JP2971469B2 - Metal paste for activating base metal plating and method for forming electrodes on ceramic electronic components - Google Patents
Metal paste for activating base metal plating and method for forming electrodes on ceramic electronic componentsInfo
- Publication number
- JP2971469B2 JP2971469B2 JP63097062A JP9706288A JP2971469B2 JP 2971469 B2 JP2971469 B2 JP 2971469B2 JP 63097062 A JP63097062 A JP 63097062A JP 9706288 A JP9706288 A JP 9706288A JP 2971469 B2 JP2971469 B2 JP 2971469B2
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- Prior art keywords
- metal
- weight
- plating
- parts
- paste
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
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Description
【発明の詳細な説明】 産業上の利用分野 本発明はセラミック基材上へ局部メッキを施す際に使
用する卑金属メッキ下地活性用金属ペーストおよびそれ
を用いたセラミック電子部品の電極形成方法に関するも
のである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal paste for activating a base metal plating base used when local plating is performed on a ceramic substrate and a method for forming an electrode of a ceramic electronic component using the same. is there.
従来の技術 従来、メッキ下地活性用金属ペーストとして、例えば
特公昭60−1951号公報に記載されているように、Ag成分
が99.5〜0.5重量％、Ni,Cu,Al,Zn,W,Mo成分の１種或は
２種以上の成分が0.5〜99.5重量％よりなる金属材料を
用意し、この金属材料を金属成分として1.0〜40重量％
含むようにビヒクル中に分散させたペーストが知られて
いる。2. Description of the Related Art Conventionally, as a metal paste for plating base activation, for example, as described in JP-B-60-1951, 99.5 to 0.5% by weight of an Ag component, Ni, Cu, Al, Zn, W, and Mo components A metal material comprising one or more components of 0.5 to 99.5% by weight is prepared, and the metal material is used as a metal component in an amount of 1.0 to 40% by weight
Pastes are known which are dispersed in a vehicle to include.
そして上記ペーストで、例えばSrTiO3−CaTiO3系材料
よりなる円板形の誘電体セラミック基材上に塗布しコン
デンサとしての電極を形成するには、先ず誘電体セラミ
ック基材の両面にそのペーストをスクリーン印刷法にて
塗布し、その後600〜800℃で焼き付ける。ただしこのペ
ーストを使用すると焼き付けの際にペースト中の金属の
酸化が発生し、不活性化された状態で焼き付けられるこ
ととなるために、Pdイオンを含む溶液に浸漬して再度活
性化させ、その後無電解Niメッキまたは無電解Cuメッキ
を施して電極を形成していた。Then, in order to form an electrode as a capacitor by applying the above paste on a disk-shaped dielectric ceramic substrate made of, for example, a SrTiO 3 -CaTiO 3 material, the paste is first applied to both surfaces of the dielectric ceramic substrate. Apply by screen printing, then bake at 600-800 ° C. However, if this paste is used, the metal in the paste will be oxidized during baking and will be baked in an inactivated state, so it is immersed in a solution containing Pd ions and activated again. Electrodes were formed by electroless Ni plating or electroless Cu plating.
発明が解決しようとする課題 従来のペーストは上述したように、焼き付け時に被メ
ッキ部分が酸化等によって不活性化状態となるために、
その後にPdイオンなどを含む溶液に浸漬して再度活性化
を行わなければならず、またAg以外の卑金属が多いペー
ストをSrTiO3−CaTiO3系の誘電体セラミック基材上に塗
布し電極を形成し、コンデンサを形成した場合このコン
デンサのＱ特性が劣化してしまうという問題点を有して
いた。Problems to be Solved by the Invention As described above, the conventional paste becomes inactive due to oxidation or the like at the time of baking,
After that, it must be immersed in a solution containing Pd ions etc. to activate again, and a paste containing many base metals other than Ag is applied to the SrTiO 3 -CaTiO 3 based dielectric ceramic base material to form electrodes However, when a capacitor is formed, there is a problem that the Q characteristic of the capacitor is deteriorated.
本発明は上記従来の課題を解決するもので、ペースト
の焼き付け時に、ペーストが酸化等により不活性状態と
なることを抑制し、ペーストの再活性化の作業が不要な
生産効率の高いメッキ下地用金属ペーストを提供するこ
とを目的とする。The present invention solves the above-mentioned conventional problems, and suppresses the paste from becoming inactive due to oxidation or the like at the time of baking of the paste, and eliminates the need for reactivation of the paste. It is intended to provide a metal paste.
課題を解決するための手段 そこで、本発明は、Zn成分を99.9〜80重量部、Ti単体
若しくはAl,Mgの少なくとも１種類とTiとからなる金属
成分を0.1〜20重量部含み、合計が100重量部となる金属
材料を金属成分として30〜85重量部だけビヒクルあるい
はガラス粉を含んだビヒクルに分散させた。Means for Solving the Problems Accordingly, the present invention provides a Zn component of 99.9 to 80 parts by weight, a metal component composed of Ti alone or at least one of Al and Mg and Ti and 0.1 to 20 parts by weight, and a total of 100 The metal material to be parts by weight was dispersed in a vehicle or a vehicle containing glass powder in an amount of 30 to 85 parts by weight as a metal component.
作 用 上記成分とすることにより、ペーストはPdイオンでの
再活性処理が不要となる。Effect By using the above components, the paste does not need to be reactivated with Pd ions.
実 施 例 先ず、Zn成分を100〜70重量部、Ti,Al,Mgの内の１種
または２種以上の成分を０〜30重量部含み、合計が100
重量部となる金属材料に対し、ホウケイ酸鉛系ガラス粉
末を第１表に示す量とテルピオール５重量部を混合し、
金属ワニスを作成した。この金属ワニス15重量部％エチ
ルセルロースをテルピオネールに溶かしたビヒクルを15
重量部加え、混練しメッキ下地活性用金属ペーストを作
成した。そして直径6mm、厚さ0.3mmのSrTiO3−CaTiO3系
の誘電体セラミック基材の両面に直径5mmの円形にスク
リーン印刷法を用いて前記ペーストを塗布し、これを空
気中で約500℃で10分間焼き付けした。この際、昇温及
び降温時間を含め合計60分間炉中に入れた。Example First, 100 to 70 parts by weight of a Zn component, and 0 to 30 parts by weight of one or more components of Ti, Al, and Mg, and a total of 100 to 70 parts by weight.
For the metal parts to be parts by weight, lead borosilicate glass powder was mixed in an amount shown in Table 1 with 5 parts by weight of terpiol,
A metal varnish was made. A vehicle prepared by dissolving 15 parts by weight of this metal varnish in ethyl cellulose in terpenion
A weight part was added and kneaded to prepare a metal paste for plating base activation. Then, the paste is applied to both surfaces of a 6 mm diameter, 0.3 mm thick SrTiO 3 -CaTiO 3 based dielectric ceramic substrate using a screen printing method on both sides of a 5 mm diameter circle, and the paste is applied at about 500 ° C. in air. Bake for 10 minutes. At this time, it was put in a furnace for a total of 60 minutes including the time of temperature rise and temperature fall.
次いで、硫酸銅、水酸化ナトリウム、ホルマリン、酒
石酸ナトリウム・カリウムからなる化学メッキ液に約20
分浸漬して、ペーストの焼き付け部分に約２μｍの銅メ
ッキ膜を作り電極を形成した。Next, about 20 chemical plating solutions consisting of copper sulfate, sodium hydroxide, formalin, and sodium / potassium tartrate
Then, a copper plating film of about 2 μm was formed on the baked portion of the paste to form an electrode.
上述の方法にて作成した誘電体セラミックコンデンサ
50個の夫々に、0.5mmφのリード線を半田付けした。Dielectric ceramic capacitor made by the above method
A lead wire of 0.5 mmφ was soldered to each of the 50 pieces.
半田付けした誘電体セラミックコンデンサについてそ
のＱと電極の引っ張り強度を測定した。The Q and the tensile strength of the electrodes of the soldered dielectric ceramic capacitor were measured.
なお、Ｑの測定はＱメータを用い、測定周波数は1MH
z、測定電圧は200mVで行った。また、引っ張り試験はシ
ョッパー型引っ張り試験機を用い、誘電体セラミックコ
ンデンサの電極に半田付けされたリード線を引っ張り、
電極面または半田付け面が破壊された時の荷重を読み、
その値を見掛けの引っ張り強度とした。このようにして
測定したＱおよび見掛けの引っ張り強度の値を第１表に
示す。The Q was measured using a Q meter, and the measurement frequency was 1 MHz.
z, the measurement voltage was 200 mV. In addition, the tensile test used a shopper type tensile tester to pull the lead wire soldered to the electrode of the dielectric ceramic capacitor,
Read the load when the electrode surface or soldering surface is broken,
The value was regarded as apparent tensile strength. Table 1 shows the values of Q and apparent tensile strength thus measured.
尚、第１表中において資料番号3,4,17,18,23,24,26,2
7は本発明の範囲内のものであり、それ以外が本発明の
範囲外のものである。 In Table 1, material numbers 3, 4, 17, 18, 23, 24, 26, 2
7 is within the scope of the present invention, and the others are outside the scope of the present invention.
試料番号２〜16はTi,Al,Mgまたはガラス粉末を単独で
添加した場合で、Ti金属を添加すると、Ｑと見掛けの引
っ張り強度は共に良好なものとなった。またガラス粉末
の添加では見掛けの引っ張り強度が良好となることが確
認された。Sample Nos. 2 to 16 were cases in which Ti, Al, Mg or glass powder was solely added. When Ti metal was added, both Q and apparent tensile strength were good. It was also confirmed that the addition of glass powder improved the apparent tensile strength.
試料番号17〜27はTi,Al,Mgの１種以上とTiとを複合し
て添加したものであり、これらのものではＱおよび見掛
けの引っ張り強度がともに良好となっていることが確認
された。Sample Nos. 17 to 27 were obtained by adding at least one of Ti, Al, and Mg in combination with Ti, and it was confirmed that both Q and apparent tensile strength were good in these samples. .
本実施例に示してきた本発明の範囲内にあるメッキ下
地活性用金属ペーストを用いることにより、従来必要で
あった貴金属イオンによる活性化処理が不要となるだけ
でなく、金属成分として全て卑金属を使用した局部メッ
キが可能となり、コストの低減にもつながる。更に本ペ
ーストを誘導体セラミック基板に焼き付け、その後無電
解メッキにて得られる電極は引っ張り強度の良好なもの
となる。By using the metal paste for plating underlayer activation within the scope of the present invention shown in the present embodiment, not only the activation treatment with precious metal ions, which was required conventionally, is unnecessary, but also all base metals are used as metal components. Local plating used can be performed, leading to cost reduction. Furthermore, the electrode obtained by baking this paste on a derivative ceramic substrate and then performing electroless plating has good tensile strength.
特に金属ワニスをビヒクルに対して30〜85重量部分散
させることにより、電極形成のために行われる無電解Ni
若しくはCuメッキの析出を良好にすると共に適度な粘性
を保つことができ、電極とペースト間の良好な接合性を
確保すると共に良好な作業性を提供することができる。In particular, by dispersing 30 to 85 parts by weight of metal varnish to the vehicle, electroless Ni
Alternatively, it is possible to improve the deposition of Cu plating and maintain an appropriate viscosity, thereby ensuring good bonding between the electrode and the paste and providing good workability.
さらにこの範囲においては、誘電体セラミック基板に
本ペーストを印刷して焼成する際に問題となる本ペース
トの酸化を抑制することができ、Ｑ値等の特性に優れ、
かつ、電極となるメッキとペーストとの結合性に優れた
誘電体電子部品を実現することができる。Further, in this range, oxidation of the present paste, which is a problem when printing and firing the present paste on a dielectric ceramic substrate, can be suppressed, and characteristics such as Q value are excellent.
In addition, it is possible to realize a dielectric electronic component having excellent bonding properties between the plating serving as an electrode and the paste.
また特にZn成分に少なくともTi成分を添加することに
より、他の金属成分のみを添加する場合に比べて、Ｑ値
及び引っ張り強度の双方ともより大きくすることができ
るので、物理的特性及び機械的特性に優れた高性能で信
頼性の高い誘電体電子部品を実現することができる。In particular, by adding at least the Ti component to the Zn component, both the Q value and the tensile strength can be increased as compared with the case where only the other metal components are added. It is possible to realize a highly reliable and highly reliable dielectric electronic component.
以上は誘電体セラミック基材の両面に電極を形成した
誘電体セラミックコンデンサを例にとって述べたが、誘
電体セラミック基材を用いたその他の電子部品において
も同様の効果が奏せられることはいうまでもない。The above description has been made with reference to a dielectric ceramic capacitor in which electrodes are formed on both surfaces of a dielectric ceramic base material. However, it is needless to say that a similar effect can be obtained in other electronic components using the dielectric ceramic base material. Nor.
発明の効果 以上説明したように、本発明のメッキ下地活性用金属
ペーストを用いると、従来必要であった貴金属イオンに
よる活性化処理が不要となるだけでなく、金属成分とし
てすべて卑金属を使用した局部メッキが可能となり、コ
ストの低減にもつながる。また、本発明の条件下でメッ
キ下地活性用金属ペーストを誘電体セラミック基材に焼
き付け、その後の無電解メッキにて得られる電極は引っ
張り強度の良好なものになる。Effect of the Invention As described above, the use of the metal paste for activating a plating underlayer of the present invention not only eliminates the need for activation treatment with precious metal ions, which has been required conventionally, but also enables the local use of base metal as a metal component. Plating becomes possible, which leads to cost reduction. Under the conditions of the present invention, the electrode paste obtained by baking the metal paste for plating underlayer activation on a dielectric ceramic substrate and then performing electroless plating has good tensile strength.
特に金属ワニスをビヒクルに対して30〜85重量部分散
させることにより、電極形成のために行われる無電解Ni
若しくはCuメッキの析出を良好にすると共に適度な粘性
を保つことができ、電極とペースト間の良好な接合性を
確保すると共に良好な作業性を提供することができる。In particular, by dispersing 30 to 85 parts by weight of metal varnish to the vehicle, electroless Ni
Alternatively, it is possible to improve the deposition of Cu plating and maintain an appropriate viscosity, thereby ensuring good bonding between the electrode and the paste and providing good workability.
さらにこの範囲においては、誘電体セラミック基板に
本ペーストを印刷して焼成する際に問題となる本ペース
トの酸化を抑制することができ、Ｑ値等の特性に優れ、
かつ、電極となるメッキとペーストとの結合性に優れた
誘電体電子部品を実現することができる。Further, in this range, oxidation of the present paste, which is a problem when printing and firing the present paste on a dielectric ceramic substrate, can be suppressed, and characteristics such as Q value are excellent.
In addition, it is possible to realize a dielectric electronic component having excellent bonding properties between the plating serving as an electrode and the paste.
また得にZn成分に少なくともTi成分を添加することに
より、他の金属成分のみを添加する場合に比べて、Ｑ値
及び引っ張り強度の双方ともをより大きくすることがで
きるので、物理的特性及び機械的特性に優れた高性能で
信頼性の高い誘電体電子部品を実現することができる。In addition, by adding at least the Ti component to the Zn component, both the Q value and the tensile strength can be increased as compared with the case where only the other metal components are added. And high-performance and highly reliable dielectric electronic component having excellent mechanical characteristics can be realized.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 多木 宏光 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 帆足 博之 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭61−27003（ＪＰ，Ａ) 特公 昭60−1951（ＪＰ，Ｂ２) 特公 昭63−10887（ＪＰ，Ｂ２) 特公 昭57−23402（ＪＰ，Ｂ２) ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Hiromitsu Taki 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. In-house (56) References JP-A-61-27003 (JP, A) JP-B-60-1951 (JP, B2) JP-B-63-10887 (JP, B2) JP-B-57-23402 (JP, B2) )
Claims (5)
Al,Mgの少なくとも１種類とTiとからなる金属成分を0.1
〜20重量部含み、合計が100重量部となる金属材料が溶
剤に分散させてなる金属ワニスを、脂溶性樹脂と水溶性
樹脂と両溶性樹脂の内の１種或いは２種以上よりなるビ
ヒクルに、金属成分として30〜85重量部を分散させてな
る卑金属メッキ下地活性用金属ペースト。(1) 99.9 to 80 parts by weight of Zn component, Ti alone or
Metal component consisting of at least one of Al and Mg and Ti is 0.1
A metal varnish in which a total of 100 parts by weight of a metal material is dispersed in a solvent, containing a metal varnish of up to 20 parts by weight, in a vehicle comprising one or more of a fat-soluble resin, a water-soluble resin, and a miscible resin. A base metal plating base activation metal paste obtained by dispersing 30 to 85 parts by weight as a metal component.
Al,Mgの少なくとも１種類とTiとからなる金属成分を0.1
〜20重量部含み、合計が100重量部となる金属材料を溶
剤に分散させてなる金属ワニスを、脂溶性樹脂と水溶性
樹脂と両溶性樹脂の内の１種或いは２種以上よりなるビ
ヒクルに、金属成分として30〜85重量部分散させると共
に、324メッシュパス以下の粉末粒径のガラスを30重量
部以下分散させたことを特徴とする卑金属メッキ下地活
性用金属ペースト。(2) 99.9 to 80 parts by weight of Zn component, Ti alone or
Metal component consisting of at least one of Al and Mg and Ti is 0.1
A metal varnish obtained by dispersing a metal material containing up to 20 parts by weight and a total of 100 parts by weight in a solvent, into a vehicle comprising one or more of a fat-soluble resin, a water-soluble resin, and a miscible resin. And 30 to 85 parts by weight of a metal component, and 30 parts by weight or less of glass having a particle size of 324 mesh or less.
特徴とする特許請求の範囲第２項に記載の卑金属メッキ
下地活性用金属ペースト。3. The metal paste for activating a base metal plating base according to claim 2, wherein glass having a melting point of 250 to 850 ° C. is used.
キ下地活性用金属ペーストを、セラミック基材上へ塗布
し、450〜900℃の温度範囲内で焼き付け処理を行い、そ
の後無電解Cuメッキまたは無電解Niメッキを行い電極を
形成することを特徴とするセラミック電子部品の電極形
成方法。4. The method according to claim 1, wherein the metal paste for activating the base metal plating base is applied on a ceramic base material, baked in a temperature range of 450 to 900 ° C., and then electroless Cu An electrode forming method for a ceramic electronic component, wherein an electrode is formed by plating or electroless Ni plating.
キ下地活性用金属ペーストを、セラミック基材上へ塗布
し、450〜900℃の温度範囲内に焼き付け処理を行い、そ
の後無電解Cuメッキまたは無電解Niメッキを行い電極を
形成することを特徴とするセラミック電子部品の電極形
成方法。5. The method according to claim 2, wherein the metal paste for activating the base metal plating base is applied on a ceramic base material, baked in a temperature range of 450 to 900 ° C., and then electroless Cu An electrode forming method for a ceramic electronic component, wherein an electrode is formed by plating or electroless Ni plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63097062A JP2971469B2 (en) | 1988-04-20 | 1988-04-20 | Metal paste for activating base metal plating and method for forming electrodes on ceramic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63097062A JP2971469B2 (en) | 1988-04-20 | 1988-04-20 | Metal paste for activating base metal plating and method for forming electrodes on ceramic electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01267903A JPH01267903A (en) | 1989-10-25 |
| JP2971469B2 true JP2971469B2 (en) | 1999-11-08 |
Family
ID=14182160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63097062A Expired - Lifetime JP2971469B2 (en) | 1988-04-20 | 1988-04-20 | Metal paste for activating base metal plating and method for forming electrodes on ceramic electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2971469B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6127003A (en) * | 1984-07-17 | 1986-02-06 | ティーディーケイ株式会社 | Conductive paste composition |
-
1988
- 1988-04-20 JP JP63097062A patent/JP2971469B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01267903A (en) | 1989-10-25 |
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