JP2965646B2 - Base metal composition for external electrode of chip type multilayer capacitor - Google Patents
Base metal composition for external electrode of chip type multilayer capacitorInfo
- Publication number
- JP2965646B2 JP2965646B2 JP23774790A JP23774790A JP2965646B2 JP 2965646 B2 JP2965646 B2 JP 2965646B2 JP 23774790 A JP23774790 A JP 23774790A JP 23774790 A JP23774790 A JP 23774790A JP 2965646 B2 JP2965646 B2 JP 2965646B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- external electrode
- multilayer capacitor
- nickel
- base metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 28
- 239000010953 base metal Substances 0.000 title claims description 19
- 239000000203 mixture Substances 0.000 title claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 72
- 229910052759 nickel Inorganic materials 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 239000011701 zinc Substances 0.000 claims description 11
- 229910052725 zinc Inorganic materials 0.000 claims description 11
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 238000007747 plating Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- KOMIMHZRQFFCOR-UHFFFAOYSA-N [Ni].[Cu].[Zn] Chemical compound [Ni].[Cu].[Zn] KOMIMHZRQFFCOR-UHFFFAOYSA-N 0.000 description 1
- WCERXPKXJMFQNQ-UHFFFAOYSA-N [Ti].[Ni].[Cu] Chemical compound [Ti].[Ni].[Cu] WCERXPKXJMFQNQ-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ニッケルを内部電極とするチップ型積層コ
ンデンサの外部電極用卑金属組成物に関するものであ
る。Description: TECHNICAL FIELD The present invention relates to a base metal composition for an external electrode of a chip type multilayer capacitor having nickel as an internal electrode.
チップ型積層コンデンサとしては、添付図に示すよう
な構成のものが公知である。図において、１は内部電
極、２は外部電極、３はセラミックス、4a、4bはメッキ
層である。As a chip-type multilayer capacitor, one having a configuration as shown in the accompanying drawings is known. In the figure, 1 is an internal electrode, 2 is an external electrode, 3 is a ceramic, and 4a and 4b are plating layers.
そして、内部電極１としては、パラジウム、白金ある
いは銀−パラジウム等の貴金属が用いられ、外部電極２
にも銀あるいは銀−パラジウム等の貴金属が用いられ、
メッキ層4a、4bとしては各々ニッケルメッキ、半田メッ
キが施されていた。A noble metal such as palladium, platinum or silver-palladium is used for the internal electrode 1.
Noble metals such as silver or silver-palladium are also used,
Nickel plating and solder plating were applied to the plating layers 4a and 4b, respectively.
しかし、高価な貴金属を内部電極および外部電極に用
いていたので、近年、コストダウンを目的として、内部
電極を卑金属であるニッケルに置換しようとする試みが
成されている。ところで内部電極にニッケルを用いる場
合、ニッケルが高融点で非酸化性雰囲気で優れた耐蝕性
を示すため、1250℃以上で且つ中性あるいは弱還元性雰
囲気でセラミックグリーンシートとともに積層されて焼
成される。そこで、このような雰囲気で焼成された内部
電極のニッケルとの組み合わせにおいて良好な電気特性
を有する外部電極が待望されている。However, since expensive precious metals are used for the internal and external electrodes, attempts have recently been made to replace the internal electrodes with nickel, which is a base metal, for the purpose of cost reduction. By the way, when nickel is used for the internal electrode, since nickel has a high melting point and excellent corrosion resistance in a non-oxidizing atmosphere, it is laminated and fired together with ceramic green sheets at a temperature of 1250 ° C. or more and in a neutral or weak reducing atmosphere. . Therefore, an external electrode having good electric characteristics in combination with nickel of an internal electrode fired in such an atmosphere is desired.
例えば、外部電極として上記従来技術と同じく銀ある
いは銀−パラジウムを用いることはコストダウン化に逆
行し、またこれらの貴金属はニッケルとの電気的接続が
悪く、静電容量が不足で、誘電正接（tanδ）が大きく
て電力損が増加するという問題がある。For example, the use of silver or silver-palladium as the external electrode in the same manner as in the above-described prior art is counter to cost reduction, and these noble metals have poor electrical connection with nickel, have insufficient capacitance, and have a dielectric loss tangent ( tanδ) is large, and there is a problem that power loss increases.
そこで、コストダウンを図り且つ内部電極のニッケル
との電気的接続を良好にするために、内部電極と同じニ
ッケルかあるいはコバルト等の卑金属を外部電極として
用いることが考えられる。これらのニッケルあるいはコ
バルトは高融点金属であり、外部電極として用いる場合
は、未焼成のニッケルの内部電極と一緒に1250℃以上で
且つ中性あるいは弱還元性雰囲気で焼成する必要があ
る。しかし、そのようにして得た外部電極は半田付けが
できないので、さらに銀などの半田付け可能な電極を形
成する必要があり、製造工程が増える。Therefore, in order to reduce the cost and improve the electrical connection between the internal electrodes and nickel, it is conceivable to use the same nickel or the same base metal as cobalt as the internal electrodes as the external electrodes. Nickel or cobalt is a high melting point metal. When used as an external electrode, it must be fired together with an unfired nickel internal electrode at 1250 ° C. or higher and in a neutral or weak reducing atmosphere. However, since the external electrodes obtained in this manner cannot be soldered, it is necessary to further form a solderable electrode such as silver, which increases the number of manufacturing steps.
また、ニッケルを内部電極とする積層コンデンサを先
に焼成しておき、この焼成済みの積層コンデンサにニッ
ケル、コバルト等の外部電極を後付けする方法も考えら
れるが、この場合、焼成済みの積層コンデンサを保護す
るために900℃前後の比較的低い温度で焼成を行う必要
がある。基本的にはこのような低い温度ではニッケル、
コバルトを焼結させることはできないので、多量のガラ
スフリットを配合して焼結が試みられたことがある。し
かし、半田濡れ性およびメッキ性が不良で、ガラスフリ
ットが多いために、静電容量が不足でtanδが増大する
等の問題が発生した。It is also conceivable that a multilayer capacitor having nickel as an internal electrode is fired first, and an external electrode of nickel, cobalt, or the like is post-installed on the fired multilayer capacitor. It is necessary to perform firing at a relatively low temperature of around 900 ° C. for protection. Basically, nickel at such low temperatures
Since cobalt cannot be sintered, sintering has been attempted by blending a large amount of glass frit. However, due to poor solder wettability and plating property and a large amount of glass frit, problems such as an increase in tan δ due to insufficient capacitance occurred.
そこで、本発明者等は、比較的低温（900℃前後）で
焼成可能な銅を外部電極として選択し、内部電極をニッ
ケルとする焼成済みの積層コンデンサに銅の外部電極を
後付けし、ニッケルメッキ、半田メッキを施した。この
時点では静電容量、tanδ等の電気特性に問題は認めら
れなかった。しかし、半田耐熱試験を行うと、密着強度
が高かったにも関わらず、静電容量の不足、tanδの増
大等の問題が発生した。すなわち、内部電極のニッケル
と外部電極の銅との間に接続不良が発生することが発明
した。この原因としては、ニッケルを内部電極とする積
層コンデンサと外部電極との強固な密着強度を得るため
に、銅に対するガラスフリットの量を多くしたので（５
〜15重量％）、内部電極のニッケルと外部電極の銅との
界面にガラスが多く集まり、両電極の接続を不確実にし
たのではないかとも考えられる。しかし、このようにし
て外部電極を形成したチップ型積層コンデンサの断面を
EPMAで観察すると、境界部分にある内部電極のニッケル
が外部電極の銅側へ一方的に拡散しているのが認められ
た。すなわち、境界部分のニッケルが少なくなったの
で、上記したような両電極の接続不良が発生したものと
思われる。Therefore, the present inventors have selected copper, which can be fired at a relatively low temperature (around 900 ° C.), as an external electrode, post-installed a copper external electrode on a fired multilayer capacitor having an internal electrode of nickel, and applied nickel plating. , Solder plated. At this time, no problem was recognized in the electrical characteristics such as the capacitance and tan δ. However, when the solder heat resistance test was performed, problems such as insufficient capacitance and increased tan δ occurred despite the high adhesion strength. That is, it was invented that a connection failure occurs between nickel of the internal electrode and copper of the external electrode. This is because the amount of glass frit with respect to copper was increased in order to obtain a strong adhesion between the multilayer capacitor having nickel as the internal electrode and the external electrode (5).
It is also conceivable that a large amount of glass was collected at the interface between nickel of the internal electrode and copper of the external electrode, making the connection between the two electrodes uncertain. However, the cross section of the chip-type multilayer capacitor with external electrodes formed in this way is
Observation by EPMA showed that the nickel of the internal electrode at the boundary part diffused unilaterally to the copper side of the external electrode. That is, it is considered that the connection failure between the two electrodes occurred as described above because the nickel in the boundary portion was reduced.
本発明は従来の技術の有するこのような問題点に鑑み
てなされたものであって、その目的は、ニッケルを内部
電極とする焼成済み積層コンデンサとの密着強度が高
く、電気的接続が良好なチップ型積層コンデンサ外部電
極用卑金属組成物を提供することにある。The present invention has been made in view of such problems of the related art, and has an object to provide a high adhesion strength with a fired multilayer capacitor having nickel as an internal electrode and a good electrical connection. An object of the present invention is to provide a base metal composition for an external electrode of a chip type multilayer capacitor.
上記目的を達成するために本発明の要旨は、ニッケル
を内部電極とするチップ型積層コンデンサの外部電極用
卑金属組成物であって、70〜95重量％の銅と、５〜15重
量％のガラスフリットと、0.2〜10重量％の亜鉛を含ん
で、合計で100重量％とすることを特徴とするチップ型
積層コンデンサ外部電極用卑金属組成物を第一の発明と
し、ニッケルを内部電極とするチップ型積層コンデンサ
の外部電極用卑金属組成物であって、70〜95重量％の銅
と、５〜15重量％のガラスフリットと、0.2〜５重量％
のチタンを含んで、合計で100重量％とすることを特徴
とするチップ型積層コンデンサ外部電極用卑金属組成物
を第二の発明とし、ニッケルを内部電極とするチップ型
積層コンデンサの外部電極用卑金属組成物であって、70
〜95重量％の銅と、５〜15重量％のガラスフリットと、
0.1〜10重量％の亜鉛と0.1〜５重量％のチタンを含ん
で、合計で100重量％とすることを特徴とするチップ型
積層コンデンサ外部電極用卑金属組成物を第三の発明と
する。In order to achieve the above object, the gist of the present invention is a base metal composition for an external electrode of a chip type multilayer capacitor having nickel as an internal electrode, comprising 70 to 95% by weight of copper and 5 to 15% by weight of glass. A chip including a frit and 0.2 to 10% by weight of zinc to make a total of 100% by weight of a base metal composition for an external electrode of a chip type multilayer capacitor, wherein nickel is used as an internal electrode. A base metal composition for external electrodes of a multilayer capacitor, comprising 70 to 95% by weight of copper, 5 to 15% by weight of glass frit, and 0.2 to 5% by weight.
The second invention is a base metal composition for an external electrode of a chip-type multilayer capacitor, characterized in that the base metal composition for a chip-type multilayer capacitor has a total weight of 100% by weight. A composition comprising 70
~ 95% by weight copper and 5-15% by weight glass frit,
A third invention provides a base metal composition for an external electrode of a chip-type multilayer capacitor, comprising 0.1 to 10% by weight of zinc and 0.1 to 5% by weight of titanium to make a total of 100% by weight.
亜鉛、チタンの原子半径は、各々1.33Å、1.45Åであ
って、銅の原子半径1.28Åまたはニッケルの原子半径1.
25Åに近いので、亜鉛、チタンは銅またはニッケルと合
金を作りやすく、内部電極のニッケルが外部電極の銅中
に拡散する前に、外部電極において、銅−亜鉛または銅
−チタンの合金が生成され、ニッケルの銅中への一方的
な拡散が抑制される。最終的には、銅−亜鉛−ニッケル
または銅−チタン−ニッケルの３元合金が生成される
が、境界付近には確実に所定量のニッケルが残存してい
るので、内部電極と外部電極の電気的接続が悪くなるこ
とはない。The atomic radii of zinc and titanium are 1.33Å and 1.45Å, respectively.The atomic radius of copper is 1.28Å or the atomic radius of nickel is 1.
Since it is close to 25 mm, zinc and titanium are easy to form an alloy with copper or nickel, and a copper-zinc or copper-titanium alloy is formed at the external electrode before nickel of the internal electrode diffuses into copper of the external electrode. In addition, unidirectional diffusion of nickel into copper is suppressed. Eventually, a ternary alloy of copper-zinc-nickel or copper-titanium-nickel is produced, but since a certain amount of nickel remains reliably near the boundary, the electric current between the internal electrode and the external electrode is reduced. The connection is not bad.
亜鉛またはチタンの添加量としては、0.2重量％以上
添加しなければ、銅との合金形成によるニッケル拡散防
止効果を期待できない。If zinc or titanium is not added in an amount of 0.2% by weight or more, an effect of preventing nickel diffusion by forming an alloy with copper cannot be expected.
しかし、10重量％超の亜鉛を添加すると、焼結時の収
縮率が大きくなるために、外部電極に亀裂を生じる。５
重量％超のチタンを添加した場合も同様の弊害が発生す
る。However, if more than 10% by weight of zinc is added, the shrinkage during sintering becomes large, so that the external electrode is cracked. 5
Similar disadvantages occur when more than 10% by weight of titanium is added.
本発明の実施例について以下に説明する。 Embodiments of the present invention will be described below.
酸素量が0.15重量％以下で平均粒径が１μの球状銅粉
またはフレーク銅粉と、軟化点が350〜600℃のガラスフ
リットと、亜鉛粉、チタン粉を９頁の表１に示すように
合計で100重量％になるように配合し、この卑金属組成
物100重量部に有機ビヒクルを20重量部添加して３本ロ
ールミルにより混合し、外部電極用の銅ペーストを得
た。そして、この銅ペーストを、ニッケルを内部電極と
する焼成済みのチップ型積層コンデンサの両端に塗布
し、150℃で10分間乾燥した後、N2雰囲気中で900℃で10
分間保持し、外部電極を形成した。次に、この外部電極
にニッケルメッキ、半田メッキを施し、図に示すような
チップ型積層コンデンサを得た。なお、焼成後の外部電
極厚みは、平面部（t1）で70μ、側面部（t2）で35μで
あった。As shown in Table 1 on page 9, a spherical copper powder or a flake copper powder having an oxygen content of 0.15% by weight or less and an average particle diameter of 1 μm, a glass frit having a softening point of 350 to 600 ° C., a zinc powder and a titanium powder. A total of 100% by weight was added, 20 parts by weight of an organic vehicle was added to 100 parts by weight of the base metal composition, and the mixture was mixed by a three-roll mill to obtain a copper paste for an external electrode. Then, this copper paste was applied to both ends of a fired chip-type multilayer capacitor having nickel as an internal electrode, dried at 150 ° C. for 10 minutes, and then dried at 900 ° C. in an N 2 atmosphere.
After holding for an additional minute, an external electrode was formed. Next, this external electrode was subjected to nickel plating and solder plating to obtain a chip-type multilayer capacitor as shown in the figure. The thickness of the external electrode after firing was 70 μm in the plane part (t 1 ) and 35 μm in the side part (t 2 ).
次いで、このようにして外部電極を形成したチップ型
積層コンデンサについて、メッキ直後ならびに半田耐熱
試験後に電気特性を測定した。その結果を表１に記す。Next, the electrical characteristics of the chip-type multilayer capacitor having the external electrodes formed as described above were measured immediately after plating and after the soldering heat test. Table 1 shows the results.
表１より以下の点が明らかである。 The following points are clear from Table 1.
本実施例に係るものは、70〜95重量％の銅に対し
て、適正量の亜鉛またはチタンおよびガラスフリットを
添加したものであるから、メッキ後ならびに半田耐熱試
験後の静電容量、Tanδ、絶縁抵抗等のすべての電気特
性が良好である。In the example according to the present invention, an appropriate amount of zinc or titanium and a glass frit were added to 70 to 95% by weight of copper, so that the capacitance after plating and the solder heat resistance test, Tanδ, All electrical properties such as insulation resistance are good.
比較例に係るものは、亜鉛またはチタンがまったく
添加されていないので、半田耐熱試験後の静電容量が不
足でtanδも増大しており、内部電極と外部電極の接続
が不良であると思われる。In the case of the comparative example, since zinc or titanium was not added at all, the capacitance after the soldering heat test was insufficient and tan δ was also increased, and the connection between the internal electrode and the external electrode seems to be poor. .
なお、銅またはニッケルと合金を形成しやすい金属と
して、Fe、Mn、Pd、Sb、Sn、Ta等を使用することもでき
る。しかし、本発明者等の実験によれば、これらの金属
を本発明の亜鉛またはチタンの代替として使用すると、
内部電極と外部電極の電気的接続は改良されたが密着強
度が低下し、実用に適さないことが分かった。Note that Fe, Mn, Pd, Sb, Sn, Ta, or the like can also be used as a metal that easily forms an alloy with copper or nickel. However, according to experiments by the present inventors, when these metals are used in place of the zinc or titanium of the present invention,
Although the electrical connection between the internal electrode and the external electrode was improved, it was found that the adhesion strength was reduced and was not suitable for practical use.
本発明により、チップ型積層コンデンサとの密着強度
が高く、電気的接続も良好でチップ型積層コンデンサ外
部電極として極めて好適な卑金属組成物を提供すること
ができる。According to the present invention, it is possible to provide a base metal composition having high adhesion strength to a chip-type multilayer capacitor, good electrical connection, and extremely suitable as an external electrode of the chip-type multilayer capacitor.
図はチップ型積層コンデンサの断面図である。 １……内部電極、２……外部電極 The figure is a sectional view of a chip type multilayer capacitor. 1 Internal electrode 2 External electrode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 愛知後 将 京都府京都市西京区樫原江ノ本町11 (72)発明者 岡田 駿 神奈川県逗子市沼間５丁目765―120 (72)発明者 桜庭 正美 京都府長岡京市竹ノ台２ (72)発明者 菊地 立郎 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 長井 淳夫 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭58−68803（ＪＰ，Ａ) 特開 昭57−152606（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01G 4/30 301 H01G 1/01 H01G 4/12 361 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shogo Aichi 11 Kashihara Enohoncho, Nishikyo-ku, Kyoto-shi, Kyoto (72) Inventor Shun Okada 5-765-120, Numa, Zushi-shi, Kanagawa Prefecture (72) Inventor Masami Sakuraba Kyoto Takenodai 2 Nagaokakyo-shi 2 (72) Inventor Tatsuro Kikuchi 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Atsushi Nagai 1006 Okadoma Kadoma-shi Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (56) References JP-A-58-68803 (JP, A) JP-A-57-152606 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H01G 4/30 301 H01G 1 / 01 H01G 4/12 361
Claims (3)
ンデンサの外部電極用卑金属組成物であって、70〜95重
量％の銅と、５〜15重量％のガラスフリットと、0.2〜1
0重量％の亜鉛を含んで、合計で100重量％とすることを
特徴とするチップ型積層コンデンサ外部電極用卑金属組
成物。1. A base metal composition for an external electrode of a chip type multilayer capacitor having nickel as an internal electrode, comprising 70 to 95% by weight of copper, 5 to 15% by weight of a glass frit, 0.2 to 1% by weight.
A base metal composition for an external electrode of a chip-type multilayer capacitor, comprising 0% by weight of zinc and a total of 100% by weight.
ンデンサの外部電極用卑金属組成物であって、70〜95重
量％の銅と、５〜15重量％のガラスフリットと、02〜５
重量％のチタンを含んで、合計で100重量％とすること
を特徴とするチップ型積層コンデンサ外部電極用卑金属
組成物。2. A base metal composition for an external electrode of a chip type multilayer capacitor having nickel as an internal electrode, comprising 70 to 95% by weight of copper, 5 to 15% by weight of a glass frit, and 02 to 5% by weight.
A base metal composition for a chip-type multilayer capacitor external electrode, comprising a total of 100% by weight containing titanium by weight.
ンデンサの外部電極用卑金属組成物であって、70〜95重
量％の銅と、５〜15重量％のガラスフリットと、0.1〜1
0重量％の亜鉛と0.1〜５重量％のチタンを含んで、合計
で100重量％とすることを特徴とするチップ型積層コン
デンサ外部電極用卑金属組成物。3. A base metal composition for an external electrode of a chip type multilayer capacitor having nickel as an internal electrode, comprising 70 to 95% by weight of copper, 5 to 15% by weight of a glass frit, 0.1 to 1% by weight.
A base metal composition for an external electrode of a chip type multilayer capacitor, comprising 0% by weight of zinc and 0.1 to 5% by weight of titanium to make a total of 100% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23774790A JP2965646B2 (en) | 1990-09-07 | 1990-09-07 | Base metal composition for external electrode of chip type multilayer capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23774790A JP2965646B2 (en) | 1990-09-07 | 1990-09-07 | Base metal composition for external electrode of chip type multilayer capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04116910A JPH04116910A (en) | 1992-04-17 |
| JP2965646B2 true JP2965646B2 (en) | 1999-10-18 |
Family
ID=17019874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23774790A Expired - Fee Related JP2965646B2 (en) | 1990-09-07 | 1990-09-07 | Base metal composition for external electrode of chip type multilayer capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2965646B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3494431B2 (en) * | 1998-12-03 | 2004-02-09 | 株式会社村田製作所 | Manufacturing method of ceramic electronic component and ceramic electronic component |
| JP2003059758A (en) * | 2001-08-10 | 2003-02-28 | Nec Tokin Corp | Method of manufacturing multilayer ceramic capacitor |
-
1990
- 1990-09-07 JP JP23774790A patent/JP2965646B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04116910A (en) | 1992-04-17 |
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