JPH0679093U - IC socket for chip substrate - Google Patents

Abstract

(57) [Summary] [Purpose] An IC chip substrate whose outer periphery is not packaged with synthetic resin can be mounted, and electrical connection can be made at the same time with electrodes provided on both sides of the chip substrate. High-quality IC socket is provided. [Structure] A socket body 1 having a protrusion 1a therein,
A large number of lead pins 3a, 3b arranged on the socket body so that the contact portions 3ai, 3bi have different heights inside the socket body, and a curved lower portion 2b having a substantially S-shaped cross section around the periphery.
In addition to the engaging portion 2c that engages with the protrusion 1a on the lower curved portion, the spring portion 2d and the pressing cover 2 having the conductive wiring pattern 2e are formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention mainly relates to an IC socket used for a leadless type IC chip substrate such as a chip substrate in which a plurality of IC elements are mounted on a circuit substrate and the outer periphery is not packaged with a synthetic resin.

[0002]

[Prior art]

 In recent years, due to high integration of ICs and miniaturization of IC chip substrates, the external connection terminals of the IC chip substrates (hereinafter referred to as electrodes of the IC chip substrate) have been arranged in high density. Further, the number of IC chip substrates in which electrodes are densely arranged on both sides of the chip substrate is increasing. Therefore, even in an IC socket on which such a highly integrated and small IC chip substrate is mounted, the lead pins are arranged in high density in accordance with the electrodes of the IC chip substrate, and moreover, both sides of the chip substrate can be easily mounted. There is a demand for an IC socket for a high-density terminal that can be electrically connected to the electrodes at the same time.

FIG. 4 and FIG. 5 are explanatory views of a conventional IC socket used for a leadless type IC chip substrate, and show essential parts related to a problem to be solved by the present invention. FIG. 4 is a schematic view of this IC socket, and FIG. 5 is a sectional view showing a state in which an IC chip substrate is mounted. The socket body 11 is provided with lead pins 13 that are in contact with the electrodes of the IC chip substrate 14 and are electrically connected thereto. The lead pin 13 has contact portions (terminals) inside and outside the socket body 11, the outer contact portion 13a is connected to the electrode pattern of the electronic circuit board 21 by soldering, and the inner contact portion 13b is the IC chip substrate 14. Is in contact with the electrode. The lead pin 13 is formed of a metal having elasticity, and the IC chip substrate 14 is pressed from the back side by the cover 12, so that a reliable connection can be obtained. The pressing cover 12 is formed of a metal plate such as stainless steel, and is fixed to the socket body 11 by the caulking portion 12a and the cutout portion 11a of the socket body 11.

Further, FIG. 6 which is an exploded perspective view shows a conventional example of an IC socket for a leadless type IC package. The frame 11 is attached to the circumference of the connection pattern 13 provided on the substrate 21. The frame 11 and the cover 12 are connected by coaxially inserting the pin 11a into the support hole 11b on the frame 11 side and the support hole 12b on the cover 12 side. When the cover 12 is closed, the frame 11 is closed. The engaging portion 11c at each peripheral end of the cover 12 and the engaging piece 12c are engaged with each other. Then, the conductive connector 16 and the leadless type IC package 15 are inserted into the frame body 11, the support cover 12 'is fitted to the frame body 11, and the cover 12 is closed to establish the connection. The IC package 15 has a connection pattern 15a on the lower surface thereof, and the conductive connector 16 has a gold-plated thin wire conductor portion embedded in a silicon rubber insulator. A cone-shaped coil spring 12a is provided inside the cover 12 so that a predetermined pressure acts on the connection pattern 13.

[0005]

[Problems to be solved by the device]

 In the case of the conventional IC socket for the IC chip substrate described with reference to FIGS. 4 and 5, when the IC chip substrate is highly integrated and miniaturized and the pitch of the electrodes of the IC chip substrate is narrowed, the lead pins 13 must be thinned. . If the lead pin 13 is thin, permanent deformation is likely to occur, and if used for a long time, the lead pin 13 cannot make elastic contact with the electrode of the IC chip substrate 14.

The IC socket described with reference to FIG. 6 is mounted with a so-called IC package in which the entire portion of the IC chip substrate other than the surface side where the electrodes (connection patterns) are provided is packaged with synthetic resin. It is a thing. In the case of such an IC package 15, as shown in FIG. 6, even if the central portion of the IC package 15 is strongly pressed by the coil spring 12a, the IC chip substrate does not bend. Moreover, since the IC element on the chip substrate is also protected by the synthetic resin, even if the IC element is mounted right above the chip substrate, there is no risk of damaging the IC element.

However, in the case of an IC chip substrate in which the outer periphery of the chip substrate is not packaged with a synthetic resin, it does not have to be pressed anywhere. Further, in the IC socket having the structure shown in FIGS. 4 to 6, it is not possible to mount the IC chip substrate having electrodes on both sides and simultaneously make electrical connection with the electrodes on both sides.

The present invention has been made in view of the above problems of the IC socket for a chip substrate. Therefore, it is possible to mount an IC chip substrate that is not packaged with synthetic resin, has high durability, and has electrodes on both sides. Provided is an IC socket which can be electrically connected to electrodes on both sides of the IC chip substrate at the same time.

[0009]

[Means for Solving the Problems]

 An IC socket for a chip substrate according to the present invention includes a socket body having a protrusion on an inner side surface thereof, and lead pins arranged in a row in the socket body so that heights of inner contact portions of the socket body are different from each other. A curved lower portion having a substantially S-shaped cross section is formed in the periphery, and an outer surface of the curved lower portion that can be electrically connected to an internal contact portion at a high position of the lead pin and that is housed in the socket body of the chip substrate. It is characterized in that it has a conductive wiring pattern formed so as to be electrically connectable also to the electrodes, and has a pressing cover provided with an engaging portion that engages with the protrusion at an upper portion of the curved lower portion.

[0010]

【Example】

 1 and 2 show an embodiment of an IC socket for a chip substrate (double-sided electrode type) of the present invention. FIG. 1 is a sectional view showing a state where the chip substrate is mounted on the IC socket, and FIG. FIG. 2 is a perspective view of a holding cover of the IC socket shown in FIG. 1. In the figure, 1 is a socket body in which a protrusion 1a is formed above the inner surface of the side wall, and 2 is a metal pressing cover. The pressing cover 2 has notches 2a at four corners, and a curved lower portion 2b having a substantially S-shaped cross section (smaller at the top and larger at the bottom) in the periphery. In the curved lower part 2b having a substantially S-shaped cross section, the concave part located at the upper part of the S-shape and concave toward the outside is the engaging part 2c with respect to the protrusion 1a, and the spring part 2d located at the lower part of the S-shape and convex toward the outside. A conductive wiring pattern 2e is provided on the substrate by a method described later.

Reference numerals 3 a and 3 b are an upper lead pin and a lower lead pin, respectively, which have contact portions inside and outside the socket body 1. The upper lead pin 3a and the lower lead pin 3b are made of a conductive metal having a higher rigidity than the conventional lead pin. The inner contact portion 3ai of the upper lead pin 3a is located directly below the protrusion 1a, but the inner contact portion 3bi of the lower lead pin 3b is located below the inner contact portion 3ai of the upper lead pin 3a. ing. On the other hand, the outer contact portions 3ao and 3bo of the upper lead pin 3a and the lower lead pin 3b are at the same height. The upper lead pins 3a and the lower lead pins 3b, which are in such a positional relationship, form a pair and penetrate through the side wall of the socket body 1 to form a large number of pairs. Reference numeral 4 is a chip substrate to which a plurality of IC elements 5 are joined. Electrodes 4a and 4b are provided on both surfaces of the chip substrate 4 so as to be connected to the IC element 5.

An insulating layer is formed on the outer surface of the spring portion 2d of the pressing cover 2 by coating, and a conductive wiring pattern 2e is formed on the insulating layer so as to be aligned with the inner contact portion 3ai of the upper lead pin 3a. Has been done. The material of the pressing cover 2 having such a spring portion 2d is a metal plate having an appropriate elastic range.

As a method of manufacturing the pressing cover 2, for example, a square plate having a desired shape and size is first punched out from such a material metal plate. Next, using a properly designed press bending die, the square plate is pressed by a press machine and bent into the shape of the cover 2. After that, the insulating film on which the conductive wiring pattern 2e is formed is adhered to the outer surface of the spring portion 2d to be configured. Alternatively, a metal plate may be punched out, then coated with an insulating material, a conductive substance may be formed into a pattern by etching on the metal plate, and then bending processing may be performed.

To mount the chip substrate 4 on the socket body 1, first, a jig is hooked on one of the cutouts 2 a at the four corners of the holding cover 2 to remove the holding cover 2 from the socket body 1. Next, the chip substrate 4 is placed on the inner contact portion 3bi of the lower lead pin 3b in the socket body 1 so that the electrode 4b contacts. Then, the spring portion 2d of the pressing cover 2 is pressed against the protrusion 1a formed in the socket main body 1, and the pressing cover 2 is pushed into the socket main body 1 while elastically deforming the spring portion 2d. The engaging portion 2c of the S-shaped curved lower portion 2b is engaged with the protrusion 1a. FIG. 1 shows a state in which mounting of the chip substrate 4 into the socket body 1 and fitting of the pressing cover 2 are completed.

That is, when the mounting of the chip substrate 4 into the socket body 1 and the fitting of the pressing cover 2 are completed, the chip substrate 4 is sandwiched by the lower lead pin 3b group and the spring portion 2d of the pressing cover 2 at the peripheral edge portion. It becomes like Then, the upper electrode 4a of the chip substrate is connected to the inner contact portion 3ai of the upper lead pin 3a via the conductive wiring pattern 2e formed on the spring portion 2d of the pressing cover 2. On the other hand, the lower electrode 4b of the chip substrate is in direct contact with the inner contact portion 3bi of the lower lead pin 3b.

In the above case, the inner contact portion 3ai of the upper lead pin 3a is located directly below the protrusion 1a, and is configured to come into contact with the conductive wiring pattern 2e at the engaging portion 2c. The position of the inner contact portion 3ai is not limited to this as long as it can contact the conductive wiring pattern 2e.

FIG. 3 shows a second embodiment of the IC socket for a chip substrate of the present invention, in which the electrode 4b is present only on one surface (the lower surface in this embodiment) of the chip substrate 4 to be mounted. is there. The IC socket of the first embodiment can also be used for this single-sided electrode type chip substrate. However, the single-sided electrode type chip substrate dedicated IC socket shown in FIG. 3 has a simpler structure because the upper lead pin 3a and the conductive wiring pattern 2e of the pressing cover 2 in the IC socket of the first embodiment are omitted.

[0018]

EFFECT OF THE INVENTION The IC socket for a chip substrate of the present invention constructed as described above has the following effects. (1) Since the lead pin is made of a conductive metal having a high rigidity and the spring portion of the pressing cover is provided on the outer circumference of the wide pressing cover, this spring portion is unlikely to cause plastic strain and belongs to the same type. More durable than conventional IC sockets. (2) Since the pressing cover presses the electrodes located on the peripheral edge of the chip substrate from directly above, it is easy to set the contact pressure between the lead pin and the electrode of the chip substrate at the time of design. Moreover, the contact stability is good, the chip substrate does not bend, and the electrodes are pressed directly above the electrodes irrespective of the position of the IC device on the chip substrate, so there is no risk of damaging the IC device. (3) The structure is simple because it consists of only two parts, the socket body and the pressing cover. Even when electrodes are provided on both surfaces of the chip substrate, both electrodes can be externally connected at the same time.

[Brief description of drawings]

FIG. 1 shows a first IC socket for a chip substrate according to the present invention.
It is sectional drawing which shows the state which mounted the chip substrate in the Example.

FIG. 2 is a perspective view of a pressing cover of the IC socket for a chip substrate shown in FIG.

FIG. 3 is a second part of an IC socket for a chip substrate according to the present invention.
It is sectional drawing which shows the state which mounted the chip substrate in the Example.

FIG. 4 is an exploded perspective view of an IC socket for a chip substrate according to a conventional technique.

FIG. 5 is a cross-sectional view showing a state where a chip substrate is mounted on a chip substrate IC socket according to a conventional technique.

FIG. 6 is an exploded perspective view of an IC socket for an IC package according to a conventional technique.

[Explanation of symbols]

 1 Socket body 1a Protrusion 2 Presser cover 2b Curved lower part 2c Engagement part 2d Spring part 2e Conductive wiring pattern 3a Upper lead pin 3ai Inner contact part of upper lead pin 3b Lower lead pin 3bi Inner contact part of lower lead pin 4 Chip board

Claims (1)

[Scope of utility model registration request] 1. A socket body having a protrusion on an inner side surface thereof, lead pins arranged in the socket body so as to have heights of inner contact portions located inside the socket body different from each other, and an S-shaped peripheral portion. The curved lower part of the cross section is formed,
A conductive wiring pattern formed on the outer surface of the curved lower portion so as to be electrically connectable to the internal contact portion at a high position of the lead pin and electrically connected to the electrode of the chip substrate housed in the socket body. An IC socket for a chip substrate, comprising: a holding cover having an engaging portion that engages with the protrusion at an upper portion of the curved lower portion.