JP2908333B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to an IC socket for pressing and fixing an IC to perform an electrical characteristic test.

[0002]

2. Description of the Related Art Conventionally, such an IC socket is, for example,
As shown in FIGS. 1 and 2 of JP-A-1-307183, an electrical characteristic test is performed by providing a base block having a comb-shaped IC receiving portion and mounting an IC.

FIGS. 5 (a) and 5 (b) are cross-sectional views of an IC mounted on an IC socket showing one example of the prior art. First, as shown in FIG. 5A, a conventional IC socket is
It has a base block 19 having a comb-shaped projection 21 and an electrode 20 which is wired to a test device (not shown) and arranged between the projections 21. In an actual test, a semiconductor device such as an IC 9 having horizontal leads 10 is fitted into the base block 19. Here, 13 is a foreign substance.

Next, as shown in FIG. 5B, after the IC 9 is inserted into the base block 19, the handler handle 1
When the IC 9 is further pressed by the IC pressing portion 7a from the upper surface of the IC 9 through the IC 2, the IC 9 sinks, and the IC 9
Lead 10 contacts the fixed electrode 20. An electrical characteristic test of the IC 9 is performed in this contact state.

In such a conventional IC socket, a comb-shaped projection 21 is fitted between the lead terminals 10 of the IC 9 to align the IC 9 with the lead terminals 1.
The foreign matter 13 such as dust between zero is removed.

FIG. 6 is a perspective view of the base block shown in FIG. As shown in FIG.
Has comb-shaped projections 21 formed on both sides of a rectangular plate parallel to each other, and the above-described electrode 20 is arranged between the projections 21.

[0007]

In the above-mentioned conventional IC socket, the lead terminals of the IC are fitted between the comb-shaped protrusions from above, and the positional relationship between the lead terminals of the IC and the comb-shaped protrusions will be described below. Since it remains fixed, it has a disadvantage that it remains attached to foreign substances that straddle the lead terminals and cannot be removed.

Further, the conventional IC socket has a disadvantage that the removed foreign matter remains on the socket, so that the foreign matter adheres to the IC.

Further, in the conventional IC socket, since the shape of the comb-shaped protrusions is angular, when the IC is fitted between the comb-shaped protrusions, the lead terminal of the IC is so set as to be engaged with the comb-shaped protrusions. When it is bent, there is a disadvantage that the REIT terminal is further bent.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, that is, to remove foreign substances on and between lead terminals of an IC and prevent reattachment in a characteristic test of the IC, An object of the present invention is to provide an IC socket which enables measurement by correcting a slight bending of a lead terminal.

[0011]

SUMMARY OF THE INVENTION An IC socket according to the present invention is a frame-like IC socket in which a plurality of electrodes are arranged in parallel and fixed in an IC socket for performing an electrical characteristic test of an IC by pressing an IC lead terminal on an electrode. A socket main body, a shaft portion and a tapered projection arranged by a spring so as to be vertically movable between the plurality of electrodes of the socket body portion, and a projection holding portion for pressing down the tapered projection portion. And an IC pressing portion for pressing the IC at the center of the frame-shaped socket main body.

Further, the tapered projection in the IC socket of the present invention is pushed by the projection pressing portion when the IC pressing portion is lowered, and is locked in a state where the lead terminal of the IC and the electrode are pressed against each other. It is formed as follows.

The socket body of the IC socket according to the present invention has the tapered protrusion near the lower surface thereof.
Air blow that cleans the tapered projection when the part is restored
It is formed with a device .

Further, the IC socket according to the present invention is a frame-shaped socket body in which a plurality of electrodes are arranged in parallel and fixed in an IC socket for performing an electrical characteristic test of an IC by pressing an IC lead terminal on an electrode. A shaft, a tapered protrusion arranged by a spring so as to be vertically movable between the plurality of electrodes of the socket body, and a protrusion holding portion for pressing the tapered protrusion, An IC holding portion for pressing the IC at the center of the frame-shaped socket body portion, and a pair of holding blocks attached to the socket body portion so that the IC holding portion can rotate.

Further, in the IC socket of the present invention, the socket main body has the taper near the lower surface thereof.
Cleaning the tapered projection when the projection is restored
It is formed with an blowing device .

[0016]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an IC socket main body for explaining a first embodiment of the present invention. As shown in FIG. 1, the IC socket according to the present embodiment includes a frame-shaped socket body 1 and an IC presser 7,
The socket body 1 has an IC (not shown) escape hole formed in the center and a plurality of electrodes 3 fixed to both opposing sides and wired to a test device (not shown);
It has a plurality of tapered projections 2 arranged so as to sink between the electrodes 3, that is, movably in the vertical direction, and formed with a tapered portion 4. The socket body 1 has a shaft 5 attached to the bottom of each tapered projection 2 and a spring 6 for recovery. In addition, the shaft 5 and the spring 6 are recessed. Sometimes lockable. On the other hand, the IC pressing portion 7 includes a plurality of projection pressing portions 8 that come into contact with the upper surface of the tapered projection portion 2.
It has a function of pressing C and pressing an IC lead described below to the electrode 3.

In the IC socket having such a structure, the IC socket
When the connector is inserted into the socket main body 1, foreign matter adhering between the lead terminals is removed by the protrusion pressing portion 8 of the IC pressing portion 7, and the positioning of the IC and the correction of the lead terminals are performed. That is, when the IC pressing portion 7 descends, the protrusion pressing portion 8 presses the tapered protrusion portion 2 to remove foreign substances straddling the lead terminals and prevent the foreign substances from reattaching. In addition, even if the test is completed and the IC presser 7 rises, the tapered projection 2 stops without rising, and the foreign matter is removed at the lower part of the socket body 1. When the removal of foreign matter at the lower portion of the socket body 1 is completed, the tapered projection 2 is released from the lock mechanism, and is raised by the shaft 5 and the spring 6.

FIGS. 2A and 2B are cross-sectional views of the IC mounted on the socket body in FIG. 1 before and after measurement. First, as shown in FIG.
The IC 9 is mounted thereon. At this time, even if the lead terminal 10 of the IC 9 has some bends, the protrusion 2 forms the tapered portion 4, so that the lead terminal 10 and the electrode 3 automatically settle at a predetermined position where they face each other. . In addition, the air blow device 11 for blowing off foreign substances such as dust is
Although it is provided at the lower portion of the socket body 1, it may be provided integrally with the socket body 1.

Next, as shown in FIG. 2B, the IC presser 7 is moved via the handler handle 12 to press the IC 9 and to press the upper surface of the projection 2 by the presser 8. As a result, the protrusion 2 sinks and is locked by a usual well-known mechanism. In this state, the test of the IC is started.

When the test is completed, foreign matter such as dust is removed by the air blow device 11. Next, when the handler handle portion 12 is pressed again, the lock mechanism is released and the IC holding portion 7 rises, so that the IC 9
Is also released. Even in this state, if the air blow device 11 is driven, dust on the protrusion 2 can be blown off.

FIGS. 3A to 3D are cross-sectional views for explaining the measuring operation and the foreign substance removing operation of the IC mounted on the socket body in FIG. First, FIG.
As shown in (a), the IC 9 is positioned by the protrusion 2 and is fitted on the electrode 3. Here, foreign matter 1
3 extends over the lead terminal 10 of the IC 9.

Next, as shown in FIG. 3 (b), when the IC holding portion 7 is lowered from above and the IC 9 is pushed in, the lead terminal 10 of the IC 9 is connected to the electrode 3 connected to the test apparatus as described above. , And an electrical property test is performed. At the same time, the tapered projection 2 is also pushed together with the foreign matter 13 by the projection holding portion 8, so that a short-circuit between the lead terminals 10 can be avoided.

Further, as shown in FIG. 3 (c), when the IC presser 7 rises with the completion of the test of the IC 9, the tapered projection 2 is kept pressed by the lock mechanism. In addition, the foreign matter 13 remains on the protrusion 2.

Further, as shown in FIG. 3D, in this step, foreign substances 13 such as dust are removed by the air blow device 11.

Thereafter, when the lock of the projection 2 is released, the projection 2 returns to between the electrodes 3 and returns to the state shown in FIG.

FIGS. 4A to 4C are cross-sectional views of an IC socket body and an IC for explaining a second embodiment of the present invention. First, as shown in FIG. 4A, in the present embodiment, the IC socket body 1
The C-holding portion 14 is integrally provided so as to be freely rotatable, and is particularly suitable for a manual measurement operation. As in the first embodiment described above, the IC socket main body 1 includes a plurality of electrodes 3 wired to a test apparatus and a shaft 5 that is disposed between the electrodes 3 and can be sunk.
And a tapered projection 2 fastened to the spring 6 and a fixedly provided pair of holding blocks 15 having rotatable pawls, and one of the holding blocks 15 has an IC holding section. 14 is supported. The IC holding portion 14 has an upper lid 17 attached to both ends thereof via springs 18 in parallel with the IC holding portion 14.
Are fixed to the plurality of protrusion holding portions 16. These projection holding portions 16 have the same function as the projection holding portion 8 in the first embodiment described above.

In short, this IC holding block 15
It has a structure in which an upper lid 17 to which the projection holding section 16 is fixed and the IC holding section 14 are pressed via a spring 18.

As described above, the IC 9 is connected to the tapered projection 2.
And fitted on the electrode 3. Here, it is assumed that there is a foreign substance 13 such as dust over the lead terminal 10.

Next, as shown in FIG. 4B, the IC presser 14 is placed on the IC 9 by manual operation.

Further, as shown in FIG. 4 (c), the upper cover 17 of the IC presser 14 is pushed in, and the claw of the presser block 15 is rotated to hook the hole of the upper cover 17 (not shown). The spring 18 is kept in a contracted state. At this time, the tapered projection 2 is pushed down together with the foreign matter 13 by the projection holding portion 16. In this state, the foreign matter 13
Since it has been pushed down to a position unrelated to the measurement of C9, the measurement of IC9 is started.

When the measurement of the IC 9 is completed, the IC presser 14 is opened and the foreign matter 13 is blown off by the air blow device 11 and removed as in the first embodiment.

[0033]

As described above, the IC socket of the present invention has a structure in which tapered projections are arranged between electrodes fixed to the socket body and are pressed down from above to sink the lead terminals. Even if there is a foreign substance that straddles the projection, the foreign substance can be sandwiched on the protrusion and moved to the lower part, so that there is an effect that the foreign substance can be easily removed by using an air blow device or the like.

Further, the IC socket of the present invention has an effect that foreign substances can be prevented from re-adhering by using a mechanism for removing foreign substances on the projections below the socket body.

Further, in the IC socket of the present invention, even if the lead terminal of the IC is bent to such a degree as to touch the protrusion, the lead terminal is corrected by tapering the upper part of the protrusion disposed on the socket body. There is an effect that the above can be measured.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an I / O for explaining a first embodiment of the present invention;
It is a perspective view of a C socket main body.

FIG. 2 is a cross-sectional view of an IC mounted on a socket body in FIG. 1 before and after measurement.

3 is a cross-sectional view for explaining a measuring operation and a foreign substance removing operation of the IC mounted on the socket body in FIG. 1;

FIG. 4 is a diagram showing an I signal for explaining a second embodiment of the present invention;
It is sectional drawing of a C socket main body and IC.

FIG. 5 shows an IC mounted on an IC socket, showing an example of the related art.
FIG.

FIG. 6 is a perspective view of the base block shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket main body part 2 Tapered projection part 3 Electrode 4 Tapered part 5 Shaft part 6,18 Spring 7,14 IC holding part 8,16 Projection holding part 9 IC 10 Lead 11 Air blow device 12 Handler grip part 15 Holding block 17 Upper lid 17

Claims (5)

(57) [Claims] An IC lead terminal is pressed against an electrode to form an IC.
In an IC socket for performing an electrical characteristic test, a frame-shaped socket body in which a plurality of electrodes are arranged and fixed in parallel, and a shaft portion so as to be vertically movable between the plurality of electrodes in the socket body. It is characterized by having a tapered projection arranged by a spring, a projection holding part for pressing the tapered projection, and an IC holding part for pressing the IC at the center of the frame-shaped socket body. IC socket. 2. The tapered projection is pushed by the projection holding part when the IC holding part descends, and
The IC socket according to claim 1, wherein the IC terminal is locked in a state where the lead terminal of C and the electrode are pressed against each other. 3. The tapered protrusion is provided near the lower surface of the socket body when the tapered protrusion is restored.
2. The method according to claim 1, further comprising an air blow device for cleaning the air.
C socket. 4. An IC by pressing an IC lead terminal on an electrode.
In an IC socket for performing an electrical characteristic test, a frame-shaped socket body in which a plurality of electrodes are arranged and fixed in parallel, and a shaft portion so as to be vertically movable between the plurality of electrodes in the socket body. A tapered projection arranged by a spring, a projection pressing part for pressing the tapered projection, an IC pressing part for pressing the IC at the center of the frame-shaped socket body, and the IC pressing part An IC socket comprising: a pair of holding blocks attached to the socket body so that the socket can be rotated. 5. The socket body is provided with the tapered projection near the lower surface thereof when the tapered projection is restored.
5. The method according to claim 4, further comprising an air blow device for cleaning the air.
C socket.