KR20080030174A - Batch type contact member assembly for socket, socket, and method of assembling the socket - Google Patents

Abstract

A batch type contact member assembly for a socket, a socket, and a socket assembling method are provided to allow a socket to accommodate various types of semiconductor devices each having a different connection terminal by the medium of a contact unit housing a plurality of contact members. A conductive contact member(11) is provided at certain interval so as to be connected with a corresponding connection terminal of a semiconductor device. A support piece(11b) is connected at a lower end of each contact member by the medium of a perforated portion(11a), and when an external force is applied to the perforated portion, the support piece is separated from the contact member. An upper connection terminal(11c) is provided at an upper portion. An upper stopper(11d) is provided to be adjacent to a lower portion of the upper connection terminal. A lower connection terminal(11e) is provided at a lower portion of the opposite of the upper stopper. A lower stopper(11f) is provided at an upper portion of the lower connection terminal. A bent portion(11g) with a certain curvature is formed between the upper stopper and the lower stopper.

Description

BATCH TYPE CONTACT MEMBER ASSEMBLY FOR SOCKET, SOCKET, AND METHOD OF ASSEMBLING THE SOCKET}

1 is a schematic partially enlarged cross-sectional view showing a burn-in test socket according to the prior art;

2 is a schematic perspective view showing a bundle-type contact member assembly for a socket according to a first embodiment of the present invention;

3 is a schematic plan view of a bundle-type contact member assembly for a socket according to a first embodiment of the present invention;

4 is a schematic perspective view of a contact unit applied to a socket according to a second embodiment of the present invention;

5 is a schematic perspective view showing a contact holder of a contact unit.

6 is a schematic partially enlarged cross-sectional perspective view of the contact holder of FIG. 5;

7 is a schematic perspective view showing a contact stopper of the contact unit.

8 is a schematic partially enlarged perspective view of the contact stopper of FIG.

9 is a view for explaining a socket assembly method according to a third embodiment of the present invention showing a state before the contact member assembly of the bundle form to the contact holder and the contact stopper assembly.

10 is a schematic partially enlarged plan view illustrating a state in which a bundle-type contact member assembly is inserted into a contact holder and a contact stopper assembly;

FIG. 11 is a schematic partially enlarged perspective view of a bundle-like contact member assembly fitted to a contact holder and a contact stopper assembly; FIG.

12 is a view showing a state in which a bundle-type contact member assembly is inserted into the remaining slots of the contact holder and the contact stopper assembly.

13 is a view showing a state in which the contact unit is completed by removing the lower support piece of each bundle-type contact member assembly.

14 is a schematic perspective view showing a base member and a lid member assembly constituting a portion of the socket;

15 is a schematic perspective view illustrating a state in which a contact unit is mounted on the base member and the cover member assembly of FIG. 14;

Figure 16 is a schematic perspective view showing a state in which the lead guide is installed on the adapter and the lower portion of the base member on the contact unit of Figure 15, respectively.

<Description of the symbols for the main parts of the drawings>

5: adapter 7: cover member

10: bundle-type contact member assembly 11: contact member

12: socket 13: base member

14: contact unit 15: contact holder

16: coupling means 17: contact stopper

18: fixing means 19, 20: locking bar

21: Lead Guide

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bundle-type contact member assembly for a socket, a socket and a socket assembling method, and more particularly to a surface mount type semiconductor device such as an IC device or an IC package for increasing the convenience of manual operation and realizing the assembly automation. A contact member assembly in the form of a bundle consisting of a plurality of contact members, the contact member provided in the socket for a socket and a socket assembly method for stably receiving a plurality of contact members of the contact member assembly through a contact holder and a contact stopper will be.

In general, surface-mount semiconductor devices such as IC devices or IC packages are composed of Land Grid Array (LGA), Ball Grid Array (BGA), and Chip Sized Package (CSP) types. A burn-in test is done for this purpose.

Burn-in test refers to a process of screening whether a semiconductor device satisfies such a condition if the semiconductor device as described above is subjected to a temperature and voltage higher than usual operating conditions for the semiconductor device before being applied to the electronic device. .

The semiconductor device as described above is mounted in a burn-in test socket and undergoes burn-in test before being shipped to a customer.

Korean Laid-Open Patent Publication No. 2003-0051371 discloses a technique related to a burn-in test socket. The burn-in test socket 1 has a large base member 2 and a contact control member (as shown in FIG. 1). 3), a plurality of contact members 4, an adapter 5, four latch assays 6 and a lid member 7.

The base member 2 partially receives each contact member 4 in a plurality of holes 2b around the central hub 2a, each of which is also received by the contact regulating member 3. It is.

The adapter 5 separately receives the upper end of each contact member 4 extending onto the contact control member 3, and the semiconductor device 8 as described above is seated on the upper surface of the adapter.

The cover member 7 is mounted on the base member 2 with four latch assays 6 interposed therebetween, and the cover member 7 is slidably moved in the up and down directions with respect to the base member.

The latch member 6a of each latch assay 6 is unlocked when the lid member 7 is pressed against the base member 2 and, on the contrary, returns to its original position when the press release is released. do.

Accordingly, the semiconductor device 8 as described above is mounted on the adapter 5 of the burn-in test socket 1, and then stably fixed by the latch member 6a of each latch assay 6. It becomes possible.

The burn-in test socket 1 is then mounted on the PCB with each contact member 4 of the socket electrically connected to a corresponding portion of the burn-in test PCB (not shown), and then burn-in It is placed in a test oven (not shown) along with the test PCB to undergo burn-in testing under certain conditions.

However, since each contact member 4 applied to the burn-in test socket 1 is provided in a state in which the contact members 4 are separated from each other, the corresponding contact members 4 of the contact regulating member 3 are disposed. Inconvenience to insert into 3a) was involved.

In addition, the burn-in test socket 1 has a recess 3b which is engaged with the hub 2a at the center of the base member 2 at the lower portion of the contact adjusting member 3, and thus the contact adjusting member ( There was a problem in that a sufficient number of contact members 4 could not be inserted in 3), and therefore, various kinds of semiconductor devices having more corresponding connection terminals than the number of fitted contact members could not be accommodated.

In addition, since the contact control member 3 of the burn-in test socket 1 is made of a single body, it is very difficult to form various types of slots 3a for each contact member 4 in the contact control member. There was no choice but to.

Further, the burn-in test socket 1 is a contact control member having each contact member 4 firstly fitted into a corresponding slot 3a of the contact control member 3 and then having the respective contact member 4. Since the (3) is disposed on the base member (2), not only is the assembly work by human being very inconvenient, but also the automation of the assembly process is very difficult.

Accordingly, the present invention has been made to solve the problems described above, the object is to provide a plurality of contact members in the form of a bundle to facilitate the assembly of the plurality of contact members in the socket by manual or automated operation To provide a contact member assembly in the form of a bundle.

It is another object of the present invention to provide a socket for accommodating various kinds of semiconductor devices having different numbers of connection terminals through a contact unit accommodating a plurality of contact members provided from a bundle-type contact member assembly. .

It is still another object of the present invention to provide a socket for dividing an existing contact control member accommodating a plurality of contact members into a contact holder and a contact stopper to conveniently form a corresponding slot for each contact member in various forms. It is.

Still another object of the present invention is to provide a socket assembly method for facilitating assembling work through manpower and automating the assembly process to ultimately increase productivity.

In order to achieve the above object, the present invention provides a plurality of conductive contact members provided at regular intervals to be connected to the connection terminal of the semiconductor device; It provides a bundle-type contact member assembly for the socket including a support piece which is connected to the lower end of each of the contact members via a cutout portion and the external force is applied to the cutout portion.

In addition, the present invention further provides the following specific embodiments of the first embodiment of the present invention.

According to the first embodiment of the present invention, each of the contact members includes an upper connection terminal provided on an upper side, an upper stopper provided adjacent to a lower portion of the upper connection terminal, and a lower connection provided on an opposite lower portion of the upper stopper. And a lower stopper provided at an upper portion of the terminal and a predetermined distance from the lower connection terminal.

According to the first embodiment of the present invention, a portion between the upper stopper and the lower stopper of each contact member is characterized in that the curved portion having a predetermined curvature.

According to the first embodiment of the present invention, a concave portion is formed at an upper end of the upper connection terminal of each contact member to accommodate the connection terminal of the semiconductor device.

On the other hand, the present invention is a base member having a plurality of through holes formed in the lower wall and the upper opening; An insulated contact stopper having a plurality of slots formed in a predetermined pattern, an insulated contact stopper having a plurality of corresponding slots detachably coupled through the contact holder and a coupling means and communicating with corresponding slots of the contact holder; A contact unit composed of a plurality of conductive contact members each fitted into a slot of the contact stopper and a corresponding slot of the contact holder, the contact unit being detachably received in the base member via a fixing means; An adapter mounted on the contact unit and having a plurality of through holes corresponding to each of the contact members, and having a semiconductor device seated on an upper surface thereof; Provided is a socket including a cover member mounted on the base member with at least two latch assays for fixing or releasing the semiconductor device and movable up and down with respect to the base member.

In addition, the present invention further provides the following specific embodiments with respect to the second embodiment of the present invention above.

According to a second embodiment of the present invention, the coupling means is provided on both side walls of any one of the outer wall of the contact holder and the outer wall of the contact stopper and has a lock bar at the front end, and each of the other corresponding portions. It is characterized in that it is made of a corresponding locking portion detachably accommodates the locking portion of the lock bar.

According to a second embodiment of the present invention, the fixing means is provided on both side walls of any one of the outer wall of the contact holder and the inner wall of the base member, each having a locking bar at the front end, and the other corresponding portion It is characterized in that it is made of a corresponding locking portion detachably accommodates the locking portion of the lock bar.

According to a second embodiment of the present invention, a lower portion of the base member may be detachably provided with lead guides having a plurality of corresponding through holes corresponding to respective through holes of the lower wall.

According to the second embodiment of the present invention, each slot of the contact holder has a wide trumpet shape at the lower inlet portion than other portions, and the upper portion of the contact holder can block the upper connection terminal of the corresponding contact member from protruding more than a predetermined height. The stop jaw is formed so that each corresponding slot of the contact stopper is characterized in that the lower inlet portion forms a wider trumpet shape than the other portions.

According to a second embodiment of the present invention, a first guide piece having a concave inner wall of a lower portion is provided between each slot of one upper surface of the contact holder to guide the upper connection terminal of the corresponding contact member to the outside. It features.

According to the second embodiment of the present invention, a second guide piece having a concave inner wall of the lower portion in a form opposite to the first guide piece is further provided on the other upper surface facing the upper one side of the contact holder. It is done.

On the other hand, the present invention comprises the steps of coupling the contact holder and the contact stopper to each other via a coupling means; Placing a desired number of bundle-shaped contact member assemblies in the lower portion of the contact stopper in order to fit the corresponding contact members of the bundle-shaped contact member assembly into a predetermined number of slots of the contact holder and the contact stopper, respectively; After removing the lower support piece of each bundle-type contact member assembly from the contact holder and the contact stopper to complete the contact unit composed of the contact holder, the contact stopper and the plurality of contact members, at least two latch assays are interposed therebetween. Mounting a contact unit in the base member of the base member and the cover member which are mutually coupled to each other; It provides a socket assembly method comprising the step of placing the adapter on the contact unit in the base member so as to maintain or guide the upper connection terminal of each of the contact members at a predetermined interval.

In addition, the present invention further provides the following specific embodiments with respect to the third embodiment of the present invention above.

According to a third embodiment of the present invention, the method may further include positioning and fixing a lead guide under the base member so as to maintain or guide the lower connection terminals of the respective contact members at predetermined intervals. .

Hereinafter, each embodiment of the bundle-type contact member assembly, the socket and the socket assembly method for a socket according to the present invention will be described with reference to FIGS. 2 to 16.

Figure 2 is a schematic perspective view showing a bundle-type contact member assembly for a socket according to a first embodiment of the present invention, Figure 4 is a schematic perspective view of a contact unit applied to the socket according to the second embodiment of the present invention.

First, as shown in FIGS. 2 and 3, the socket-shaped contact member assembly 10 for a socket according to the first embodiment of the present invention may be connected to a corresponding connection terminal of a semiconductor device (not shown). A plurality of conductive contact members 11 provided at intervals and connected to each of the lower ends of the contact members through a cutout portion 11a and separated from the contact member 11 when an external force is applied to the cutout portions. It consists of the structure containing the support piece 11b. The cutout portion 11a is a preliminary cutout line pressed to a predetermined depth through a press device (not shown). When a predetermined external force is applied to the preliminary cutout line, the support piece 11b is removed from each of the conductive contact members 11. Easily removed

Here, each of the contact members 11 includes an upper connection terminal 11c provided on an upper side, an upper stopper 11d provided adjacent to a lower portion of the upper connection terminal, and a lower portion opposite to the upper stopper. It consists of the lower connection terminal 11e and the lower stopper 11f provided in the upper part of a fixed distance from this lower connection terminal. Each of the contact members 11 is formed by punching a metal sheet having excellent conductivity such as a beryllium copper sheet.

A portion between the upper stopper 11d and the lower stopper 11f of each of the contact members 11 preferably includes a bent portion 11g having a predetermined curvature.

The upper end of the upper connection terminal 11c of each of the contact members 11 has a shape having the same cross-sectional area as the main body portion or a wider cross-sectional area than the main body portion to accommodate the connection terminal of the LGA type semiconductor device, Alternatively, the concave portion 11cc may be formed to accommodate a ball-shaped connection terminal of a BGA type semiconductor device (not shown).

On the other hand, the socket 12 according to the second embodiment of the present invention is largely composed of the base member 13, the contact unit 14, the adapter 5 and the lid member (Figs. 4 and 14 to 14). See FIG. 16).

Here, the base member 13 has a structure in which a plurality of through holes (not shown) are formed in the lower wall and opened upward.

The contact unit 14 is an insulating contact holder 15 in which a plurality of slots 15a are formed in the form of a predetermined pattern, and is detachably coupled to the contact holder and the coupling means 16, and the contact holder ( An insulating contact stopper 17 having a plurality of corresponding slots 17a communicating with the corresponding slots 15a of 15, a slot 17a of the contact stopper and a corresponding slot 15a of the contact holder 15; It is composed of a plurality of conductive contact member materials 11 fitted in each. In addition, the contact unit 14 is detachably housed in the base member 13 via the fixing means 18 (see FIGS. 4 to 8).

The coupling means 16 is provided on both sides of any one of the outer wall of the contact holder 15 and the outer wall of the contact stopper 17, the locking bar 19 having a locking portion 19a at the front end, Each of the other corresponding portions is provided with a corresponding locking portion 19b for detachably accommodating the locking portion 19a of the locking bar 19. The locking portion 19a of the locking bar 19 may be an arrow-shaped protrusion with three corners cut out, and correspondingly, the corresponding locking portion 19b is a pair of lower ends of the protrusion. It may be a fixing protrusion (see Figure 4).

The fixing means 18 is provided on both sides of any one of the outer wall of the contact holder 15 and the inner wall of the base member 13, the locking bar 20 having a locking portion 20a at the front end, Each of the other corresponding portions is provided with a corresponding locking portion 20b for detachably accommodating the locking portion 20a of the locking bar 20. The locking portion 20a and the corresponding locking portion 20b of the locking bar 20 are male and female coupling holes provided in a form opposite to the outer wall of the contact holder 15 and the inner wall of the base member 13. It may be made of a coupling protrusion (see FIG. 4).

Each of the slots 15a of the contact holder 15 has a wide trumpet shape with a lower inlet portion than the other portion, and the upper connection terminal 11c of the corresponding contact member 11 protrudes above a predetermined height in the upper portion. The stop jaw 15aa is formed to be blocked. Each of the corresponding slots 17a of the contact stopper 17 has a wider trumpet shape than its lower inlet portion (see FIGS. 5 and 6).

A first guide in which the inner wall of the lower portion is concave between the slots 15a of the upper side of the contact holder 15 to guide the upper connection terminal 11c of the contact member 11 to the outside smoothly. It is preferable that the piece 15b is provided.

In addition, a second guide piece 15c having a concave inner wall of a lower portion may be further provided on the other upper surface facing the upper one side surface of the contact holder 15 so as to face the first guide piece 15b. Can be.

The adapter 5 is mounted on the contact unit 14, and a plurality of through holes 5a corresponding to the contact members 11 are formed, and a semiconductor device (not shown) is mounted on the upper surface.

The cover member 7 is mounted on the base member 2 with at least two latch assays 6 for fixing or releasing the semiconductor device and is movable up and down with respect to the base member. Do.

A lower part of the base member 13 is detachably provided with a lead guide 21 having a plurality of corresponding through holes (not shown) corresponding to each through hole (not shown) of the lower wall.

Next, a method of assembling the socket having the above-described configuration will be described with reference to FIGS. 4 and 9 to 16.

First, the contact holder 15 and the contact stopper 17 are coupled to each other through the coupling means 16 (see FIG. 4).

Thereafter, the contact member assembly 10 having the desired number of bundles is sequentially positioned below the contact stopper 17 so that a predetermined number of slots 15a and 17a of the contact holder 15 and the contact stopper 17 are placed. The corresponding contact members 11 of the bundle-shaped contact member assembly 10 are respectively inserted (see FIGS. 9 to 12). In this case, the bundle-type contact member assembly 10 is a part of each contact member 11 is tightly fitted into the corresponding slot (15a, 17a) is fixed.

Then, the lower support pieces 11b of the respective bundle-type contact member assemblies 10 are removed from the contact holder 15 and the contact stopper 17, so that the contact holder 15, the contact stopper 17 and After completing the contact unit 14 composed of a plurality of contact members 11, the base member 13 and the base member of the lid member 7 coupled to each other with at least two latch assays 6 interposed therebetween. 13, the contact unit 14 is mounted (see FIGS. 13 to 15). In this case, the contact unit 14 may be mounted in the base member while pressing the cover member 7 toward the base member 13 by hand or an auxiliary jig (not shown).

Then, the adapter 5 is placed on the contact unit 14 in the base member 13 so as to maintain or guide the upper connection terminal 11c of each of the contact members 11 at a predetermined interval (Fig. 16).

Then, the lead guide 21 is positioned and fixed to the lower portion of the base member 13 so as to maintain or guide the lower connection terminal 11e of each of the contact members 11 at a predetermined interval (see FIG. 16). ).

Accordingly, the operator can connect the lower connection terminal 11e of each contact member 11 on the lead guide 21 side of the assembled socket 12 to the corresponding connection terminal of the test printed circuit board (not shown). After connecting to the semiconductor device, a semiconductor device (not shown) is seated on the adapter 5 in the socket 12 so that a predetermined burn-in test can be performed. At this time, the semiconductor device is pressed by the latch member 6a of the latch assay 6, so that the bent portion 11g of each of the contact members 11 has a predetermined elastic force, It is possible to provide a desired contact force between the upper connection terminal 11c and the corresponding connection terminal of the semiconductor device.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and simple substitutions, modifications, and changes within the technical idea of the present invention will be apparent to those skilled in the art.

As described above, the bundle-type contact member assembly for the socket according to the first embodiment of the present invention allows a plurality of contact members to be conveniently assembled to the socket by manual or automated operation.

The socket according to the second embodiment of the present invention is capable of accommodating various types of semiconductor devices having different numbers of connection terminals through a contact unit accommodating a plurality of contact members provided from a bundle-type contact member assembly. .

In addition, the socket according to the second embodiment of the present invention is formed by dividing the existing contact control member for accommodating a plurality of contact members into a contact holder and a contact stopper to conveniently form the corresponding slots for the respective contact members in various forms. Make it possible.

The socket assembly method according to the third embodiment of the present invention facilitates the assembling work through manpower, and also enables the assembly process to be automated to ultimately increase productivity.

Claims (13)

A plurality of conductive contact members provided at predetermined intervals so as to be connectable with corresponding connection terminals of the semiconductor device; A support piece which is connected to the lower end of each contact member via a cutout portion and is separated from the contact member when an external force is applied to the cutout portion. Bundle-shaped contact member assembly for a socket comprising a. 2. The contact member according to claim 1, wherein each of the contact members comprises: an upper connecting terminal provided on an upper side, an upper stopper provided adjacent to a lower portion of the upper connecting terminal, and a lower connecting terminal provided on a lower side opposite to the upper stopper; A bundle-type contact member assembly for a socket, comprising a lower stopper provided at an upper portion of a lower distance from a lower connection terminal. 3. The bundle-type contact member assembly for socket according to claim 2, wherein a portion between the upper stopper and the lower stopper of each contact member is a curved portion having a predetermined curvature. 3. The bundle-type contact member assembly for socket according to claim 2, wherein a recess is formed at an upper end of the upper connection terminal of each contact member so as to accommodate the connection terminal of the semiconductor device. A base member having a plurality of through holes formed in the lower wall and having an upper opening; An insulated contact stopper having a plurality of slots formed in a predetermined pattern, an insulated contact stopper having a plurality of corresponding slots detachably coupled through the contact holder and a coupling means and communicating with corresponding slots of the contact holder; A contact unit composed of a plurality of conductive contact members each fitted into a slot of the contact stopper and a corresponding slot of the contact holder, the contact unit being detachably received in the base member via a fixing means; An adapter mounted on the contact unit and having a plurality of through holes corresponding to each of the contact members, and having a semiconductor device seated on an upper surface thereof; A cover member mounted on the base member with at least two latch assays for holding or releasing the semiconductor device and movable up and down with respect to the base member. Socket comprising a. According to claim 5, The coupling means is provided on both sides of any one of the outer wall of the contact holder and the outer wall of the contact stopper and a locking bar having a locking portion at the front end, respectively provided in the other corresponding portion and the locking A socket comprising a corresponding locking portion for removably receiving the locking portion of the bar. According to claim 5, The fixing means is provided on both sides of any one of the outer wall of the contact holder and the inner wall of the base member and the locking bar having a locking portion at the front end, respectively provided in the other corresponding portion and the locking A socket comprising a corresponding locking portion for removably receiving the locking portion of the bar. The socket of claim 5, wherein the lower portion of the base member is detachably provided with lead guides having a plurality of corresponding through holes corresponding to the respective through holes of the lower wall. According to claim 5, Each of the slots of the contact holder has a lower mouth portion is wider than the other portion of the shape of a trumpet, and the upper portion has a stop jaw to prevent the upper connection terminal of the contact member protruding above a certain height And each corresponding slot of the contact stopper has a lower inlet portion forming a wider trumpet than other portions. The socket of claim 9, wherein a first guide piece having a concave inner wall of a lower portion is provided between the slots of the upper one side surface of the contact holder to guide the upper connection terminal of the contact member to the outside. The socket of claim 10, wherein a second guide piece having a concave inner wall of a lower portion is formed on the other upper surface facing the upper one side of the contact holder so as to face the first guide piece. Coupling the contact holder and the contact stopper to each other through a coupling means; Placing a plurality of bundle-type contact member assemblies in a lower portion of the contact stopper in order to insert corresponding contact members of the bundle-type contact member assembly into a predetermined number of slots of the contact holder and the contact stopper, respectively; After removing the lower support piece of each bundle-type contact member assembly from the contact holder and the contact stopper to complete the contact unit composed of the contact holder, the contact stopper and the plurality of contact members, at least two latch assays are interposed therebetween. Mounting a contact unit in the base member of the base member and the cover member which are mutually coupled to each other; Positioning an adapter on a contact unit in the base member so as to maintain or guide the upper connection terminals of the respective contact members at a predetermined interval; Socket assembly method comprising a. The socket assembly method of claim 12, further comprising positioning and fixing a lead guide under the base member to maintain or guide the lower connection terminals of the respective contact members at a predetermined interval.

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