JP2927280B2 - Method for manufacturing SOI substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an SOI substrate, and more particularly to a method of manufacturing an SOI substrate effective for preventing warpage.

[0002]

2. Description of the Related Art A silicon-on-insulator (SO) manufactured using a wafer bonding technique.
I) The thickness of the buried insulating film (usually an oxide film) of the substrate can be arbitrarily determined within a range permitted by the forming process.
For high breakdown voltage devices, an SOI substrate having a buried oxide film having a thickness of 1 to 3 μm is generally used. Further, for example, in the case of an SOI substrate having a diameter of 6 inches, the total thickness is 600 to
On the other hand, the thickness of the SOI layer is about 10 to 20 μm at most, which is very thin compared to the entire thickness. In an SOI substrate having such a structure, a difference in stress between the front surface and the rear surface of the substrate becomes large due to a difference in thermal expansion coefficient between the oxide film and silicon, and warpage occurs. Since this warp causes a bad effect such as deteriorating the manufacturing yield of the device or preventing the process from proceeding when the manufacturing equipment exceeds the allowable amount, the oxide film having a certain thickness is usually formed on the back surface of the substrate. To reduce warpage. A manufacturing method for reducing such warpage is disclosed in Japanese Patent Publication No. 7-955.
No. 05 (first publication) and Japanese Patent Application Laid-Open No. 6-13593 (second publication).

FIG. 4 is a cross-sectional view in the order of steps of a method of manufacturing an SOI substrate disclosed in the first publication as a first conventional example. First, as shown in FIG. 4A, the single crystal silicon substrate 1 is oxidized to form an oxide film 2 having a thickness of 500 μm on one mirror surface. Then, as shown in FIG.
The single-crystal silicon substrate 3 is bonded to the single-crystal silicon substrate 1 to form one integrated substrate. Next, FIG.
As shown in (1), the integrated single-crystal silicon substrate is thermally oxidized in an oxidizing atmosphere at a temperature of about 1100 ° C. for about 120 minutes, thereby firmly joining the integrated single-crystal silicon substrate. , About 500 on all surfaces
An oxide film 4 of nm is formed. Next, as shown in FIG. 4D, the surface of the single-crystal silicon substrate 1 is polished and thinned to a desired thickness, and the SOI layer 5 is formed. At this time, since the upper and lower surfaces of the single crystal silicon substrate 3 are covered with oxide films having the same thermal expansion coefficient and the same thickness, the warpage of the integrated single crystal silicon substrate is reduced.

Next, FIG. 5 is a sectional view showing a method of manufacturing an SOI substrate according to a second prior art as a second conventional example in the order of steps. First, as shown in FIG. 5A, an oxide film 2 is formed on a single-crystal silicon substrate 1, and then, as shown in FIG. 5B, a nitride film 6 is deposited by a CVD method. Next, as shown in FIG. 5C, the single-crystal silicon substrate 3 is bonded, and a heat treatment at about 1100 ° C. is performed. After this, FIG.
As shown in (d), the single-crystal silicon substrate 1 is polished to complete the process, leaving the SOI layer 5 having a desired thickness. This S
A tensile stress acts on the nitride film 6 in the buried insulating film layer of the OI substrate, which acts in a direction to eliminate the compressive stress of the oxide film 2, and thus has an effect of preventing the SOI substrate from warping in a convex shape.

[0005]

In the above-mentioned first conventional example, the oxide film 4 on the back surface of the SOI substrate suppresses the warpage. However, since the oxide film etching step is always included in the device forming process, this oxide film There is a problem that the film 4 is removed and warpage increases, or a step of protecting the back surface is required each time so that the back surface oxide film is not removed.

In the second conventional example, since the bonding interface is the single crystal silicon (3) and the nitride film 6, voids are generated as compared with the general interface between the single crystal silicon and the oxide film. There was a problem that the mass production was poor.

An object of the present invention is to solve these problems and to provide a method for manufacturing an SOI substrate having a buried insulating film layer (oxide film) in which the warpage of the substrate is reduced.

[0008]

According to the present invention, there is provided an SOI substrate manufacturing method comprising the steps of: oxidizing a first single crystal silicon substrate to form a first oxide film on a surface thereof; One main surface of the second single crystal silicon substrate is bonded to one main surface of the single crystal silicon substrate via the first oxide film to form one
Forming a single substrate, and bonding the second single-crystal silicon substrate of the bonded substrates to the other main surface side with a second
Forming the oxide film, covering the second oxide film with a polycrystalline silicon film, and grinding and polishing the other main surface side of the first single crystal silicon substrate of the bonded substrate to a predetermined thickness. Forming an SOI layer having a thickness of

In the present invention, the second oxide film can be covered with a nitride film or a nitride film and a polycrystalline silicon film instead of the polycrystalline silicon film. After bonding one main surface of the single crystal silicon substrate, heat treatment can be performed to increase the bonding strength.

[0010]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a first embodiment of the present invention in the order of manufacturing steps. First, as shown in FIG. 1A, the single crystal silicon substrate 1 is thermally oxidized to form an oxide film 7. At this time, the oxide film 7 may be formed only on the side to be a bonding surface later, or may be formed on the entire surface. It is desirable that the thickness of the oxide film 7 is increased as the withstand voltage of the device is increased. For example, when a MOSFET with a withstand voltage of 200 V is formed, the thickness is set to 0.5 μm to 1 μm.

Next, as shown in FIG. 1B, the single-crystal silicon substrate 1 and the single-crystal silicon substrate 3 are bonded at room temperature after cleaning. In this state, the bonding interface is hydrogen bonded or
Since only a weak bond due to Van der Waals force is maintained, a heat treatment is then performed as shown in FIG. 1 (c) to strengthen the bond. This heat treatment is performed, for example, at 1100 ° C. for 2 hours in an oxidizing atmosphere, so that the single crystal silicon substrate 3 is covered with the oxide film 8 and the oxide film 7 also has a somewhat increased thickness. 8
Will be covered. When this heat treatment is performed in a nitrogen atmosphere, an oxide film is not formed on the single-crystal silicon substrate 3, so that an oxide film may be deposited by a CVD method.
The oxide film 8 formed on the back surface (the surface on the side of the single crystal silicon substrate 3) functions to suppress the warpage of the substrate in the polishing step for forming the SOI layer and the device formation process. It is desirable that the thickness be equal to the thickness of the oxide film 7 formed on one side.

Therefore, as shown in FIG. 1D, a polycrystalline silicon film 9 is deposited as a protective film for the oxide film 8 by a CVD method or the like. The polycrystalline silicon film 9 is for preventing the oxide film 8 on the back surface from being removed in the oxide film etching step in the device forming process, and may have a thickness of about 0.1 to 0.5 μm. Next, as shown in FIG. 1E, the surface (the surface on the side of the single crystal silicon substrate 1) is ground and
Polishing is performed to form an SOI layer 5 having a desired thickness, for example, about 5 μm. Oxide film 7 formed on single crystal silicon substrate 1
Remains on the side surface of the SOI layer 5, but is thereafter removed by polishing or etching the peripheral portion of the SOI layer 5 with a width of about 1 to 3 mm.

Next, in this embodiment, an oxide film 8 having the same thickness as the buried oxide film 7 is formed on the back surface of the SOI substrate, and the warpage of the substrate is corrected. This warpage value is
For example, when the thickness of the buried oxide film 7 is 1 μm, the thickness is about 10 to 30 μm if the back oxide film 8 is provided.
If not present, it increases to about 100 μm. Since the polycrystalline silicon film is formed on the back surface of the SOI substrate so as to cover the oxide film, it is possible to prevent the oxide film on the back surface of the SOI substrate from being removed in the oxide film etching step in the device forming process. Therefore, the device formation process can be advanced without causing a large warp in the SOI substrate.

FIG. 2 is a sectional view showing a second embodiment of the present invention in the order of manufacturing steps. 2A to 2C are the same as in the first embodiment. Next, as shown in FIG. 2D, a nitride film 6 is deposited as a protective film of the oxide film 8 by a CVD method or the like. The nitride film 6 is for preventing the oxide film 8 on the back surface from being removed in the oxide film etching step in the device forming process, and may have a thickness of about 0.1 to 0.3 μm. Next, as shown in FIG. 2E, the surface (the surface on the side of the single crystal silicon substrate 1) is ground and polished, and the S
An OI layer 5 is formed.

In this embodiment, an oxide film 8 having the same thickness as the buried oxide film 7 is formed on the back surface of the SOI substrate, and the warpage of the substrate is corrected. In addition, this SOI
Since the nitride film 6 is formed on the back surface of the substrate so as to cover the oxide film, it is possible to prevent the oxide film on the back surface of the SOI substrate from being removed in the oxide film etching step in the device formation process. Therefore, the device formation process can be advanced without causing a large warp in the SOI substrate.

FIG. 3 is a sectional view showing a manufacturing process according to a third embodiment of the present invention. FIGS. 3A to 3C are the same as in the first embodiment. Next, as shown in FIG.
Nitride film 6 and polycrystalline silicon film 9 as protective films for C
It is deposited by a VD method or the like. The nitride film 6 and the polycrystalline silicon film 9 are deposited by CVD or the like. The nitride film 6 and the polycrystalline silicon film 9 are for preventing the oxide film 8 on the back surface from being removed in the oxide film etching step in the device forming process, and each has a thickness of 0.1.
It may be about 0.3 μm or about 0.1 μm to 0.5 μm. Next, as shown in FIG. 3E, the surface (the surface on the side of the single crystal silicon substrate 1) is ground and polished to form an SOI layer 5 having a desired thickness.

In this embodiment, an oxide film 8 having the same thickness as the buried oxide film 7 is formed on the back surface of the SOI substrate, and the warpage of the substrate is corrected. In addition, this SO
Since the nitride film 6 and the polycrystalline silicon film 9 are formed on the back surface of the I substrate so as to cover the oxide film 8, it is necessary to prevent the oxide film on the back surface of the SOI substrate from being removed in the oxide film etching step in the device forming process. Can be prevented. Therefore, the device formation process can be advanced without causing a large warp in the SOI substrate.

In each of the above-described embodiments, the film for protecting the oxide film on the back surface of the SOI substrate is different. However, after the formation of polycrystalline silicon and the etching of polycrystalline silicon in the device forming process, there is no or very little oxide film etching. In this case, the first embodiment is desirable. Further, in the case where there is no or very little oxide film etching after the formation of the nitride film and the etching of the nitride film in the device formation process, the second embodiment is desirable. Further, in the case where there is an oxide film etching step after polycrystalline silicon formation / polycrystalline silicon etching or after nitride film formation / nitride film etching, a third embodiment in which a nitride film and a polycrystalline silicon film are arbitrarily overlapped is provided. Is desirable.

[0019]

As described above, according to the structure of the present invention, an oxide film for correcting the warpage of an SOI substrate and a protective film (polycrystalline silicon film, nitride film, etc.) for preventing the oxide film from being removed. ) Is formed on the back surface, so that the warpage of the SOI substrate does not increase in the device forming process, the process can be performed stably, and the flatness of the SOI substrate can be maintained. Can also be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a first embodiment of the present invention in order of a manufacturing process.

FIG. 2 is a sectional view illustrating a second embodiment of the present invention in the order of manufacturing steps.

FIG. 3 is a sectional view illustrating a third embodiment of the present invention in the order of manufacturing steps.

FIG. 4 is a sectional view of a first conventional example of an SOI substrate in a manufacturing process order.

FIG. 5 is a sectional view in order of a manufacturing process of a second conventional SOI substrate.

[Explanation of symbols]

 1,3 single crystal silicon substrate 2,4 oxide film 5 SOI layer 6 nitride film 9 polycrystalline silicon film

Claims (5)

(57) [Claims] A step of oxidizing a first single crystal silicon substrate to form a first oxide film on a surface thereof; and forming the first oxide film on one main surface of the first single crystal silicon substrate. Bonding one main surface of a second single-crystal silicon substrate to form a single substrate, and
Forming a second oxide film for preventing warpage on the other main surface side of the single crystal silicon substrate, covering the second oxide film with a polycrystalline silicon film, and forming the second oxide film on the other main surface side of the single crystal silicon substrate. Grinding and polishing the other main surface side of the single-crystal silicon substrate to form an SOI layer with a predetermined thickness. 2. The method according to claim 1, wherein the second oxide film is covered with a nitride film instead of the polycrystalline silicon film. 3. The method according to claim 1, wherein the second oxide film is covered with a nitride film and a polycrystalline silicon film instead of the polycrystalline silicon film. 4. The method according to claim 2, wherein a polycrystalline silicon film is formed on the nitride film covering the second oxide film. 5. The SOI according to claim 1, further comprising a step of bonding one main surface of the second single-crystal silicon substrate to the first single-crystal silicon substrate and then performing a heat treatment to increase the bonding strength. Substrate manufacturing method.