JP2001155833A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket that can inexpensively manufacture contacts and can easily carry out mounting of contacts on a socket body, exchanging and maintenance. SOLUTION: An IC package P is loaded on IC loading table 3 of a socket body 1, and contacting portions of contacts are contacted to upper and lower surfaces of the lead terminals PL of the package, respectively. A number of upper contacts 20, in which key portions 20a are directly mounted on a member 2 of the socket body 1, are arranged at an outer edge of the loading table with their top edges as upper contacting portions 20c. On the loading 3, lower contacts 30 different from the upper contacts 20 are disposed to positions corresponding to the upper contacts. Lower ends of the lower contacts 30 are conductively contacted to the key portions, respectively, so that the lower ends make up lower contacting portions 30b. Also, the loading table 3 is removably mounted to the base member 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly, to an IC socket on which a mounted IC package is mounted and which is used for conducting an electric current test.

[0002]

2. Description of the Related Art Conventionally, in order to reduce the contact resistance by ensuring the contact between a lead terminal and a contact of an IC package, the lead terminals of an IC package mounted on an IC mounting base of a socket body are respectively provided on both upper and lower surfaces. An IC socket in which a contact portion of a contact is brought into contact is known (JP-A-62-93964, JP-A-10-93964).
No. 144444). However, in each of these conventional IC packages, the contacts implanted in the base member of the socket main body are changed from the backbone portion to the upper contact forming the upper contact portion and the lower contact forming the lower contact portion. In this structure, one upper contact portion makes contact with the upper surface of the lead terminal and another lower contact portion makes contact with the lower surface of the lead terminal. That is, the contact is configured as an integrally formed part in which the upper contact and the lower contact are connected.

[0003]

However, in the above-mentioned conventional socket, the contact becomes complicated as a single piece, so that the manufacturing cost for press molding (punching) increases and the thin plate is originally short. In addition to the difficult handling, not only is it difficult to insert the socket into the narrow part of the base member of the socket body, but also there is a problem that the contact may be broken carelessly during the work. there were. In addition, a large number of the contacts are arranged on the outer periphery of the IC mounting table of the socket body at minute intervals, but after the work of attaching to the base member is completed, or after the work of inspecting and measuring the IC package, In some cases, fine dust, fiber dust, or the like is found to adhere between the contacts or at the contact portions of the contacts. Leaving it will cause inspection errors such as poor contact, so it is necessary to perform maintenance work such as cleaning to remove the dust and fiber debris, etc. It becomes very complicated and may break the contacts during the work. Furthermore, some contacts become defective due to long-term use, and the contacts may be replaced.
The replacement work was similarly inconvenient. The above problems and disadvantages are particularly remarkable as the number of pins of the IC package increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has been made to solve the problem. An IC socket which can reduce the cost of manufacturing a contact and facilitate the work of mounting, exchanging, and maintaining a contact on a socket body. The purpose is to provide it at low cost.

[0005]

In the IC socket of the present invention, an IC package is mounted on an IC mounting base of a socket body, and contact portions of contacts are respectively brought into contact with upper and lower surfaces of lead terminals of the package. In the IC socket described above, a number of upper contacts having a trunk portion planted on the base member of the socket body are arranged on the outer periphery of the mounting table, and the tip is an upper contact portion. Separate lower contacts are arranged corresponding to the respective upper contacts, and the lower ends of the respective lower contacts are brought into contact with the main body so as to be able to conduct electricity, and the upper ends are formed as lower contact portions. The contact portion can contact the upper and lower surfaces of the lead terminal (claim 1). That is, the present invention is characterized in that the upper contact and the lower contact constituting the contact are separated and separated from each other, and each of them has a simple shape as a single item. This simplifies the press die to facilitate its manufacture, reduces the occurrence of defective molding, and increases the yield.

In the present invention, the upper contact is displaced outward to open and the IC package can be attached to and detached from the mounting table. The means for opening and closing the upper contact is, when the IC package is manually attached and detached, carried out by a cover which is mounted on the socket body so as to be able to move up and down in the same manner as in the prior art described above. Even in this case, when the cover is pushed down, the upper contact is displaced outward,
Alternatively, conversely, the upper contact is opened outward in the initial state, and when the cover is pressed down, the upper contact is displaced to a position where the upper contact comes into contact with the upper surface of the lead terminal of the IC package. Good. When the IC package is attached / detached by the automatic attaching / detaching device, the upper contact may be opened / closed by the opening / closing mechanism of the device without using the cover.

Further, the present invention is characterized in that the IC mounting base is detachably attached to the base member (claim 2), whereby the IC mounting base is detached from the base member and the socket is detached. By taking out the upper and lower contacts from the main body, mounting, replacement, and maintenance of both contacts can be easily performed in a state where the upper and lower contacts are separated. Further, according to the present invention, as a specific socket structure, a cover is attached to the socket body so as to be vertically movable, and a connection member engaging with each contact of each row is attached to the upper contact, When the cover is depressed, the upper contact is displaced outwardly via the connecting member so that the IC package can be mounted on the mounting table. According to the third aspect of the present invention, each of the upper contacts is displaced outward by pushing down the cover, so that the IC mounting base is displaced outward. The IC package is mounted (loaded) on the mounting table since the upper part of the package is opened. After that, when the cover is released and the cover is slowly moved upward, the upper contact is displaced in the closing direction and contacts the upper surface of the lead terminal of the IC package,
Along with the contact of the lower contact with the lower surface of the lead terminal,
The upper and lower contacts contact the upper and lower surfaces of the lead terminal, respectively.

In the structure using the connecting member, the connecting member is used to position the IC mounting table, that is, the upper contact, the lower contact, and the IC.
It is preferable to position the package. Specifically, on the base member or the IC mounting table, a guide post serving as a guide for loading an IC package is erected, and the connecting member is provided with a positioning piece having both ends protruding inward. The positioning piece is slidably brought into contact with the inner wall of the guide post (claim 4). The guide post may be disposed on either side of the base member or the IC mounting table. However, in a form in which the IC mounting table is attached to and detached from the base member, as in claim 2, It is preferable to form them integrally. Thus, it is possible to reliably position the mounting table and the connecting member, that is, the upper contact, after the IC mounting table is mounted on the base member. In addition, since the IC mounting base does not require ribs or separators for positioning the lower contact, the structure of the outer peripheral surface is simplified.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a socket body with a cover removed, showing an embodiment of the present invention in the case of an open-top type IC socket of a cover direct push type. FIG. 2 is a half sectional view showing a state where a cover is attached and an IC package is mounted. The socket body 1 includes a detachable base member 2 and I
An IC socket is formed by mounting the cover 4 on the base member 2 so as to be able to move up and down, and these are plastic molded products having insulating properties.

The base member 2 is a rectangular plate having a substantially square shape in a plan view. A guide portion 5 for supporting the cover 4 so as to be able to move up and down is integrally formed at a corner thereof, and a space for accommodating the IC package P is provided. The IC mounting base 3 is mounted and mounted on the portion. Specifically, a nut 6 is buried in the center of the base member 2 and a square fitting recess 7 is formed in the upper part thereof.

The IC mounting base 3 has a projecting ridge 9 projecting partly or entirely around the outer peripheral portion of the upper surface thereof to form a mounting surface 3a inside the projecting ridge 9 and position the IC package P on the mounting surface 3a. It was made possible to be mounted. Note that the IC package P is of a mounting type, and lead terminals PL projecting around the four sides protrude outward beyond the ridge 9. Guide posts 8 are integrally connected to the outside of the four corners of the IC mounting base 3 so as to be integrally connected to each other. When the IC package P is loaded and mounted on the mounting base 3, the guide posts 8 are positioned at the corners of the package P. Guide the parts so that they load smoothly. Further, the IC mounting base 3 has a shaft hole 10 opened at the center thereof, and a square fitting projection 11 which fits into the fitting recess 7 of the base member 2 at the outer periphery thereof. The mounting table 3 is formed by fitting the fitting projection 11 into the fitting recess 7 of the base member 2.
It is mounted on the base member 2 in a stopped state, that is, in a positioned state, and is fastened and fixed by the bolt 12 and the nut 6 inserted into the shaft hole 10. Therefore, the IC mounting base 3 is detached from the base member 2 together with the guide post 8 by removing the bolt 12 from the nut 6 and pulling up the mounting base 3, ie, the IC mounting base 3 is detachable from the base member 2. It is.

The base member 2 of the socket body 1 has
A large number of upper contacts 20 are arranged on the outer periphery of the mounting table 3, more specifically, between the guide posts 8. Each upper contact 20 has a thin plate-shaped base portion 20a at a lower end thereof, and connects an outer end of the base portion 20a with a spring portion 20b that is curved in a substantially semicircular shape inwardly upward and connects the spring portion 20b. An upper contact portion 20c protruding substantially horizontally inward from the upper end of the upper contact portion. Also, each upper contact 20 has an operating portion 20d that protrudes upward from the rear end of the contact portion 20c.
And a contact piece 20e horizontally protruding inward from a middle portion of the upper surface of the base portion 20a. Further, a terminal portion 20f protrudes downward from the lower surface of the base portion 20a. The upper contact 20 is connected to the respective portions 20a.
20f is an integrally molded product formed by press molding (punching). These upper contacts 20 are mounted in rows on the outer periphery of the mounting base 3 by implanting the base portion 20a and the terminal portions 20f on the base member 2, and the lower end terminal portions 20f are not shown. This is to conduct to the test circuit of the inspection device.

On the other hand, a large number of lower contacts 30 are arranged in rows on the outer periphery of the IC mounting base 3 so as to correspond to the upper contacts 20, respectively. Each lower contact 30 is a thin plate-shaped rectangular plate that is long in the vertical direction, and has a shape in which the hooking portion 30a protrudes inward at the center in the vertical direction, and is a press-formed product (punching). The lower contact 30 is mounted on the IC mounting base 3 by inserting the locking portion 30a into a slit 31 formed on the outer four peripheral surfaces of the mounting base 3 and locking the same. The upper end surface of the lower contact 30 is located on the outer end of the mounting table 3,
Specifically, it is exposed on the outer upper surface of the raised edge 9, and the upper end surface is a lower contact portion 30b on which the lead terminal PL of the IC package P is seated. At the lower end of the lower contact 30, there is formed a seating part 30c which is always in contact with the contact piece 20e of the upper contact 20, and the seating part 30c
The lower contact 30 is electrically connected to the main body 20a via the contact piece 20e.

The above-mentioned upper contact 20 has a spring portion 20.
Due to the elasticity of b, the state where the upper contact portion 20c is in contact with the lower contact portion 30b of the lower contact 30 is set to the initial position. And the upper contact 20 for each row
Then, a connecting member 21 that straddles and engages with each contact is attached, and by operating the connecting member 21, the upper contact 20 is displaced outward (opening operation).
That is, the connecting member 21 is a member having a length substantially equal to the length of each row of the upper contacts 20 and covering the upper half of each upper contact 20, and the arrangement pitch of the upper contacts 20 on the inner surface. Slits 22 are formed at the same intervals as above, and the operating portion 20d and the lower contact portion 20c of the upper contact 20 are inserted and mounted in each slit 22.

The connecting member 21 is integrally provided with positioning pieces 23 with both ends protruding inward.
Is slidably brought into contact with an inner wall 8a formed on the guide post 8 of the IC mounting base 3 so that the IC mounting base 3
, And the positioning of the upper contact 20 and the lower contact 30 (see FIG. 1). A cam plate 24 is integrally attached to both end surfaces of the connecting member 21 by a shaft 25, and a lower portion of each cam plate 24 is rotatable via a support shaft 27 to a bracket 26 erected on the base member 2. And the upper working portion 24
a is formed to protrude above the connecting member 21. This cam plate 24
The tip of the action portion 24a is in contact with the inclined surface 4a formed on the inner surface of the cover 4, and is rotated about the support shaft 27 by an operation of moving the cover 4 up and down.

That is, when the cover 4 is pressed down,
When the inclined surface 4a pushes the action portion 24a outward to rotate the connecting member 21 outward, thereby displacing the upper contact 20 outward (opening operation) and releasing the pressing of the cover 4 Then, due to the elasticity of the upper contact 20, the contact 20 returns to the initial position (closing operation), and accordingly, the action portion 24a pushes the inclined surface 4a to move the cover 4 upward. In order to assist the upward movement of the cover 4, a spring may be interposed on the inner surface of the cover 4 to urge the cover 4 upward.

In the IC socket described above, when the cover 4 is pressed down, the upper contact 20 is opened via the connecting member 21, and the upper contact portion 20c is brought into contact with the contact portion 30b of the lower contact 30. The upper part of the IC mounting base 3 is opened apart from the opening 4, so that the opening window 4b of the cover 4
, The IC package P is loaded and mounted on the mounting table 3, and each lead terminal PL is seated on each lower contact portion 30b (see FIG. 2). Thereafter, the pressing of the cover 4 is released, so that the upper contact 20 is connected via the connecting member 21.
Perform the closing operation, so that each contact portion 20c of the upper contact 20 contacts the upper surface of each lead terminal PL of the IC package P (see FIG. 3). Accordingly, each lead terminal PL of the IC package P is simultaneously contacted by the upper contact 20 and the lower contact 30, and the conduction test is performed.

When the upper contact 20 is opened by pushing down the cover 4 (see FIG. 2),
The C mounting table 3 can be taken out of the socket body 1 through the opening window 4b of the cover 4 (see FIG. 4). Therefore, the taken out mounting table 3 can perform a cleaning operation of removing dust and fiber debris from the lower contact 30 using a cleaning tool such as a brush or a pin, or perform maintenance such as replacement of a defective contact. . During the maintenance work, the lower surface of the IC mounting base 3 is only arranged in parallel with the lower contacts 30 and there is no rib or the like for positioning the lower contacts 30. Therefore, it is easy to replace and clean the contacts. on the other hand,
After removing the cover 4 on the base member 2 side,
With the inside of the upper contact 20 opened, maintenance such as cleaning work can be performed on the contact.

When the IC mounting base 3 is attached to the base member 2 again, the positioning piece 23 of the connecting member 21 comes into sliding contact with the inner wall 8a of the guide post 8, so that the positioning between the upper contact 20 and the IC mounting base 3 is performed. Is secured.

FIG. 5 shows another embodiment for ensuring an energized state between the lower contact 30 and the trunk 20a of the upper contact 20. The trunk 20a 'has an upper surface formed as a flat surface, Seating part 30 at lower end of lower contact 30 '
c 'is formed in a horizontal U-shape, and the seating portion 30c' is
0a 'so as to make elastic contact. That is, an elastic portion is formed on the lower contact 30 'side so as to be in contact with the main body 20a'.

In the above embodiment, the case where the lead terminal PL of the package P comes into contact with the lower contact portion 30b when the IC package P is mounted on the IC mounting base 3 has been described. The lead terminal PL is separated from the lower contact portion 30b, and the upper contact 20
The lower contact 30 may be moved upward in conjunction with the closing operation of the first contact so that the lower contact portion 30b contacts the lead terminal PL. In the above embodiment, the base member 2
While the IC mounting table 3 was fixed,
It is also possible to adopt a float system in which the mounting table 3 is moved up and down. Furthermore, although the structure in which the upper contact 20 and the lower contact 30 are disposed around the four sides of the base member 2 has been described, a socket body having a structure in which they are disposed only on two opposing sides may be used.

In the first or second aspect of the present invention, as long as the upper contact 20 has a base portion 20a and an upper contact portion 20c at the tip, the shape of the middle portion is not limited to the above-mentioned shape. Not something. For example, it may be linear as in JP-A-59-50551. In the above-described embodiment, the configuration in which the guide post is formed integrally with the IC mounting base is described. However, except for claim 4, the guide post may be provided on the base member. The base 3 is the base member 2
However, except for claim 2 and the dependent claims, the IC mounting base may be formed integrally with the base member, in which case the guide post Is also integrally formed with the base member.

[0023]

According to the present invention, the contacts are separated into an upper contact and a lower contact, so that each of the contacts has a simple shape as a single item. Therefore, it is possible to simplify the press die for producing the contact to facilitate its production, to increase the yield and to reduce the production cost, and it is convenient to handle the contact and easy to mount the contact on the socket body. . According to the second aspect, the IC mounting base can be detached from the base member and taken out of the socket body, so that the upper contact and the lower contact are separated and the two contacts are mounted, exchanged, and maintained. Can be performed, and the workability is significantly improved as compared with the conventional art. Further, according to the third aspect, it is possible to provide an IC socket having a specific structure which is easy to attach and detach an IC package and is excellent in usability.

According to the fourth aspect, the positioning between the mounting base and the upper contact after the IC mounting base is mounted on the base member is ensured even though the IC mounting base is separate from the base member. You. In addition, since the IC mounting base does not require ribs or separators for positioning the lower contact, the structure of the outer peripheral surface is simplified, and maintenance such as contact replacement and cleaning work is simplified.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a socket body in an IC socket of the present invention.

FIG. 2 is a cross-sectional view showing one half of a state in which a cover is attached and an IC package is mounted, and shows a state in which an upper contact is opened.

3 is a cross-sectional view of the same portion as FIG. 2, showing a state in which an upper contact is closed.

FIG. 4 is a cross-sectional view showing a state where an IC mounting base is detached from a base member.

FIG. 5 is a cross-sectional view showing another embodiment in which a contact state between a lower contact and a backbone is changed.

[Explanation of symbols]

1: Socket body 2: Base member
3: IC mounting base 4: Cover 20: Upper contact
20a: Backbone 20c: Upper contact 21: Connecting member 30: Lower contact 30b: Lower contact
30c: seat P: IC package PL: lead terminal

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Makoto Hoshi 755-1, Ogano, Ogano-machi, Chichibu-gun, Saitama F-term (reference) 2G003 AG01 AG10 AG12 AG20 AH04 2G011 AC06 AC14 AE02 AF02 5E024 CA08 CA09 CB01

Claims (4)

[Claims] An IC package is mounted on an IC mounting base of a socket body, and contact portions of contacts are respectively brought into contact with upper and lower surfaces of lead terminals of the package.
In the C socket, a number of upper contacts in which a base portion is planted on a base member of the socket body are arranged on the outer periphery of the mounting table, and a tip is an upper contact portion, and the mounting table is different from the upper contact. The lower contacts of the body are arranged corresponding to the respective upper contacts, and the lower ends of the respective lower contacts are brought into contact with the main body so as to be able to conduct electricity, and the upper ends are formed as the lower contact portions. An IC socket characterized in that a part can be brought into contact with upper and lower surfaces of the lead terminal. 2. The IC socket according to claim 1, wherein said mounting table is detachably attached to said base member. 3. A cover is attached to the socket body so as to be movable up and down, a connection member engaging with each contact in each row is attached to the upper contact, and the connection member is pressed when the cover is pressed down. The upper contact is displaced outward through the IC so that the IC package can be mounted on the mounting table, and when the cover is released, each contact portion of the upper contact contacts the upper surface of the lead terminal of the IC package. The IC socket according to claim 1 or 2, wherein the IC socket is returned to a position where the IC socket moves. 4. An IC mounted on the base member or the IC mounting table.
A guide post serving as a guide for loading the package is erected, and the connecting member is provided with a positioning piece having both ends protruding inward, and the positioning piece is slidably abutted on the inner wall of the guide post. The IC socket according to claim 3, wherein the IC socket is provided.