JPS6081851A - Ic case - Google Patents

Abstract

PURPOSE:To improve the mounting efficiency of an IC case by providing a springlike contactor in the case, thereby eliminating the necessity of the spring shape at the IC socket side, and lowering the height of a socket itself. CONSTITUTION:The leads 4 of an IC case 3 use spring material, bent to obtain elasticity, the terminal 5 of the IC socket 2 is a flat terminal board, and the specified contacting force is applied by the elasticity of the leads 4. Thus, the length of the leads 4 can be increased as compared with that of the terminal 5, thereby reducing the irregularity of the contacting force. The length of the terminal 5 can be shortened, the socket 2 is reduced in size to contribute to the increase in the mounting space.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field to Which the Invention Pertains] The present invention relates to an IC case mounted on an electronic circuit board constituting an electronic device and an electronic computer.

[Prior art]

Conventionally, this type of IC case is a ceramic or molded case, and flat terminals protrude straight in the horizontal or vertical direction.

Therefore, when mounted on a printed circuit board via an IC socket, the IC socket is electrically connected using the mechanical characteristics (spring characteristics) provided in the IC socket. In this case, the "spring" provided within the IC socket requires space to obtain a specified amount of spring characteristics (contact force).

However, for this purpose, the mechanical structure has already reached its limit, and therefore, such an IC case has the disadvantage that the mounting space cannot be reduced.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional drawbacks, and to provide an IC case having a structure in which a spring-like contact is provided in the IC case, thereby reducing the mounting space.

[Structure of the invention]

The IC case of the present invention is an IC case mounted in an IC socket provided on a printed circuit board.
It is constructed with a spring-like contact that comes into contact with the terminal of the C socket.

[Explanation of Examples]

Next, the present invention will be explained in detail with reference to the drawings.

1 to 3 show a first embodiment of the present invention, and FIGS. 4 to 6 show a second embodiment. 1 and 4 are perspective views of the IC case and the parts mounted thereon, FIGS. 2 and 5 are sectional views before mounting, and 3 and 6 are sectional views of the mounting edge.

A first embodiment will be explained with reference to FIGS. 1 to 3.

An IC is attached to an IC socket 2 attached to a printed circuit board 1.
Case 3 is implemented. The leads 4 of the IC case 3 are made of spring material and are curved to obtain spring properties.
, has a structure in which it comes into contact with the terminal 5 when mounted in the IC socket 2. The terminal 5 is a flat terminal plate unlike the conventional one, and comes into contact with the series lead 4 by applying a specified contact force due to the spring properties of the lead 4. FIG. 2 shows the state before the IC case 3 is mounted, and FIG. 3 shows the state where the IC case 3 is mounted on the IC socket 2 and the leads 4 and terminals 5 are in contact.

Since the buried lead 4 can be made longer than the length of the terminal 5, variations in contact force can be reduced.

Furthermore, the length of the terminal 5 itself can be shortened, making the IC socket 2 more compact and contributing to an expansion of the mounting space. Further, when the IC socket 2 is soldered to the printed circuit board 1, the contact surface between the terminal 5 and the lead 4 may become contaminated. This contamination is removed by cleaning, and this cleaning work is much easier when the terminal 5 is flat than when the terminal 5 is curved.

Next, a second embodiment will be described with reference to FIGS. 4 to 6. The first embodiment was an embodiment in which the leads 4 protruded perpendicularly to the IC case 3, but the second embodiment
This is a case in which the lead 9 extends horizontally with respect to the C case 8. An IC case 8 is placed on an IC socket 7 having a terminal 10.
A carrier 11 for pressing the leads 9 onto the terminals 10 is mounted and fixed to the IC socket 7 with screws 12. At this time, a predetermined amount of contact force is applied to the terminal 10 due to the springiness of the lead 9, causing contact.

〔Effect of the invention〕

By providing spring properties to the leads of the IC case, the present invention eliminates the need for a spring shape on the IC socket side.
The height of the socket itself can be reduced, mounting efficiency can be increased, and the contact portion within the socket can be cleaned easily.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a first embodiment of the present invention and parts for mounting it, Fig. 2 is a sectional view showing the state before mounting the first embodiment, and Fig. 3 is a perspective view of the first embodiment of the present invention. FIG. 4 is a cross-sectional view showing the state after the embodiment is implemented, FIG. 4 is a perspective view showing the second embodiment of the present invention and parts for mounting it, and FIG. 5 is a diagram showing the state before the second embodiment is implemented. FIG. 6 is a sectional view showing the state in which the second embodiment is implemented. 1...Printed circuit board, 2,7...IC
Socket, 3.8...IC case, 4,9...
...Lead, 5゜5-i r/2 Fig. 84

Claims (1)

[Scope of Claim] An IC case mounted on an IC socket provided on a printed circuit board, characterized in that the IC case has a spring-like contact that comes into contact with a terminal of the IC socket.