good bonding strength with respect to the substrate.

〔The invention's effect〕

As described above in detail, according to the present invention, electrical connection between electric circuit components having electrodes arranged at high density can be easily realized, and the conduction state and the joint state at this time are both good. As a result, a high-density connection with a narrow pitch and a large number of pins in a semiconductor product or peripheral devices thereof can be easily performed. In addition, the present invention has excellent effects such that deformation such as bending of the electrical connection member does not occur at the time of joining and alignment of the electrode and the conductor is unnecessary.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an electrical connecting member used for carrying out the method of the present invention, FIG. 2 is a plan view of an electrical connecting member used for carrying out the method of the present invention, and FIG. FIG. 4 is a schematic cross-sectional view of a conventional electrical connection member. 1 ... electric connection member, 2 ... substrate, 3 ... organic resin,
4 ... Conductor, 12,15 ... Electrode

Claims (1)

(57) [Claims] 1. A method of connecting electric circuit components to connect electrodes of the corresponding electric circuit components, wherein one end of each of the electric circuit components is brought into contact with the base in an organic resin formed on the base. Using an electrical connection member in which a plurality of conductors are scattered without projecting the other end from the organic resin, the organic resin is removed from the electrical connection member to remove the plurality of conductors on the base. And exposing these exposed sides to one of the electric circuit components to be connected, transferring the conductors in contact with each of the electrodes of the electric circuit components, and leaving the conductor transferred to the electrodes, A method of connecting an electric circuit component, wherein a corresponding electrode of the other electric circuit component is aligned, overlapped, and joined to the remaining conductor.